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| product structure silicon monolithic integrated circuit ? this product is not designed prot ection against radioactive rays 1/20 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 14k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 datashee t 4-channel white led driver with integrated fet for up to 24 leds BD6586MUV ? general description BD6586MUV is white led driver ic with pwm step-up dc/dc converter that can boost max 24v and current driver that can drive max 25ma. the wide and precision brightness can be controlled by external pwm pulse. BD6586MUV has very accurate current drivers, and it has few current errors between each strings. so, it will be helpful to reduce brightness spots on the lcd. small package type is suited for saving space. ? features high accuracy & good matching (3.0%) current drivers 4ch (max.25ma/ch) 28v power nch mosfet soft start drive up to 6 in series, 4 strings in parallel rich safety functions ? over-voltage protection ? output short protection ? external sbd open detect ? over current limit ? thermal shutdown ? uvlo ? typical application circuit ? key specifications ? operating power supply voltage range: 2.7v to 5.5v ? led maximum current: 25ma (max.) ? quiescent current: 0.1 a (typ.) ? switching frequency: 1.0mhz(typ.) ? operating temperature range: -40 ? to +85 ? ? package w(typ.) x d(typ.) x h(max.) ? applications all middle size lcd equipments backlight of notebook pc, portable dvd player, car navigation systems, etc. figure 2. typical application circuit (power control pwm application) v qfn024v4040 4.00mm x 4.00mm x 1.00mm figure 1. 4.7 f 2.7v to 5.5v vd et sw led4 4.7 h 6led x 4parallel gnd each 20ma 2.2 f en1 gnd 24k ? pgnd batter y pwm led2 led3 sw en2 test iset vbat sw led1 testo trsw gnd pgnd 1 f can be set up to each 10~25ma 1 00h z~1 khz pw m
datasheet 2/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 ? absolute maximum ratings (ta=25 ?) parameter symbol ratings unit condition terminal voltage 1 vmax1 7 v vbat, en1, en2, trsw, pwm,testo, iset, test terminal voltage 2 vmax2 25 v led1, led2, led3, led4, terminal voltage 3 vmax3 30.5 v sw terminal voltage 4 vmax4 50.5 v vdet power dissipation 1 pd1 500 *1 mw power dissipation 2 pd2 780 *2 mw power dissipation 3 pd3 1510 *3 mw operating temperature range topr -40 to +85 ? storage temperature range tstg -55 to +150 ? *1 reduced 4.0mw/ ? with ta>25 ? when not mounted on a heat radiation board. *2 1 layer (rohm standard board) has been mounted. copper foil area 0mm 2 , when it?s used by more than ta=25 ? , it?s reduced by 6.2mw/ ?. *3 4 layer (jedec compliant board) has been mounted. copper foil area 1layer 6.28mm 2 , copper foil area 2 to 4layers 5655.04mm 2 , when it?s used by more than ta=25 ? , it?s reduced by 12.1mw/ ?. ? recommended operating rating (ta=-40 ? to +85 ? ) parameter symbol limits unit condition min. typ. max. power supply voltage vbat 2.7 3.6 5.5 v ? electrical characteristics (unless otherwise specified, vbat=3.6v, ta = +25 ?) parameter symbol limits unit condition min. typ. max. [en1, en2, pwm terminal] en threshold voltage (low) vthl 0 - 0.4 v en threshold voltage (high) vthh 1.4 - 5.5 v en terminal input current iin - 8.3 16.0 a input=2.5v [under voltage lock out] under voltage lock out uvlo 2.05 2.35 2.65 v vbat falling edge [switching regulator] quiescent current iq - 0.1 2.0 a en1=en2=pwm=0v current consumption idd - 2.2 4.6 ma vdet=0v,iset=24k ? led control voltage vled 0.4 0.5 0.6 v over current limit ocp 1.1 1.5 2.5 a *1 sbd open protect sop - - 0.1 v detect voltage of vdet pin switching frequency fsw 0.7 1.0 1.3 mhz duty cycle limit duty 91 95 99 % led1-4=0.3v over voltage limit ovl 25.0 25.5 26.0 v led1-4=0.3v sw transistor on resistance rsw - 0.24 0.32 ? isw=100ma [current driver] led maximum current ilmax - - 25 ma led current accuracy ilaccu - - 5 % iled=20ma led current matching ilmat - - 3 % ? each led current/average (led1- 4) ? iled=20ma iset voltage iset 0.5 0.6 0.7 v led current limiter ilocp 35 60 90 ma current