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datashee t product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/29 www.rohm.com 16.feb.2016 rev.003 tsz02201-0r1r0g100010-1-2 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 serial eeprom series automotive eeprom 125 operation microwire bus eeprom (3-wire) br93h46-2c general ? description br93h46-2c is a serial eeprom of serial 3-line interface method features ? conforming to microwire bus ? withstands electrostatic voltage up to 6kv (hbm method typ ? wide temperature range -40 to +125 ? same package line-up and same pin configuration ? 2.5v to 5.5v single supply voltage operation ? address auto increment function at read operation ? prevention of write mistake ? write prohibition at power on ? write prohibition by command code ? write mistake prevention circuit at low voltage ? self-timed programming cycle ? program condition display by ready / busy ? low supply current ? write operation (5v) : 0.8ma (typ) ? read operation (5v) : 0.5ma (typ) ? standby operation (5v) : 0.1 a (typ) ? compact package msop8 / tssop-b8 / sop8 / sop-j8 ? high-reliability using rohm original double-cell structure ? more than 50 years data retention (ta 125 ) ? more than 300,000 write cycles (ta 125 ) ? data set to ffffh on all addresses at shipment ? aec-q100 qualified package (typ) (typ) (max) msop8 2.90mm x 4.00mm x 0.90mm tssop-b8 3.00mm x 6.40mm x 1.20mm sop8 5.00mm x 6.20mm x 1.71mm sop-j8 4.90mm x 6.00mm x 1.65mm br93h46-2c package type msop8 tssop-b8 sop8 sop-j8 capacity bit format product name supply voltage rfvm rfvt rf rfj 1kbit 64 16 br93h46-2c 2.5v to 5.5v sop8 sop-j8 msop8 tssop-b8 downloaded from: http:///
datasheet d a t a s h e e t 2/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c absolute maximum ratings (ta=25 ) parameter symbol limits unit supply voltage v cc -0.3 to +6.5 v permissible dissipation p d 380 (msop8) (1) mw 410 (tssop-b8) (2) 560 (sop8) (3) 560 (sop-j8) (4) storage temperature range t stg -65 to +150 operating temperature range t opr -40 to +125 input voltage/output voltage \ -0.3 to v cc +0.3 v when using at ta=25 or higher, 3.1mw(1), 3.3mw(2) , 4.5mw(3,4),to be reduced per 1 . memory cell characteristics (v cc =2.5v to 5.5v) parameter limits unit conditions min typ max write cycles (5) 1,000,000 - - cycles ta 85 500,000 - - cycles ta 105 300,000 - - cycles ta 125 data retention (5) 100 - - years ta 25 60 - - years ta 105 50 - - years ta 125 (5) not 100% tested recommended operating conditions parameter symbol limits unit supply voltage v cc 2.5 to 5.5 v input voltage v in 0 to v cc downloaded from: http:///
datasheet d a t a s h e e t 3/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c dc characteristics (unless otherwise specified, ta=-40 to +125 , v cc =2.5v to 5.5v) parameter symbol limit unit conditions min typ max input low voltage v il -0.3 - 0.3xv cc v input high voltage v ih 0.7xv cc - v cc +0.3 v output low voltage 1 v ol1 0 - 0.4 v i ol =2.1ma, 4.0v v cc 5.5v output low voltage 2 v ol2 0 - 0.2 v i ol =100 a output high voltage 1 v oh1 2.4 - v cc v i oh =-0.4ma, 4.0v v cc 5.5v output high voltage 2 v oh2 v cc -0.2 - v cc v i oh =-100 a input leak current i li -10 - 10 a v in =0v to v cc output leak current i lo -10 - 10 a v out =0v to v cc , cs=0v supply current i cc1 - - 3.0 ma f sk =2mhz, t e/w =4ms (write) i cc2 - - 1.5 ma f sk =2mhz (read) i cc3 - - 3.0 ma f sk =2mhz, t e/w =4ms (wral) standby current i sb - - 10 a cs=0v, do=open radiation resistance design is not made. ac characteristics (unless otherwise specified, ta=-40 to +125 , v cc =2.5v to 5.5v) parameter symbol min typ max unit sk frequency f sk - - 2 mhz sk h time t skh 200 - - ns sk l time t skl 200 - - ns cs l time t cs 200 - - ns cs setup time t css 50 - - ns di setup time t dis 50 - - ns cs hold time t csh 0 - - ns di hold time t dih 50 - - ns data 1 output delay time t pd1 - - 200 ns data 0 output delay time t pd0 - - 200 ns time from cs to output establishment t sv - - 150 ns time from cs to high-z t df - - 150 ns write cycle time t e/w - - 4 ms downloaded from: http:///
