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hsdl-3000 ordering information part number packaging type package quantity hsdl-3000#007 tape/reel front view 2500 hsdl-3000#017 strip front view 10 description the hsdl-3000 is a small form factor infrared (ir) trans - ceiver module that provides interface between logic and ir signals for through-air, serial, half-duplex ir data link. the module is compliant to irda physical layer specif - cations 1.3 and is iec 825-class 1 eye safe. the hsdl-3000 can be shut down completely to achieve very low power consumption. in the shutdown mode, the pin diode will be inactive and thus producing very little photocurrent even under very bright ambient light. such features are ideal for battery-operated handheld products. the hsdl-3000 has two front packaging type options (hsdl-3000#007/017). both options have an integrated shield that helps to ensure low emi emission and high immunity to emi feld, thus enhancing reliable perfor - mance. application support information the application engineering group is available to assist you with the technical understanding associated with hsdl-3000 infrared transceiver module. you can contact them through your local sales representatives for addi - tional details. features ? fully compliant to irda 1.3 specifcations: C 2.4 kbps to 115.2 kbps C excellent nose-to-nose operation C typical link distance > 1.5 m ? guaranteed temperature performance, C20 to 70 c C critical parameters are guaranteed over tempera - ture and supply voltages ? low power consumption C low shutdown current (10 na typical) C complete shutdown for txd, rxd, and pin diode ? small module size C 2.70 x 9.10 x 3.65 mm (hxwxd) ? withstands >100 mv p-p power supply ripple typically ? v cc supply 2.7 to 5.5 volts ? led stuck-high protection ? iec 825-class 1 eye safe ? designed to accommodate light loss with cosmetic windows applications ? data communication C pdas C notebooks C printers ? mobile telecom C cellular phones C pagers C smart phones ? digital imaging C digital cameras C photo-imaging printers ? electronic wallet ? medical and industry data collection hsdl-3000#007/017 irda ? data compliant 115.2 kbps infrared transceiver data sheet
2 functional block diagram i/o pins confguration table pin symbol description notes 1 led a led anode tied through external resistor, r1, to regulated v cc from 2.7 to 5.5 volts. 2 txd transmitter data input. logic high turns on the led. if held high longer than ~ 50 s, the led is turned active high. of. txd must be either driven high or low. do not foat the pin. 3 rxd receiver data output. output is a low pulse response when a light pulse is seen. active low. 4 sd shutdown. complete shutdown txd, rxd, and pin diode. active high. 5 v cc supply voltage regulated, 2.7 to 5.5 volts. 6 gnd ground connect to system ground. C shield emi shield connect to system ground via a low inductance trace. for best performance, do not connect to gnd directly at the part. pinout recommended application circuit components component recommended value r1 2.2 ? 5%, 0.25 watt, for 2.7 v cc 3.3 v operation 2.7 ? 5%, 0.25 watt, for 3.0 v cc 3.6 v operation 6.8 ? 5%, 0.25 watt, for 4.5 v cc 5.5 v operation cx1 [1] 0.47 f 20%, x7r ceramic cx2 [2] 6.8 f 20%, tantalum caution: the bicmos inherent to the design of this component increases the components susceptibility to damage from electrostatic discharge (esd). it is advised that normal static precautions be taken during han - dling and assembly of this component to prevent damage and/or degradation, which may be induced by esd. notes: 1. cx1 must be placed within 0.7 cm of hsdl-3000 to obtain optimum noise immunity. 2. in environments with noisy power supplies, supply rejection can be enhanced by including cx2 as shown in hsdl-3000 functional block diagramon page 2. gnd (6) v cc (5) leda (1) r1 v cc transmitter hsdl-3xxx cx1 txd (2) shield sd (4) rxd (3) cx2 receiver 6 5 4 3 2 1 rear view marking information the hsdl-3000#007/017 is marked with a number 0 and ywwll on the shield where y indicates the units manufacturing year, ww refers to the work week and ll is the lot information.
