page 1 of 4 the big deal ? ultra-wide band, dc to 43.5 ghz ? excellent power handling, up to 2w ? contiguous ground plane for easy installation product overview mini-circuits kat-d-series mmic attenuator dice (rohs compliant) are fxed value, absorptive attenuators fabricated using highly repetitive mmic processing with thin flm resistors on gaas substrates. providing precise attenuation from dc up to 43.5 ghz, these attenuators are ideal for a very wide range of applica - tions up to millimeter wave bands including 5g systems and more. kat-d-series attenuator dice are avail - able from stock with nominal attenuation values of 0 to 10 db (in 1 db steps), and 12, 15, 20, and 30 db. feature advantages ultra-wide band operation, dc to 43.5 ghz kat-d-series attenuator dice support a wide array of applications including 5g sys - tems, microwave communications, satellite, defense and aerospace, medical broad - band and optical applications single, contiguous ground plane the attenuators achieve ultra-wide band performance up to 43.5 ghz with single, contiguous ground plane, simplifying installation into customer hybrids. high power handling, up to 2w power handling up to 2w makes kat attenuator dice suitable for a wide range of system power requirements. wide range of nominal attenuation values: 0 to 10 db (in 1 db steps) and 12, 15, 20 and 30 db small increment offerings enable circuit designers to change attenuation values with - out motherboard redesign, making the kat-d-series ideal for adjusting attenuation values based on test results. excellent attenuation fatness provides precise, consistent attenuation across the entire frequency band, ideal for broadband and multi-band usage. kat-d-series key features 50 ? up to 2w dc to 43.5 ghz millimeter wave precision fixed attenuator die notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com
page 2 of 4 k at-2-d + product features ? wide bandwidth, dc to 43.5 ghz ? excellent attenuation accuracy & fatness ? exceptional power handling, up to 2w rev. a m164399 KAT-2-D+ rs/cp/am 171017 typical applications ? cellular ? pcs ? communications ? radar ? defense ? 5g 50 ? 2w 2db dc to 43.5 ghz general description KAT-2-D+ is an absorptive attenuator die fabricated using highly repetitive mmic process including thin flm resistors on gaas substrate. KAT-2-D+ attenuator die contains through-wafer vias to realize low thermal resistance and wideband operation. simplifed schematic ordering information: refer to last page bonding pad position / description pad # description 2 rf-in 5 rf-out 1,3,4,6 ground die bottom ground (numbers on bond pads are for identifcation only, not marked on die) 0 l2 l3 l4 l1 h1 0 h3 h2 0 1 2 3 6 5 4 note: 1. bond pad material - gold 2. bottom of die - gold plated die dimensions in m l1 l2 l3 l4 h1 h2 h3 thickness rf-in/rf-out bond pad size ground bond pad size 125 375 625 750 85 615 700 100 125 x 100 100 x 100 millimeter wave precision fixed attenuator die notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com +rohs compliant the +suffix identifies rohs compliance. see our web site for rohs compliance methodologies and qualifications
page 3 of 4 k at-2-d + assembly and handling procedure 1. storage dice should be stored in a dry nitrogen purged desiccators or equivalent. 2. esd mmic gaas attenuator dice are susceptible to electrostatic and mechanical damage. die are supplied in antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static workstation. devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter esd damage to dice. 3. die attach the die mounting surface must be clean and fat. using conductive silver flled epoxy, recommended epoxies are diemat dm6030hk-pt/h579 or ablestik 84-1lmisr4. apply suffcient epoxy to meet required epoxy bond line thickness, epoxy fllet height and epoxy coverage around total die periphery. parts shall be cured in a nitrogen flled atmosphere per manufacturers cure condition. it is recommended to use antistatic die pick up tools only. 4. wire bonding bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond pads. thermosonic bonding is used with minimized ultrasonic content. bond force, time, ultrasonic power and temperature are all critical parameters. suggested wire is pure gold, 1 mil diameter. bonds must be made from the bond pads on the die to the package or substrate. all bond wires should be kept as short as low as reasonable to minimize performance degradation due to undesirable series inductance. (ground bond wires are optional) absolute maximum ratings operating temperature (ground) -40c to 85c rf input power 2w electrical specifcations at 25c, 50 ? parameter condition (ghz) min. typ. max. unit frequency range dc 43.5 ghz attenuation 1 dc - 5 2.00.1 db 5 - 15 2.00.1 15 - 18 2.00.1 18 - 26.5 2.00.2 26.5 - 43.5 1.90.6 vswr 1 dc - 5 1.1 :1 5 - 15 1.1 15 - 18 1.1 18 - 26.5 1.1 26.5 - 43.5 1.3 operating input power at 2 : 25c dc - 43.5 2 w 85c dc - 43.5 1 w 1. electrical specifcations are typical measured characteristics on die using mpi titan series 250 m pitch gsg probe. 2. tested in industry standard 2x2 mm, 6-lead mclp package. permanent damage may occur if any of these limits are exceeded. assembly diagram fixed attenuator die notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com rf - i n rf - out ground ground
page 4 of 4 performance data data table swept graphs s-parameter (s2p files) case style die die ordering and packaging information quantity, package small, gel - pak: 5,10,50,100 kgd* medium ? , partial wafer: kgd*<5k large ? , full wafer KAT-2-Dg+ KAT-2-Dp+ KAT-2-Df+ ? available upon request contact sales representative refer to an-60-067 environmental ratings env-80 additional notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp d. mini-circuits does not warrant the accuracy or completeness of the information, text, graphics and other items contained within this document and same are provided as an accommodation and on an as is basis, with all faults. e. purchasers of this part are solely responsible for proper storing, handling, assembly and processing of known good dice (including, without limitation, proper esd preventative measures, die preparation, die attach, wire bond ing and related assembly and test activities), and mini-circuits assumes no responsibility therefor or for environmental effects on known good dice. f. mini-circuits and the mini-circuits logo are registered trademarks of scientifc components corporation d/b/a mini- circuits. all other third-party trademarks are the property of their respective owners. a reference to any third-party trademark does not constitute or imply any endorsement, affliation, sponsorship, or recommendation by any such third-party of mini-circuits or its products. esd rating** human body model (hbm): class 2 (pass 2000v) in accordance with ansi/esd stm5.1-2001 additional detailed technical information additional information is available on our dash board. k at-2-d + ** tested in industry standard 2x2 mm, 6-lead mclp package. *known good dice (kgd) means that the dice are taken from pcm good wafer and visually inspected in question have been subjected to mini-circuits while this is not defnitive, it does help to provide a higher degree of confdence that dice are capable of meeting typical rf electrical parameters specifed by mini-circuits. fixed attenuator die notes a. performance and quality attributes and conditions not expressly stated in this specifcation document are intended to be excluded and do not form a part of this specifcation document. b. electrical specifcations and performance data contained in this specifcation document are based on mini-circuits applicable established test performance criteria and measurement instructions. c. the parts covered by this specifcation document are subject to mini-circuits standard limited warranty and terms and conditions (collectively, standard terms); purchasers of this part are entitled to the rights and benefts contained therein. for a full statement of the standard terms and the exclusive rights and remedies thereunder, please visit mini-circuits website at www.minicircuits.com/mclstore/terms.jsp mini-circuits ? www.minicircuits.com p.o. box 350166, brooklyn, ny 11235-0003 (718) 934-4500 sales@minicircuits.com
|
