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product structure silicon monolithic integrated circuit ? this product is not designed prot ection against radioactive rays 1/36 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 14k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 datashee t 4-channel white led driver with integrated fet for up to 40 leds BD65D00MUV ? general description this ic is white led driver ic with pwm step-up dc/dc converter that can boost max 41v and current driver that can drive max 100ma. the wide and precision brightness can be controlled by external pwm pulse. this ic has very accurate current drivers, and it has few current errors between each strings. so, it will be helpful to reduce brightness spots on the lcd panel. small package is suited for saving space. it can respond to the application according to the application to be abele to switch to external/internal nchfet boosting. ? features ? high efficiency pwm step-up dc/dc converter (fsw=typ 1.25mhz, 0.60mhz to 1.6mhz) ? high accuracy & good matching current drivers 4ch (max100ma/ch) ? integrated 50v power nch mosfet ? soft start function ? drive up to 10 leds in series, 4 strings in parallel ? various safety functions over-voltage protection external sbd open detect / output short protection over current limit ch terminal open / gnd short protect ch over voltage protect / led short protect thermal shutdown uvlo iset short protection ? pwm dimming(100hz - 25khz)analog brightness control ? key specifications ? operating power supply voltage range: 6v to 27v ? led maximum current: 100ma/ch ? quiescent current: 1.6 a (typ.) ? operating temperature range: -40 ? to +85 ? ? package ?????? w(typ.) x d(typ.) x h(max.) ? a pplications all lcd equipments, backlight of notebook pc, amusement, net book, monitor, tv, portable dvd player, light source etc. ? typical application circuit (4 parallel) figure 2. typical application circuit 6v to 27v v qfn028 v 5050 5.00mm x 5.00mm x 1.00mm figure 1.
2/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? absolute maximum ratings (ta=25 ?) parameter symbol ratings unit conditions terminal voltage 1 vmax1 7 v vdc, iset, abc, comp, fset, test, fault, preout, trin, sensp terminal voltage 2 vmax2 45 v ch1 to ch4, lx, ovp terminal voltage 3 vmax3 30.5 v vin, enable terminal voltage 4 vmax4 15 v pwm power dissipation 1 pd1 380 *1 mw power dissipation 2 pd2 880 *2 mw power dissipation 3 pd3 3264 *3 mw operating temperature range topr -40 to +85 ? storage temperature range tstg -55 to +150 ? *1 reduced 3.0mw/ ? with ta>25 ? when not mounted on a heat radiation board. *2 1 layer (rohm standard board) has been mounted. copper foil area 0mm 2 , when it?s used by more than ta=25 ? , it?s reduced by 7.0mw/ ?. *3 4 layer (jedec compliant board) has been m ounted. copper foil area 1.4layer 20.2mm 2 , copper foil area 2 to 3layers 5505mm 2 , when it?s used by more than ta=25 ? , it?s reduced by 26.1mw/ ?. ? power dissipation is calculated by formula : (storage temperature max - 25 ? )/ ja (ex. pd1=3.0mw/ ?) ? recommended operating ratings (ta=-40 ?to +85 ?) parameter symbol limits unit conditions min. typ. max. power supply voltage vinl 6.0 12.0 27.0 v coil power supply vin 4.5 5 27.0 v ic power supply ? electrical characteristics (unless otherwise specified, vin=12v, ta = +25 ?) parameter symbol limits unit conditions min. typ. max. [general] quiescent current iq - 1.6 4.4 a enable=0v current consumption idd - 3.6 5.4 ma ovp=0v,iset=39k ? max. output voltage mov - - 41 v under voltage lock out uvlo - 3.7 4.1 v vin falling edge [enable terminal] low level input voltage enl 0.0 - 0.8 v high level input voltage 1 enh 2.0 - vin v enable pull down resistor enr 100 300 500 k ? enable =3v output current eniout - 0 2 a enable=0v [pwm terminal] low level input voltage pwml 0.0 - 0.8 v high level input voltage 2 pwmh 1.3 - 14.5 v pwm pull down resistor pwmr 100 300 500 k ? pwm=3v output current pwmiout - 0 2 a pwm=0v [fault] nch ron ffcr - - 3 k ? enable=pwm=3v, ovp=2v [regulator] vdc voltage vreg 4.2 5.0 6.0 v no load, vin > 6v
3/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? electrical characteristics - continued (unless otherwise specified, vin=12v, ta = +25 ?) parameter symbol limits unit conditions min. typ. max. [switching regulator] led control voltage vled 0.64 0.80 0.96 v switching frequency accuracy fs w 1.00 1.25 1.50 mhz fset=56k ? duty cycle limit duty 91.0 95.0 99.0 % ch1-4=0.3v, fset=56k ? lx nch fet ron ron - 0.3 0.5 ? ilx=80ma [protection] over current limit ocp 1.5 2.5 - a *1 over voltage limit input ovp 1.16 1.20 1.24 v detect voltage of ovp pin output short protect ovpfault 0.02 0.05 0.08 v detect voltage of ovp pin ovp leak current ovil - 0.1 1.0 a ch terminal over voltage protect accuracy vsc -15 0 +15 % vsc=8v [current driver] led maximum current ilmax - - 100 ma this is current driver?s characteristics. this ic may not output current according to application. led current accuracy ilaccu - - 5.0 % iled=60ma (39k ? ) led current matching ilmat - - 3.0 % (max led current ? min led current)/ ideal current (60ma) iled=60ma led current limiter ilocp - 0 0.1 ma current limit value at iset resistance 1k ? setting iset voltage iset - 0.733 - v led current accuracy2 ilaccu2 - 3.0 - % iled=60ma, abc=0.733v *1 this parameter is tested with dc measurement. ? block diagram pin number 22pin figure 3. block diagram currentsense sense
4/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? pin descriptions pin no. pin name io function terminal diagram 1 vdc out regulator output / internal power-supply c 2 test in test signal (pull down 100k ? within ic) e 3 fset in resistor connection for frequency setting a 4 abc in pin for analog brightness control c 5 gnd - gnd for switching regulator b 6 comp out erramp output a 7 iset in resistor connection for led current setting a 8 ch4 in current driver sink for ch4 c 9 nc - - - 10 ch3 in current driver sink for ch3 c 11 nc - - - 12 ch2 in current driver sink for ch2 c 13 nc - - - 14 ch1 in current driver sink for ch1 c 15 nc - - - 16 gnd - gnd for current driver b 17 fault out fault signal c 18 preout out signal output pin for internal switching tr a 19 trin in gate termi nal for switching tr a 20 sensp in source terminal for external switching tr a 21 pgnd - pgnd for switching tr d 22 lx out switching tr drive terminal f 23 lx 24 nc - - - 25 ovp in detect input for sbd open and ovp c 26 pwm in input pin for current driver power on/off e 27 enable in pin for power on/off or power control e 28 vin in battery input g - thermal pad - heat radiation pad of back side connect to gnd ? pin esd type figure 4. pin esd type vdc