3 absolute maximum ratings for implementations where case to ambient thermal resistance is 50c/w. parameter symbol min. max. units conditions storage temperature t s C40 100 c operating temperature t a C20 70 c led supply voltage v led 0 7 v supply voltage v cc 0 7 v output voltage: rxd v o C0.5 7 v led current pulse amplitude iled 500 ma 90 s pulse width 20% duty cycle recommended operating conditions parameter symbol min. max. units conditions operating temperature t a C20 70 c supply voltage v cc 2.7 5.5 v logic input logic high v ih 2/3 v cc v cc v voltage for txd logic low v il 0 1/3 v cc v receiver input logic high ei h 0.0036 500 mw/cm 2 for in-band signals 115.2 kbps [1] irradiance logic low ei l 0.3 w/cm 2 for in-band signals [1] txd pulse width (sir) t tpw (sir) 1.5 1.6 s t pw (txd) = 1.6 s at 115.2 kbps receiver data rate 2.4 115.2 kbps ambient light see test methods on page 16 for details.
4 electrical & optical specifcations specifcations (min. and max. values) hold over the recommended operating conditions unless otherwise noted. unspecifed test conditions may be any - where in their operating range. all typical values (typ.) are at 25c with v cc set to 3.0 v unless otherwise noted. parameter symbol min. typ. max. units conditions receiver viewing angle 2 1/2 30 peak sensitivity p 875 nm wavelength rxd output voltage logic high v oh v cc C0.2 v cc v i oh = C200 a, ei 0.3 w/cm 2 logic low v ol 0 0.4 v rxd pulse width (sir) [2] t rpw (sir) 1 7.5 s 1/2 15, c l = 9 pf rxd rise and fall times t r , t f 25 100 ns c l = 9 pf receiver latency time [3] t l 25 50 s receiver wake up time [4] t rw 18 100 s ei = 10 mw/cm 2 transmitter radiant intensity ie h 44 75 mw/sr i leda = 350 ma, 1/2 15, txd v ih , t a = 25c viewing angle 2 1/2 30 60 peak wavelength p 875 nm txd logic levels high v ih 2/3 v cc v cc v low v il 0 1/3 v cc v txd input current high i h 0.02 1 a v i v ih low i l C1 C0.02 1 a 0 v i v il led current shutdown i vled 20 1000 na v i (sd) v ih , t a = 25c wakeup time [5] t tw 30 100 ns maximum optical t pw(max) 25 50 s pulse width [6] txd rise and t r , t f 600 ns fall time (optical) led anode on state v on (leda) 2.2 v i leda = 350 ma, v i (txd) v il voltage
5 transceiver input current high i h 0.01 1 a v i v ih low i l C1 -0.02 1 a 0 v i v il supply current shutdown i cc1 0.01 1 a v sd v cc C 0.5, t a = 25c idle i cc2 290 450 a v i (txd) v il , ei = 0 active i cc3 2 8 ma v i (txd) v il notes: 1. an in-band optical signal is a pulse/sequence where the peak wavelength, p, is defned as 850 nm p 900 nm, and the pulse characteristics are compliant with the irda serial infrared physical layer link specifcation. 2. for in-band signals 2.4 kbps to 115.2 kbps where 3.6 w/cm 2 ei 500 mw/cm 2 . 3. latency is defned as the time from the last txd light output pulse until the receiver has recovered full sensitivity. 4. receiver wake up time is measured from v cc power on to valid rxd output. 5. transmitter wake up time is measured from v cc power on to valid light output in response to a txd pulse. 6. maximum optical pulse width is defned as the maximum time that the led will remain on. this is to prevent the long turn on time for the led. electrical & optical specifcations (continued) parameter symbol min. typ. max. units conditions iled (ma) 500 v cc (v) hsdl-3000 graph 1 3.9 4.8 290 320 470 2.4 5.7 410 2.7 4.2 380 3.3 3.6 4.5 5.4 350 440 3.0 5.1 2.2 ? 6.8 ? 2.7 ? iled (ma) 500 v on (leda) hsdl-3000 graph 2 1.95 2.05 290 320 470 1.80 2.20 410 1.85 380 1.90 2.00 2.15 350 440 2.10 ie h (mw/sr) 110 iled (ma) hsdl-3000 graph 3 300 380 40 50 100 1.80 500 80 220 70 260 340 460 60 90 420 iled vs. v cc . iled vs. v on (leda). ie h vs. iled.