datasheet d a t a s h e e t 4/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c serial input / output timing data is taken from di, in sync with the rise of sk. at read command, data is outputted from do in sync with the rise of sk. after write command input, the status signal of write (ready / busy) can be monitored from do by setting cs to h after tcs, from the fall of cs, and will display a valid stat us until the next command start bit is inputted. but, if cs is set to l, do sets to high-z state. to execute a series of commands, cs is set to l once af ter completion of each command for internal circuit reset. block diagram figure 1. serial input / output timing diagram command decode control clock generation power source voltage detection write prohibition high voltage occurrence command register address buffer sk di dummy bit do data register r/w amplifier 16bit 16bit 1,024 bit eeprom cs address decoder 6bit 6bit figure 3. block diagram downloaded from: http:///
datasheet d a t a s h e e t 5/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c pin configuration pin description figure 2. pin configuration pin no. pin name i / o function 1 cs input chip select input 2 sk input serial clock input 3 di input start bit, ope code, address, and serial data input 4 do output serial data output, ready / busy status output 5 gnd - ground, 0v 6,7 nc - non connected terminal, vcc, gnd or open 8 vcc - power supply, 2.5v to 5.5v cs sk di do br93h46rfvm-2c:msop8 br93h46rfvt-2c :tssop-b8 br93h46rf-2c :sop8 br93h46rfj-2c :sop-j8 1 2 3 4 876 5 vcc nc nc gnd (top view) downloaded from: http:///
datasheet d a t a s h e e t 6/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c typical performance curves 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 23 456 supply voltage : vcc v input high voltage :vih v spec ta= -40 ta= 25 ta= 125 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 23 456 supply voltage : vcc v input low voltage : vil v spec ta= -40 ta= 25 ta= 125 0.0 0.2 0.4 0.6 0.8 1.0 012345 output low current : iol ma output low voltage : vol v spec ta= -40 ta= 25 ta= 125 0.0 0.2 0.4 0.6 0.8 1.0 012345 output low current : iol ma output low voltage : vol v spec ta= -40 ta= 25 ta= 125 figure 4. input high voltage (cs, sk, di) vs. supply voltage figure 5. input low voltage (cs, sk, di) vs. supply voltage figure 6. output low voltage vs. output low current (v cc =2.5v) figure 7. output low voltage vs. output low current (v cc =4.0v) downloaded from: http:///
datasheet d a t a s h e e t 7/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c typical performance curves \ continued 0.0 1.0 2.0 3.0 4.0 5.0 0 0.4 0.8 1.2 1.6 output high current : ioh ma output high voltage : voh v spec ta= -40 ta= 25 ta= 125 0.0 1.0 2.0 3.0 4.0 5.0 0 0.4 0.8 1.2 1.6 output high current : ioh ma output high voltage : voh v spec ta= -40 ta= 25 ta= 125 0 2 4 6 8 10 12 23456 supply voltage : vcc v input leakage current : ili a spec ta= -40 ta= 25 ta= 125 0 2 4 6 8 10 12 23456 supply voltage : vcc v output leakage current : ilo a spec ta= -40 ta= 25 ta= 125 figure 8. output high voltage vs. output high current (v cc =2.5v) figure 9. output high voltage vs. output high current (v cc =4.0v) figure 10. input leak current (cs, sk, di) vs. supply voltage figure 11. output leak current (do) vs. supply voltage downloaded from: http:///
datasheet d a t a s h e e t 8/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c typical performance curves \ continued figure 12. supply current at write operation vs. supply voltage (write, f sk =2.0mhz) figure 13. supply current at read operation vs. supply voltage (read, f sk =2.0mhz) figure 15. standby current vs. supply voltage figure 14. supply current at wral operation vs. supply voltage (wral, f sk =2.0mhz) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 23 456 supply voltage : vcc v current consumption at write : icc1(write) ma spec ta= -40 ta= 25 ta= 125 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 23 456 supply voltage : vcc v current consumption at wral : icc3(wral) ma spec ta= -40 ta= 25 ta= 125 0 2 4 6 8 10 12 23456 supply voltage : vcc v standby current : isb a spec ta= -40 ta= 25 ta= 125 0.0 0.4 0.8 1.2 1.6 23 456 supply voltage : vcc v current consumption at read : icc2(read) ma spec ta= -40 ta= 25 ta= 125 downloaded from: http:///
