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product structure silicon monolithic integrated circuit this product has no protection against radioactive rays . 1/18 tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 tsz22111 ? 14 ? 001 www.rohm.com dc brushless fan motor driver 5v single-phase full-wave fan motor driver bu6909agft description the bu6909agft is a 5v single-phase full-wave fan motor driver with built in hall element. it is part of the dc brushless fan motor driver series. bu6909agft is built in a compact package and provides auto gain control function (agc), silent drive by soft switching, and low battery consumption via its standby function. bu6909agft is best used for notebook pc cooling fans. features ? built in hall element ? auto gain control function (agc) ? soft switching drive (pwm type) ? low pwm duty start up ? quick start function ? stand-by mode ? incorporates lock protection and automatic restart circuit ? compact package (gft:tssof6 flat lead package) when tssof6 is mounted, package thickness is 0.3mm ? rotating speed pulse signal (fg) output ? pwm speed control package w(typ) x d(typ) x h(max) tssof6 2.90mm x 3.80mm x 0.8mm tssof6 applications ? for compact 5v fan such as notebook pc cooling fan absolute maximum ratings parameter symbol limit unit supply voltage v cc 7 v power dissipation pd 0.54 (note 1) w operating temperature topr -40 to +85 c storage temperature tstg -55 to +125 c output voltage v omax 7 v output current i omax 800 (note 2) ma fg signal output voltage v fg 7 v fg signal output current i fg 10 ma junction temperature tjmax 125 c (note 1) reduce by 5.4mw/ over 25 . (on 70.0mm70.0mm1.6mm glass epoxy board) (note 2) this value is not to exceed pd. caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is impor tant to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings. recommended operating condition parameter symbol limit unit operating supply voltage range v cc 1.8 to 5.5 v downloaded from: http:///
2/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 block diagram this is an open drain output. connect a pull-up resistor. conventional fan motor driver ic with hall element requires adjustment of hall bias resistor due to several factors that affect the hall amplitude. this ic automatically adjusts hall amplitude through the use of a built in hall element and unique agc function. consider protection against voltage rise due to reverse connection of power supply and back electromotive force. enables speed control by applying external pwm signal. maximum input frequency is 50khz. 1 fg oscillator circuit uvlo tsd lock protection pre driver h-bridge signal out offset cancel control logic a/d conversion pwm duty hall element 3 2 gnd out1 6 vcc 4 5 pwm out2 m tsd : thermal shut down(heat rejection circuit) uvlo :under voltage lock outputs (low voltage protection circuit) page 15. page 14. page 8. page 10. figure 1. block diagram and application circuit pin description pin no. pin name function 1 fg fg signal output 2 gnd gnd 3 out1 motor output 1 4 out2 motor output 2 5 pwm pwm signal input 6 vcc power supply i/o truth table ? supply magnetic direction (positive) ? output operation figure 2. output operation supply magnetic direction pwm* out1 out2 fg s h(open) h l l (output tr on) n h(open) l h h (output tr off) s l l l h (output tr off) n l l l h (output tr off) *when pwm terminal is l, ic state changes to stand-by mode. fg terminal is always h in stand-by mode s n marking (heat protection circuit) b rev b fwd v out 1 :b b rev b fwd v out2 magnetic flux density:b b hys b h y s magnetic flux density downloaded from: http:///
3/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise specified ta=25c, v cc =5v) parameter symbol min typ max unit conditions characteristics circuit current 1 i cc 1 - 2 4 ma pwm=open figure 3 circuit current 2 (stand-by mode) i cc 2 - 25 50 a pwm=gnd figure 4 magnetic switch-point for forward rotation b fwd - 1.5 mt figure 5 magnetic switch-point for reverse rotation b rev -1.5 - mt figure 6 magnetic hysteresis b hys - 3.0 5.0 mt figure 7 pwm input h level v pwmh 2.5 - v cc v - pwm input l level v pwml 0 - 0.8 v - pwm input frequency f pwm 5 - 50 khz - output voltage v o - 0.16 0.24 v io=200ma upper and lower total figure 8 to 13 fg low voltage v fgl - - 0.4 v i fg =5ma figure 14,15 fg leak current i fgl - - 5 a v fg =7v figure 16 lock detection on time t on 0.35 0.50 0.65 s figure 17 lock detection off time t off 3.5 5.0 6.5 s figure 18 downloaded from: http:///
4/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves 0 20 40 60 80 100 123456 supply voltage : v cc [v] circuit current : i cc 2 [a] figure 3. circuit current 1 figure 4. circuit current 2 (stand-by mode) figure 5. magnetic switch-point for forward rotation figure 6. magnetic switch-point for reverse rotation operating voltage range 85c25c -40c operating voltage range 0.0 1.0 2.0 3.0 4.0 123456 supply voltage : v cc [v] circuit current : i cc 1 [ma] 85c25c -40c operating voltage range operating voltage range -2.5 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 123456 supply voltage : v cc [v] 85c25c -40c operating voltage range ?R -2.5 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 123456 supply voltage : v cc [v] -40c 25c85c operating voltage range magnetic switch-point for forward rotation : b fwd [mt] magnetic switch-point for reverse rotation : b rev [mt] downloaded from: http:///