6 hsdl-3000#007 and hsdl-3000#017 package outline with dimension and recommended pc board pad layout recommended land pattern 0.55 dimensions height: width: depth: 8.60 1.20 0.60 (2 places) pitch 1.55 (5x) 3.65 2.95 0.25 6 5 4 3 2 1 1.55 0.85 3.05 1.10 9.10 0.15 5.80 1.25 1.55 1.35 2.70 0.15 unless otherwise stated, tolerances 0.2 mm 2.70 0.15 mm 9.10 0.15 mm 3.65 0.20 mm 1 2 3 4 5 6 2.30 0.50 2.60 2.65 0.70 0.425 0.65 (4 places) 3.13
7 16.40 + 2.00 0 b c 2.00 0.50 3.46 8.00 0.10 4.00 0.10 16.00 0.30 1.75 0.10 1.55 0.05 0.40 0.10 3.00 0.10 polarity empty parts mounted leader empty (40 mm min.) (40 mm min.) (40 mm min.) 1.13 0.10 progressive direction "b" "c" quantity pin 6: gnd pin 1: vled +0.10 0 3.30 +0.10 0 7.50 0.10 r 1.00 2.00 0.50 dia. 13.00 0.50 21.00 0.80 label detail a detail a 330 80 2500 9.50 0.10 5.00 (max.) 1 2 3 4 5 6 3.40 0.20 4.20 0.20 8.00 (max.) material of carrier tape: conductive polystyrene material of cover tape: pvc method of cover: heat activated adhesive unit: m m + hsdl-3000#007 and hsdl-3000#017 tape and reel dimensions
8 moisture proof packaging the hsdl-3000 is shipped in moisture proof packaging. once opened, moisture absorption begins. recommended storage conditions storage temperature 10c to 30c relative humidity below 60% rh time from unsealing to soldering after removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. baking if the parts are not stored in a dry environment, they must be baked before refow process to prevent damage to parts. baking should be done only once. packaging baking temperature baking time in reel 60c 48 hours in bulk 100c 4 hours 125c 2 hours 150c 1 hour
9 50 100 150 200 250 300 t-time (seconds) 25 80 120 150 180 200 230 255 0 t - temperature ( c) r1 r2 r3 r4 r5 217 max 260 c 60 sec to 150 sec above 217 c p1 heat up p2 solder paste dry p3 solder reflow p4 cool down the refow profle is a straight-line representation of a nominal temperature profle for a convective refow sol - der process. the temperature profle is divided into four process zones, each with diferent ? t/ ? time temperature change rates or duration. the ? t/ ? time rates or duration are detailed in the above table. the temperatures are measured at the component to printed circuit board connections. in process zone p1 , the pc board and hsdl-3000 pins are heated to a temperature of 150 c to activate the fux in the solder paste. the temperature ramp up rate, r1, is limited to 3 c per second to allow for even heating of both the pc board and hsdl-3000 pins. process zone p2 should be of sufcient time duration (100 to 180 seconds) to dry the solder paste. the temperature is raised to a level just below the liquidus point of the solder, usually 200 c (392 f). process zone p3 is the solder refow zone. in zone p3, the temperature is quickly raised above the liquidus point of solder to 255 c (491 f) for optimum results. the dwell time above the liquidus point of solder should be between 20 and 40 seconds. it usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. beyond a dwell time of 40 seconds, the intermetallic growth within the solder connections be - comes excessive, resulting in the formation of weak and unreliable connections. the temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200 c (392 f), to allow the solder within the connections to freeze solid. process zone p4 is the cool down after solder freeze. the cool down rate, r5, from the liquidus point of the solder to 25 c (77 f) should not exceed 6 c per second maxi - mum. this limitation is necessary to allow the pc board and hsdl-3000 pins to change dimensions evenly, put - ting minimal stresses on the hsdl-3000. it is recommended to perform refow soldering no more than twice. recommended refow profle process zone symbol t maximum ? t/ time or duration heat up p1, r1 25c to 150c 3c/s solder paste dry p2, r2 150c to 200c 60s to 180s solder refow p3, r3p3, r4 200c to 255c 255c to 200c 3c/s-6c/s cool down p4, r5 200c to 25c -6c/s time maintained above 217c > 217c 60s to 150s peak temperature 260c time within 5c of actual peak temperature > 255c 20s to 40s time 25c to peak temperature 25c to 260c 8mins max.