5/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? typical performance curves figure 8. under voltage lock out figure 5. quiescent current figure 6. current consumption figure 7. vdc voltage
6/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? typical performance curves figure 9. fault ron figure 10. switching frequency figure 11. max duty figure 12. lx nch ron fre q uenc y ( mhz )
7/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? typical performance curves - continued figure 14. over voltage protect figure 16. ovp leak current figure 13. over current limit figure 15. output short protect
8/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? typical performance curves - continued figure 18. led current vs. ch voltage figure 19. iset voltage figure 17. ch terminal ovp figure 20. led current matching
9/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? typical performance curves - continued figure 21. led open time vs. temp figure 22. led short time vs. temp figure 23. thermal shut down figure 24. efficiency 10ledx4ch iled=60ma
10/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? typical performance curves - continued figure 25. led current vs. pwm duty pwm freq=200hz fset=56k ? figure 26. led current vs. pwm duty pwm freq=30khz fset=56k ?
11/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? application example figure 27, figure 28 and figure 29 are application examples. recommended schematics and layout are shown in page 29, 31. figure 27. bd65d00 application example (4 parallel) figure 28. bd65d00 application example (3 parallel) BD65D00MUV ch1 ch 2 ch 3 ch 4 ov p 10 serial x 4 parallel (40pcs) 60ma abc lx lx 2.2f/50v fa u lt vin 10h 10f iset 39k ? gnd pgnd vdc pgnd 2.2m ? 68k ? vout 2.2f gnd pgnd fset test 56k ? 1nf 12v to 27v(vinl) e nable p wm 2.1v to vin c omp 1k ? pwm f pw m =1 00 hz~2 5khz 22nf reset preout trin sensp 10 ? BD65D00MUV ch1 ch 2 ch 3 ov p 10 serial x 3 parallel (30pcs) 60ma abc lx lx 2.2f/50v fa u lt vin 10h 10f iset 39k ? gnd pgnd vdc pgnd 2.2m ? 68k ? vout 2.2f gnd pgnd fset test 56k ? 1nf 9v to 27v(vinl) e nable p wm 2.1v to vin c omp 1k ? pwm f pw m =1 00 hz~2 5khz 22nf reset preout trin sensp 10 ? ch 4
12/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 figure 29. bd65d00 application example (2 parallel) BD65D00MUV ch1 ch 2 ov p 10 serial x 2 parallel (40pcs) 60ma abc lx lx 2.2f/50v fa u lt vin 10h 10f iset 39k ? gnd pgnd vdc pgnd 2.2m ? 68k ? vout 2.2f gnd pgnd fset test 56k ? 1nf 6v to 27v(vinl) e nable p wm 2.1v to vin c omp 1k ? pwm f pw m =1 00 hz~2 5khz 22nf reset preout trin sensp 10 ? ch 3 ch 4
13/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? functional descriptions 1) pwm current mode dc/dc converter this detects the lowest voltage inside ch 1,2,3,4 pin voltage during power on. pwm duty is decided to be 0.8v and output voltage is kept invariably. as for the input soft the pwm co mparator as the feature of the pwm current mode, one is overlapped with error components from the error amplifier, and the other is overlapped with a current sense signal that controls the inductor current into slope waveform to prevent s ub harmonic oscillation. this output controls internal nch tr via the rs latch. in the period where inte rnal nch tr gate is on, energy is accumulated in the external inductor, and in the period where internal nch tr gate is off, energy is transferred to the output capacitor via external sbd. this ic has many safety functions, and their det ection signals stop switching operation at once. 2) pulse skip control this ic regulates the output voltage using an improved pulse-skip. in ?pulse-ski p? mode the error amplifier disables ?switching? of the power stages when it detects low outpu t voltage and high input voltage. the oscillator halts and the controller skip switching cycles. the error amplifier reactivate s the oscillator and starts swit ching of the power stages again when this ic detects low input voltage. at light loads a conventional ?pulse-skip? regulation mode is used. the ?pulse- skip? regulation minimizes the operating current because this ic does not switch continuously and hence the losses of t he switching are reduced. when the error amplifier disables ?switching?, the load is al so isolated from the input. this improved ?pulse-skip? control is also referred t o as active-cycle control. figure 30. pulse-skip 3) soft start this ic has soft start function. the soft start function prevents large coil current. rush current at turning on is prevented by the soft start function. the soft start of this ic controls over-current setting hence peak is controlled. therefore, before switching phenomenon (not pulse-skip phenomenon) occurs, soft start (the phenomenon wher e-in current flows to the coil) will not start (stop). pulse-skip can release soft-start if the switching on/off time is set. after changing enable pin, pwm pin from ?l? ? ?h?, regulator (vdc) voltage increases. soft start is effective within the period 4.3ms when uvlo is detect ed and when it exceeds vdc=3.9v (typ.). once soft start is finished, even if you change pwm from ?l? ? ?h?, soft start does not work. figure 31. soft start pwm vout led current lx 60ma duty 20% @1.25mhz(typ) pulse skip pwm v out lx led current en able v dc s oft start pw m pulse-skip max 1ms typ 4.3ms off on off on uvlo on off enabl max 1m s off on off on vdc soft star t pwm uvlo off t1 t2 soft start tim e=t 1+t 2=4.3m s typ.