datasheet d a t a s h e e t 9/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c typical performance curves \ continued 0 4 8 12 16 20 24 28 23456 supply voltage : vcc v sk frequency : fsk mhz spec ta= -40 ta= 25 ta= 125 0 50 100 150 200 250 300 23456 supply voltage : vcc v sk high time : tskh ns spec ta= -40 ta= 25 ta= 125 0 50 100 150 200 250 300 23456 supply voltage : vcc v sk low time : tskl ns spec ta= -40 ta= 25 ta= 125 0 50 100 150 200 250 300 23456 supply voltage : vcc v cs low time : tcs ns spec ta= -40 ta= 25 ta= 125 figure 16. sk frequency vs. supply voltage figure 17. sk high time vs. supply voltage figure 18. sk low time vs. supply voltage figure 19. cs low time vs. supply voltage downloaded from: http:///
datasheet d a t a s h e e t 10/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c typical performance curves \ continued 0 20 40 60 80 100 120 23456 supply voltage : vcc v cs setup time : tcss ns spec ta= -40 ta= 25 ta= 125 0 20 40 60 80 100 120 23456 supply voltage : vcc v di setup time : tdis ns spec ta= -40 ta= 25 ta= 125 0 20 40 60 80 100 120 23456 supply voltage : vcc v di hold time : tdih ns spec ta= -40 ta= 25 ta= 125 -450 -400 -350 -300 -250 -200 -150 -100 -50 0 50 23 456 supply voltage : vcc v cs hold time : tcsh ns spec ta= -40 ta= 25 ta= 125 figure 20. cs setup time vs. supply voltage figure 21. di setup time vs. supply voltage figure 22. di hold time vs. supply voltage figure 23. cs hold time vs. supply voltage downloaded from: http:///
datasheet d a t a s h e e t 11/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c typical performance curves \ continued 0 50 100 150 200 250 300 350 23456 supply voltage : vcc v data "1" output delay time : tpd1 ns spec ta= -40 ta= 25 ta= 125 0 50 100 150 200 250 300 350 23456 supply voltage : vcc v data "0" output delay time : tpd0 ns spec ta= -40 ta= 25 ta= 125 0 50 100 150 200 250 23456 supply voltage : vcc v time between cs and output : tsv ns spec ta= -40 ta= 25 ta= 125 0 50 100 150 200 250 23456 supply voltage : vcc v time between cs and output high-z :tdf ns spec ta= -40 ta= 25 ta= 125 figure 25. data "0" output delay time vs. supply voltage figure 24. data "1" output delay time vs. supply voltage figure 27. time from cs to high-z vs.. supply voltage figure 26. time from cs output establishment vs.. supply voltage downloaded from: http:///
datasheet d a t a s h e e t 12/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c figure 28. write cycle time vs.. supply voltage 0 1 2 3 4 5 6 23456 supply voltage : vcc v write cycle time : te/w ms spec ta= -40 ta= 25 ta= 125 typical performance curves \ continued downloaded from: http:///
datasheet d a t a s h e e t 13/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c description of operation communications of the microwire bus are carried out by sk (seria l clock), di (serial data input), do (serial data output), and cs (chip select) for device selection. in connecting one eeprom to a microcontroller, connect it as show n in figure.29-(a) or figure.29-(b). and, when using the input and output common i/o port of the microcontroller, connect di and do via a resistor as shown in figure.29-(b) (refer to pages 19/29), wherein connection by 3 lines is possible. in case of using multiple eeprom devices, refer to figure. 29-(c). communications of the microwire bus are started by the first 1 input after the rise of cs. this input is called the start bi t. after input of the start bit, the ope c ode, address, and data are then inputted c onsecutively. address and data are all inputted with msb first. all 0 signal inputs after the rise of cs up to the start bit is ignored. therefore, if there is a limitation in the bit width of pic of the microcontroller, it is possible to input 0 before the start bit to control the bit width. command mode ? input the address and the data in msb-first order. ? as for *, input either v ih or v il . *start bit acceptance of all the commands of this ic starts at recognition of the start bit. the start bit means the first 1 input after the rise of cs. *1 for read, after setting the command, the data output of the selected address starts. then, in a sequential order of addres ses, the data of the next address will be outputted , and will continuously output data of succeeding addresses with the use of a co ntinuous sk clock input. (auto-increment function) *2 when the write and the write-all commands are executed, the previous data written in the selected memory cell are automatic ally deleted first, then the input data is written next. command start bit ope code address data br93h46-2c read (read) *1 1 10 a5,a4,a3,a2,a1,a0 d15 to d0(read data) write enable (wen) 1 00 1 1 write (write) *2 1 01 a5,a4,a3,a2,a1,a0 d15 to d0(write data) write all (wral) *2 1 00 0 1 d15 to d0(write data) write disable (wds) 1 00 0 0 figure 29. connection methods with microcontroller figure 29-(a). connection by 4 lines cs sk do di cs sk do cs sk di do figure 29-(b). connection by 3 lines cs sk di do cs3cs1 cs0 sk do di figure 29-(c). connection example of multiple devices micro- controller br93h46 micro- controller br93h46 micro- controller cs sk di do device 1 cs sk di do device 2 cs sk di do device 3 downloaded from: http:///