10 appendix a : hsdl-3000#007/#017 smt assembly application note 1.0 solder pad, mask and metal solder stencil aperture figure 1. stencil and pcba. 1.1 recommended land pattern for hsdl-3000 hsdl-3000 fig 2.0 land pattern shield solder pad a b f 6x pad y d e g tx lens rx lens fiducial x c fiducial theta dim . m m inches a b c (pitch) d e f g h 2.30 0.85 1.55 1.10 3.05 2.20 2.42 0.20 0.091 0.034 0.061 0.043 0.120 0.087 0.095 0.008 h figure 2. top view of land pattern. metal stencil for solder paste printing land pattern pcba stencil aperture solder mask
11 1.2 adjacent land keep-out and solder mask areas dim. mm inches h min. 0.40 min. 0.016 j 10.1 0.40 k 3.85 0.15 l 3.2 0.126 figure 3. hsdl-3000#007/#017 pcba C adjacent land keep-out and solder mask. ? adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. there should be no other smd components within this area. ? h is the minimum solder resist strip width required to avoid solder bridging adjacent pads. ? it is recommended that 2 fducial cross be placed at mid-length of the pads for unit alignment. note: wet/liquid photo-imageable solder resist/mask is recommended. hsdl-3000 fig 3.0 pcba land keep-out h l tx lens rx lens j solder mask land k y x 2.0 recommended solder paste/cream volume for castellation joints the recommended printed solder paste volume required per castellation pad is 0.30 cubic mm (based on either no-clean or aqueous solder cream types with typically 60 to 65% solid content by volume). 2.1 recommended metal solder stencil aperture it is recommended that only 0.152 mm (0.006 inches) or 0.127 mm (0.005 inches) thick stencil be used for solder paste printing. this is to ensure adequate printed solder paste volume and no shorting. the following combina - tion of metal stencil aperture and metal stencil thick - ness should be used: see fig. 4. t, nominal stencil thickness l, length of aperture mm inches mm inches 0.152 0.006 2.3 0.05 0.091 0.002 0.127 0.005 2.75 0.05 0.108 0.002 w, the width of aperture, is fxed at 0.85 mm (0.034 inches). aperture opening for shield pad is 3.05 mm x 1.1 mm as per land dimen - sion. figure 4. solder paste stencil aperture. hsdl-300 solder stencil apertures as per land dimensions l w t (stencil thickness) solder paste
12 appendix b: hsdl-3000#007/#017 C recommended optical port design z x y to insure irda compliance, some constraints on the height and width of the window exist. the minimum di - mensions ensure that the irda cone angles are met with - out vignetting. the maximum dimensions minimize the efects of stray light. the minimum size corresponds to a cone angle of 30 degrees, the maximum, to a cone angle of 60 degrees. x is the width of the window, y is the height of the win - dow, and z is the distance from the hsdl-3000 to the back of the window. the distance from the center of the led lens to the cen - ter of the photodiode lens is 5.80 mm. the equations for the size of the window are as follows: x = 5.80 +2(z + d) tan y = 2(z + d) tan where is the required half angle for viewing. for the irda minimum, it is 15 degrees, for the irda maximum it is 30 degrees. (d is the depth of the led image inside the part, 3.2 mm from the tx lens vertex). these equations result in the following tables and graphs: minimum and maximum window sizes depth (z) mm x min. y min. x max. y max. 0 7.34 1.71 9.33 3.70 1 7.88 2.25 10.48 4.85 2 8.42 2.79 11.63 6.00 3 8.95 3.32 12.79 7.16 4 9.49 3.86 13.94 8.31 5 10.02 4.39 15.10 9.47 6 10.56 4.93 16.25 10.62 7 11.10 5.47 17.41 11.78 8 11.63 6.00 18.56 12.93 9 12.17 6.54 19.72 14.09 10 12.70 7.07 20.87 15.24 11 13.24 7.61 22.03 16.40 12 13.77 8.14 23.18 17.55 13 14.31 8.68 24.34 18.71 14 14.85 9.22 25.49 19.86 15 15.38 9.75 26.65 21.01 16 15.92 10.29 27.80 22.17 17 16.46 10.83 28.95 23.32 18 16.99 11.36 30.11 24.48 19 17.53 11.90 31.26 25.63 20 18.06 12.43 32.42 26.79 dimensions are in mm. window width x vs. module depth z. window height y vs. module depth z. window width x ? mm 25 module depth z ? mm 10 hsdl-3000 width vs depth 4 8 0 5 0 1 0 15 2 6 20 x max. x min. window height y ? mm 18 module depth z ? mm 6 hsdl-3000 window ht vs module depth 4 8 0 2 14 0 1 0 10 2 6 12 8 4 acceptable range 16 y max. y min.
