ret y rt - high forward surge capability - high reliability - ultra fast recovery time - low power loss - ul recognized file # e-326243 - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test sy m bol u n i t v rrm v v rms v v dc v i f(av) a trr ns r jc o c/w t j o c t stg o c document number: ds_d1401029 version: g14 weight: 1.7g (approximately) UGF5J taiwan semiconductor isolated hi g h volta g e ultrafast rectifiers feat u res - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec m ech an i cal dat a ito-220ac maximum rms voltage maximum dc blocking voltage m ax i m u m rat i n gs an d elect ri cal ch aract eri st i cs (t a =25 unless otherwise noted) param et er maximum repetitive peak reverse voltage case: ito-220ac polarity: as marked mounting torque: 5 in-lbs maximum maximum average forward rectified current 5 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 65 a maximum instantaneous forward voltage (note 1) i f = 5 a v f v maximum reverse current @ rated v r t j =25 t j =125 i r 30 a 25 typical thermal resistance 5.5 operating junction temperature range 200 - 55 to +150 - 55 to +150 storage temperature range note 1: pulse test with pw=300 s, 1% duty cycle note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a u gf5 j 600420 600 3.00 maximum reverse recovery time (note 2) downloaded from: http:///
ret y rt part n o. part n o. UGF5JUGF5J (ta=25 unless otherwise noted) document number: ds_d1401029 version: g14 UGF5J taiwan semiconductor orderi n g i n form at i on pack i n g code green com pou n d code pack age pack i n g suffix "g" ito-220ac 50 / tube ex am ple preferred p/n pack i n g code green com pou n d code descri pt i on UGF5J c0 rat i n gs an d ch aract eri st i cs cu rv es UGF5J c0 c0 UGF5J c0g c0 g green compound 0 1 2 3 4 5 6 7 8 0 2 55 07 51 0 01 2 51 5 01 7 5 average forward current (a) case temperature ( ) fig.1 maximum forward current derating curve resistive or inductive load with heatsink 0 10 20 30 40 50 60 70 80 11 01 0 0 peak forward surge current (a) number of cycles at 60 hz fig. 2 maximum forward sirge current 8.3ms single half sine wave 0.001 0.01 0.1 1 10 100 10 20 30 40 50 60 70 80 90 100 instantantaneous reverse current ( a) percent of rated peak reverse voltage(%) fig. 4 typical reverse characteristics tj=25 tj=125 0.1 1 10 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 instantaneous forward current (a) forward voltage (v) fig. 3 typical forward characteristics tj=125 tj=25 downloaded from: http:///
ret y rt min max min max a 4.30 4.70 0.169 0.185 b 2.50 3.10 0.098 0.122 c 2.30 2.90 0.091 0.114 d 0.46 0.76 0.018 0.030 e 6.30 6.90 0.248 0.272 f 9.60 10.30 0.378 0.406 g 3.00 3.40 0.118 0.134 h 0.00 1.60 0.000 0.063 i 0.95 1.45 0.037 0.057 j 0.50 0.90 0.020 0.035 k 2.40 3.20 0.094 0.126 l 14.80 15.50 0.583 0.610 m - 4.10 - 0.161 n - 1.80 - 0.071 o 12.60 13.80 0.496 0.543 p 4.95 5.20 0.195 0.205 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1401029 version: g14 m ark i n g di agram UGF5J taiwan semiconductor pack age ou t li n e di m en si on s dim. unit (mm) unit (inch) 10 100 1000 0.1 1 10 100 capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vslg=50mvp-p downloaded from: http:///
ret y rt assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1401029 version: g14 UGF5J taiwan semiconductor n ot ic e specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf, downloaded from: http:///
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