limit value at iset resistance 4.7k ? setting led1, 2, 3, 4=0.5v led terminal over voltage protect ledovp 10.0 11.5 13.0 v en1=en2=pwm=2.5v *1 this parameter is tested with dc measurement. datasheet 3/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 ? pin descriptions ? pin esd type pin name in/out pin number function terminal equivalent circuit diagram 1 vbat in battery input g 2 en1 in power control pin a 3 en2 in power control pin a 4 gnd - gnd for dc/dc b 5 pwm in pwm input pin for power on/off only driver a 6 iset in register connection for led current setting d 7 gnd - gnd for iset register b 8 led1 in current sink for led1 c 9 led2 in current sink for led2 c 10 gnd - gnd for current driver b 11 led3 in current sink for led3 c 12 led4 in current sink for led4 c 13 test in test input (pull down 100k ? to gnd) a 14 testo out test output d 15 n.c. - no connect pin e 16 sw out switching tr drive pin f 17 sw out switching tr drive pin f 18 sw out switching tr drive pin f 19 vdet in detect input for sbd open and ovp c 20 n.c. - no connect pin e 21 pgnd - pgnd for switching transistor d 22 pgnd - pgnd for switching transistor d 23 n.c. - no connect pin e 24 trsw out the gate of switching tr d - thermal pad - heat radiation pad of back side connect to gnd - gnd vbat pin a vbat pin b gnd pin c gnd vbat pin d pin e pgnd pin f pgnd gnd pin g pgnd figure 3. pin esd type datasheet 4/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 ?block diagram pin number 24pin figure 4. block diagram ? description of functions 1) pwm current mode dc/dc converter while BD6586MUV is power on, the lowest voltage of led1, 2, 3, 4 is detected, pwm duty is decided to be 0.5v and output voltage is kept invariably. as for the inputs of th e pwm comparator as the feat ure of the pwm current mode, one is overlapped with error components from the error amplifie r, and the other is overlapped with a current sense signal that controls the inductor current into slope waveform to pr event sub harmonic oscillation. this output controls internal nch tr via the rs latch. in the period where internal nch tr gate is on, energy is accumulated in the external inductor, and in the period where internal nch tr gate is off, energy is transferred to the output capacitor via external sbd. BD6586MUV has many safety functions, and their detection signals stop swit ching operation at once. 2) soft start BD6586MUV has soft start function. the soft start function prevents large coil current. rush current at turning on is prevented by the soft start function. after en1, en2 are changed l ? h, soft start becomes effective for with in 1ms and soft start doesn't become effective even if en1, en2 are changed l ? h after that. and, when the h section of pwm is within 1ms, soft start be comes invalid when pwm is input to h more than three times. the invalid of the soft start can be canceled by making en1, en2, pwm ? l. and, a soft start function doesn't work after a protection function release. current sense datasheet 5/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 ? description of functions - continued 3) external sbd open detect and over voltage protection BD6586MUV has over boost protection by external sbd open and over voltage protection. it detects vdet voltage and is stopped output tr in abnormal condition. details are as shown below. ? external sbd open detect in the case of external sbd is not connected to ic, the coil or internal tr may be destructed. therefore, at such an error as vout becoming 0.1v or below, the under detector shown in the figure wo rks, and turns off the output tr, and prevents the coil and the ic from being destructed. and the ic changes from activation into non-activa tion, and current does not flow to the coil (0ma). ? over voltage protection at such an error of output open as the output dc/dc and the led is not connected to ic, the dc/dc will boost too much and the vdet terminal exceed the absolute maximum ratings, and may destruct the ic. therefore, when vdet becomes sensing voltage or higher, the over voltage limit works, and turns off the output tr, and the pressure up made stop. at this moment, the ic changes from activation into non- activation, and the output voltage goes down slowly. and, when the output voltage becomes the hyster esis of the over voltage limit or bel ow, the output voltage pressure up to sensing voltage once again and unless the application error is recovered, this operation is repeated. 