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? 2016 microchip technology inc. ds50002489a-page 1 RN4870/71 features ? fully qualified bluetooth ? smart module ? on-board bluetooth 4.2 low energy stack ? ascii command interface api over uart ? scripting engine for hostless operation ? compact form factor ? the RN4870/71 family comes in four different sizes from 6 mm x 8 mm to 12 mm x 22 mm: - RN4870: 12 mm x 22 mm - rn4871: 9 mm x 11.5 mm - RN4870u: 12 mm x 15 mm - rn4871u: 6 mm x 8 mm ? beacon private service for beacon services ? uart transparent service for serial data applications ? remote configuration over the air operational ? operating voltage: 1.9v to 3.6v (3.3v typical) ? temperature range: -20c to +70c ? supports uart ? up to three pulse width modulation (pwm) outputs rf/analog features ? ism band 2.402 to 2.480 ghz operation ? channels: 0-39 ? rx sensitivity: -90 dbm ? tx power: 0 dbm ? rssi monitor mac/baseband/higher layer features ? secure aes128 encryption ? gap, gatt, sm, l2cap and integrated public profiles ? customer can create up to five public and four private services ? keyboard i/o authentication ? software configurable role as peripheral or central and client or server antenna options ? ceramic chip antenna (RN4870/rn4871) ? external antenna connection via rf pad (RN4870u/rn4871u) applications ? health/medical devices ? sports activity/fitness meters ? beacon applications ? internet of things (iot) sensor tag ? remote control ? wearable smart devices and accessories ? smart energy/smart home ? industrial control description the rn487x modules, based on microchip's is187x bluetooth le ics, provide a complete solution to implement bluetooth 4.2 lo w energy connectivity. these modules are interfaced via a two- or four-wire uart interface with microchip's simple ascii command set for easy integration into most applications. all products in the rn series can be dynamically configured by the host microcontroller with a few simple ascii commands. the rn487x series also supports on-board scripting to automate basic operations without a host microcontroller. the RN4870 (12 mm x 22 mm) and rn4871 (9 mm x 11.5 mm) modules combine microchip' s bluetooth le silicon with all necessary peripheral components and an on-board chip antenna to create an easy to use/drop-in solution. all modules in this series are bluetooth sig qualified. the RN4870 and rn4871 include fcc modular certification, as well as most other worldwide government regulatory approvals. for a listing of the latest certifications, go to www.microchip.com/wireless . the RN4870u (12 mm x 15 mm) and rn4871u (6 mm x 8 mm) offer compact, flexible, unshielded options for designs that are extremely space constrained or need to remotely locate the antenna. bluetooth ? 4.2 low energy module
RN4870/71 ds50002489a-page 2 ? 2016 microchip technology inc. table of contents 1.0 device overview ............................................................................................................. ............................................................. 3 2.0 specifications .............................................................................................................. ................................................................. 9 3.0 interface pins.............................................................................................................. ................................................................11 4.0 physical dimensions and attributes .......................................................................................... ................................................. 13 5.0 application reference circuits .............................................................................................. ..................................................... 23 6.0 ascii command api........................................................................................................... ....................................................... 29 7.0 supported services .......................................................................................................... .......................................................... 31 8.0 antenna characteristics ..................................................................................................... ........................................................ 33 9.0 timing characteristics ...................................................................................................... .......................................................... 35 10.0 regulatory approval ........................................................................................................ ........................................................... 37 11.0 ordering information ....................................................................................................... ........................................................... 43 the microchip web site ......................................................................................................... .............................................................. 45 customer change notification service ........................................................................................... ..................................................... 45 customer support ............................................................................................................... ................................................................. 45 product identification system.................................................................................................. ............................................................. 46 to our valued customers it is our intention to provide our valued customers with the be st documentation possible to ensur e successful use of your micro chip products. to this end, we will continue to improve our publicatio ns to better suit your needs. our publications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regardi ng this publication, please contact the ma rketing communications department via e-mail at docerrors@microchip.com . we welcome your feedback. most current data sheet to obtain the most up-to-date version of this data sheet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page . the last character of the literature number is the vers ion number, (e.g., ds30000000a is version a of document ds30000000). errata an errata sheet, describing minor operational differences fr om the data sheet and recommended workarounds, may exist for curren t devices. as device/documentation is sues become known to us, we will publish an er rata sheet. the errata will specify the revisi on of silicon and revision of document to which it applies. to determine if an errata sheet exists for a particu lar device, please check with one of the following: ? microchip?s worldwide web site; http://www.microchip.com ? your local microchip sales office (see last page) when contacting a sales office, please specif y which device, revision of silicon and data sheet (include literature number) you are using. customer notification system register on our web site at www.microchip.com to receive the most current information on all of our products.