14/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 4) fault when the error condition occurs, boost oper ating is stopped by the protection functi on avoiding error condition. ?l? is outputted from fault pin when an error occurs. after power-on, unt il soft start is released, ar ound 4.3ms (typ.), protection functions do not operate (except tsd). when enable pin is changed to ?l?, even if output of faul t pin latches, it will still reset to the initial status. (in pulse-skip state, while the switching is stopped, the mask time of the fault pin becomes longer since the soft start is also stopped.) when using 3 parallel connection of led in le ss than 4.3ms (typ.), the fault pin will output ?l? if the process of the unused pin is not yet finish ed. evaluate sufficiently the start up time when the connected capacitor between comp pin & gnd starts up smoothly. object of protect function is as shown below. - over-voltage protection (ovp) - thermal shut down (otp) - over current protect (ocp) - output short protect - led short (latch) - led open (latch) figure 32. fault operating description fault protect function (ovp, ocp) boost operation enable vdc pwm protect function (led open, led short) protect function (tsd) off normal boost stop normal off normal undetected detected undetected typ4.3 ms ?x? ?x? ?l? ?l? ?h? ?l? ?h? mask undetected detected undetected latch t y p100s undetected detected undetected ?l? ?h? ?l? ?h? ?h? ?l?
15/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? protection protection table case failure mode detection mode ch1 pin ch2 to 4 pin vout adjustment fault terminal 1 led short ( led ch1 is short) ch1 > vsc led current stop and dc/dc feedback doesn?t return normal burning dc/dc feedbacks at ch2 to ch4 adjust vf of led at ch2 to ch4 at the biggest line ?h? ? ?l? (latch) 2 led open ( led ch1 is open) ch1 < 0.2v(typ.) and ovp > 1.2v(typ.) led current stop and dc/dc feedback doesn?t return normal burning dc/dc feedbacks at ch2 to ch4 adjust vf of led at ch2 to ch4 at the biggest line ?h? ? ?l? (latch) 3 vout/lx gnd short ovp < 50mv(typ.) fault change from ?h? to ?l?, and switching is stopped. when ovp>50mv, fault return ?h? - ?h? ? ?l? 4 output led stack voltage too high ovp > 1.2v(typ.) fault change from ?h? to ?l ?, and switching is stopped. ovp<1.2v, fault returns to ?h ? (does not return when it occurs at the same time with led open) - ?h? ? ?l? 5 lx current too high ocp > 2.5a or otp > 175 c(typ.) fault change from ?h ? to ?l ?, and switching is stopped. fault pin does not returns to ?h ? because ic shutdowns and when enable is from ?h ? to l until ?h ?. - ?h? ? ?l? ? over voltage protection (ovp) when led is separated it will result to output open and over step-up. when the built-in (external) tr and ovp pin exceed the absolute maximum rating, the built-in (external) tr and ic will break down. thus, ovp pin when more than the detect voltage will turn into over voltage protection st atus turning off switching and stopping dc/dc. after over voltage protection, as shown in figure 33, the ic changes from activation into non-activation, and the output voltage goes down slowly. and when the feedback of ch1 isn?t returned, feedback takes place in ch2. figure 33. ovp operating description vout ch1 volta g e ch1 connection ch2 connection feedbac k enabl e , pwm normal ch1 ch1 ch2 normal ope n ch1 curren t 60ma 0m a ch2 curren t 60ma 0m a ovp signal hysteresis(typ 2.5%)
16/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 the value shown in electrical characteristics is used here. over voltage limit min 1.16v typ 1.20v max 1.24v led control voltage min 0.64v typ 0.80v max 0.96v led terminal over voltage protect min 6.80v typ 8.00 v max 9.20v 1. calculate the condition of the total value of led vf. example) in the case of serial 8 leds with vf=2 .9v (min), 3.2v (typ.), 3.5v (max) => 3.5v x 8=28v 2. then calculate the biggest value of output with the following formula. the biggest value of output = the biggest value calculated in #1 + the biggest value of led terminal voltage. (0.96v) example) the biggest value of output = 28v + 0.96v =28.96v 3. set the smallest value of over voltage larger than the biggest value of output. if over voltage is closer to the total value of vf, it could be occurred to detect over voltage by ripple, noise, and so on. it is recommended that some margins should be left on the difference between over voltage and the total value of vf. this time around 6% margin is placed. example) output largest value = 28.96v, the smallest value of over vo ltage = 28.96v x 1.06 = 30.70v ic over voltage limit min=1.16v, typ=1.20v, max=1.24v typ = 30.70v(1.20v/1.16v) = 31.76v max = 31.76v(1.26v/1.20v) = 33.35v 4. below shows how to adjust setting resistor value. please fix resistor high between ovp terminal and output and then set over voltage after changing resistor between ovp terminal and gnd. if this resistor value is decreased, output voltage will also decrease while pwm is turned off, hence ripple of output voltage becomes larger and the sound/noise of output capacitor also increases. example) selecting ovp resistor (r1 and r2). ? ovp resistor selection (example. 1) vf=3.5v max, serial = 7 led ovp = 1.2v, r1 = 2.2m ? , r2 = 95.3k ? vout = 1.2 (2.2m ? + 95.3k ? )/ 95.3k? = 28.90v (example. 2) vf=3.5v max, serial = 8 led ovp = 1.2v, r1 = 2.2m ? , r2 = 82k ? vout = 1.2 (2.2m ? + 82k ? )/ 82k ? = 33.40v (example. 3) vf=3.5v max, serial = 9 led ovp = 1.2v, r1 = 2.2m ? , r2 = 73.2k ? vout = 1.2 (2.2m ? + 73.2k ? )/ 73.2k? = 37.27v (example. 4) vf=3.5v max, serial = 10 led ovp = 1.2v, r1 = 2.2m ? , r2 = 68k ? vout = 1.2 (2.2m ? + 68k ? )/ 68k ? = 40.02v ?;,9405(3 vout r1 r2