4) thermal shut down BD6586MUV has thermal shut down function. the thermal shut down works at 175 c or higher, and while holding the setting of en1, en2 control from the outside, turns into non operation condition from operation condit ion. and at 175 c or below, the ic gets back to its normal operation. 5) over current limit over current flows the current detection resistor between swit ching transistor source and pg nd, then the voltage of that resistor turns more than detection voltage. over current protection is operating and it is prevented from flowing more than detection current by reducing on duty of switching tr without stopping boost. as over current detector of BD6586MUV is detected peak current, current more than over current setting value does not flow. 6) under voltage lock out(uvlo) when vbat declines in 2.35v (typ.) from the condition of the power-on, dc/dc and a current driver are changed from a state of movement to the condition at the time of the non -movement. and, it is returned in a state of movement when vbat is raised beyond 2.55v (typ.). ? operating of the application deficiency 1) when 1 led or 1parallel open during the operating the led parallel which becam e open isn't lighting, but other led parallel is lighting. then, output boosts up to the over voltage protec tion voltage 25.5v because led terminal can be 0v. after the over voltage protection is detected, led terminal of 0v isn?t cut from feedback loop. then, output voltage will become normal voltage automatically. 2) when led short-circuited in the plural all led continue to be turned on, unless led terminal voltage beco me more than ?led terminal over voltage protection (11.5v)?. when it was more than 11.5v, the line which short-circuited is only turned on, and led current of other lines decrease or turn off. 3) when schottky diode came off all led aren't turned on. also, ic isn't destroyed because boost operating stops by the schottky diode coming off protected function. 4) when an output capacitor short. all led aren't turned on. and, an ic isn't destroyed because boost stops by the sbd open protection function. but, big electric current occurs, and a coil or sbd is likely to destroy it because the route of the gnd short circuit of the power supply coil output capacitor occurs. 5) when the resistance to connect it to the iset terminal short, all led are n't turned on. because led current limit works, all current drivers stop, and dc/dc maintain s boost under the state without load. and, it is returned in a state of no rmality by canceling a state of short. datasheet 6/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 ? start control and select constant current driver BD6586MUV can control the start conditions by en1, 2 and pwm terminals, and sets 0.4v or below en1, 2 terminals, so ic can power off. en1, 2 and pwm power on at more than 1.4v, constant current can select on/off by the combination of en as shown below table. when there is unused constant current dr iver, unused led terminal is set ?open?. enable constant current driver ic power en1 en2 pwm led1 led2 led3 led4 h h h off on on off on l h h off on on on on h l h on on on on on l l h off off off off off h h l off off off off on l h l off off off off on h l l off off off off on l l l off off off off off ? control signal input timing ? vbat pwm min. 100s 2.7v dc/dc vout en1,2 2 3 stable voltage 1 gnd vbat pin 300k ? 