? 2016 microchip technology inc. ds50002489a-page 3 RN4870/71 1.0 device overview 1.1 overview the RN4870/71 bluetooth low energy (ble) modules integrate bluetooth 4.2 baseband controller, on-board bluetooth stack, digital and analog i/o, and rf power amplifier into one solution. table 1-1 shows the various options for packaging and features available in the RN4870/71 family. table 1-2 provides the description of the pin functions for all the modules in the RN4870/71 family. figure 1-1 through figure 1-4 show the pinout for the different modules. table 1-1: RN4870/71 family part number (1) antenna on-board shielding number of pins dimensions RN4870-v/rm118 yes yes 33 12 mm x 22 mm RN4870u-v/rm118 no no 30 12 mm x 15 mm rn4871-v/rm118 yes yes 16 9 mm x 11.5 mm rn4871u-v/rm118 no no 17 6 mm x 8 mm note 1: the last three digits in p/n indicate firmware version. at the time of publication, the latest fi rmware version is 1.18. ensure to check product webpage for latest part number and firmware version. table 1-2: pin description RN4870u RN4870 rn4871u rn4871 name type description ? 1 ? ? gnd power ground reference ? 2 ? ? gnd power ground reference 1 3 12 13 gnd power ground reference 2 4 11 14 vbat power positive supply input. range: 1.9v~3.6v ? ? 10 ? bk_in power buck power supply input can be connected to the vbat pin connect to 10 f low esr ceramic capacitor voltage range: 1.9v to 3.6v 35??p2_2d i/ogpio pwm1 default: input; pulled-high 4 6 ? ? vdd_io power v dd ; power input same input pin as vbat can be connected to the vbat pin 5 7 ? ? vdd_io power v dd ; power input same input pin as vbat can be connected to the vbat pin 6 8 ? ? ulpc_o power 1.2v ulpc ldo output used for diagnostic purposes do not connect to any pin or device for measurement, connect a bypass 1 f capacitor to ground 79??p2_3d i/ogpio pwm2 default: input; pulled-high 8 10 ? ? bk_o power 1.55v buck power supply output for diagnostic purpose do not connect ? ? 13 6 p1_6 d i/o a o/p gpio ? ? 14 5 p1_7 d i/o a o/p gpio
RN4870/71 ds50002489a-page 4 ? 2016 microchip technology inc. 9 11 15 15 p2_7 d i/o a i/p gpio; default: input; pulled-high ad14 configured as the tx_ind pin by default 10 12 ? ? p1_1 d i/o a i/p gpio; default: input; pulled-high ad9 configured as the bledk_status1_ind pin by default 11 13 2 3 p1_2 d i/o a i/p gpio; default: input; pulled-high ad10 12 14 3 4 p1_3 d i/o gpio; default: input; pulled-high ad11 13 15 8 11 p0_0 d i/o gpio; default: input; pulled-high ad0 configured as the uart_cts pin by default 14 16 ? ? p1_0 d i/o gpio; default: input; pulled-high ad8 configured as the bledk_status2_ind pin by default 15 17 6 9 p3_6 d i/o gpio; default: input; pulled-high pwm0 configured as the uart_rts pin by default 16 18 16 16 p2_0 d i/p system configuration input; 1: application mode 0: test mode, for flash update and eeprom settings default: input; pulled-high 17 19 ? ? p2_4 d i/o gpio; default: input; pulled-high 18 20 ? ? nc ? no connection 19 21 7 10 rst_n d i/p module reset; active-low; internally pulled-high 20 22 5 7 uart_rx d i/p uart data input 21 23 4 8 uart_tx d o/p uart data output 22 24 ? ? p3_1 d i/o gpio; default: input; pulled-high configured as rssi_ind pin by default 23 25 ? ? p3_2 d i/p gpio; default: input; pulled-high configured as the link_drop pin by default 24 26 ? ? p3_3 d i/p gpio; default: input; pulled-high configured as the uart rx indication pin by default 25 27 ? ? p3_4 d i/p gpio; default: input; pulled-high configured as the pairing_key pin by default 26 28 ? ? p3_5 d i/o a i/p gpio; default: input; pulled-high led1; provides indication whether the module is on/off 27 29 ? ? p0_7 d i/o gpio; default: input; pulled-high configured to the low_battery_indicator pin by default 28 30 9 12 p0_2 d i/o ad2 led0: provides indication whether the module is in on/off mode 29 31 17 2 gnd power ground reference ? 32 ? ? gnd power ground reference table 1-2: pin description (continued) RN4870u RN4870 rn4871u rn4871 name type description
? 2016 microchip technology inc. ds50002489a-page 5 RN4870/71 figure 1-1: pin diagram - RN4870u figure 1-2: pin diagram - RN4870 30 ? 1 1 bt_rf a i/o external antenna connection (50 ohms) ? 33 ? ? gnd power ground reference legend: pin type abbreviations: a = analog d = digital i/o = input/output i/p = input o/p = output table 1-2: pin description (continued) RN4870u RN4870 rn4871u rn4871 name type description tp-2 tp-2 cldo_o tp-1 vcc_pa tp-3 vcc_rf tp-1 tp-3 gnd gnd vbat p2_2 vdd_io vdd_io ulpc_o p2_3 bk_o p2_7/tx_ind p1_1 p1_2 p1_3 p0_0/cts p1_0 p3_6/rts p2_0/mode p2_4 nc rst_n p0_2/led p0_7 p3_5 p3_4 p3_3 p3_2 p3_1 uart_tx uart_rx 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 1 bt_rf 2 30 1 top view bottom view tp-2 tp-2 cldo_o tp-1 vcc_pa tp-3 vcc_rf tp-1 tp-3 gnd gnd gnd gnd gnd gnd vbat p2_2 vdd_io vdd_io ulpc_o p2_3 bk_o p2_7/tx_ind p1_1 p1_2 p1_3 p0_0/cts p1_0 p3_6/rts p2_0/mode p2_4 nc rst_n p0_2/led p0_7 p3_5 p3_4 p3_3 p3_2 p3_1 uart_tx uart_rx 1 33 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 top view bottom view
RN4870/71 ds50002489a-page 6 ? 2016 microchip technology inc. figure 1-3: pin diagram - rn4871u figure 1-4: pin diagram - rn4871 3 4 1 2 5 6 7 8 9 13 10 11 12 14 15 16 17 17 1 tp-1 tp-2 tp-3 tp-4 tp-5 vbat bk_in gnd p1_6 p1_7 p2_7 p2_0 gnd bt_rf p1_2 p1_3 uart_tx uart_rx rst_n p3_6 p0_2 p0_0 tp-1 cldo_o vcc_pa tp-3 vcc_rf tp-2 tp-4 ulpc_o tp-5 bk_o top view bottom view cldo_o tp-5 tp-3 vcc_pa tp-2 vcc_rf tp-4 ulpc_o bk_o tp-1 1 2 3 4 5 bt_rf p1_2 gnd p1_7 p1_3 15 16 p2_7 p2_0 14 vbat 13 gnd p0_2 12 6 7 8 9 10 11 uart_tx rst_n p3_6 p0_0 uart_rx p1_6 tp-1 tp-2 tp-3 tp-4 tp-5 top view bottom view
? 2016 microchip technology inc. ds50002489a-page 7 RN4870/71 1.2 module configuration the gpio pins of the RN4870 and rn4871 modules can be configured to different functions using the ascii command interface. ta b l e 1 - 3 shows the various pins in the RN4870/71 module that are available for configuration and their default configuration settings. table 1-4 provides details on each functions available. table 1-5 shows the status of the module as indicated by the status 1 and status 2 indication pins. table 1-6 shows the details of test pads that are present on the bottom side of the module, used for diagnostic purposes during testing. figure 1-5 shows all the key elements of the module. table 1-3: configurable pins and default functions in the RN4870 and rn4871 pin name available in default function RN4870 rn4871 p0_7 x ? low battery indication p1_0 x ? status 2 p1_1 x ? status 1 p2_2 x ? none p2_4 x ? none p3_1 x ? rssi indication p3_2 x ? link drop p3_3 x ? uart rx indication p3_4 x ? pairing key p3_5 x ? none p1_2 x x none p1_3 x x none p1_6 ? x uart rx indication p1_7 ? x none table 1-4: configurable f unctions and descriptions function name description low battery indication pin output goes low when the v dd is below a specified level. to set the threshold level, change t he eeprom settings. status 1 use this indication pin along with the st atus 2 pin to indicate the current status of the module. refer to table 1-5 for details of the status indication. status 2 use this indication pin along with the st atus 1 pin to indicate the current status of the module. refer to table 1-5 for details of the status indication. rssi indication use this indication pin to indicate the quality of the link based on the rssi level. if the rssi level is lower than the s pecified threshold value, then the rssi indication pin goes low. se t the threshold for the rssi link quality in eeprom. link drop use this pin to force the module to drop the current ble link with a peer device. pulling the link drop pin low forces the connection to close. the pin needs to be pulled low for at least 10 ms. uart rx indication use this pin to enable communication with the uart when the module is in low- power mode. when not in low-power mode, the module runs on a 16 mhz clock. if low-power mode is enabled on the module by using command so,1 , the module runs on a 32 khz clock thus reducing power consumption. however, in low-power mode, the host mcu cannot communicate with the module via the uart since the uart is not operational. if the user intends to provide data or commands via uart in the low-power mode, then the uart rx indication pin must be pulled low and the user needs to wait for at least five milliseconds before sending the data. pulling the uart rx indication pin low allows the module to operate the 16 mhz clock and to enable uart.
