28.50mm [1.122"] 28.50mm [1.122"] 1.75mm [0.069"] 1.75mm [0.069"] 1.0mm typ. 0.51mm [0.020"] 2.87mm [0.113"] 4 d e s c r i p t i o n : bga surface mount emulator foot 416 position (1.0mm pitch) gold plated female recep tacle pins to smt solder balls (bga type). pin asig nment 1:1. status: released drawing: h. hansen scale: 2:1 rev: b date: 11/23/05 modified: 1/9/06 file: SF-BGA416E-B-42 dwg SF-BGA416E-B-42(f) drawing ? 2005 ironwood electronics, inc. po box21151 st. paul, mn 55121 tele: (651) 452-8100 www.ironwoodelectronics.com 1 substrate: 1.59mm 0.18mm [0.0625" 0.007"] fr4/g10 or equivalent high temp material. (rohs) 2 top view side view pins: material- brass alloy 360 1/2 hard; finish- 0.25m [10"] au over 1.27m [50"] ni (min.). 3 solder balls (see table above) c o n t a c t d a t a accepts 0.20mm - 0.33mm diameter pins 3-finger 37 gram, initial insertion force (with 0.254mm dia. pin) 30 gram, normal force (with 0.254mm dia. pin) 20 gram, extraction force (with 0.2545mm dia. pin) contacts: beryllium copper alloy172, ht; finish- 0.25m [10"] au over 1.27m [50"] ni (min.). patent pending 2 3 4 1 o r d e r i n g i n f o r m a t i o n : solder ball alloy part number suffix sn63pb37 *rohs compliant -42 sn96.5ag3.0cu0.5 -42f* t o l e r a n c e s : diameters 0.03mm [0.001"], pcb perimeters 0.18m m [0.007"], pcb thicknesses 0.18mm [0.007"], pit ches (from true position) 0.08mm [0.003"], all other tolerances 0.13mm [0 .005"] unless stated otherwise. materials and spec ifications are subject to change without notice. detail a detail a 1.33mm [0.052"] 2.36mm [0.093"]
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