0v 5v 10k ? figure 5. control signal timing figure 6. voltage with a control sign higher than vbat example corresponding to application of conditions in case you input control signs, such as en1, en2 and pwm in the condition that the standup of supply voltage (vbat) is not completed, be careful of the following point. ? input each control signal after vbat exceeds 2.7v. ? please do not input each control sign until vbat exceeds hi voltage of en1, en2 and pwm. ? when you input hi voltage to en1, en2 and pwm during t he standup of vbat, please give min.100s as the standup time of vbat from stable voltage to 2.7v. there is no timing limitation at each input signal of en1, en2 and pwm. if each control sign changes into a condition lower than vbat in (1) and (2), it goes via the esd custody diode by the side of vbat of each terminal. a power supply is supplied to vbat and there is a possibility of malfunctioning. moreover, when the entrance current to the terminal exceeds 50ma, it has possibility to damage the lsi. in order to avoid this condition, as shown in the above figure, please insert about 10k ? in a signal line, and apply current qualification. ? led current setting range led current can set up normal current by resist ance value (riset) connecting to iset voltage. setting of each led current is given as shown below. normal current = 20ma(24k ? /riset) also, normal current setting range is 10ma to 25ma. led current becomes a leak current max 2a at off setting. iset normal current setting example riseth led current riseth led current 24k ? (e24) 20ma 28k ? (e96) 17.1ma 25.5 k ? (e96) 18.8ma 30k ? (e24) 16.0ma 27 k ? (e12) 17.8ma 33k ? (e6) 14.5ma datasheet 7/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 ? brightness control there are two dimming method is available, first method is analog dimming that apply analog voltage to iseth terminal, and second method is pwm control via digital dimming of en1, en2 pwm terminals or pwm. because each method has the different merit, please choose a suit able method for the application of use. refer to figure 25 for the analog dimming. two techniques can be used as digital dimming by the pwm c ontrol. one is pwm control of current driver, the other is pwm control of power control. as these two characteristics are shown in the below, sele cts to pwm control process comply with application. ?efficiency emphasis in the low brightness which has an influence with the battery life ? 2) power control pwm control ?led current dispersion emphasis in the pwm brightness control ? 1) current driver pwm control (reference) pwm regulation process efficiency of led current 0.2ma (pwm duty=1%) pwm frequency 200hz low duty current driver 60% 0.1% power control 94% 0.6% 1) current driver pwm control is controlled by providi ng pwm signal to pwm terminal, as it is shown figure 7. the current set up with iset is chosen as the h section of pwm and the current is off as the l section. therefore, the average led current is increasing in proportion to duty cycle of pwm signal. this method that it lets internal circuit and dc/dc to work, because it becomes to switch the driver, t he current tolerance is a few when the pwm brightness is adjusted, it makes it possible to brightness control unt il 20s (min0.4% at 200hz). and, don't use for the brightness control, because effect of iset changeov er is big under 20s on time and under 20s off time. there is no effect of on/off changeover at 0% and 100%, so there is no pr oblem on use. typical pwm frequency is 100hz to 10khz. pwm led current coil current ic?s active current on off on off on off on figure 7. current driver pwm control 2) power control pwm control is controlled by providing pwm signal to en1, en2 as it is shown figure 8. the current setting set up with pwm logic is chosen as the h section and the current is off as the l sect ion. therefore, the average led current is increasing in proportion to duty cycle of en1, en2 signal. this method is, because ic can be power-off at off-time, the consumption current can be suppress, and the high efficiency can be available, so it makes it possible to brightness control until 50s (min1% at 200hz). and, don't us e for the brightness control, because effect of power on/off time changeover is big under 50s on time and under 50s off time. there is no effect of on/off changeover at 0% and 100%, so there is no probl em on use. typical pwm frequency is 100hz to 1khz. en1,en2 led current coil current ic?s active current on off on off on off on off figure 8. power control pwm control datasheet 8/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 4.7 f vd et sw led4 4. 