RN4870/71 ds50002489a-page 8 ? 2016 microchip technology inc. figure 1-5: block diag ram of the RN4870/71 pairing key use this pin to force the module to enter standby mode. the pin must be pulled down for at least 160 ms. rf active indication use this indication pin to indi cate that the module is currently performing an active transmission and receiving ble data. table 1-5: status indication pins status 1 status 2 state high high power on high low standby state low low connection established low high data session open (transparent uart) table 1-6: test points on the bottom side RN4870u RN4870 rn4871u rn4871 symbol description tp-1 tp-1 tp-3 tp-3 vcc_pa 1.55v rf pa ldo tp-2 tp-2 tp-1 tp-5 cldo_o 1.2v cldo output tp-3 tp-3 tp-2 tp-2 vcc_rf 1.2v rf ldo output ? ? tp-4 tp-4 ulpc_o 1.2v ulpc ldo output ? ? tp-5 tp-1 bk_o 1.55v buck reg output table 1-4: configurable functions and descriptions (continued) function name description RN4870/rn4871
? 2016 microchip technology inc. ds50002489a-page 9 RN4870/71 2.0 specifications table 2-1 provides the general sp fdjgjdbujpot g or the module. table 2-2 and ta b l e 2 - 3 provide the electrical characteristics and the current consumption of the module. table 2-1: general specifications specification description standard compliance bluetooth 4.2 frequency band 2.402 to 2.480 ghz modulation method gfsk maximum data rate (trans parent uart) 10 kbps (ios ? 9) antenna ceramic interface uart, aio, pio operating range 1.9v to 3.6v sensitivity -90 dbm rf tx power 0 dbm operating temperature range -20c to +70c storage temperature range -65c to +150c operating relative humidity range 10% to 90% storage relative humidity range 10% to 90% moisture sensitivity level 2 table 2-2: electrical characteristics parameter min. typ. max. units supply voltage (v dd ) 1.9 ? 3.6 v i/o supply voltage (vdd_io = v dd ) 1.9 ? 3.6 v i/o voltage levels v il input logic levels low v ss ? 0.3 v dd v v ih input logic levels high 0.7 v dd ?v dd v v ol output logic levels low vss ? 0.2 v dd v v oh output logic levels high 0.8 v dd ?v dd v reset v th , res threshold voltage ? 1.6 ? v reset low duration 63 ? ? ns input and tri-state current with pull-up resistance 34 48 74 k ? pull-down resistance 29 47 86 k ? leakage current -1 ? 1 a adc (analog to digital converter) full scale (bat_in) 0 3.0 3.6 v full scale (ad0~ad15) 0 ? 3.6 v conversion time (enob 8-bit) ? 131 ? s conversion time (enob 10-bit) ? 387 ? s operating current ? ? 500 a
RN4870/71 ds50002489a-page 10 ? 2016 microchip technology inc. table 2-3: current consumption parameter min. typ. max. units supply current tx mode peak current at v dd = 3v, tx = 0 dbm, buck mode ? ? 13 ma rx mode peak current at v dd = 3v, buck mode ? ? 13 ma link static current ? 60 ? a standby current 1.9 ? 2.9 a power-saving 1 ? 1.7 a temperature sensor (pts) temperature range detected -20 ? +70 c digital output 1387 ? 2448 ? resolution ? 12 ? units/deg accuracy -3 ? +3 c conversion time (enob 10-bit) ? 12.35 ? ms operating current ? ? 200 a table 2-4: current consumption du ring various application modes test mode test condition (1) average current consumption remarks standby mode advertising interval: 100 ms 0.23 ma ? advertising interval: 500 ms 0.077 ma ? ble connected mode (no data exchange) connection interval: 500 ms 0.08 ma module set in transparent uart mode transparent uart enabled data transmission in progress connection interval: 18.75 ms 3.87 ma tx data throughput: 9.863 kbps connection interval: 40 ms 2.77 ma tx data throughput: 4.676 kbps transparent uart enabled data being received connection interval: 18.75 ms 3.06 ma (write with response) throughput: 4.956 kbps 3.9 ma (write with reliable burst transmit) throughput: 9.382 kbps connection interval: 40 ms 2.14 ma (write with response) throughput: 2.494 kbps (write with response) 3.03 ma (write with reliable burst transmit) throughput: 5.056 kbps shutdown mode ? 1.44 a ? note 1: test conditions: input volt age: 3.3v; test phone: iphone6 with ios 9.02 version
? 2016 microchip technology inc. ds50002489a-page 11 RN4870/71 3.0 interface pins figure 3-1 shows the power scheme using a 3.3v low-dropout regulator to the rn487x and a host mcu. this scheme ensures that the same voltage is used for both the module and the mcu. figure 3-1 also shows the basic uart connections to the host mcu. figure 3-2 shows the recommended connections for running the RN4870/71 on coin cell battery. figure 3-1: power scheme system configurator system configurator note 1: ensure vdd_io and mcu v dd voltages are compatible 2: control and indication ports are configurable 3: to implement low-power operation, enable the uart_rx_ind pin and connect to ground. note 1: ensure vdd_io and mcu v dd voltages are compatible 2: control and indication ports are configurable 3: 10 f (x5r) and 330 ohm resistor are required for rn487x 4: bk_in connects to vbat for rn4871u 5: to implement low-power operation, enable the uart_rx_ind pin and connect to ground. RN4870/71/70u rn4871u
RN4870/71 ds50002489a-page 12 ? 2016 microchip technology inc. figure 3-2: RN4870/71 coin cell power scheme the configuration pins on the RN4870 can also be configured through windows ? -based user interface (ui) configuration tool, bledk3. RN4870/71 note 1: application includes adc, pwm (RN4870), and i 2 c bus interface 2: bk_in connection is needed only for rn4871u. 3: to implement low-power operation, enable the uart_rx_ind pin and connect to ground.
