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1/8 www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. s t epping mot o r driv er series s t andard 36v s t epping motor drivers bd6393f p , BD6395FP desc ri ptio n bd6393fp,BD6395FP are the simple type that provides t he minimum function for driving stepping motor and various protection circuits. as for its basic function, it is a low po wer consumption bipolar pwm constant current -drive driver with power upplys rated voltage of 36v and rated output current of 1.2a, 1.5a. there are excitation modes of full step & half step &, quarter step mode. this series contributes to r eduction of mounting area, cost down, safety design. f e atu r e 1) power supply: one system drive (rated voltage of 36v) 2) rated output current: 0.8a, 1.2a, 1.5a 3) low on resistance dmos output 4) parallel in drive mode 5) pwm constant current control (self oscillation) 6) built-in spike noise cancel function (external noise filter is unnecessary) 7) full step, half step, quarter step 8) power save function 9) built-in logic input pull-down resistor 10) power-on reset function 11) thermal shutdown circuit (tsd) 12) over current protection circuit (ocp) 13) under voltage lock out circuit (uvlo) 14) over voltage lock out circuit (ovlo) 15) malfunction prevention at the time of no app lied power supply (ghost supply prevention) 16) electrostatic discharge: 4kv (hbm specification) 17) fin heat-radiating type hsop package (bd6393fp/BD6395FP) 18) pin-compatible line-up (bd6393fp/BD6395FP) a p p lic ati on laser beam printer, scanner, photo printer, fax, ink jet prin ter, mini printer, sewing machine, toy, and robot etc. no.12009eat05 downloaded from: http:///
technical note 2/8 bd6393f p , BD6395FP www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. a b s o lute maximum r a tings(t a= 25 ) item symbol bd6393fp BD6395FP unit supply voltage v cc1,2 -0.2 +36.0 v power dissipation pd 1.45 1 w 3.47 2 input voltage for control pin v in -0.2 +5.3 v rnf maximum voltage v rnf 0.5 v maximum output current i out 1.2 3 1.5 3 a/phase operating temperature range t opr -25 +75 storage temperature range t stg -55 +150 junction temperature t jmax 150 1 70mm 70mm 1.6mm glass epoxy board. derating in done at 11.6mw/ for operating above ta=25 . 2 4-layer recommended board. derating in done at 27.8mw/ for operating above ta=25 . 3 do not, however exceed pd, aso and tjmax=150 . o per ati ng c o n d i tio n s( t a = -25 +75 ) item symbol bd6393fp BD6395FP unit supply voltage v cc1,2 16 28 v output current (dc) i out 0.8 4 1.2 4 a/phase 4 do not however exceed pd, aso. electrical characteristics applicable to all the series (unless otherwise specified ta=25 , v cc1,2 =24v) item symbol limit unit condition min. typ. max. w h ol e circuit current at standby i ccst - 0.45 2.00 ma ps=l circuit current i cc - 3 10 ma ps=h, vref=2v control input (p hase 1, i01, i1 1, phase2, i02, i12, ps) h level input voltage v inh 2.0 - 5.0 v l level input voltage v inl 0 - 0.8 v out put (out 1a, out 1 b, out 2 a, o u t 2 b) output on resistance (bd6393fp) r on - 1.80 2.16 i out = 0.6a sum of upper and lower output on resistance (BD6395FP) r on - 1.00 1.30 i out = 1.0a sum of upper and lower output leak current i leak - - 10 a c u rr ent c ontr o l rnfx input current i rnfx -40 -20 - a rnfx=0v vref input current i vref -2.0 -0.1 - a vref=0v vref input voltage range v ref 0 - 2 v comparator threshold 100% v cthll 0.340 0.400 0.460 v vref=2v,i0x=l,i1x=l comparator threshold 67% v cthhl 0.227 0.267 0.307 v vref=2v,i0x=h,i1x=l comparator threshold 33 v cthlh 0.113 0.133 0.153 v vref=2v,i0x=l,i1x=h minimum on time t onmin 0.3 0.7 1.2 s r=39k , c=1000pf downloaded from: http:///
technical note 3/8 bd6393f p , BD6395FP www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. t e rminal function ? block diagr a m ? a p p lic ati on c i rc uit d i a g r a m bd6393fp/ BD6395FP pin no. pin name function pin no. pin name function 1 pgnd ground terminal 14 nc non connection 2 out1b h bridge output terminal 15 gnd ground terminal 3 vcc1 power supply terminal 16 i02 logic input terminal for dac 4 rnf1 connection terminal of resistor for output current detection 17 i12 logic input terminal for dac 5 nc non connection 18 phase2 logic input terminal 6 out1a h bridge output terminal 19 cr2 connection terminal of cr for setting pwm frequency fin fin fin terminal (used by connecting with gnd) fin fin fin terminal (used by connecting with gnd) 7 cr1 connection terminal of cr for setting pwm frequency 20 out2a h bridge output terminal 8 phase1 logic input terminal 21 nc non connection 9 i11 logic input terminal for dac 22 rnf2 connection terminal of resistor for output current detection 10 i01 logic input terminal for dac 23 vcc2 power supply terminal 11 vref output current value setting terminal 24 out2b h bridge output terminal 12 ps power save terminal 25 nc non connection 13 nc non connection fig.1 block diagram & application circuit diagram 0.2 39k 1000pf 39k 1000pf 0.2 resistor for current. detecting. setting range is 0.1 ? 0.3 . be sure to short vcc1 & vcc2. bypass capacitor. setting range is 100uf 470uf(electrolytic) 0.01uf 0.1uf(multilayer ceramic etc.) resistor for current. detecting. setting range is 0.1 ? 0.3 . vref phase1 cr1 logic predriver current limit comp. buffer vcc1 out1b one shot out1a rnf1 i01 i11 gnd pgnd tsd ovlo uvlo ps ocp dac phase2 cr2 logic predriver current limit comp. vcc2 out2b one shot out2a rnf2 i02 i12 ocp dac regulator reset set the pwm frequency. setting range is c:470pf 4700pf r:10k ? 100k . set the pwm frequency. setting range is c:470pf 4700pf r:10k ? 100k . 0.1uf 100uf test terminal for testing. please connect to gnd. downloaded from: http:///