7 h 6led x 4parallel gnd each 20ma 2. 2 f en1 gnd 24k ? pgnd batter y pwm led2 led3 power on /off sw en2 test iset vbat sw led1 testo trsw gnd pgnd 6v to 25v other power su pp l y 2.7v to 5.5v ? the separations of the ic power supply and coil power supply this ic can work in separating the power source in both ic power supply and coil power supply. with this application, it can obtain that decrease of ic power consumption, and the applied voltage exceeds ic rating 5.5v. that application is shown in below figure 9. the higher volt age source is applied to the power source of coil that is connected from an adapter etc. next, the ic power su pply is connected with a different coil power supply. when the coil power supply is applied, it is no any problem ev en though ic power supply is the state of 0v. although ic power supply is set to 0v, pull-down resistance is arranged for the power off which cuts off the leak route from coil power supply in ic inside, the leak route is cut off. and, ther e is no power on-off sequence of coil power supply and ic power supply. figure 9. each battery and coil power supply ? the coil selection the dc/dc is designed by more than 4.7h. when l value sets to a lower value, it is possibility t hat the specific sub-harmonic oscillation of current mode dc / dc will be happened. please do not let l value to 3.3h or below. and, l value increases, the phase margin of dc / dc becomes to zero. please enlarge the output capacitor value when you increase l value. example) 4.7h = output capacitor 2.2f/50v 1pcs 6.8h = output capacitor 2.2f/50v 2pcs 10h = output capacitor 2.2f/50v 3pcs this value is just examples, please made sure the final judgment is under an enough evaluation. ? the adjustment of the switching wave form a switching wave form between the coil and the switch terminal can be adjusted by connecting a capacitor to trsw. switching noise can be restrained though efficiency is made to decrease by connecting a capacitor. decide capacity value after the enough evaluation when you adjust switching noise. trsw pgnd sw trsw pgnd sw figure 10. the adjustment of the switching wave form datasheet 9/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 sw sw sw test0 test n.c. ise t en2 le d 6 l e d5 l ed 4 l ed 3 le d2 vba t en1 gnd pwm trs w n.c. pgnd pgnd n.c. vde t gnd led1 led2 gnd led3 led4 c vbat to gnd to anode of each led bd658 6muv to power suppl y c out c in sbd l riset 1 2 3 4 5 6 7 8 9 10 11 12 18 17 16 15 14 13 24 23 22 21 20 19 pwm (100hz~1000hz) to anode of led to power suppl y thermal via thermal via ? pcb layout in order to make the most of the perform ance of this ic, its layout pattern is very important. characteristics such as efficiency and ripple and the likes change greatly with layout patterns, which please note carefully. figure 11. pcb layout connect the input bypath capacitor cin nearest to coil l and pgnd, as shown in the upper diagram. ripple of a power supply is smoothed by cin and connect stable voltage to vbat terminal by the low resistance. thereby, the input voltage ripple of the ic can be reduced. connect cvbat nearest to between the vbat terminal and gnd (4 pin) as shown in the upper diagram when you can't be wired by the low resistance from cin to vbat pin connect schottky barrier diode sbd of the regulator nearest to between coil l and sw terminal. and connect output capacitor cout nearest to between cin and gnd pin. thereby, the output vo ltage ripple of the ic can be reduced. gnd terminal (4,7,10 pin) is connected inside the ic, and it is gnd of the block except switching and a transistor. a current drive performance may be restricted by influence of a noise, if pgnd which is not smooth connected to gnd. a gnd terminal is