? 2016 microchip technology inc. ds50002489a-page 13 RN4870/71 4.0 physical dimensions and attributes 4.1 RN4870 module figure 4-1 shows the physical dimensions of the RN4870 module. figure 4-2 illustrates the recom- mended pcb layout, and figure 4-3 shows the recom- mended mounting details. ensure that there is no top copper layer near the test pin area, indicated by the shaded keep out areas , as shown in figure 4-2 . when laying out the host pcb, the areas under the antenna must not contain any top, inner layer, or bottom copper as shown in figure 4-3 . a low-impedance ground plane ensures the best radio performance (best range; lowest noise). figure 4-3 also shows a minimum ground plane area to the left and right side of the module for best antenna performance. the ground plane can be extended beyond the minimum recommended as required for host pcb emc noise reduction. for best range performance, keep all external metal at least 30 mm away from the ceramic chip antenna. figure 4-1: RN4870 module dimensions
RN4870/71 ds50002489a-page 14 ? 2016 microchip technology inc. figure 4-2: RN4870 recommended pcb footprint figure 4-3: recommended mounting details
? 2016 microchip technology inc. ds50002489a-page 15 RN4870/71 4.2 RN4870u module figure 4-4 shows the physical dimensions of the RN4870u module. figure 4-5 illustrates the recom- mended pcb layout, and figure 4-6 shows the recom- mended mounting details. a low-impedance ground plane ensures the best radio performance (best range; lowest noise). pin 30 (bt_rf) is a 50 ohm connection that can be connected to an external antenna such as a pcb trace antenna, a component (chip) antenna, or through a host pcb 50 ohm micro-strip trace. this trace can be extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test posts. it is recommended that the micro-strip trace to be as short as possible for minimum loss and best impedance matching. if the micro-strip trace is longer, a 50 ohm impedance is recommended. figure 4-4: RN4870u module dimensions
RN4870/71 ds50002489a-page 16 ? 2016 microchip technology inc. figure 4-5: RN4870u recommended pcb footprint figure 4-6: RN4870u recommended pcb mounting
? 2016 microchip technology inc. ds50002489a-page 17 RN4870/71 4.3 rn4871 module figure 4-7 shows the physical dimensions of the rn4871 module. figure 4-8 illustrates the recom- mended pcb layout, and figure 4-9 shows the recom- mended mounting details. ensure that there is no top copper layer near the test pin area, indicated by the shaded keep out areas , as shown in figure 4-8 . when laying out the host pcb, the areas under the antenna must not contain any top, inner layer, or bottom copper as shown in figure 4-9 . a low-impedance ground plane ensures the best radio performance (best range; lowest noise). figure 4-9 also shows a space area around antenna section for best antenna performance. the ground plane can be extended beyond the minimum recommended as required for host pcb emc noise reduction. for best range performance, keep all external metal at least 30 mm away from the ceramic chip antenna. figure 4-7: rn4871 module dimensions
RN4870/71 ds50002489a-page 18 ? 2016 microchip technology inc. figure 4-8: rn4871 recommended pcb footprint figure 4-9: rn4871 recommend ed pcb mounting suggestion
? 2016 microchip technology inc. ds50002489a-page 19 RN4870/71 4.4 rn4871u module figure 4-10 shows the physical dimensions of the rn4871u module. figure 4-11 illustrates the recom- mended pcb layout. it is highly recommended to layout the host pcb as suggested in figure 4-12 . figure 4-13 shows the recommended placement for the module on the host pcb board. for optimal transmission and reception sensitivity, place the module at the edge of the board. a low-impedance ground plane ensures the best radio performance (best range; lowest noise). pin 1 (bt_rf) is a 50 ohm connection that can be connected to an external antenna such as a pcb trace antenna, a component (chip) antenna, or through a host pcb 50 ohm micro-strip trace. this trace can be extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test posts. it is recommended that the micro-strip trace to be as short as possible for minimum loss and best impedance matching. if the micro-strip trace is longer, a 50 ohm impedance is recommended. figure 4-10: rn4871u module dimensions top view bottom view side view
RN4870/71 ds50002489a-page 20 ? 2016 microchip technology inc. figure 4-11: rn4871u recommended pcb footprint figure 4-12: rn4871u re commended pcb mounting
? 2016 microchip technology inc. ds50002489a-page 21 RN4870/71 figure 4-13: recommendation s for the placemen t of the module on the host pcb board 4.5 soldering recommendations the RN4870/71 bluetooth modules are assembled using standard lead-free reflow profile ipc/jedec j-std-020. the module can be soldered to the host pcb using standard leaded and lead-free solder reflow profiles. to avoid damaging the module, the following recom- mendations are given: ? microchip technology application note, ?an233 solder reflow recommendation? (ds00233) provides solder reflow recommendations ?do not exceed peak temperature (t p ) of 250c ? refer to the solder paste data sheet for specific reflow profile recommendations ? use no-clean flux solder paste ?do not wash as moisture can be trapped under the shield ? use only one flow. if the pcb requires multiple flows, apply the module on the final flow. acceptable best acceptable lowest performance
RN4870/71 ds50002489a-page 22 ? 2016 microchip technology inc. notes:
? 2016 microchip technology inc. ds50002489a-page 23 RN4870/71 5.0 application reference circuits 5.1 external configuration and programming the RN4870/71 modules can be configured and firm- ware programmed using an external configuration and programming tool. figure 5-1 shows the mandatory connections required between the module and the external programming header. it is recommended to include these pin connections on the host pcb for development. for accessing the various configuration and indication pins, use ta b l e 1 - 2 , ta b l e 1 - 3 , table 1-4 and ta b l e 1 - 5 . 5.2 reference circuit figure 5-2 through figure 5-5 show the reference circuits for various modules under the RN4870/71 fam- ily. in the circuits, the power input range is 1.9v ~ 3.6v. a battery reverse protection circuit is recommended in case a battery power input is used. note that the vdd_io is the same as the power input. in case of a led connection, the power input must be greater than 3.0v. for the RN4870u, an rf antenna matching circuit must also be included as shown in figure 5-3 . figure 5-1: external programming header configurations RN4870/71 1p2_0 p2_0 vbat 1rxd 1txd 1gnd rxd txd gnd 1 vbat