17/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? over current protection over current flows in current detect resi stor that is connected between internal switching tr source and pgnd. when it increases beyond detect voltage, over cu rrent protect operates. over current protec t prevents it becoming more than detect voltage by reducing on duty of switchi ng tr without stopping boosting operation. since the over current detector of this ic detects peak current, more than setting value of over current doesn?t flow. if both pwm=h (boosting condition) and over current situation keep going during continuous 2ms, the ic shuts down. by making enable ?h?->?l?->?h?, the ic activates again. the ic might shut down if boosting operation starts with slow speed of power supply activation and also low voltage. please operate after setting input voltage that is required for application. ? external sbd open detect / output short protection if in case external sbd and dc/dc output (v out) connection is open, or vout is short ed in gnd, there is a risk that coil and the internal tr might break down. therefore, at such an error as ovp becoming 50mv (typ.) or below, turns off the output tr, and prevents the coil and the ic from being destructed. and the ic changes from activation into non-acti vation, current does not flow to the coil (0ma). ? thermal shut down this ic has thermal shut down function. the thermal shut down works at 175 c (typ.) or higher, and the ic changes from activation into non-activation. 2ms fault coil current over current protec t ch1 terminal enabl e oc p pw m internal reset continuous 2ms(typ.) fault termina l 0 v latch reset
18/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? operating of the a pplication deficiency 1) when 1 led or 1string open during the operation the led string which became open isn't lighting (e.g. ch1), but other led strings are lighting. as shown in figure 34, when the strings in ch1 are open, ch1 pin become 0v. the lowest voltage is below 0.8v thus the output will boost up to over voltage protection voltage. when ov er voltage protect is detect ed, open process starts. once open, since the pin which is the obj ect of the feedback is excluded, vout returns to normal voltage. 2)when led short-circuited in multiple all led strings are lighted unless ch1 to 4 terminal voltage is more than 8v(typ.). when it was more than 8v only t he strings which short-circuited are turned off, le d current strings of other lines continue to turn on normally. short line (ch1) current is changed from 60ma to 0.05ma (typ.), so ch1 terminal don?t heat. ? 3)when schottky diode remove ic breakdown is prevented by stopping boost operation thru schottky diode protection function (ovp pin <50mv). ch 1 ch 2 ch 1 ch 2 figure 34. led open protect figure 35. led short protect vout ch1 voltage ch1 connection ch2 connection feedback enable, pw ch1 curren t normal ch1 off ch 2 normal o p en 60ma 0ma ch2 curren t 60ma 0m a ch1 ovp ch1 enable 100 s ch1terminal feedback ch1 current ch1 ch2 ch2 current 60ma 60ma 0.05ma(typ.) vout 0.8v led short ? ch2 terminal 0.8v typ 8v ch1>ch2 100 s(typ.)
19/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? control signal input timing timing sequence1 figure 36. shows the power on sequence. enable and pwm signal from ?l? to ?h? after charging current (vin on). power off sequence, on the other hand, is turn ing off power supply (vin) after enable and pwm signal turns from h to l. timing sequence2 figure 37. shows the power on sequence. power supply charge (vin on), enable signals from l to h, then pwm signal from l to h. power off sequence, on t he other hand, is turning off power s upply (vin)and enable, pwm signal from h to l. enable, pwm vin power on power off led ic timing sequence for pwm control turn-on vin 2 ~ 5v min 0 s pw m enable min 0 s 6.0 ~ 27v 1.3~5v 0 ~ 0.8v 0 ~ 0.8v 0v led ic timing sequence for pwm control turn-off pw m 2 ~ 5v min 0 s vin enabl e min 0 s 6.0 ~ 27v 2 ~ 5v 0 ~ 0.8v 0 ~ 0.8v 0v figure 36. timing sequence1 pwm vin, enable power on power off en able 2 ~ 5v min 0 s vin pw m min 0 s 6.0 ~ 27v 1.3~5v 0 ~ 0.8v 0 ~ 0.8v 0v vin 2 ~ 5v min 0 s en able pw m min 0 s 6.0 ~ 27v 1.3~5v 0 ~ 0.8v 0 ~ 0.8v 0v led ic timing sequence for pwm control turn-on figure 37. timing sequence2 led ic timing sequence for pwm control turn-off *other signals are inputted after signals are turned on. *other signals are inputted after signals are turned off. *other signals are inputted after signals are turned on. *other signals are inputted after signals are turned off.
20/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 timing sequence3 figure 38.shows power on sequence. power supply charge (vin on), pwm from l to h, then afterwards enable signal from l to h. power off sequence is power supply (vin) off, pwm signal from h to l then enable signal from h to l. vin wake up speed figure 39. control signal timing in case there is pwm off status (min: 10ms) during operation, enable is reset (?h? to ?l?) as shown in figure 40. if pwm stops and vout voltage is dropped, this ic will be in current limiter state when pwm starts (no soft start). if soft start is not necessary, ther e is no need also to reset. vin min. 100s 6.0 v 1 2 figure 40. pwm stop and enable turn ?off? pwm off vin enable min 10ms pwm pwm reset enable vin, pwm power on power off pw m 2 ~ 5 v min 0 s vin en abl e min 0 s 6.0 ~ 27v 1.3~5 v 0 ~ 0.8v 0 ~ 0.8v 0v vin 2 ~ 5v min 0 s pw m enable min 0 s 4.2 ~ 27v 2 ~ 5v 0 ~ 0.8v 0 ~ 0.8v 0v led ic timing sequence for pwm control turn-on figure 38. timing sequence3 led ic timing sequence for pwm control tn *other signals are inputted after signals are turned on. *other signals are inputted after signals are turned off.
