HPND-0002 small signal rf pin diode chips for hybrid integrated circuits data sheet description these pin/nip diode chips are specifcally designed for hybrid applications requiring thermosonic or thermo - compression bonding techniques. the top metallization is a layer of gold for a tarnish free surface that allows ei - ther thermosonic or thermocompression bonding tech - niques. the bottom metallization is also gold, suitable for epoxy or eutectic die attach method. applications these small signal, general purpose pin/nip diode chips are optimized for various analog and digital applications such as switches, digital phase shifters, pulse and ampli - tude modulators, limiters, leveling, and attenuating. features ? thermocompression/thermosonically bondable ? ideal for hybrid integrated circuits ? gold metallization ? silicon nitride passivation ? uniform electrical characteristics ? batch matched versions available ? planar construction maximum ratings junction operating and storage temperature range: -65c to +150c t a = 25c pd power dissipation: 250 mw (measured in an infnite heat sink derated linearly to zero at 150c.) operation in excess of any one of these conditions may result in permanent damage to this device. HPND-0002 chip dimensions d x y x dimensions d x y top contact bottom contact dimensions in millimeters eutectic die attach part no. HPND-0002 0.20 (8) 0.38 (15) 0.20 (8) cathode anode (0.03) (1) (0.05) (2) (0.03) (1) for epoxy or (1/1000 inch).
assembly and handling procedures for pin chips: 1. storage devices should be stored in a dry nitrogen purged des - sicator or equivalent. 2. cleaning if required, surface contamination may be removed with electronic grade solvents. typical solvents, such as freon (t.f. or t.m.c.), acetone, deionized water, and methanol, or their locally approved equivalents, can be used singularly or in combinations. typical cleaning times per solvent are one to three minutes. di water and methanol should be used (in that order) in the fnal cleans. final drying can be accomplished by placing the cleaned dice on clean flter paper and drying with an in - frared lamp for 5-10 minutes. acids such as hydrofuoric (hf), nitric (hno 3 ), and hydrochloric (hcl) should not be used. the efects of cleaning methods/ solutions should be verifed on small samples prior to submitting the en - tire lot. following cleaning, dice should be either used in assembly (typically within a few hours) or stored in clean containers in a reducing atmosphere or a vacuum chamber. 3. die attach a. eutectic eutectic die attach can be accomplished by scrub - bing the die with/without a preform on the header to combine with the silicon in the die. temperature is approximately 400c, with heating times of 5-10 sec - onds. (noteCtimes and temperature utilized may vary depending on the type, composition, and heat capacity of the header or substrate used.) this method is recom - mended for HPND-0002. b. epoxy for epoxy die-attach, conductive silver-flled epoxies are recommended. this method can be used for all avago technologies pin chips. 4. wire bonding either ultrasonic, thermosonic or thermocompression bonding techniques can be employed. suggested wire is pure gold, 0.7 to 1.5 mil diameter. electrical specifcations at t a = 25c typical parameters chip for nearest nearest epoxy or equivalent equivalent minimum typical typical reverse eutectic surface mount axial lead breakdown maximum series carrier recovery die attach part no. part no. voltage capacitance resistance lifetime time hpnd- hsmp- 5082- v br (v) c j (pf) r s ( ? ) (ns) rr (ns) 0002 3810 3081 100 0.20 3.5 1500 300 test v r = v br v r = 50 v i f = 100 ma i f = 50 ma i f = 20 ma conditions measure i r = 250 ma v r = 10 v i r 10 a f = 1.0 mhz 90% recovery f = 100mhz for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, limited in the united states and other countries. data subject to change. copyright ? 2006 avago technologies limited. all rights reserved. obsoletes 5965-9143e av01-0640en - november 28, 2006
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