RN4870/71 ds50002489a-page 24 ? 2016 microchip technology inc. figure 5-2: RN4870 reference circuit RN4870 gnd 1 gnd 2 gnd 3 vbat 4 p2_2 5 vdd_io 6 vdd_io 7 ulpc_o 8 p2_3 9 bk_o 10 p2_7/tx_ind 11 p1_1 12 p1_2/scl 13 p1_3/sda 14 p0_0/cts 15 p1_0 16 p3_6/rts 17 p2_0/mode 18 p2_4 19 nc 20 rst 21 uart_rx 22 uart_tx 23 p3_1 24 p3_2 25 p3_3 26 p3_4 27 p3_5 28 p0_7 29 p0_2 30 gnd 31 gnd 32 gnd 33 rn4 8 7 0 g n d g n d g n d v b a t p 2 _ 2 vdd_ io v dd _ io u lpc _ o p 2 _ 3 bk_ o p 2 _ 7 / tx_ ind p1 _ 1 p 1 _ 2 / scl p1 _ 3 /s d a p 0 _ 0 / c t s p 1 _ 0 p 3 _ 6 / r t s p 2 _ 0 / m o d e p 2 _ 4 n c r s t uart _ r x ua rt_ tx p 3 _ 1 p 3 _ 2 p 3 _ 3 p 3 _ 4 p 3 _ 5 p 0 _ 7 p 0 _ 2 g n d g n d g n d u1 b ld1 gnd gnd 330 r1 gnd vcc vcc uart_tx uart_rx p0_2 p0_0 p1_0 p1_1 p1_2 p1_3 p0_7 p2_0 p2_2 p2_3 p2_4 p2_7 p3_1 p3_2 p3_3 p3_4 p3_5 p3_6 4.7k r2 vcc p0_7 p3_1 p3_2 p3_3 p3_4 p3_5 3 2 1 sts2301 q1 p0_0 p1_0 p2_0 p2_4 p3_6 p1_1 p1_2 p1_3 p2_3 p2_7 p2_2 configurable i/o p2_0 mode low high test mode app mode p 2 _ 0 l o w hi g h m o de t e s t m o de app m o de 1 2 j1 gnd 1 2 3 4 5 j2 gnd power input reverse voltage protection configuration interface vcc uart_tx uart_rx uart interface led option p0_2 10uf 6.3v x5r c1 gnd 1uf c2 gnd rst
? 2016 microchip technology inc. ds50002489a-page 25 RN4870/71 figure 5-3: RN4870u reference circuit gnd 1 vbat 2 p2_2 3 vdd_io 4 vdd_io 5 ulpc_o 6 p2_3 7 bk_o 8 p2_7/tx_ind 9 p1_1 10 p1_2/scl 11 p1_3/sda 12 p0_0/cts 13 p1_0 14 p3_6/rts 15 p2_0/mode 16 p2_4 17 nc 18 rst 19 uart_rx 20 uart_tx 21 p3_1 22 p3_2 23 p3_3 24 p3_4 25 p3_5 26 p0_7 27 p0_2 28 gnd 29 bt_rf 30 g n d v b at p 2 _ 2 vdd_ i o vdd_ i o u lpc _ o p2 _ 3 bk _ o p 2 _ 7 / tx_ ind p 1 _ 1 p 1 _ 2 / sc l p 1 _ 3 /s d a p 0 _ 0 / c t s p 1 _ 0 p 3 _ 6 / r t s p 2 _ 0 / m o d e p 2 _ 4 n c r s t u art _ r x ua rt _ tx p3 _ 1 p3 _ 2 p3 _ 3 p3 _ 4 p3 _ 5 p0 _ 7 p0 _ 2 g nd bt_ rf RN4870u u1 b ld1 gnd gnd 330 r1 gnd vcc vcc uart_tx uart_rx p0_2 p0_0 p1_0 p1_1 p1_2 p1_3 p0_7 p2_0 p2_2 p2_3 p2_4 p2_7 p3_1 p3_2 p3_3 p3_4 p3_5 p3_6 4.7k r2 vcc p0_7 p3_1 p3_2 p3_3 p3_4 p3_5 3 2 1 sts2301 q1 p0_0 p1_0 p2_0 p2_4 p3_6 p1_1 p1_2 p1_3 p2_3 p2_7 p2_2 configurable i/o p2_0 mode low high test mode app mode p2 _ 0 l o w hi g h m o de t e s t m o de app m o de 1 2 j1 gnd 1 2 3 4 5 j2 gnd power input reverse voltage protection configuration interface vcc uart_tx uart_rx uart interface led option p0_2 c3 c4 ant1 1nh l1 10uf 6.3v x5r c1 gnd 1uf c2 gnd gnd antenna matching rst
RN4870/71 ds50002489a-page 26 ? 2016 microchip technology inc. figure 5-4: rn4871 reference circuit vbat 14 p2_7 15 p1_6 6 p1_2 3 p1_3 4 p0_0 11 p3_6 9 p2_0 16 rst 10 uart_rx 7 uart_tx 8 p0_2 12 gnd 13 bt_rf 1 p1_7 5 gnd 2 rn4871 u1 b ld1 gnd 330 r1 gnd vcc vcc uart_tx uart_rx p0_2 p1_2 p1_3 p1_7 p2_7 4.7k r2 vcc p0_2 3 2 1 sts2301 q1 p0_0 p2_0 p1_6 p3_6 p1_2 p1_3 p2_7 p2_0 configurable i/o p2_0 mode low high test mode app mode p 2 _ 0 l o w hi gh m o de t e s t mode a pp m ode 1 2 j1 gnd 1 2 3 4 5 j2 gnd power input reverse voltage protection configuration interface vcc uart_tx uart_rx uart interface led option p0_2 10uf 6.3v x5r c1 gnd gnd p0_0 p2_0 p3_6 p1_6 p1_7 1uf c2 gnd rst
? 2016 microchip technology inc. ds50002489a-page 27 RN4870/71 figure 5-5: rn4871u reference circuit vbat 11 bk_i 10 p2_7 15 p1_6 13 p1_2 2 p1_3 3 p0_0 8 p3_6 6 p2_0 16 rst 7 uart_rx 5 uart_tx 4 p0_2 9 gnd 17 bt_rf 1 p1_7 14 gnd 12 rn4871u u1 b ld1 gnd 330 r1 gnd vcc vcc uart_tx uart_rx p0_2 p1_2 p1_3 p1_7 p2_7 4.7k r2 vcc p0_2 3 2 1 sts2301 q1 p0_0 p2_0 p1_6 p3_6 p1_2 p1_3 p2_7 p2_0 configurable i/o p2_0 mode low high test mode app mode p2_0 low hi gh mo de tes t mode a pp m ode 1 2 j1 gnd 1 2 3 4 5 j2 gnd power input reverse voltage protection configuration interface vcc uart_tx uart_rx uart interface led option p0_2 10uf 6.3v x5r c1 gnd p0_0 p2_0 p3_6 p1_6 p1_7 gnd 1uf c2 gnd gnd c3 c4 ant1 1nh l1 gnd antenna matching rst
RN4870/71 ds50002489a-page 28 ? 2016 microchip technology inc. 5.3 power drop protection to prevent any problems that may arise when the power supply goes below 1.9v, a power-supply drop- protection circuit is recommended. essentially, this circuit consists of a reset ic which acts as an open drain with a delay =< 10 ms, and is triggered at 1.8v power supply. figure 5-6 shows a recommended power drop protection circuit. figure 5-6: power drop protection circuit RN4870/71 vbat rst_n reset ic out vdd
? 2016 microchip technology inc. ds50002489a-page 29 RN4870/71 6.0 ascii command api the RN4870/71 command application programming interfaces (apis) are documented in the ?RN4870/71 bluetooth ? low energy module user's guide? (ds50002466a). the following are the available command options and their categories: ? connection - establish connection - disconnect - bond/unbond current connection - start/stop scan for other devices - add/delete peer devices to white list - read rssi values - stop connection process ?i/o - read/write i 2 c - change settings in the eeprom - configure pin functions - configure gpio mask - set/get gpio states - read and write analog data -pwm control ? system - reboot - factory default - enter and exit command mode - enter low-power mode ?scripting - enter script mode - declare event handler - execute current script - list current script - clear script - define user function ?gatt services - create/delete public services/characteristics - read/write characteristic values - set notification for characteristics ? gap role - central, peripheral, observer and broadcaster ? advertising - start/stop - set custom advertisement content - set scan response content - set beacon content ? private service - create/delete private services/characteristics - read/write characteristic values - set notification for characteristics ? transparent uart - enable/disable - peripheral side configuration - central side configuration ? remote configuration of the module ? read individual device information or profile settings
RN4870/71 ds50002489a-page 30 ? 2016 microchip technology inc. notes:
? 2016 microchip technology inc. ds50002489a-page 31 RN4870/71 7.0 supported services the RN4870 supports four built-in gatt services: ? device information public service ? airpatch private service, which handles over the air (ota) updates ? beaconthings, which handles beacon services control ? uart transparent private service, which handles data streaming function in addition to the above predefined private services, the RN4870 provides the ability to create private services. if the services are supported on both end points of a bluetooth low energy connection, such as central and peripheral devices, data can be exchanged. for example, two RN4870 modules can define a custom (private) service with its own unique characteristics. data can be exchanged easily via command api. private services are not registered with the bluetooth sig, and therefore not interoperable with other bluetooth low energy devices, unless the device implements the private servic e. an example of a built- in private service is the transparent uart. for an example on how to create a custom service using the RN4870, refer to ?RN4870/71 bluetooth ? low energy module user's guide? (ds50002466a). RN4870 allows custom defined services up to five public and four private services. each custom defined service allows up to eight custom defined characteristics. all servic e definitions are saved in on-board non-volatile memory (nvm) where the user must setup the module only once.
RN4870/71 ds50002489a-page 32 ? 2016 microchip technology inc. notes:
? 2016 microchip technology inc. ds50002489a-page 33 RN4870/71 8.0 antenna characteristics the RN4870 and rn4871 modules contain an integral ceramic chip antenna. figure 8-1 and figure 8-2 show the antenna performance on the modules. figure 8-1: RN4870 antenna performance parameter values frequency 2450 mhz max gain 1.63 dbi efficiency 71.55% antenna description manufacturer part number manufacturer ant ant3216a063r2400a pifa 2.4ghz l3 2w1.6 ant3216a063r2400a yageo
RN4870/71 ds50002489a-page 34 ? 2016 microchip technology inc. figure 8-2: rn4871 antenna performance parameter values frequency 2442 mhz max gain 0.1 dbi efficiency 42.7% antenna description manufacturer part number manufacturer ant aant3216ll00r2400a pifa 2.4ghz l3 2w1.6 ant3216ll00r2400a yageo
? 2016 microchip technology inc. ds50002489a-page 35 RN4870/71 9.0 timing characteristics figure 9-1 shows the timing diagram for the RN4870/ 71 modules when it is reset in the test mode and application mode. figure 9-2 shows the timing diagram for the module when it is powered on. in application mode, when RN4870/71 is ready to talk to mcu after reset, the module provides a uart response indicating that the reset is complete. for more details, refer to the ?RN4870/71 bluetooth ? low energy mod- ule user's guide? (ds50002466a). figure 9-1: timing diagram of RN4870/ 71 uart ready after r eset (in test and application mode) figure 9-2: timing diagram of RN4870/71 uart when powered on (in test and application mode) ext reset 1ms p2_0=0 p2_0=1 25ms test mode process application mode process 46ms 68ms uart ready for mcu uart ready for mcu status pin/uart report command vbat p2_0=0 p2_0=1 25ms test mode process application mode process 46ms 68ms uart ready for mcu uart ready for mcu status pin/uart report command
RN4870/71 ds50002489a-page 36 ? 2016 microchip technology inc. table 9-1 shows the error rate for various uart baud rates for the RN4870/71 m odule. the system clock is running at 16 mhz. table 9-1: error rate for various baud rates on the RN4870/71 set baud rate measur ed baud rate error 921600 941176 -2.12% 460800 457143 0.79% 307200 307692 -0.16% 230400 231884 -0.64% 115200 115942 -0.64% 57600 57971 -0.64% 38400 38095 0.79% 19200 19048 0.79% 9600 9524 0.79%
? 2016 microchip technology inc. ds50002489a-page 37 RN4870/71 10.0 regulatory approval this section outlines the regulatory information for the RN4870/71 module for the following countries: ? united states ? canada ? europe ? japan ? korea ? taiwan ? other regulatory jurisdictions 10.1 united states the RN4870/71 module has received federal commu- nications commission (fcc ) cfr47 telecommunica- tions, part 15 subpart c ?int entional radiators? single- modular approval in accor dance with part 15.212 mod- ular transmitter approval. single-modular transmitter approval is defined as a complete rf transmission sub-assembly, designed to be incorporated into another device, that must demonstrate compliance with fcc rules and policies independent of any host. a transmitter with a modular grant can be installed in dif- ferent end-use products (referred to as a host, host product, or host device) by the grantee or other equip- ment manufacturer, then the host product may not require additional testing or equipment authorization for the transmitter function provided by that specific module or limited module device. a host product itself is required to comply with all other applicable fcc equipment au thorization regulations, requirements, and equipmen t functions that are not associated with the transmitter module portion. for example, compliance must be demonstrated: to regula- tions for other transmitter components within a host product; to requirements for unintentional radiators (part 15 subpart b), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter m odule (i.e., verification or declaration of conformity) as appropriate (e.g., blue- tooth and wi-fi transmitter modules may also contain digital logic functions). 10.1.1 labeling and user information requirements the RN4870 module has been labeled with its own fcc id number, and if the fcc id is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. this exterior label can use wording as follows: for the RN4870 module: due to the limited size of the rn4871, the fcc identi- fier (fcc id) is not displayed on the module. therefore, the fcc id must be placed on the outside of the fin- ished product into which t he module is installed must also display a label referring to the enclosed module. this exterior label can use wording as follows: for the rn4871 module: contains transmitter module fcc id: a8tbm70abcdefgh or contains fcc id: a8tbm70abcdefgh this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. contains transmitter module fcc id: a8tbm71s2 or contains fcc id: a8tbm71s2 this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