21/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? how to activate pay attention to the following when activating. ? regulator (vdc) is operated after enable=h. inner circuit is operated after releasing uvlo. when boosting after releasing uvlo, soft start function is operated. soft start circuit needs t 15 (more than 5s) such as figure 41. soft start is operated during tsoft time. set pwm width ?h? until soft start finishes. example: time until soft start finishes at pwm frequency 25khz and pwm=h time is 6s by soft start time typ 4.3ms tsoft = 6s - 5s = 1s soft start time / tsoft / pwm frequency = 4300s / 1s / 25khz = 172ms at dimming with pwm terminal (after soft start finishes) figure 41. soft start figure 42. timing input (after soft start) "$ ? vin vdc enable t1 h[v] t2 t3 t14 t6 t10 t11 t7 t9 t8 t4 t5 h[v] pwm t14 t3 vin terminal vdc terminal enable terminal uvlo si g nal pwm terminal soft start up to ocp value (0a to 2.5a ) t t soft comp terminal pulse-skip signal t detect skip lx terminal stop to switching name unit min. typ. max. t1 power supply rise time s 100 - - t2 power supply - enable rise time s0 - - t3 enable rise time s 0 - 100 t4 enable fall time s 0 - 100 t5 enable low width s50 - - t6 power supply - pwm time s0 - - t7 pwm rise time s 0 - 100 t8 pwm high width s5 - - t9 pwm fall time s 0 - 100 t10 pwm low width s5 - - t11 pwm cycle s 40 5000 10000 t12 enable(h)->pwm(h) time s0 - - t13 enable(l)->pwm(l) time s0 - - t14 pwm(l)->enable(l) time s0 - - t15 soft start set up time s5 - - h operation voltage v 4.2 12 27 l no operation voltage v - - 4.2
22/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? how to select the number of led strings of the current driver in order to reduce the number of strings of current driver, open unnecessary ch1 to 4 pins for them not to be selected. when using 2 strings, open the unnecessary 2 strings. during vout wake up in an open state, vout boost up until ovp voltage. once ic detect ovp, vout don?t boost up until ovp from next start up. if enable set to ?l,? ic resets ch4 status as shown figure 43. also during vout wake up, ch4 (open terminal) and ch1 are selected as shown figure 44. ? figure 43. select the number of ch1 strings figure 44. select the number of ch4 strings (wake up) ch 1 ch 2 ch 3 vout ch1~3 ch4 ovp normal volta g e 0.8v ( t yp . ) 0v 0v pwm enabl e reset mask open ch1 curren t ch4 termina l ch4 curren t 60m a vou t soft start: typ 4.3ms enabl e sta b le pw m ch1 termina l 0m a 0m a feedback terminal typ 0.8v over voltage protect signal ?unmask te rm i na l s e le c t ( led open prot ec t ) ch1 ch4 normal condition over voltage protect 100 s(typ.)
23/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? start control (enable) and led current driver selection (pwm) this ic can control the ic system by enable, and ic can power off compulsory by setting 0.8v or below. also, it powers on enable is at more than 2.0v. after it?s selected to enable=h, when it is selected at pwm=h, led current decided with iset resistance flow. next, when it is selected at pw m=l, led current stop to flow. enable pwm ic led current 0 0 off off 1 0 on off 0 1 off off 1 1 on current decided with iset ? led current setting range normal current setting is done thru resist or (riset) connected to voltage of iset. setting of each led current is given as shown below. riset = 2340/iledmax also, normal current setting range is 30ma to 100ma. led cu rrent becomes a leak curren t max 2a at off setting. iset normal current setting example riset led current 24k ? (e24) 97.5ma 30k ? (e24) 78.0ma 39k ? (e24) 60.0ma 43k ? (e24) 54.4ma 68k ? (e24) 34.4ma ? frequency setting range switching frequency can be set by connecting the resistor to fset pin. also, frequency setting range is 0.60mhz to 1.60mhz. the below diagrams are the reference data that shows what happens when fset terminal is connected to resister. fset frequency setting example rfset frequency 130k ? (e96) 0.57mhz 56k ? (e24) 1.25mhz 43k ? (e24) 1.59mhz max duty example frequency max duty[%] min typ max 600mhz - 96.0 - 1.25mhz 91.0 95.0 99.0 1.6mhz - 92.0 - min duty example frequency min duty[%] min typ max 1.25mhz - 20 - frequency [mhz] 1.25 56k ? 130 k ? fset[k ? ] 0.57 1.59 43 k ?
24/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? pwm dimming current driver pwm control is controlled by providi ng pwm signal to pwm port, as it is shown figure 45. the current set up with iset is chosen as the h section of pwm and the current is off as the l section. therefore, the average led current is increasing in proportion to duty cycle of pwm signal. this method that it lets internal circuit and dc/dc to work, because it becomes to sw itch the driver, the current toleranc e is a few when the pwm brightness is adjusted, it makes it possible to brightne ss control until 5s (min 0.1% at 200hz). a nd, don't use for the brightness control, because effect of iset changeover is big under 1s on time and under 1s off time. typical pwm frequency is 100hz to 25khz. ? analog dimming this ic controls led current thru an analog input (abc terminal). led current is determined thru the resistor connected to iset. normal state is abc voltage= typ 0.733v. decrease led current to decrease abc voltage and increase led current to increase abc voltage. in order to get the max value of led current, follow the setting range of led current found in page 18. be careful that the setting led current max value is abc voltage=0.733v (typ.). abc input range is 0.05v ? 0.9v. this dimming is effected by iset tolerance. when analog dimming is not used, connect capacitor to abc terminal. led current increases until charging of the capacitor at the abc terminal is finished. the resistor between 1.2v and abc terminal is 120.9k ? . take into consideration the charge time before deciding the capacitor value. pwm led current coil current ic?s active current on off on off on off on figure 45. pwm sequence iset + - iset resistor driver abc 1.2v 0.733v dc input 120.9k ? 39k ? 180k ? iset + - iset resistor driver abc 1.2v 0.733v 120.9k ? 180k ? 39k ? figure 46. analog dimming application figure 47. pwm dimming application figure 48. iled vs. abc voltage iled [ma] 60ma 0.733 v 0.9v abc[v] 73.7ma riset=39k ?