datasheet d a t a s h e e t 14/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c timing chart 1) read cycle (read) *1 start bit when data 1 is input for the first time after the rise of cs , this will be recognized as the st art bit. and, even if multiple 0 are input after the rise of cs, the first 1 input will still be recognized as the start bit, and the following operation starts. this is common to all the commands tha t will be discussed hereafter . when the read command is recognized, the dat a (16bit) of the selected address is ou tput to serial. and at that moment, 0 (dummy bit) is output first, in sync with address bit a0 and with the rise of sk. afterwhich, the main data is output in sync with the rise of sk. this ic has address auto increment function available only for read command, wherein after executing read command on the first selected address, t he data of the next address is read. and this will continue in a sequential order of addresses with the use of a continuous sk clock input, and by keeping cs at h during auto-increment. 2) write cycle (write) in this command, input 16-bit data (d15 to d0) are written to a designated address (a5 to a0). the actual write starts from the fall of cs, after d0 is sampled with sk clock (25th clock from the start bit input), to the rise of the 26th clock. when status is not detected (cs="l" fixed), write time is 4ms (max.) in conformity with te/w. and when status is detected (cs="h"), all commands are not accepted for areas where "l" (busy) is output from d0. therefore, do not input any command. write is not made or canceled if cs starts to fall after the rise of the 26th clock. note: take tskh or more from the rise of the 25th clock to the fall of cs. 3) write all cycle (wral) in this command, input 16-bit data is written simultaneously to all addresses. data is written in bulk at a write time of only 4ms (max.) in conformity with te/w. the actual write starts from the fall of cs, after d0 is samp led with sk clock (25th clock from the start bit input), to the rise of the 26th clock. if cs was ended after the rise of the 26th clock, command is canceled, and write is not completed. note:take tskh or more from the rise of the 25th clock to the fall of cs. cs 1 2 1 4 high-z 1 a5 a1 a0 0 d15 d14 d1 d15 d14 *1 *2 d0 sk di do 0 25 0 3 5 26 - figure 32. write all cycle figure 31. write cycle figure 30. read cycle - 5 3 0 0 3 4 2525 5 7 *2 the succeeding address data output auto-increment function downloaded from: http:///
datasheet d a t a s h e e t 15/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c 4) write enable (wen) / disable (wds) cycle at power on, this ic is in write disable status by the in ternal reset circuit. before executing the write command, it is necessary to execute the write enable command first. and, once this command is executed, writing is valid unitl the write disable command is executed or the power is turned off. however, the read command is valid regardless of whether write enable / disable command is executed. input to sk after 6 clocks of this command is available by either h or l, but be sure to input it. when the write enable command is executed after power on, write enable status gets in. when the write disable command is executed then, the ic gets in write disable stat us as same as at power on, and then the write command is canceled thereafter in software manner. however, the read command is still executable. in write enable status, even when the write command is input by mistake, writing will still continue. to prevent such a mistake, it is recommended to execute the write disable command after th e completion of each write execution. application 1) method to cancel each command read write, wral figure 34. read cancel available timing figure 35. write, wral cancel available timing a from start bit to 25th clock rise cancel by cs=l b 25th clock rise and after cancellation is not available by any m eans. if vcc is turned off in this area, designated address data is not guaranteed, therefore write once again. c 26th clock rise and after cancel by cs=l however, when write is started in b area (cs is ended), cancellation is not available by any means. and when sk clock is input continuously, cancellation is not available. 