5/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 8. output h voltage (temperature characteristics) figure 9. output h voltage (voltage characteristics) figure 10. output l voltage (temperature characteristics) 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.6 0.8 output current : i o [a] output h voltage : v oh [v] 85c25c -40c 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.6 0.8 output current : i o [a] output h voltage : v oh [v] 1.8v5.0v 5.5v 0.0 0.2 0.4 0.6 0.8 1.0 0 . 00 . 20 . 40 . 60 . 8 output current : i o [a] output l voltage : v ol [v] 85c25c -40c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 123456 supply voltage : vcc [v] magnetic hysteresis : bhys [mt] figure 7. magnetic hysteresis 8 5 25 -40 operating voltage range downloaded from: http:///
6/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 12. total output voltage (output h and l) (temperature characteristics) figure 11. output l voltage (voltage characteristics) figure 13. total output voltage (output h and l) (voltage characteristics) figure 14. fg output l voltage (temperature characteristics) 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.6 0.8 output current : i o [a] output l voltage : v ol [v] 1.8v 5.0v5.5v 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.6 0.8 output current : i o [a] output voltage : v o [v] 85c25c -40c 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.6 0.8 output current : i o [a] output voltage : v o [v] 1.8v 5.0v5.5v 0.0 0.1 0.2 0.3 0.4 0.5 024681 0 fg current : i fg [ma] fg output l voltage : v fgl [v] 85c25c -40c downloaded from: http:///
7/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued figure 16. fg output leak current figure 15. fg output l voltage (voltage characteristics) figure 17. lock detection on time figure 18. lock detection off time 0.0 0.1 0.2 0.3 0.4 0.5 024681 0 fg current : i fg [ma] fg output l voltage : v fgl [v] 1.8v 5.0v5.5v 0.0 0.5 1.0 1.5 2.0 123456 supply voltage : v cc [v] fg leak current : i fgl [a] 85c25c -40c 0.0 0.2 0.4 0.6 0.8 1.0 123456 supply voltage : v cc [v] lock detection on time : t on [s] 85c25c -40c 0 2 4 6 8 10 123456 supply voltage : v cc [v] lock detection off time : t off [s] 85c25c -40c operating voltage range operating voltage range operating voltage range downloaded from: http:///
8/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 auto gain control conventional fan motor driver ic with hall element requires adjustment of hall bias resistor for acoustic noise characteristic and motor rotation efficiency because the magnetic field strength and the magnetic field waveform are different in each motor. this ic automatically controls hall am plitude generated by built in hall element and motor magnet through the use of a unique agc function. agc function needs 15 ms to select the required hall amp gain when turning on the power, and recovering from stand-by mode and lock protection.(refer to figure 23 and 24.) (insufficient magnetic force area) pre C agc area (best magnetic force area) (excess magnetic force area) n n s n at starting ( approach agc area) at driving (agc control) gain up gain up agc control pre C agc area s hall amp gain select time : 15 ms motor start up indefinite area [+/-1.5mt] pwm out1out2 fg vcc pwm soft-switching time hall signal ( image) approach agc area by analog circuit precise agc by digital circuit figure 19. agc image of the hall signal (in case of weak magnetic field) after the startup, the hall signal is incr eased by hall amplifier gain. the increased hall signal is set by the agc around the pre-agc area, the weak magnetic field of the motor as in figure 19. to sele cting a gain requires about 15ms before it activates the motor. downloaded from: http:///
9/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 soft switching (pwm type) soft switching is operated using an output pwm pulse. the ou tput pwm signal is generated by the slope of processed agc hall signal. first, the processed agc hall signal is converted to absolute waveform. next, the absolute waveform and the triangular waveform internally generated by the ic are synthesized. the synthesized waveform determines the pwm soft switching duty and the ratio of time. pwm soft switching time depends on motor speed. in case of a slower hall signal, pwm soft switching time is long due to the obtuse angle of the processed agc hall signal (pwm soft switching time is about 2ms to 4ms.). in case of a faster hall signal, pwm soft switching time is short due to the shar p slope of the agc hall signal (pwm soft switching time is about 200 s to 1ms.). and, the triangular wave oscillator insi de the ic uses a pwm soft switching frequency of 50khz (typical). hence, input pwm frequency is not equal to pwm soft switching frequency. (a) the processed agc hall signal is converted to absolute waveform (b) motor speed is slow (c) motor speed is fast figure 20. pwm soft switching signal synthesis downloaded from: http:///