RN4870/71 ds50002489a-page 38 ? 2016 microchip technology inc. a user?s manual for the product should include the fol- lowing statement: additional information on labeling and user information requirements for part 15 devices can be found in kdb publication 784748 available at the fcc office of engi- neering and technology (oet) laboratory division knowledge database (kdb) http://apps.fcc.gov/oetcf/kdb/index.cfm . 10.1.2 rf exposure all transmitters regulated by fcc must comply with rf exposure requirements. kd b publication 447498 gen- eral rf exposure guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or de vices comply with limits for human exposure to radio frequency (rf) fields adopted by the federal communications commission (fcc). output power listed is conducted. this grant is valid only when the module is sold to oem integrators and must be installed by the oe m or oem integrators. this transmitter is restricted for use with the specific antenna(s) tested in this ap plication for certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with fcc multi-transmit- ter product procedures. this module is approved for installation into mobile or/and portable host platforms. 10.1.3 helpful web sites federal communications commission (fcc): http://www.fcc.gov fcc office of engineering and technology (oet) lab- oratory division knowl edge database (kdb): http://apps.fcc.gov/oetcf/kdb/index.cfm 10.2 canada the RN4870/71 module has been certified for use in canada under industry canada (ic) radio standards procedure (rsp) rsp-100, radio standards specification (rss) rss-gen, rss-210, and rss- 247. modular approval permits the installation of a module in a host device without the need to recertify the device. 10.2.1 labeling and user information requirements labeling requirements (from rsp-100 - issue 10, section 3): the host device shall be properly labeled to identify the module within the host device. modular devices (from rsp-100 - issue 10, section 7): the industry canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the industry ca nada certification number of the module, preceded by the words ?contains transmit- ter module?, or the word ?c ontains?, or similar wording expressing the same meaning, as follows: for the RN4870 module: due to the limited size of the rn4871, the industry canada certification number is not displayed on the module. therefore, the host device must be labeled to display the industry canada certification number of the module, preceded by the words ?contains transmitter module?, or the word ?cont ains?, or similar wording expressing the same meaning, as follows: this equipment has been tested and found to comply with the limits for a class b di gital device, pursuant to part 15 of the fcc rules. these limits are designed to provide reasonable protection against harmful interference in a residential installation. this equip- ment generates, uses and can radiate radio fre- quency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. however, there is no guarantee that interference will not occur in a particular installation. if this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the follow- ing measures: ? reorient or relocate the receiving antenna. ? increase the separati on between the equipment and receiver. ? connect the equipment into an outlet on a circuit different from that to wh ich the receiver is con- nected. ? consult the dealer or an experienced radio/tv technician for help. contains transmitter module ic: 12246a-bm70bles1f2 contains transmitter module ic: 12246a-bm71s2
? 2016 microchip technology inc. ds50002489a-page 39 RN4870/71 user manual notice for license-exempt radio appara- tus (from section 8.4, rss-gen, issue 4, november 2014): user manuals for license-exempt radio appara- tus shall contain the following or equivalent notice in a conspicuous location in the user manual or alterna- tively on the device or both: 10.2.2 rf exposure all transmitters regulated by ic must comply with rf exposure requirements listed in rss-102 - radio fre- quency (rf) exposure compliance of radiocommuni- cation apparatus (all frequency bands). 10.2.3 helpful web sites industry canada: http://www.ic.gc.ca/ 10.3 europe the RN4870/71 module is an r&tte directive assessed radio module that is ce marked and has been manufactured and tested with the intention of being integrated into a final product. the RN4870/71 module has been tested to r&tte directive 1999/5/ec essential requirements for health and safety (article (3.1(a )), electromagnetic compati- bility (emc) (article 3.1(b)), and radio (article 3.2) and are summarized in table 10-1 and ta b l e 1 0 - 2 euro- pean compliance testing. a notified body opinion has also been issued. all test reports are available on the RN4870/71 product web page at http://www.micro- chip.com . the r&tte compliance association provides guid- ance on modular devi ces in document technical guidance note 01 available at http://www.rtteca.com/html/download_area.htm . 10.3.1 labeling and user information requirements the label on the final product which contains the RN4870/71 module must follow ce marking require- ments. the r&tte compliance association technical guidance note 01 provides guidance on final product ce marking. this device complies with industry canada's license- exempt rsss. operation is subject to the following two conditions: (1) this device may not cause interference; and (2) this device must accept any interference, includ- ing interference that may cause undesired operation of the device. le prsent appareil est conforme aux cnr d'indus- trie canada applicables aux appareils radio exempts de licence. l'exploitation est autorise aux deux con- ditions suivantes: (1) l'appareil ne doit pas produire de brouillage; (2) l'utilisateur de l'apparei l doit accepter tout brouil- lage radiolectrique subi, mme si le brouillage est susceptible d'en compromettre le fonctionnement. note: to maintain conformance to the testing listed in table 10-1 , the module shall be installed in accordance with the installa- tion instructions in this data sheet and shall not be modified. when integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is theref ore responsible for demonstrating compliance of the final product with the essential requirements of the r&tte directive.