flat window (frst choice) curved front, flat back (do not use) curved front and back (second choice) shape of the window from an optics standpoint, the window should be fat. this ensures that the window will not alter either the ra - diation pattern of the led, or the receive pattern of the photodiode. if the window must be curved for mechanical design rea - sons, place a curve on the back side of the window that has the same radius as the front side. while this will not completely eliminate the lens efect of the front curved surface, it will reduce the efects. the amount of change in the radiation pattern is dependent upon the material chosen for the window, the radius of the front and back curves, and the distance from the back surface to the transceiver. once these items are known, a lens design can be made which will eliminate the efect of the front surface curve. the following drawings show the efects of a curved window on the radiation pattern. in all cases, the center thickness of the window is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back surface of the window is 3 mm. hsdl-3000 flat window hsdl-3000 curved window hsdl-3000 curved/flat window
test methods background light and electro-magnetic field there are four ambient interference conditions in which the receiver is to operate correctly. the conditions are to be applied separately: 1. electromagnetic feld: 3 v/m maximum (please refer to iec 61000-4-3 severity level 3 for details). 2. sunlight: 10 kilolux maximum at the optical port. this is simulated with an ir source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased to provide 490 w/ cm2 (with no modulation) at the optical port. the light source faces the optical port. this simulates sunlight within the irda spectral range. the efect of longer wavelength radation is covered by the incandescent condition. 3. incandescent lighting: 1000 lux maximum. this is produced with general service, tungsten-flament, gas-flled, inside frosted lamps in the 60 watt to 100 watt range to generate 1000 lux over the horizontal surface on which the equipment under test rests. the light sources are above the test area. the source is expected to have a flament temperature in the 2700 to 3050 kelvin range and a spectral peak in the 850 to 1050 nm range. 4. fluorescent lighting: 1000 lux maximum. this is simulated with an ir source having a peak wavelength within the range of 850 nm to 900 nm and a spectral width of less than 50 nm biased and modulated to provide an optical square wave signal (0 w/cm2 minimum and 0.3 w/cm2 peak amplitude with 10% to 90% rise and fall times less than or equal to 100 ns) over the horizontal surface on which the equipment under test rests. the light sources are above the test area. the frequency of the optical signal is swept over the frequency range from 20 khz to 200 khz. due to the variety of fuorescent lamps and the range of ir emissions, this condition is not expected to cover all circum- stances. it will provide a common foor for irda operation. for company and product information, please go to our web site: www.liteon.com or http://optodatabook.liteon.com/databook/databook.aspx data subject to change. copyright ? 2007 lite-on technology corporation. all rights reserved.

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