10/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 pwm control rotation speed of motor can be changed by controlling on/of f of the upper output dependi ng on the duty of the input signal to pwm terminal. when pwm terminal is open, h logic is applied. output pwm frequency is 50 khz (typ). this ic is not direct pwm. hence, input pwm frequency is not equal to output pwm frequency. figure 21 sh ows the characteristic of input pwm duty and output pwm duty. pwm terminal has a built in digital low pass filter (lpf). out put pwm duty has 3.5ms (max) transitional time from the point of change in input pwm duty, this is caus ed by the lpf characteristic (reference is shown in figure 22). additionally, input pwm uses frequencies above 5 khz. 0 20 40 60 80 100 0 2 04 06 08 01 0 0 input pwm duty [%] output pwm duty [%] figure 21. characteristic of input pwm duty and output pwm duty figure 22. timing chart of pwm control downloaded from: http:///
11/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 low duty start up function during motor start up from stop condition, outputs are driv en by a pwm signal of about pwm 50% duty for 3 times of changing magnetic direction. after the low pwm duty start up function, output pwm duty changes corresponding to the input pwm duty. for cases of input pwm duty range of more than 50%, output pwm duty changes corresponding to same input pwm duty at all driving time. this function enables the ic to start the motor regardless of input pwm signals duty. when input pwm duty is 0%, the motor is held on stand-by mode. additionally, the motor changes to idling mode for input pwm duty range of 0% to 2.5%. idling mode only runs on circuit current 1 (i cc 1) in the electrical characteristics table. idling mode turns all output terminals to open state. (a) case a : input pwm duty 2.5% to 50% (b) case b : input pwm duty 50% to 100% figure 23. low duty start up function table 1. truth table of input pwm duty and each outputs terminals input pwm duty [%] ic function (state) out1, out2 fg duty 0 off (stand-by mode) off, off (open state) h (output tr : off) duty 0 < 2.5 on (idle mode) off, off (open state) h (output tr : off) case a : duty 2.5 to 50 on (low duty start up driving) h / l, l / h h / l case b : duty 50 to 100 on (normal driving) h / l, l / h h / l downloaded from: http:///
12/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 quick start function this series has an integrated quick start function. when the pwm signal is input, this function can start up the motor at once regardless of the detection time of the lock protection f unction. (consider hall amp gain select time. reference is shown in figure 24.) stand-by mode stand-by function turns off the circuit when the time of pwm=l has elapsed in order to reduce stand-by current. the circuit current consumption during stand-by mode is specified at the para meter circuit current 2 of the electrical characteristics. figure 24 shows the timing diagram of stand-by mode and quick start function. the 0% detection time before the ic changes to stand-by mode is variable depending on the input pwm duty. this is because of the built in lpf at the pwm terminal. as an exampl e, figure 25 shows the characteristic curve of 0% detection time and input pwm duty for a 25khz input pwm frequency. figure 24. stand-by mode and quick start function 0 20 40 60 80 100 0.0 1.0 2.0 3.0 4.0 0% detection time : t 0 [ms] input pwm duty [%] figure 25. characteristic curve of 0% detection time and input pwm duty at 25khz lock protection and automatic restart motor rotation is detected by hall signal, while lock detection on time (t on ) and lock detection off time (t off ) are set by ic internal counter. external part (c or r) is not required. timing chart is shown in figure 26. figure 26. lock protection timing chart downloaded from: http:///
13/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 equivalent circuit 1) supply voltage terminal 2) pwm signal input terminal 3) fg output terminal 4) motor output terminal hall position (reference data) vcc gnd fg gnd vcc gnd out2 out1 vcc pwm 200k 10k downloaded from: http:///
14/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 safety measure 1) reverse connection protection diode reverse connection of power results in ic destruction as shown in figure 27. when reverse connection is possible, reverse connection protection diode must be added between power supply and vcc. in normal energization reverse power connection after reverse connection destruction prevention circuit block vcc gnd each pin circuit block vcc gnd each pin circuit block vcc gnd each pin internal circuit impedance high amperage small large current flows thermal destruction no destruction figure 27. flow of current when power is connected reversely 2) protection against vcc voltage rise by back electromotive force back electromotive force (back emf) generates regenerative current to power supply. however, when reverse connection protection diode is connected, vcc voltage rises because the diode prevents current flow to power supply. on on on on phase switching figure 28. vcc voltage rise by back electromotive force when the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place a (a) capacitor or (b) zener diode between vcc and gnd. if necessary, add both (c). (d) capacitor and resistor can also be used to have better esd surge protection. (a) capacitor (b) zener diode on on on on (c) capacitor and zener diode (d) capacitor and resistor on on on on figure 29. protection against vcc voltage rise downloaded from: http:///