25/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ?coil selection the dc/dc is designed by more than 4.7h. when ?l? value sets to a lower value, it is possibility that the specific sub-harmonic oscillation of current mode dc / dc will be happened. do not let ?l? value to 3.3h or below. when ?l? value increases, the phase margin of dc / dc becom es zero. please enlarge the output capacitor value when you increase ?l? value. make the resistor component smaller in order to increase the efficiency of dcr inductor. please estimate peak current of coil as shown in the examples below. peak current calculation as over current detector of this ic is detected the peak current, it have to estimate peak current to flow to the coil by operating condition. in case of, - supply voltage of coil = v in - inductance value of coil = l - switching frequency = fsw (min=1.0mhz, typ = 1.25mhz, max = 1.5mhz) - output voltage = vout - total led current = i led - average current of co il = iave - peak current of coil = ipeak - cycle of switching = t - efficiency = eff (please set up having margin) - on time of switching transistor = ton - on duty = d the relation is shown below: ccm: ipeak = (v in / l) (1 / fsw) (1-( v in / vout)), dcm: ipeak = (v in / l) ton iave=( vout iout / v in ) / eff ton=(iave (1- v in / vout) (1/fsw) (l/ v in ) 2) 1/2 each current is calculated. as peak current varies according to whether there is the direct current superposed, the next is decided. ccm: (1- v in / vout) (1/fsw) < ton ? peak current = ipeak /2 + iave dcm: (1- v in / vout) (1/fsw) > ton ? peak current = v in / l ton (example 1) in case of, v in = 12v, l = 10h, fsw = 1.25mhz, vout = 32v, i led = 240ma, efficiency = 88% iave = (32 240m / 12) / 88% = 0.7273a ton = (0.7273 (1 - 12 / 32) (1 / 1.25m) (10 / 12) 2) 1/2 = 0.78s (1- v in / vout) (1 / fsw) = 0.5s < ton(0.78s) ccm ipeak = (12 / 10) (1 / 1.25m) (1 - (12 / 32)) = 0.6a peak current = 0.6a / 2 + 0.727a = 1.027a (example 2) in case of, v in = 24.0v, l = 10h, fsw = 1.25mhz, vout = 32v, i led = 120ma, efficiency = 88% iave = (32 120m / 24.0) / 88% = 0.1818a ton = (0.1818 (1-24 / 32) (1 / 1.25m) (10 / 24) 2) 1/2 = 0.17s (1- v in / vout) (1 / fsw)=0.20s > ton(0.17s) dcm ipeak = v in / l x ton = 24 / 10 x 0.17s = 0.42a peak current = 0. 42a dcm/ccm calculation discontinuous condition mode (dcm) and continuous co ndition mode (ccm) are calculated as following. ccm: l > vout d (1 - d) 2 t / (2 i led ) dcm: l < vout d (1 - d) 2 t / (2 i led ) *d = 1- v in / vout (example 1) in case of, v in = 7.0v, l = 10h, fsw = 1.2mhz, vout = 32v, i led = 240ma vout d (1 - d) 2 t / (2 i led ) = 32 (1 ? 7 / 32) (7 / 32) 2 1/(1.2 10 6 ) / (2 0.24) = 4.69 < l(10h) ? ccm (example 2) in case of, v in = 12.0v, l = 10h, fsw = 1.2mhz, vout = 32v, i led = 60ma vout d (1 - d) 2 t / (2 i led ) = 32 (1 ? 12 / 32) (12 / 32) 2 1/(1.2 10 6 ) / (2 0.12) = 15 > l(10h) ? dcm
26/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? output capacitor selection output capacitor smoothly keeps output voltage and supplies le d current. output voltage consists of charge (fet on) and discharge (led current). so output voltage has ou tput ripple voltage in every fet switching. output ripple voltage is calculated as following. output ripple voltage - switching cycle = t - total led current = i led - switching on duty = d - output ripple voltage = v ripple - output capacitor = c out - output capacitor (real value) = c real - decreasing ratio of capacitor = c error c real = c out c error (capacitor value is decreased by bias, so) c real = i led (1-d) t / v ripple c out = i led (1-d) t / v ripple / c error (example 1) in case of, v in =12.0v, fsw = 1.2mhz, vout =32v, i led =120ma, c out = 8.8f, c error = 50% t = 1 / 1.2mhz d = 1 ? v in / vout = 1 ? 12/32 v ripple ??= i led (1-d) t / (c out c error ) = 120ma (12/32) / 1.2mhz / (8.8f0.5) = ? 8.5mv 0v 35v 50v output voltage capa [ f] c out c real figure 49. bias characteristics of capacitor
27/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? the separations of the ic power supply and coil power supply this ic can work in separating the power source in both ic power supply and coil power supply. with this application, it can decrease ic power consumption, and can correspond to applied voltage exceeds ic rating 27v. that application is shown in below figure 50. the higher volt age source is applied to the power source of coil that is connected from an adapter etc. next, the ic power supply is connected with a different coil power supply. under the conditions for inputting from 4.5v to 5.5v into ic vin, please follow the recommend design in figure 50. it connects vin terminal and vdc terminal together at ic outside. when the coil power supply is applied, there is no any problem even though ic power supply is the state of 0v. although ic power supply is set to 0v, pull-down resistance is arranged for the power off which cuts off the leak route from coil power supply in ic inside, the leak route is cut off. and, ther e is no power on-off sequence of coil power supply and ic power supply. however, there?s an instance where the over current protection may be affected if t he power supply was inputted last in the coil because the enable and pwm were inputted already and also because of under voltage t hat was detected before the power supply stabilizes. before it reaches the needed voltage in the applications to be used, turn off the enable and pwm input. separate vin and coil power supply connect vin and vdc terminals figure 50. application at the ti me of power supply isolation BD65D00MUV ch 1 ch 2 ch 3 ch 4 ov p 10 serial x 4 parallel (40pcs) 60ma abc lx lx 2.2f/50v fa u lt vin 10h 10f iset 39k ? gnd pgnd vdc pgnd 2.2m ? 68k ? vo ut 2.2f gnd pg nd fset test 56k ? 1nf 12v to 27v (vinl) e nable p wm 2.1v to vin c omp 1k ? pwm f pw m =100hz~25khz 22nf reset preo ut trin sensp 10 ? BD65D00MUV ch 1 ch 2 ch 3 ch 4 ov p 10 serial x 4 parallel (40pcs) 60ma abc lx lx 2.2f/50v fa u lt vin 10h 10f iset 39k ? gnd pgnd vdc pgnd 2.2m ? 68k ? vo ut 2.2f gnd pg nd fset test 56k ? 1nf 6v to 32v(vinl) e nable p wm 2.1v to vin c omp 1k ? pwm f pw m =100hz~25khz 22nf reset preo ut trin sensp 10 ? 4.5 to 5.5v
