? semiconductor components industries, llc, 2014 august, 2014 ? rev. 0 1 publication order number: hbl5006/d hbl5006 series led shunt the hbl5006 series are electronic shunts which provide a current bypass in the case of leds going into open circuit. leds are by nature quite fragile when subjected to transients and surge conditions. there are also many cases where high reliability of the led lighting must be maintained such as in headlights, lighthouses, bridges, aircraft, runways and so forth. in these cases the low cost addition of the shunt device will provide full assurance that an entire string of leds will not extinguish should one led fail open. the shunt device is also applicable to other loads where circuit continuity is required. the devices are designed to be used with led string currents from 50 to 350 ma. features ? protection for the following iec standards: iec 61000?4?2 (level 4) iso 10605 ? low esd clamping voltage ? automatically resets itself if the led heals itself or is replaced ? on?state v oltage typically 1.1 v ? off?state current less than 1.0 a ? sz prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free and are rohs compliant typical applications ? leds where preventive maintenance is impractical ? led headlights in automobiles ? automotive led applications ? leds with high reliability requirements ? crowbar protection for open circuit conditions ? overvoltage protection for sensitive circuits http://onsemi.com control circuit see detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. ordering information marking diagrams xx = specific device code m = date code sod?323 case 477 sod?523 case 502 sod?923 case 514ab hd m 56 12 m ld m + ? hbl5006 1 2 1 2 hbl5006 1 2 apply heat sinking to pin 2 esd
hbl5006 series http://onsemi.com 2 maximum ratings rating symbol value unit on?state current, (t a = 25 c) (note 2) sod?323 (note 1) sod?323 (note 2) sod?523 (note 1) sod?523 (note 2) sod?923 (note 1) sod?923 (note 2) i t(avg) 250 200 300 250 350 300 ma thermal resistance, junction?to?air (all packages) sod?323 (note 1) sod?323 (note 2) sod?523 (note 1) sod?523 (note 2) sod?923 (note 1) sod?923 (note 2) ja 435 550 360 435 285 360 c/w operating temperature range (note 3) t j ?40 to 150 c non?operating temperature range t j 150 c lead temperature, soldering (10 sec) t l 260 c iec 61000?4?2 contact (esd) iec 61000?4?2 air (esd) esd esd 15 15 kv stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. mounted onto a 2?layer, 1000 mm 2 per layer, 3 oz cu, fr4 pcb with pin 2 connected to the heat sink and pin 1 only connected to a signal trace. the heat sinking must be connected to pin 2, which is the led cathode connection. normally this device would be mounted on the same copper heat sink and adjacent to the led(s). if the led(s) were to go open, t hen the hbl shunt would now dissipate the power using the same copper heat sink. since the shunt has a voltage that is nominally 30% of the led, then the power dissipation would be much lower, and easily handled by the same heat sink as the led. 2. mounted onto a 2?layer, 50 mm 2 per layer, 1 oz cu, fr4 pcb. 3. max operating temperature for dc conditions is 150 c, but not to exceed 175 c for pulsed conditions with low duty cycle or non?repetitive.