1bit 2bit 6bit 16bit cancel is available in all areas in read mode. method to cancel cancel by cs = l a 1bit 2bit 6bit 16bit c b sk ? rise of 25th clock d1 enlarged figure d0 di 24 25 26 27 a b c note 1) if v cc is turned off in this area, designated address data is not guaranteed. therefore, it is recommended to execute write once again. note 2) if cs is started at the same timing as that of the sk rise, write execution/cancel becomes unstable. therefore, it is recommended to set cs to l in sk=l area. as for sk rise, recommended timing is of t css /t csh or higher. cs 1 2 1 5 high-z 0 0 sk di do 9 3 4 6 7 8 enable=1 1 disable=0 0 f igure 33. write enable (wen) / disable (wds) cycle downloaded from: http:///
datasheet d a t a s h e e t 16/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c 2) i/o equivalent circuit output circuit input circuit do oeint. cs reset int. csint. figure 36. output circuit (do) figure 39. input circuit (di) figure 37. input circuit (cs) figure 38. input circuit (sk) sk en skint. di en diint. downloaded from: http:///
datasheet d a t a s h e e t 17/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c cs sk di do d0 bus y read y high-z enlarged cs sk di do bus y high-z improvement by do pull up bus y read y cs=sk=di=h when do=open cs=sk=di=h when do=pull up do h 3) i/o peripheral circuit 3-1) pull down cs by making cs=l at power on/off, mistake in operation and mistake write are prevented. pull down resistance r pd of cs pin to prevent mistake in operation and mistake write at power on/off, a cs pull-down resistor is necessary. select an appropriate resistance value from microcontrollers v oh , i oh and this ics vih characteristics. 3-2) do is available for both pull up and pull down. do output is high-z except during ready / busy outpu t timing in write command and, after data output at read command. when malfunction occurs at high-z input of the microcontroller port c onnected to do, it is necessary to pull down and pull up do. when there is no influence upon the microc ontroller actions, do may be le ft open. if do is open during a transition of output from busy to ready status , and at an instance where cs=h, sk=h, di=h, eeprom recognizes this as a start bit, resets ready output, and sets do=high-z. therefore, read y signal cannot be detected. to avoid such output, pull up do pin for improvement. figure 40. cs pull-down resistance microcontroller v ohm h output i ohm r pd v ihe l input eeprom r pd ??? v ohm i ohm v ohm v ihe ??? 4.0 2 10-3 r pd 2.0 [k ] r pd example) when v cc =5v, v ihe =3.5v, v ohm =4.0v, i ohm =2ma, from the equation , with the value of rpd satisfying the equation above, v ohm becomes 4.0v or higher, and with v ihe (=3.5v), equation is also satisfied. : eeprom v ih specifications : microcontroller v oh specifications : microcontroller i oh specifications ? v ihe ? v ohm ? i ohm figure 41. ready output timing at do=open downloaded from: http:///
datasheet d a t a s h e e t 18/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c pull up resistance rpu and pull-down resistance rpd of do pin as for pull up and pull down resistance value, select an appropria te value to this resistance value from microcontroller v ih , v il , and v oh , i oh , v ol , i ol characteristics of this ic. ready / busy status dis play (do terminal) this display outputs the internal stat us signal. when cs is started after t cs (min.200ns) from cs fall after write command input, h or l output. r/b display l (busy) = write under execution after the timer circuit in the ic works and creates the period of t e/w , this time circuit co mpletes automatically. and write to the memory cell is made in the period of t e/w , and during this period, other command is not accepted. r/b display = h (ready) = command wait status even after t e/w (max.4ms) from write of the memory ce ll, the following command is accepted. therefore, cs=h in the period of t e/w , and when input is in sk, di, malfunction may occur. therefore, set di=l in the area cs=h. (especially, in the case of shared input port, attention is required.) *do not input any command while status signal is output. command i nput in busy area is canceled, but command input in ready area is accepted. therefore, status ready output is canceled, and malfunction and mistake write may be made. figure 42. do pull up resistance figure 43. do pull down resistance microcontroller v ilm l input i ole v ole l output eeprom r pu r pu ??? v ole v ilm ??? 