15/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 3) problem of gnd-line pwm switching do not perform pwm switching of gnd line because gnd terminal potential cannot be kept to a minimum. figure 30. gnd line pwm switching prohibited 4) fg output fg output is an open drain output and requires pull-up resistor. a vcc voltage that is beyond its absolute maximum rating when fg output terminal is directly connected to power supply, could damage the ic. the ic can be protected by adding resistor r1 (as shown in figure 31). figure 31. protection of fg terminal thermal derating curve thermal derating curve indicates power that can be consumed by ic with reference to ambient temperature. power that can be consumed by ic begins to attenuate at certain ambient temper ature. this gradient is determined by thermal resistance ja. thermal resistance ja depends on chip size, power consumption, package ambient temperature, packaging condition, wind velocity, etc., even when the same package is used. thermal derating curve indicates a reference value measured at a specified condition. figure 32. shows a thermal derating curve. 0. 0 0. 1 0. 2 0. 3 0. 4 0. 5 0. 6 0 25 50 75 100 125 150 ambient temperature : ta [ ] power dissipation : pd [w] reduce by 5.4mw/ over 25 . (70.0mm 70.0mm 1.6mm fr4 glass epoxy board) figure 32. thermal derating curve m controller vcc pwm input prohibite motor driver gnd fg protection resistor r1 connector of board pull-up resistor vcc downloaded from: http:///
16/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity wh en connecting the power supply, such as mounting an external diode between the power supply and the ics pow er supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. however, pins that drive inductive loads (e.g. motor driver output s, dc-dc converter outputs) may inevitably go below ground due to back emf or electromotive force. in such cases, the user should make sure that such voltages going below ground will not cause the ic and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and pcb wiring to name a few. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the grou nd traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maxi mum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, an d routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
17/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevit ably formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which cause these parasiti c elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. even if the power supply voltage is applied, make sure that the input terminals have voltages within the values specified in the electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circ uit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage. marking diagrams tssof6(top view) part number marking lot number a b 1 pin mark downloaded from: http:///
18/18 datasheet d a t a s h e e t bu6909agft tsz02201-0h1h0b101190-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.oct.2014 rev.002 www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name tssof6 downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific app lications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to s trict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arisi ng from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6. in particular, if a transient load (a large amount of load a pplied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation (pd) depending on ambient temperature (ta). wh en used in sealed area, confirm the actual ambient temperature. 8. confirm that operation temperature is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, e tc.) flux is used, the residue of flux may negatively affect p roduct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice- ge rev.003 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in this docu ment are presented only as guidance for products use. therefore, i n case you use such information, you are solel y responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderab ility of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is in dicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under controlled goods prescr ibed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to ap plication example contained in this document is for referen ce only. rohm does not warrant that foregoing information or da ta will not infringe any intellectual property rights or any other rights of a ny third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or other d amages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any i ntellectual property rights or other rights of rohm or any third parties with respect to the information contained in this d ocument. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the products and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described i n this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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