technical note 4/8 bd6393f p , BD6395FP www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. point s to noti ce for terminal de scri p ti on ps power save terminal ps can make circuit standby state and make motor output open. please be careful because there is a delay of 40 s(max.) before it is returned from standby state to normal state and the motor output becomes active. ps state l standby state (reset) h active phase1,phase2 logic input terminal these terminals decide output state. phasex outxa outxb l l h h h l i01,i02,i11,i12 logic input terminal for dac these terminals decide internal dac output voltage for current limit. i0x i1x output current level(%) l l 100 h l 67 l h 33 h h 0 (i0x,i1x)=(h,h) : motor output are open. pro t ecti on ci rcu i t s thermal shutdown (tsd) this ic has a built-in thermal shutdown circuit for therma l protection. when the ics chip temperature rises above 175 (typ.), the motor output becomes open. also , when the temperature returns to under 150 (typ.), it automatically returns to normal operation. however, even when tsd is in operat ion, if heat is continued to be added externally, heat overdrive can lead to destruction. over current protection (ocp) this ic has a built in over current protection circuit as a provision against destruction when the motor outputs are shorted each other or vcc-motor output or motor output-gnd is shorted. this circ uit latches the motor output to open condition when the regulated threshold current flows for 4 s (typ.). it returns with power r eactivation or a reset of the ps terminal. the over current protection circuits only aim is to prevent the destruction of the ic from irregular situations such as motor output shorts, and is not meant to be used as protection or security for the set. therefore, sets should not be designed to take into account this circuits functions. after ocp operating, if irregul ar situations continues and the return by power reactivation or a reset of the ps te rminal is carried out repeatly, then ocp operates repeatly and the ic may generate heat or otherwise deteriorate. when the l value of the wiring is great due to the wiring being long, after the over current has flowed an d the output terminal voltage jumps up and the absolute maximum values may be exceeded and as a result, there is a possibility of destruction . also, when current which is over the output current rating and under the ocp detection current flows, the ic can heat up to over t jmax =150 and can deteriorate, so current which exceeds the output rating should not be applied. under voltage lock out (uvlo) this ic has a built-in under voltage lock out function to pr event false operation such as ic output during power supply under voltage. when the applied voltage to the vcc termina l goes under 11v (typ.), the motor output is set to open. this switching voltage has a 1v (typ.) hysteresis to prev ent false operation by noise et c. please be aware that this circuit does not operate during power save mode. over voltage lock out (ovlo) this ic has a built-in over voltage lock out function to pr otect the ic output and the motor during power supply over voltage. when the applied voltage to the vcc terminal goes over 33v (typ.), the motor output is set to open. this switching voltage has a 1v (typ.) hysteresis and a 4 s (typ.) mask time to prevent false operation by noise etc. although this over voltage locked out circuit is built-in, th ere is a possibility of destruction if the absolute maximum value for power supply voltage is exceeded, therefore the ab solute maximum value should not be exceeded. please be aware that this circuit does not operate during power save mode. false operation prevention function in no power supply (ghost supply prevention) if a logic control signal is input when there is no power suppl ied to this ic, there is a function which prevents the false operation by voltage supplied via the electrostatic destruction prevention diode from the logic control input terminal to the vcc, to this ic or to another ics power supply. therefor e, there is no malfunction of the circuit even when voltage is supplied to the logic control input terminal while there is no power supply. downloaded from: http:///
technical note 5/8 bd6393f p , BD6395FP www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. p o w e r d iss ip at io n hsop25 package (bd6393fp/BD6395FP) hsop25 has a heat-dissipating fin terminal on the ic side, but it is possible to greatly increase power dissipation by taking a large heat dissipation pattern, such as with copper foil, on the back as well as the surface of the board. also, this terminal is a gnd potential, therefore there is a possibilit y for malfunction or destructi on if it is shorted with any potential other than gnd. fig. 2 hsop25 derating curve ambient temperature:ta[ ] power dissipation pd[w] 1.0 100 125 0 3.47w 4 2.66w 3 1.79w 2 1.45w 1 2.0 3.0 4.0 5.0 measurement machine th156 kuwano electric measurement condition rohm board board size 70*70*1.6mm 3 (with through holes on the board) the exposed metal of the backside is connected to the board with solder. board 1-layer board(copper foil on the back 0mm 2 ) board 2-layer board(copper foil on the back 15*15mm 2 ) board 2-layer board(copper foil on the back 70*70mm 2 ) board 4-layer board(copper foil on the back 70*70mm 2 ) board ja = 86 /w board ja = 70 /w board ja = 47 /w board ja = 36 /w downloaded from: http:///