connected to the stabl e gnd plane. and connect it to a gnd plane after smoothing pgnd by cin and cout. gnd and pgnd are separated inside ic. and connect it to a gnd plane af ter smoothing pgnd by cin and cout. connect the heat sink of ic to a gnd plane through t hermal via. and connect with the largest possible pattern. it is satisfactory even if it con nects with the gnd terminal of ic. connect led current setting resistor riset nearest to iset pin. there is possibility to oscillate when capacity is added to iset terminal, so pay attention that capacity isn't added. and, riset of gnd side must be wired directly to gnd(7pin) pin. when those pins are not connected direct ly near the chip, influence is given to the performance of BD6586MUV, and may limit the current drive performance. as fo r the wire to the inductor, make its resistance component small so as to reduce electric power consumption and increase the entire efficiency. a layout pattern in consideration of these is shown in page 10. datasheet 10/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 ? recommended pcb layout pattern figure.10 frontal surface datasheet 11/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 ? selection of external parts recommended external parts are as shown below. when to use other parts than these, se lect the following equivalent parts. ? coil value manufacturer product number size dc current (ma) dcr (? ) vertical horizontal height (max) 4.7 h toko a915ay-4r7m 5.2 5.2 3.0 1870 0.045 4.7 h toko b1015as-4r7m 8.4 8.3 4.0 3300 0.038 4.7 h toko a1101as-4r7m 4.1 4.1 1.2 1400 0.115 4.7 h tdk ltf5022t-4r7n2r0 5.0 5.2 2.2 2000 0.073 10 h tdk ltf5022t-100m1r4 5.0 5.2 2.2 1400 0.140 4.7 h tdk vlp6810t-4r7m1r6 6.3 6.8 1.0 1600 0.167 10 h tdk vlp6810t-100m1r1 6.3 6.8 1.0 1100 0.350 ? capacitor value pressure manufacturer product number size tc cap tolerance vertical horizontal height [ power supply capacitor ] 4.7 f 25v murata grm319b31e475k 3. 2 1.6 0.850.1 b +/-10% 4.7 f 25v murata grm21br61e475k 2.0 1.25 1.250.1 x5r +/-10% 1 f 10v murata grm188b11a105k 1.6 0.8 0.80.1 b +/-10% 4.7 f 10v murata grm219b31a475k 2.0 1.25 0.850.1 b +/-10% [ output capacitor ] 1 f 35v murata grm219b3ya105k 2. 0 1.25 0.850.1 b +/-10% 1 f 50v murata grm31mb31h105k 3.2 1.6 1.150.1 b +/-10% 1 f 50v murata grm21bb31h105k 2. 0 1.25 1.250.1 b +/-10% 2.2 f 50v murata grm31cb31h225k 3.2 1.6 1.60.2 b +/-10% ? resistor value tolerance manufacturer product number size vertical horizontal height [ resistor for led current decision datasheet 12/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 4.7 f 2.7v to 5.5v vdet sw led4 4.7 h 6led x 3parallel gnd 2.2 f en1 gnd 24k ? pgnd batter y pwm led2 led3 power on/off sw en2 test iset vbat sw led1 testo trsw gnd pgnd 1 f 100hz~10khz pwm each 20ma can be set up to each 10~25ma ? application example ~ led current setting controlled iset resistor. 19.6k ? : 24.5ma 24k ? : 20ma 30k ? : 16ma 33k ? : 14.5ma ~ brightness control please input pwm pulse from en1, en2 or pwm terminal. please refer electrical function page 7. 7 inch panel s figure 14. 6 series4 parallel, led current 20ma setting power control pwm application 5inch panel figure 15. 6 series3 parallel, led current 20ma setting current driver pwm application datasheet 13/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 4.7 f 2.7v to 5.5v vdet sw led4 4.7 h 4led x 4parallel gnd 2.2 f en1 gnd 24k ? pgnd batter y pwm led2 led3 power on/off sw en2 test iset vbat sw led1 testo trsw gnd pgnd 1 f 100hz~10khz pwm each 20ma can be set up to each 10~25ma ~ led current setting controlled iset resistor. 19.6k ? : 24.5ma 24k ? : 20ma 30k ? : 16ma 33k ? : 14.5ma ~ brightness control please input pwm pulse from en1, en2 or pwm terminal. please refer electrical function page 7. 5 inch panel figure 16. 4 series4 parallel, led current 20ma setting current driver pwm application 4.7 f 2.7v to 5.5v vdet sw led4 4.7 h 5led x 3parallel gnd 2.2 f en1 gnd 24k ? pgnd battery pwm led2 led3 power on/off sw en2 test iset vbat sw led1 testo trsw gnd pgnd 1 f 100 hz~10khz pwm e ach 20ma can be set up to each 10~25ma figure 17. 