5 0.4 2.1 10-3 r pu 2.2 [k ] r pu example) when v cc =5v , v ole =0.4v, i ole =2.1ma, v ilm =0.8v, from the equation , v cc v ole i ole with the value of r pu to satisfy the above equation, v ole becomes 0.4v or below, and with v ilm (=0.8v), the equation is also satisfied. microcontroller v ihm h input i ohe v ohe h output eeprom rpd r pd 48 [k ] v ohe vi hm ??? 5 0.2 0.1 10-3 r pd example) when v cc =5v , v ohe =4.8v, i ohe =0.1ma, v ihm =3.5v from the equation r pd ??? v ohe i ohe with the value of r pd to satisfy the above equation, v ohe becomes 4.8v or below, and with v ihm (=3.5v), the equation is also satisfied. : eeprom v ol specifications : eeprom i ol specifications : microcontroller v il specifications ? v ole ? i ole ? v ilm : eeprom voh specifications : eeprom ioh specifications : microcontroller vih specifications ? v ohe ? i ohe ? v ihm do status do status cs high-z sk di do clock write instruction ready busy status tsv figure 44. r/b status output timing chart downloaded from: http:///
datasheet d a t a s h e e t 19/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c 4) when to directly connect di and do this ic has independent input terminal di and output terminal do, wherein signals are handled separately on timing chart. but, by inserting a resistance r between these di and do terminals, it is possible to carry out control by only 1 control line. data collision of microcontroller di/o output and do output and feedback of do output to di input. drive from the microcontroller di/o output to di input on i/o timing, and signal output from do output occur at the same time in the following points. 4-1) 1 clock cycle to take in a0 address data at read command dummy bit 0 is output to do terminal. when address data a0 = 1 input, through current route occurs. 4-2) timing of cs = h after write command. do terminal in ready / busy function output. when the next start bit input is recognized, high-z gets in. especially, at command input after write, when cs in put is started with microcontroller di/o output l, ready output h is output from do te rminal, and through current route occurs. feedback input at timing of these 4-1) and 4-2) does not cause disorder in basic operations, if resistance r is inserted. microcontroller di/o port di eeprom do r figure 45. di, do control line common connection eeprom cs input eeprom sk input eeprom di input eeprom do output microcontroller di/o port a1 high-z collision of di input and do output h a0 0 d15 d14 d13 a1 a0 high-z microcontroller output microcontroller input figure 46. collision timing at read data output at di, do direct connection eeprom cs input eeprom sk input eeprom di input eeprom do output microcontroller di/o port write command microcontroller output busy busy ready ready ready collision of di input and do output h igh-z write command write command write command write command microcontroller input microcontroller output figure 47. collision timing at di, do direct connection downloaded from: http:///
datasheet d a t a s h e e t 20/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c selection of resistance value r the resistance r becomes through current limit resistance at data collision. when through current flows, noises of power source line and instantaneous stop of power source may o ccur. when allowable through current is defined as i, the following relation should be satisfied. determine allowable curr ent amount in consideration of impedance and so forth of power source line in set. and insert resistance r, and set the value r to satisfy eeprom input level v ih /v il , even under influence of voltage decline owing to leak current and so fo rth. insertion of r will not cause any influence upon basic operations. 4-3) address data a0 = 1 input, dummy bit 0 output timing (when microcontroller di/o output is h, eeprom do outputs l, and h is input to di) ? make the through current to eeprom 10ma or below. ? see to it that the input level v ih of eeprom should satisfy the following. 