technical note 6/8 bd6393f p , BD6395FP www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. usage notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify br eaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute ma ximum ratings, consider adding circuit protection devices, such as fuses. (2) connecting the power supply connector backward connecting of the power supply in reverse polarity can damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. (3) power supply lines design pcb layout pattern to provide low impedance gnd and supply lines. to obtain a low noise ground and supply line, separate the ground section and supply li nes of the digital and analog blocks. furthermore, for all power supply terminals to ics, connect a capacitor between the power supply and the gnd terminal. when applying electrolytic capacitors in the circuit, not that capacitance characteristic values are reduced at low temperatures. (4) gnd potential the potential of gnd pin must be minimu m potential in all operating conditions. (5) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) in actual operating conditions. users should be aware that bd6391efv has been designed to expose their frames at the back of the package, and should be used with suitable heat dissipation treatment in th is area to improve dissipation. as large a dissipation pattern should be taken as possible, not only on the front of the baseboard but al so on the back surface. bd6393fp and BD6395FP are both equipped with fin heat dissipation terminals, but dissipation efficiency can be improved by applying heat dissipation treatment in this area. it is important to consider actual us age conditions and to take as large a dissipation pattern as possible. (6) inter-pin shorts and mounting errors when attaching to a printed circuit board, pay close attention to the direction of the ic and displacement. improper attachment may lead to destruction of the ic. there is also possibility of destruction from short circuits which can be caused by foreign matter entering between out puts or an output and the power supply or gnd. (7) operation in a strong electric field use caution when using the ic in the presence of a strong electr omagnetic field as doing so may cause the ic to malfunction. (8) aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. (9) thermal shutdown circuit the ic has a built-in thermal shutdown circuit (t sd circuit). if the chip temperature becomes t jmax =150 , and higher, coil output to the motor will be open. the tsd circuit is des igned only to shut the ic of f to prevent runaway thermal operation. it is not designed to protect or indemnify peri pheral equipment. do not use the tsd function to protect peripheral equipment. tsd on temperature [ ] (typ.) hysteresis temperature [ ] (typ.) 175 25 (10) inspection of the application board during inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility that it could cause stress to the ic, t herefore an electrical discharge should be performed after each process. also, as a measure again electrostatic discharge, it should be earthed during the assembly process and special care should be taken during transport or storage. furthermore, when connecti ng to the jig during the inspection process, the power supply should first be turned off and then removed before the inspection. downloaded from: http:///
technical note 7/8 bd6393f p , BD6395FP www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. (11) input terminal of ic this ic is a monolithic ic, and between each element there is a p+ isolation for element partition and a p substrate. this p layer and each elements n layer make up the p-n junction, and various parasitic elements are made up. for example, when the resistance and transistor are connected to the terminal as shown in figure 3, when gnd (terminal a) at the resistance and gnd (terminal b) at the transistor (npn), the p-n junction operates as a parasitic diode. also, when gnd (terminal b) at the transistor (npn) the parasitic npn transistor operates with the n la yers of other elements close to the aforementioned parasitic diode. because of the ics structure, the creation of parasitic elements is inevitable from the electrical potential relationship. the operation of parasitic elements causes interference in circ uit operation, and can lead to malfunction and destruction. therefore, be careful not to use it in a way which causes t he parasitic elements to operate, such as by applying voltage that is lower than the gnd (p substrate) to the input terminal. fig.3 pattern diagram of parasitic element (12) ground wiring patterns when using both small signal and large current gnd pattern s, it is recommended to isolate the two ground patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern potential of any external components, either. (13) test terminal be sure to connect test pin to gnd. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a p aras iti c element pin b other adjacent elements e b c gnd p aras iti c element downloaded from: http:///
technical note 8/8 bd6393f p/BD6395FP www.rohm.com 2012.02 - rev . a ? 2012 rohm co., ltd. all rights reserved. or der in g p a rt n u mb er b d 6 3 9 1 ef v -e 2 ?` efv=hsop25 ?`?? e2: `???` (unit : mm) hsop25 7.8 0.3 5.4 0.2 2.75 0.1 1.95 0.1 25 14 1 13 0.11 1.9 0.1 0.36 0.1 12.0 0.2 0.3min. 0.25 0.1 13.6 0.2 0.8 (max 13.95 include burr) s 0.1 s ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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