5 series3 parallel, led current 20ma setting current driver pwm application datasheet 14/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 4.7 f 2.7v to 5.5v vdet sw led4 4.7 h 6led x 2parallel gnd 2.2 f en1 gnd 24k ? pgnd batter y pwm led2 led3 sw en2 test iset vbat sw led1 testo trsw gnd pgnd 1 f 100hz~1khz pwm each 40ma can be set up to each 20~50ma 4.7 f 2.7v to 5.5v vdet sw led4 4.7 h 6led x 2parallel gnd 2.2 f en1 gnd 24k ? pgnd batter y pwm led2 led3 power on/off sw en2 test iset vbat sw led1 testo trsw gnd pgnd 1 f 100hz~10khz pwm each 20ma can be set up to each 10~25ma ~ led current setting controlled iset resistor. 19.6k ? : 24.5ma 24k ? : 20ma 30k ? : 16ma 33k ? : 14.5ma ~ brightness control please input pwm pulse from en1, en2 or pwm terminal. please refer electrical function page 7. less than 5 inch panel figure 18. 6 series2 parallel, led current 20ma setting current driver pwm application figure 19. 6 series2 parallel, led current 40ma setting power control pwm application datasheet 15/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 4.7 f 2.7v to 5.5v vdet sw led4 4.7 h 6led x 2parallel gnd 2.2 f en1 gnd 24k ? pgnd batter y pwm led2 led3 sw en2 test iset vbat sw led1 testo trsw gnd pgnd 1 f 100hz~1khz pwm each 40ma can be set up to each 20~50ma 4.7 f 2.7v to 5.5v vdet sw led4 4.7 h 2led x 3parallel gnd 2.2 f en1 gnd 24k ? pgnd batter y pwm led2 led3 power on/off sw en2 test iset vbat sw led1 testo trsw gnd pgnd 1 f 100hz~10khz pwm each 20ma can be set up to each 10~25ma ~ led current setting controlled iset resistor. 19.6k ? : 24.5ma 24k ? : 20ma 30k ? : 16ma 33k ? : 14.5ma ~ brightness control please input pwm pulse from en1, en2 or pwm terminal. please refer electrical function page 7. less than 5 inch panel figure 20. 2 series3 parallel, led current 20ma setting current driver pwm application figure 21. 3 series2 parallel, led current 40ma setting power control pwm application datasheet 16/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 4.7 f 2.7v to 5.5v vdet sw led4 4.7 h 6led x 1parallel gnd 2.2 f en1 gnd 24k ? pgnd batter y pwm led2 led3 sw en2 test iset vbat sw led1 testo trsw gnd pgnd 1 f 100hz~1khz pwm each 80ma can be set up to each 40~100ma 4.7 f 2.7v to 5.5v vdet sw led4 4.7 h 6led x 1parallel gnd 2.2 f en1 gnd 24k ? pgnd batter y pwm led2 led3 power on/off sw en2 test iset vbat sw led1 testo trsw gnd pgnd 1 f 100hz~10khz pwm each 60ma can be set up to each 30~75ma ~ led current setting controlled iset resistor. 19.6k ? : 24.5ma 24k ? : 20ma 30k ? : 16ma 33k ? : 14.5ma ~ brightness control please input pwm pulse from en1, en2 or pwm terminal. please refer electrical function page 7. for big current led figure 22. 6 series1 parallel, led current 60ma setting current driver pwm application figure 23. 6 series1 parallel, led current 80ma setting power control pwm application datasheet 17/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 ~ led current setting controlled iset resistor. 19.6k ? : 24.5ma 24k ? : 20ma 30k ? : 16ma 33k ? : 14.5ma ~ brightness control please input pwm pulse from en1, en2 or pwm terminal. please refer electrical function page 7. for the application of 7v and more 4.7 f vdet sw led4 4.7 h 6led x 4parallel gnd 2.2 f en1 gnd 24k ? pgnd batter y pwm led2 led3 power on/off sw en2 test iset vbat sw led1 testo trsw gnd pgnd 6.0vto25v other power su pp l y 2.7v to 5.5v 1 f each 20ma can be set up to each 20~50ma figure 24. 6 series4 parallel, led current 20ma setting power control pwm application ? analog style optical application control led current to charged d/a voltage. show application example and typ control. please decide final value after you ev aluated application, characteristic. 4.7 f 2.7v to 5.5v vd et sw led4 4.7 h 6led x 4paralle l gnd 2.2 f en1 gnd 47 0k ? pgnd batter y pwm led2 led3 sw en2 test iset vbat sw led1 testo trsw gnd pgnd 1 f power on /off 24k ? d/a each 20ma can be set up to each 10~25ma figure 25. analog style optical application d/a led current 0.05v 19.4ma 0.2v 14.4ma 0.4v 7.7ma 0.5v 4.4ma 0.6v 1.0ma 0.7v 0ma led current = iset voltage 470k ? + iset voltage -d/ a 24k ? 