28/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? pcb layout in order to make the most of the performance of this ic, its pc b layout is very important. characteristics such as efficiency and ripple and the likes change greatly with lay out patterns, which please note carefully. figure 51. schematic ? put input bypass capacitor cin (10 f) as close as possible between coill1 and pgnd pin. ? connect smoothing capacitor cvdc1(2.2 f) as close as possible between vdc pin and gnd. ? connect schottky barrier diode sbd as close as possible between coil1and lx pin. ? connect output capacitor cout1 between cathode of sbd and pgnd. ? make both pgnd sides of cvin and cout1 as close as possible. > ? connect led current setting resistor riset(39k ? ) as close as possible between iset pin and gnd. ? there is possibility to oscillate when capacity is added to iset terminal, so pay attention that capacity isn?t added. ? put analog dimming pin smoothing capacitor cabc (1nf) close to abc pin and do not extend the wiring to prevent noise ? increasing and also led current waving. ? put frequency setting resistor(56k ? ) as close as possible between fset pin and gnd. put gmamp setting resistor rcmp(1k ? ) and ccmp(22nf) as close as possible to comp pin and do not extend the wiring to prevent noise increasing and also oscillating. < gnd and pgnd connection> gnd is analog ground, and pgnd is power ground. pgnd might cause a lot of noise due to the coil current of pgnd. try to connect with analog ground, after smoothing with in put bypath capacitor cvin and output capacitor cout1. pad is used for improving the efficiency of ic heat r adiation. solder pad to gnd pin (analog ground). moreover, connect ground plane of board using vi a as shown in the patterns of next page. the efficiency of heat radiation improves according to the area of ground plane. when those pins are not connected direct ly near the chip, influence is give to the performance of BD65D00MUV, and limit the current drive performance. as for the wire to the inducto r, make its resistance component small so as to reduce electric power consumption and increase the entire efficiency. BD65D00MUV ch 1 ch 2 ch 3 ch 4 ov p 10 serial x 4 parallel (40pcs) abc lx lx 2.2f/50v fa u lt vin 10h 10f iset gnd pgnd vdc pgnd 2.2m ? 68k ? vo ut 2.2f gnd pg nd fset test 56k ? 1nf 10v to 27v (vinl) e nable p wm 2.1v to vin c omp 1k ? pwm f pw m =100hz~25khz 22nf reset preo ut trin sensp 10 ? cin sbd cout1 cvdc1 rovp1 rovp2 rcmp ccmp rfset riset cabc
29/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 76 sbd r160-60 d65d00 100 rfset 56k ? l1 10h rcmp 1k ? cin 10f/25v BD65D00MUV cabc 1nf/10v cout1 2.2f/50v cvdc 2.2f/10v ccmp 22nf/10v riset 39k ? power supply 6v to 27v (vbat) + - ? recommended pcb layout figure 52. top figure 53. bottom rovp1 2.2m ? rovp2 75k ?
30/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 figure 54. top copper trace layer figure 55. middle1 copper trace layer figure 56. middle2 copper trace layer figure 57. bottom copper trace layer
31/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? selection of external parts recommended external parts are as shown below. when to use other parts than these, se lect the following equivalent parts. ? coil value manufacturer product number size (mm) dc current (ma) dcr (? ) l w h (max.) 4.7 h tdk ltf5022t-4r7n2r0-lc 5.0 5.2 2.2 2000 0.073 4.7 h toko a915ay-4r7m 5.2 5.2 3.0 1870 0.045 4.7 h toko b1015as-4r7m 8.4 8.3 4.0 3300 0.038 10h tdk ltf5022t-100m1r4-lc 5.0 5.2 2.2 1400 0.140 10h toko a915ay-100m 5.2 5.2 3.0 1400 0.140 10h toko b1047as-100m 7.6 7.6 5.0 2700 0.053 ? capacitor value pressure manufacturer product number size l w h 10f 25v murata grm31cb31e106ka75 3.2 1.6 1.6 4.7 f 25v murata grm319r61e 475k 3.2 1.6 0.850.1 2.2 f 50v tdk c3225jb1h225k 3.2 2.5 2.00.2 2.2f 50v murata grm 31cb31h225k 3.2 1.6 1.6 2.2f 50v panasonic ecjhvb1h225k 3.2 1.6 0.85 2.2f 10v murata grm 188b31a225k 1.6 0.8 0.8 0.1f 50v murata grm 188b31h104k 1.6 0.8 0.8 0.1f 10v murata grm 188b31a104k 1.6 0.8 0.8 0.022f 10v murata gr m155b31h223k 1.0 0.5 0.5 470pf 50v murata grm155b11h471k 1.0 0.5 0.5 ? resistor value tolerance manufacturer product number size (mm) l w h 2.2m ? 1.0% rohm mcr03pzpzfx2204 1.6 0.8 0.45 91k ? 0.5% rohm mcr03pzpzd9102 1.6 0.8 0.45 75k ? 0.5% rohm mcr03pzpzd7502 1.6 0.8 0.45 68k ? 0.5% rohm mcr03pzpzd6802 1.6 0.8 0.45 56k ? 0.5% rohm mcr03pzpzd5602 1.6 0.8 0.45 36k ? 0.5% rohm mcr03pzpzd3602 1.6 0.8 0.45 10k ? 1.0% rohm mcr03pzpzf103 1.6 0.8 0.45 1k ? 0.5% rohm mcr03pzpzd1002 1.6 0.8 0.45 330? 0.5% rohm mcr03pzpzd3300 1.6 0.8 0.45 ? sbd pressure manufacturer product number size (mm) l w h (max.) 60v rohm rb160m-60 3.5 1.6 0.8 mos fet nch pressure manufacturer product number size (mm) i d (a) drive voltage (v) l w h (max.) 45v rohm rtr020n05 2.8 2.9 1.0 2 2.5 45v rohm rtr030n05 2.8 2.9 1.0 3 2.5 the coil is the part that is mo st influential to efficiency. select the coil whos e direct current resistor (dcr) is small and current - inductance characteristic is excellent. bd65d00 is designed for the inductance value of 10h. don?t use the inductance value less than 3.3h. select a capacitor of ceramic type with excellent frequency and temperature characteristics. further, select capacitor to be used with small direct current resistance. ? about heat loss in heat design, operate the dc/dc conver ter in the following condition. (the following temperature is a guarantee te mperature, so consider the margin.) 1. ambient temperature ta must be less than 85 ?. 2. the loss of ic must be less than dissipation pd.