4-4) do status ready output timing (when the microcontroller di/o is l, eeprom do outputs h, and l is input to di) ? set the eeprom input level v il so as to satisfy the following. r r v cc C v olm i olm 5 C 0.4 2.1 10-3 r 2.2 [k ] ??? therefore, from the equations and , r 12.5 [k ] microcontroller di/o port di eeprom do r h output i ohm v ohm v ole l output figure 48. circuit at di, do direct connection (microcontroller di/o h output, eeprom l output) v ohm v ihe v ohm i ohm r + v ole at this moment, if v ole =0v, v ohm iohm r r ??? v ohm i ohm : eeprom v ih specifications : eeprom v ol specifications : microcontroller v oh specifications : microcontroller i oh specifications ? v ihe ? v ole ? v ohm ? i ohm microcontroller di/o port di eeprom do r l output i ohm v olm v ohe h output conditions v olm v ile v olm v ohe C i olm r as this moment, if v ohe =vcc, v olm v cc C i olm r r ??? v cc C v olm i olm figure 49. circuit at di, do direct connection (microcontroller di/o l output, eeprom h output) example) when v cc =5v, v ohm =5v, i ohm =0.4ma, v olm =0.4v, i olm =2.1ma, from the equation , from the equation , r r v ohm i ohm 5 0.4 10-3 r 12.5 [k ] ??? : eeprom v il specifications : eeprom v oh specifications : microcontroller v ol specifications : microcontroller i ol specifications ? v ile ? v ohe ? v olm ? i olm conditions downloaded from: http:///
datasheet d a t a s h e e t 21/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c 5) power-up/down conditions ? at power on/off, set cs l. when cs is h, this ic gets in input accept status (active) . at power on, set cs l to prevent malfunction from noise. (when cs is in l status, all inputs are canceled.) at powe r decline low power status may pr evail. therefore, at power off, set cs l to prevent malfunction from noise. por circuit this ic has a por (power on reset) circuit as a mistake wr ite countermeasure. after por ac tion, it gets in write disable status. the por circuit is valid only when power is on, and does not work when power is off. however, if cs is h at power on/off, it may become write enable status owing to noises and the likes. for secure actions, observe the following conditions. 1. set cs=l 2. turn on power so as to satisfy the recommended conditions of t r , t off , vbot for por circuit action. lv cc circuit lv cc (v cc -lockout) circuit prevents data rewrite action at low power, and prevents wrong write. at lvcc voltage (typ=1.9v) or below, it prevents data rewrite. 6) noise countermeasures v cc noise (bypass capacitor) when noise or surge gets in the power source line, malf unction may occur. therefore, in removing these, it is recommended to attach a bypass capacitor (0.1 f) between ic v cc and gnd as close to ic as possible. it is also recommended to attach a bypass capacitor between board v cc and gnd. sk noise when the rise time (tr) of sk is long, and a certain degree or more of noise exists, malfunction may occur owing to clock bit displacement. to avoid this, a schmitt trigger circuit is built in sk input. t he hysteresis width of this circuit is set about 0.2v. if noise exists at sk input, set the noise amplitude 0.2vp-p or below. and it is recommended to set the rise time (t r ) of s k to 100ns or below. in the case when the rise time is 100ns or higher, take sufficient noise countermeasures. make the clock rise, fall time as small as possible. t off t r vbot 0 v cc t r t off vbot 10ms or below 10ms or higher 0.3v or below 100ms or below 10ms or higher 0.2v or below v cc gnd v cc gnd v cc cs bad example good example figure 50. timing at power on/off figure 51. rise waveform diagram bad example cs pin is pulled up to vcc. in this case, cs becomes h (active status), eeprom may malfunction or have write error due to noises. this is true even when cs input is high-z. good example it is l at power on/off. set 10ms or higher to recharge at power off. when power is turned on wi thout observing this condition, ic internal circuit may not be reset. recommended conditions of t r , t off , vbot downloaded from: http:///
