________________________________________________________________________ http://www.union - ic.com rev . 1 4 mar .20 1 6 1 / 5 um5059 single line esd protection diode array um5059 dfn2 1.0 0.6 general description the um5059 esd protection diode is designed to replace multilayer varistors (mlvs) in portable applications such as cell phones, notebook computers, a nd pdas. they feature large cross - sectional area junctions for conducting high transient currents, offer desirable electrical characteristics for board level protection, such as fast response time, lower operating voltage, lower clamping voltage and no de vice degradation when compared to mlvs. the um5059 esd protection diode protects sensitive semiconductor components from damage or upset due to electrostatic discharge (esd) and other voltage induced transient events. the um5059 is available in df n 2 1.00. 6 (compatible with sod923 & sod882) package with working voltages of 5 volt. it gives designer the flexibility to protect one unidirectional line in applications where arrays are not practical. additionally, it may be sprinkled around the board in applic ations where board space is at a premium. it may be used to meet the esd immunity requirements of iec 61000 - 4 - 2, 30 kv air, 30 kv contact discharge. applications features ? cell phone handsets and accessories ? personal digital assistants (pdas) ? noteboo ks, desktops and servers ? portable instrumentation ? cordless phones ? digital cameras ? peripherals ? mp3 players ? transient p rotection for d ata l ines to iec 61000 - 4 - 2 (esd) 30 kv ( a ir), 30 kv ( c ontact) ? small p ackage for u se in p ortable e lectronics ? suitable r eplacement for mlvs in esd ? protect o ne i/o or p ower l ine ? low c lamping v oltage ? stand - off v oltage: 5v ? low l eakage c urrent ? solid - s tate s ilicon - a valanche t echnology ? small body outline dimensions: 1.0mm0.6mm pin configurations top view um5059 dfn 2 1.0 0.6 + - + ? e 9
________________________________________________________________________ http://www.union - ic.com rev . 1 4 mar .20 1 6 2 / 5 um5059 o rdering information part number working v oltage packaging type channel marking code s hipping qty um5059 5.0v dfn 2 1.00.6 1 e9 5000pcs/7 inch tape & reel absolute maximum ratings r ating s ymbol v alue u nit peak pulse power (t p =8/20 s) p pk 140 watts maximum peak pulse current (t p =8/20 s) i pp 11 amps lead soldering temperature t l 260 (10 sec.) c operating temperature t j - 55 to +125 c storage temperature t stg - 55 to +1 50 c - symbol definition p arameter s ymbol maximum reverse peak pulse current i pp clamping voltage @ i pp v c working peak reverse voltage v rwm maximum reverse leakage current @ v rwm i r breakdown voltage @ i t v br te st current i t forward current i f forward voltage @ i f v f peak power dissipation p pk max. capacitance @ v r =0v, f=1mhz c
________________________________________________________________________ http://www.union - ic.com rev . 1 4 mar .20 1 6 3 / 5 um5059 electrical characteristics (t=25c, device for 5.0v reverse stand - off voltage) p arameter s ymbol c onditions m in t yp m ax u nit r everse stand - off voltage v rwm 5 v reverse breakdown voltage v br i t =1ma 6 6.8 7. 8 v reverse leakage current i r v rwm = 5v, t=25c 0.1 c i pp = 5a, t p =8/20 pp =11a, t p =8/20 f i f =10ma 0.8 v junction capacitance c j v r = 0v, f=1mhz 40 55 pf junction capacitance c j v r = 2.5v, f =1mhz 30 40 pf applications information device connection options um5059 esd protection diode is designed to protect one data, i/o, or power supply line. the device is unidirectional and may be used on lines where the signal polarity is above ground. the cathode dot should be placed towards the line t hat is to be protected. circuit board layout recommendations for suppression of esd good circuit board layout is cri tical for the suppression of esd induced transients. the following guidelines are recommended: 1. place the tvs near the input terminals or connectors to restrict transient coupling. 2. minimize the path length between the tvs and the protected line. 3. minimi ze all conductive loops including power and ground loops. 4. the esd transient return path to ground should be kept as short as possible. 5. never run critical signals near board edges. 6. use ground planes whenever possible. f or multilayer printed - circuit b oards, use ground vias. 7. keep parallel signal paths to a minimum. 8. avoid running protection conductors in parallel with unprotected conductor. 9. minimize all printed - circuit board conductive loops including power and ground loops. 10. avoid using shared tr ansient return paths to a common ground point.
________________________________________________________________________ http://www.union - ic.com rev . 1 4 mar .20 1 6 4 / 5 um5059 package information um5059 dfn2 1.00.6 outline drawing note: r is opti onal. dimensions symbol millimeters inches min typ max min typ max a 0. 40 - 0. 53 0.016 - 0.021 a1 0.00 - 0.05 0.000 - 0.002 b 0. 45 0.50 0. 55 0.018 0.020 0.022 d 0.95 1.00 1.0 75 0.037 0.039 0.042 e 0.55 0.60 0.6 75 0.022 0.024 0.027 e 0.65typ 0.026typ l 0. 20 0.25 0. 30 0.008 0.010 0.012 l1 0.00 0.05 0.10 0.000 0.002 0.004 r 0.05 0.10 0.15 0.002 0.004 0.006 land pattern notes: 1 . compound dimension: 1.000.60 ; 2. unit: mm; 3. general tolerance 0.0 5mm unless otherwise specified; 4. the layout is just for reference. tape and reel orientation e l ( 2 ) b ( 2 ) p i n # 1 i d r a 1 a s i d e v i e w b o t t o m v i e w d e l 1 0 . 6 5 0 . 6 5 0 . 3 5 e 9
________________________________________________________________________ http://www.union - ic.com rev . 1 4 mar .20 1 6 5 / 5 um5059 green compliance union semiconductor is committed to environmental excellence in all aspects of its operations including meeting or exceeding regulatory requirements with respect to the use of hazardous substances. numerous successful pro grams have been implemented to reduce the use of hazardous substances and/or emissions. all union components are compliant with the rohs directive, which helps to support customers in their compliance with environmental directives. for more green complianc e information, please visit: http://www.union - ic.com/index.aspx?cat_code=rohsdeclaration important notice the information in this document has been carefully reviewed and is bel ieved to be accurate. nonetheless, this document is subject to change without notice. union assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the contained informatio n, or to notify a person or organization of any update. union reserves the right to make changes, at any time, in order to improve reliability, function or design and to attempt to supply the best product possible. union semiconducto r, inc add : unit 606, no.570 shengxia road, shanghai 2012 10 tel: 021 - 51093966 fax: 021 - 51026018 website: www.union - ic.com
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