800 typ led current = 0.6v 470k ? + 0.6v-d/a 24k ? 800 datasheet 18/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 ? operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assum ed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating condition these conditions represent a range within which characteri stics can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can br eak down ics. take protective measures against the breakdown due to the reverse connection, such as mounti ng an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and t he gnd lines. in this regard, for the digital block power supply and the analog block powe r supply, even though these po wer supplies has the same level of potential, separate the power supply pattern for the di gital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrol ytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capaci ty dropout at a low temperature, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gnd voltage including an actual electric transient . (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or t he gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong elec tromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connec ted to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each proc ess. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then di smount it from the jig. in addition, for protection against static electricity, establis h a ground for the assembly process and pay thorough attention to the transportation and t he storage of the set pcb. (9) input terminals in terms of the construction of ic, para sitic elements are inevitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunct ion and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applie d to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a volt age lower than the power supply voltag e or within the guaranteed value of electrical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluc tuations in voltages of the small-signal gnd. pay attention not to caus e fluctuations in the gnd wiring pattern of external parts as well. (11) external capacitor in order to use a ceramic capacitor as the external capaci tor, determine the constant wi th consideration given to a degradation in the nominal capacitance due to dc bias and c hanges in the capacitance due to temperature, etc. (12) thermal shutdown circuit (tsd) when junction temperatures become 175c (typ) or higher, the t hermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit, which is aim ed at isolating the lsi from thermal runaway as much as possible, is not aimed at the protection or guarantee of the lsi. therefore, do not c ontinuously use the lsi with this circuit operating or use the lsi assuming its operation. (13) thermal design perform thermal design in which there are adequate margins by taking into account the permissible dissipation (pd) in actual states of use. (14) selection of coil select the low dcr inductors to decrease power loss for dc/dc converter. datasheet 19/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 ? ordering information b d 6 5 8 6 m u v - e2 part number package muv: vqfn024v4040 packaging and forming specification e2: embossed tape and reel ? marking diagram ? physical dimension tape and reel information (unit : mm) vqfn024v4040 0.08 s s 16 7 12 19 24 13 18 0.40.1 0.02 +0.03 - 0.02 1pin mark 2.40.1 c0.2 0.5 4.00.1 0.75 2.40.1 4.00.1 1.0max (0.22) 0.25 +0.05 - 0.04 order quantity needs to be multiple of the minimum quantity. datasheet 20/20 BD6586MUV www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400190-1-2 10.dec.2012 rev.001 ? revision history date revision changes 10.dec.2012 001 new release datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. datasheet part number BD6586MUV package vqfn024v4040 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes BD6586MUV - web page distribution inventory |
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