1. 2. 3. material content data sheet sales product name ice2a180z issued 29. august 2013 ma# MA001086268 package pg-dip-7-4 weight* 653.08 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.565 0.85 0.85 8521 8521 leadframe inorganic material phosphorus 7723-14-0 0.049 0.01 74 non noble metal zinc 7440-66-6 0.194 0.03 297 non noble metal iron 7439-89-6 3.884 0.59 5948 non noble metal copper 7440-50-8 157.726 24.15 24.78 241512 247831 wire noble metal gold 7440-57-5 0.178 0.03 0.03 272 272 encapsulation organic material carbon black 1333-86-4 1.424 0.22 2181 plastics epoxy resin - 46.049 7.05 70511 inorganic material silicondioxide 60676-86-0 427.261 65.43 72.70 654229 726921 leadfinish non noble metal tin 7440-31-5 6.460 0.99 0.99 9891 9891 plating noble metal silver 7440-22-4 1.911 0.29 0.29 2926 2926 glue plastics epoxy resin - 0.356 0.05 546 noble metal silver 7440-22-4 2.019 0.31 0.36 3092 3638 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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