datasheet d a t a s h e e t 22/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c operational notes 1. described numeric values and data are design representative values, and the values are not guaranteed. 2. application circuit although we can recommend the application circuits contained herein with a relatively high degree of confidence, we ask that you verify all characteristics and spec ifications of the circuit as well as it s performance under actual conditions. pleas e note that we cannot be held responsible for problems that may arise due to patent infringements or noncompliance with any and all applicable laws and regulations. 3. absolute maximum ratings operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. 4. ground voltage the voltage of the ground pin must be the lo west voltage of all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 5. thermal consideration use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. consi der pc that does not exceed pd in actual operating conditions (pc pd). package power dissipation : pd (w)=(tjmax ta ) / ja power dissipation : pc (w)=( v cc vo)io+v cc ib tjmax : maximum junction temperature=150 , ta : peripheral temperature[ ] , ja : thermal resistance of package-ambience[ /w], pd : package power dissipation [w], pc : power dissipation [w], v cc : input voltage, vo : output voltage, io : load, ib : bias current 6. short between pins and mounting errors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit may be caused by conductive particles caught between the pins. 7. operation under str ong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. downloaded from: http:///
datasheet d a t a s h e e t 23/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c part numbering b r 9 3 h 4 6 x x x x 2 c x x lineup capacity package orderable part number type quantity 1k msop8 reel of 3000 br93h46rfvm-2ctr tssop-b8 BR93H46RFVT-2CE2 sop8 reel of 2500 br93h46rf-2ce2 sop-j8 br93h46rfj-2ce2 capacity 46 = 1kbit package specifications tr reel shape emboss taping (msop8) e2 reel shape emboss taping (tssop-b8, sop8, sop-j8) process code bus type 93: microwire bus operating temperature h: -40c to +125c package rfvm rfvt rf rfj : msop8 : tssop-b8 : sop8 : sop-j8 downloaded from: http:///
datasheet d a t a s h e e t 24/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c physical dimensions tape and reel information (unit : mm) msop8 0.08 s s 4.0 0.2 8 3 2.8 0.1 1 6 2.9 0.1 0.475 4 5 7 (max 3.25 include burr) 2 1pin mark 0.9max 0.75 0.05 0.65 0.08 0.05 0.22 +0.05C0.04 0.6 0.2 0.29 0.15 0.145 +0.05C0.03 4 + 6 4 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin downloaded from: http:///
datasheet d a t a s h e e t 25/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c (unit : mm) tssop-b8 0.08 s 0.08 m 4 4 234 8765 1 1.0 0.05 1pin mark 0.525 0.245 +0.05C0.04 0.65 0.145 +0.05 C0.03 0.1 0.05 1.2max 3.0 0.1 4.4 0.1 6.4 0.2 0.5 0.15 1.0 0.2 (max 3.35 include burr) s direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () 1pin downloaded from: http:///
datasheet d a t a s h e e t 26/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) sop8 0.9 0.15 0.3min 4 + 6 4 0.17 +0.1 - 0.05 0.595 6 4 3 8 2 5 1 7 5.0 0.2 6.2 0.3 4.4 0.2 (max 5.35 include burr) 1.27 0.11 0.42 0.1 1.5 0.1 s 0.1 s downloaded from: http:///
datasheet d a t a s h e e t 27/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) sop-j8 4 + 6 4 0.2 0.1 0.45min 234 5 6 7 8 1 4.9 0.2 0.545 3.9 0.2 6.0 0.3 (max 5.25 include burr) 0.42 0.1 1.27 0.175 1.375 0.1 0.1 s s downloaded from: http:///
datasheet d a t a s h e e t 28/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c marking diagrams capacity product name marking package type 1k rh46 msop8 tssop-b8 sop8 sop-j8 msop8 (top view) part number marking lot number 1pin mark rh4 6 tssop-b8 (top view) part number marking lot number 1pin mark r h 4 6 sop8 (top view) part number marking lot number 1pin mark r h 4 6 sop-j8 (top view) part number marking lot number 1pin mark r h 4 6 downloaded from: http:///
datasheet d a t a s h e e t 29/29 www.rohm.com 16.feb.2016 rev.003 tsz22111 ? 15 ? 001 ? 2012 rohm co., ltd. all rights reserved. tsz02201-0r1r0g100010-1-2 br93h46-2c revision history date revision changes 20.jul.2012 001 new release 19.dec.2012 002 all page document converted to new format. p2 data retention was changed. 16.feb.2016 003 p1 data retention and write cycles were modified. p13 reference page number was modified. p14 figure 31. was modified. p18 text bugs were modified in figure 42. and figure 44.. downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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