hbl5006 series http://onsemi.com 3 electrical characteristics (unless otherwise noted: t a = 25 c) symbol characteristics package min typ max unit v br breakdown voltage: the minimum voltage across the device in or at the breakdown region. measured at i br = 1 ma. sod?323 6.2 7.0 v sod?523 6.2 7.0 sod?923 6.2 7.0 i h holding current: the minimum current required to maintain the device in the on-state. sod?323 25 40 ma sod?523 25 40 sod?923 25 40 i l latching current: the minimum current required to turn from the off-state to the on-state. sod?323 9.0 ma sod?523 9.0 sod?923 9.0 v bo breakover voltage: the voltage across the device in the breakover region. sod?323 6.5 7.2 8.0 v sod?523 6.5 7.2 8.0 sod?923 6.5 7.2 8.0 i r off?state current: the dc value of current that results from the application of the off-state voltage. measured at 3.3 v. sod?323 1.0 a sod?523 1.0 sod?923 1.0 v t on?state voltage. measured at 100 ma. sod?323 0.9 1.1 1.3 v sod?523 0.9 1.1 1.3 sod?923 0.9 1.1 1.3 v c clamping voltage tlp (note 4) iec 6100?4?2 level 2 equivalent ( 4 kv contact, 4 kv air) iec 6100?4?2 level 4 equivalent ( 8 kv contact, 15 kv air) } } i pp = 8 a i pp = 16 a sod?323 6.5 11.2 v sod?523 6.5 11.2 sod?923 6.5 11.2 product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 4. ansi/esd stm5.5.1 ? electrostatic discharge sensitivity testing using transmission line pulse (tlp) model tlp conditions: z 0 = 50 , t p = 100 ns, t r = 4 ns, averaging window; t 1 = 30 ns to t 2 = 60 ns. figure 1. i?v characteristics breakover voltage voltage current on?state current holding current latching current off?state current breakdown voltage
hbl5006 series http://onsemi.com 4 typical application circuit figure 2. typical application circuit current source typical application circuit for hbl5006 control circuit hbl5006 esd control circuit hbl5006 esd control circuit hbl5006 esd control circuit hbl5006 esd
hbl5006 series http://onsemi.com 5 device ordering information device marking package shipping ? hbl5006ht1g hd sod?323 (pb?free) 3000 / tape & reel szhbl5006ht1g* hd hbl5006xv2t1g 56 sod?523 (pb?free) 3000 / tape & reel szhbl5006xv2t1g* 56 hbl5006p2t5g ld sod?923 (pb?free) 8000 / tape & reel SZHBL5006P2T5G* ld ?for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and m ounting techniques reference manual, solderrm/d. *sz prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable. package dimensions sod?323 case 477?02 issue h h e notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters. 3. lead thickness specified per l/f drawing with solder plating. 4. dimensions a and b do not include mold flash, protrusions or gate burrs. 5. dimension l is measured from end of radius. note 3 d 1 2 b e a3 a1 a c note 5 l h e dim min nom max millimeters a 0.80 0.90 1.00 a1 0.00 0.05 0.10 a3 0.15 ref b 0.25 0.32 0.4 c 0.089 0.12 0.177 d 1.60 1.70 1.80 e 1.15 1.25 1.35 0.08 2.30 2.50 2.70 l 0.031 0.035 0.040 0.000 0.002 0.004 0.006 ref 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 min nom max inches 1.60 0.063 0.63 0.025 0.83 0.033 2.85 0.112 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint*
hbl5006 series http://onsemi.com 6 package dimensions sod?523 case 502 issue e notes: 6. dimensioning and tolerancing per asme y14.5m, 1994. 7. controlling dimension: millimeters. 8. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 9. dimensions d and e do not include mold flash, pro- trusions, or gate burrs. e d ?x? ?y? b 2x m 0.08 x y a h c dim min nom max millimeters d 1.10 1.20 1.30 e 0.70 0.80 0.90 a 0.50 0.60 0.70 b 0.25 0.30 0.35 c 0.07 0.14 0.20 l 0.30 ref h 1.50 1.60 1.70 12 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* e e recommended top view side view 2x bottom view l2 l 2x 2x 0.48 0.40 2x 1.80 dimension: millimeters package outline l2 0.15 0.20 0.25
hbl5006 series http://onsemi.com 7 package dimensions sod?923 case 514ab issue c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. maximum lead thickness includes lead finish. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e do not include mold flash, pro- trusions, or gate burrs. dim min nom max millimeters a 0.34 0.37 0.40 b 0.15 0.20 0.25 c 0.07 0.12 0.17 d 0.75 0.80 0.85 e 0.55 0.60 0.65 0.95 1.00 1.05 l 0.19 ref h e 0.013 0.015 0.016 0.006 0.008 0.010 0.003 0.005 0.007 0.030 0.031 0.033 0.022 0.024 0.026 0.037 0.039 0.041 0.007 ref min nom max inches d e c a ?y? ?x? 2 1 dimensions: millimeters *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* see application note and8455/d for more mounting details 1.20 2x 0.25 2x 0.36 package outline b 2x 0.08 xy top view h e side view 2x bottom view l2 l 2x l2 0.05 0.10 0.15 0.002 0.004 0.006 on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 hbl5006/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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