RN4870/71 ds50002489a-page 40 ? 2016 microchip technology inc. 10.3.2 helpful web sites a document that can be used as a starting point in understanding the use of short range devices (srd) in europe is the european radio communications committee (erc) recommendation 70-03 e, which can be downloaded from the european radio commu- nications office (ero) at: http://www.ero.dk/ . additional helpful web sites are: ? radio and telecommunications terminal equip- ment (r&tte): http://ec.europa.eu/enter prise/rtte/index_en.htm ? european conference of postal and telecommu- nications administrations (cept): http://www.cept.org/ ? european telecommunications standards insti- tute (etsi): http://www.etsi.org ? european radio communications office (ero): http://www.ero.dk/ ? the radio and telecommunications terminal equipment compliance association (r&tte ca): http://www.rtteca.com/ table 10-1: european compliance testing for RN4870 table 10-2: european compliance testing for rn4871 certification standards arti cle laboratory report number safety en60950-1:2006/a11:2009/a1:2010/ a12:2011/a2:2013 (3.1(a)) tuv rheinland 10051261 003 health en 62479:2010 10053580 001 emc en 301 489-1 v1.9.2 (3.1(b)) 10051137 002 en 301 489-17 v2.2.1 radio en 300 328 v1.9.1 (3.2) 10053580 001 notified body opinion 10048935 001 certification standards article laboratory report number safety en60950-1:2006/a11:2009/a1:2010/ a12:2011/a2:2013 (3.1(a)) tuv rheinland 10053210 001 health en 62479:2010 10053433 001 emc en 301 489-1 v1.9.2 (3.1(b)) 10052964 001 en 301 489-17 v2.2.1 radio en 300 328 v1.9.1 (3.2) 10053433 001 notified body opinion 10048936 001
? 2016 microchip technology inc. ds50002489a-page 41 RN4870/71 10.4 japan the RN4870/71 module has rece ived type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the ministry of internal affairs and communications (mic) of japan pursuant to the radio act of japan. integration of this module into a final product does not require additional radio cert ification provided installa- tion instructions are followed and no modifications of the module are allowed. additional testing may be required: ? if the host product is subject to electrical appli- ance safety (for example, powered from an ac mains), the host product may require product safety electrical appliance and material (pse) testing. the integrator sh ould contact their confor- mance laboratory to determ ine if this testing is required. ? there is a voluntary electromagnetic compatibil- ity (emc) test for the ho st product administered by vccii: http://www.vcci.jp/vcci_e/index.html 10.4.1 labeling and user information requirements the label on the final product which contains the RN4870/71 module must follow japan marking requirements. the integrator of the module should refer to the labeling requirements for japan available at the ministry of internal affairs and communications (mic) website. the RN4870 module is labeled with its own technical conformity mark and certification number. the final product in which this module is being used must have a label referring to the type certified module inside: due to the limited size of the rn4871, the technical conformity mark and certif ication number is not dis- played on the module. therefore, the final product in which this module is being used must have a label referring to the type certified module inside: 10.4.2 helpful web sites ministry of internal affa irs and communications (mic): http://www.tele.soumu.go.jp/e/index.htm association of radio industries and businesses (arib): http://www.arib. or.jp/english/ 10.5 korea the RN4870/71 module has received certification of conformity in accordance with the radio waves act. integration of this module into a final product does not require additional radio certif ication provided installa- tion instructions are followed and no modifications of the module are allowed. 10.5.1 labeling and user information requirements the label on the final product which contains the RN4870/71 module must follow kc marking require- ments. the integrator of the module should refer to the labeling requirements for korea available on the korea communications commission (kcc) website. the RN4870 module is labeled with its own kc mark. the final product requires the kc mark and certificate number of the module: due to the limited size of the rn4871, the kc mark is not displayed on the module. therefore, final product requires the kc mark and certificate number of the module: 10.5.2 helpful web sites korea communications commission (kcc): http://www.kcc.go.kr . national radio research agency (rra): http://rra.go.kr. contains transmitter modul e with certificate number: contains transmitter modul e with certificate number:
RN4870/71 ds50002489a-page 42 ? 2016 microchip technology inc. 10.6 taiwan the RN4870/71 module has received compliance approval in accordance wit h the telecommunications act. customers seeking to use the compliance approval in their product should contact microchip technology sales or distribution partners to obtain a letter of authority. integration of this module into a final product does not require additional radio cert ification provided installa- tion instructions are followed and no modifications of the module are allowed. 10.6.1 labeling and user information requirements the RN4870 module is labeled with its own ncc id number, and if the ncc id is not visible when the mod- ule is installed inside another device, then the outside of the device must also display a label referring to the enclosed module. this exterior label can use wording such as the following: due to the limited size of the rn4871, the ncc id is not displayed on the module. therefore, the outside of the device must also displa y a label referring to the enclosed module. this exterior label can use wording such as the following: the user's manual should contain below warning (for rf device) in traditional chinese: ? ? ! ? ????Ck ?l ? ?JC???l?C ?S? ?????l?? ???O? ??? ??l ? ?l?C???w ??_??? lF?_Fr??Ko ?_r^m? ???????I?o? ?l?C??????I?W t?? ?CO??_ 10.6.2 helpful web sites national communications commission (ncc): http://www.ncc.gov.tw . 10.7 other regulatory jurisdictions should other regulatory juri sdiction certification be required by the customer, or the customer need to recertify the module for othe r reasons, a certification utility is available. for furt her regulatory certification utility and documentation, cont act your local microchip technology sales office.
? 2016 microchip technology inc. ds50002489a-page 43 RN4870/71 11.0 ordering information table 11-1 provides ordering information for the RN4870/71 module. go to http://www.microchip.com for current pricing and a list of di stributors carrying microchip products. table 11-1: ordering information part number description RN4870-v/rm118 bluetooth 4.2 ble single mode , class 2, surface mount module with antenna and shield. size: 12 mm x 22 mm RN4870u-v/rm118 bluetooth 4.2 ble single mode , class 2, surface mount module, external antenna, no shield. size: 12 mm x15 mm rn4871-v/rm118 bluetooth 4.2 ble single mode , class 2, surface mount module with antenna and shield. size: 9 mm x 11.5 mm rn4871u-v/rm118 bluetooth 4.2 ble single mode , class 2, surface mount module, external antenna, no shield. size: 6 mm x 8 mm
RN4870/71 ds50002489a-page 44 ? 2016 microchip technology inc. appendix a: revision history revision a (april 2016) this is the initial release of this document.
? 2016 microchip technology inc. ds50002489a-page 45 RN4870/71 the microchip web site microchip provides online support via our www site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faq), technical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchip?s customer notifi cation service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or de velopment tool of interest. to register, access the microchip web site at www.microchip.com . under ?support?, click on ?customer change notification? and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support customers should contac t their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sa les offices and locations is included in the back of this document. technical support is available through the web site at: http://microchip.com/support
RN4870/71 ds50002489a-page 46 ? 2016 microchip technology inc. product identification system to order or obtain information, for exampl e, on pricing or delivery, refer to the factory or the listed sales office. device: RN4870: ceramic chip antenna RN4870u: external antenna rn4871: ceramic chip antenna rn4871u: external antenna temperature range: v=-20 ? c to +70 ? c (various) package: rm = radio module example: RN4870-v/rm118: various temperature note 1: tape and reel identifier only appears in the catalog part number description. this identifier is used fo r ordering purposes and is not printed on the device package. check with your microchip sales office for package availability with the tape and reel option. part no. device v temperature range rm package xxx firmware revision number
? 2016 microchip technology inc. ds50002489a-page 47 information contained in this publication regarding device applications and the like is prov ided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application me ets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safe ty applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or ot herwise, under any microchip intellectual property rights unless otherwise stated. trademarks the microchip name and logo, the microchip logo, anyrate, dspic, flashflex, flexpwr, heldo, jukeblox, keeloq, keeloq logo, kleer, lancheck, link md, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. clockworks, the embedded control solutions company, ethersynch, hyper speed control, hyperlight load, intellimos, mtouch, precision edge, and quiet-wire are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, any capacitor, anyin, anyout, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dynamic average matching, dam, ecan, ethergreen, in-circuit serial programming, icsp, inter-chip connectivity, jitterblocker, kleernet, kleernet logo, miwi, motorbench, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem.net, pickit, pictail, puresilicon, righttouch logo, real ice, ripple blocker, serial quad i/o, sqi, superswit cher, superswitcher ii, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. gestic is a registered tradem arks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2016, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn: 978-1-5224-0514-6 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of pr oducts is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal meth ods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip pr oducts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are committed to continuously improving t he code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your softwar e or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microper ipherals, nonvolatile memory and analog products. in addition, microchi p?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem by dnv == iso/ts 16949 ==
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