32/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? application example nch fet using internal/external this ic can be changed with the internal/external nc hfet for switching to suit your application. it is possible when the heat dispersion of a package of cases,su ch as light,led current is used, and we use the external nchfet. 1. external fet application led current: 60ma (iset = 39k ? ) led: 15 leds in series, 4 strings in parallel figure 58. application example of external fet BD65D00MUV ch1 ch2 ch3 ch4 ovp 15serial x 4 parallel (60pcs) 60ma abc lx lx 2.2f/50v fault vin 10h 10f iset 39k ? gnd pgnd vdc pgnd 2.2m ? 47k ? vout 2.2f gnd pgnd fset test 56k ? 1nf 24v to 27v enable pw m 2.1v to vin comp 1k ? pw m f pw m =100hz~25khz 22nf reset preout trin sensp 10?
33/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 2. analog dimming and monitoring fault terminal led current: 60ma (iset = 39k ? ) led: 10 leds in series, 4 strings in parallel figure 59. application example of analog dimming BD65D00MUV ch 1 ch 2 ch 3 ch 4 ov p 10 serial x 4 parallel (40pcs) 60ma abc lx lx 2.2f/50v fa u lt vin 10h 10f iset 39k ? gnd pgnd vdc pgnd 2.2m ? 68k ? vo ut 2.2f gnd pg nd fset test 56k ? 1n f 12v to 27v e nable p wm 2.1v to vin c omp 1k ? pw m 22nf reset preo ut trin sensp 10 ? d/a 3v 30k ? monitor
34/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as supp ly voltage (vin), temperature range of operating conditions (topr), etc., can break down devices, t hus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maxi mum ratings is assumed, consideration should be given to take physical safety measures including the use of fuses, etc. (2) operating conditions these conditions represent a range within which characteri stics can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connector the reverse connection of power supply connector can br eak down ics. take protective measures against the breakdown due to the reverse connection, such as mounting an external diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and the gnd lines. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occu rrence of capacity dropout at a low temperature, thus determining the constant. (5) gnd voltage make setting of the potential of the gnd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure no terminals are at a potential lower than the gn d voltage including an actual electric transient . (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong elec tromagnetic field can malfunction them. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connect ed to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from t he set pcb by each process. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to tu rn off the power supply and then dismount it from the jig. in addition, for protection against static electricity, establis h a ground for the assembly process and pay thorough attention to the transportation and t he storage of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are in evitably formed in relation to potential. the operation of the parasitic element can cause interference with circuit operati on, thus resulting in a malf unction and then breakdown of the input terminal. therefore, pay thorou gh attention not to handle the input te rminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element wi ll operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal gnd. pay att ention not to cause fluctuations in the gnd wiring pattern of external parts as well. (11) external capacitor in order to use a ceramic capacitor as the external capacitor, determine the c onstant with consideration given to a degradation in the nominal capacitance due to dc bias and c hanges in the capacitance due to temperature, etc. (12) thermal shutdown circuit (tsd) w hen junction temperatures become 175 ? (typ.) or higher, the thermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit, which is aimed at isolating the lsi from thermal runaway as much as possible, is not aimed at the protection or guarantee of the lsi. therefor e, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. (13) thermal design perform thermal design in which there ar e adequate margins by taking into account the permissible dissipation (pd) in actual states of use. (14) selection of coil select the low dcr inductors to decrease power loss for dc/dc converter. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
35/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? ordering information b d 6 5 d 0 0 m u v - e2 part number package muv: vqfn028v5050 packaging and forming specification e2: embossed tape and reel ? marking diagram ? physical dimension tape and reel information (unit : mm) vqfn028v5050 0.08 s s 1pin mark 17 8 14 22 28 15 21 0.40.1 1.0 0.5 0.25 +0.05 -0.04 2.70.1 2.70.1 c0.2 5.00.1 5.00.1 0.02 +0.03 - 0.02 (0.22) 1.0max order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin figure 61. vqfn028v5050 vqfn028v5050 (top view) d65d00 1pin mark part number marking lot number figure 60. marking diagram
36/36 BD65D00MUV datasheet www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 k 15k 001 tsz02201-0g3g0c400220-1-2 7.dec.2012 rev.001 ? revision history date revision changes 07.dec.2012 001 new release
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number BD65D00MUV package vqfn028v5050 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes BD65D00MUV - web page distribution inventory

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