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datashee t product structure silicon monolithic integrated circuit this product is not designed for pr otection against radioactive rays . 1/26 tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com ac/dc drivers pwm control ic BM1P107FJ general the pwm control ic for ac/dc BM1P107FJ provides an optimum system for all products that include an electrical outlet. a built-in start circuit that withstands 650 v helps to keep power consumption low. both isolated and non-isolated versions are supported, making for simpler design of various types of low-power converters. switching mosfet and current detection resistors are external devices, thus achieving a higher degree of freedom in power supply design. the switching frequency is set as fixed. since current mode control is used, a current limit is imposed in each cycle, and excellent performance is demonstrated in bandwidth and transient response. with a light load, frequency is reduced and higher efficiency is realized. a frequency hopping function is also built in, contributing to low emi. also on chip are soft start and burst functions, a per-cycle overcurrent limiter, vcc overvoltage protection, overload protec tion, and other protection functions. basic specifications ? operating power supply voltage range: vcc 8.9 v to 26.0 v vh: to 600 v ? operating current: normal: 0.60 ma (typ.) burst mode: 0.35 ma (typ.) ? oscillation frequency: BM1P107FJ: 100 khz (typ.) ? operating temperature range: -40 c to +85 c features ? pwm frequency: 100 khz ? pwm current mode method ? frequency hopping function ? burst operation during light load / frequency reduction function ? 650 v start circuit ? vcc pin undervoltage protection ? vcc pin overvoltage protection ? cs pin open protection ? cs pin leading-edge-blanking function ? per-cycle overcurrent limiter function ? overcurrent limiter with ac voltage compensation function ? soft start function ? secondary overcurrent protection circuit package sop-j8 4.90 mm 6.00 mm 1.65 mm pitch 1.27 mm (typ.) (typ.) (typ.) (typ.) applications ac adapters, tvs, and household appliances (vacuum cle aners, humidifiers, air cleaners, air conditioners, ih cooking heat ers, rice cookers, etc.) application circuit line-up figure 1 application circuit downloaded from: http:///
2/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta = 25c) parameter symbol rating unit conditions maximum voltage 1 vmax1 -0.3 ~ 30.0 v vcc maximum voltage 2 vmax2 -0.3 ~ 6.5 v cs, fb maximum voltage 3 vmax3 -0.3 ~ 15.0 v out maximum voltage 4 vmax4 -0.3 ~ 650 v vh out pin peak current i out 1.0 a allowable dissipation p d 674.9 (note1) mw when mounted operating temperature range t opr -40 ~ +85 o c storage temperature range t str -55 ~ +150 o c (note1) sop-j8: when mounted, 70 70 1.6 mm (glass epoxy on single-layer substrate). reduce to 5.40 mw/c when used at ta = 25c or above. recommended operating conditions (ta = 25c) parameter symbol rating unit conditions supply voltage range 1 vcc 8.9 ~ 26.0 v vcc pin voltage supply voltage range 2 vh 80 ~ 600 v vh pin voltage electrical characteristics (unless otherw ise noted, ta = 25c, vcc = 15 v) parameter symbol rating unit conditions min. typ. max. circuit current circuit current (on) 1 i on1 - 600 1000 a fb = 2.0 v (during pulse operation) circuit current (on) 2 i on2 - 350 450 a fb = 0.0 v (during burst operation) vcc pin (5 pin) protection function vcc uvlo voltage 1 v uvlo1 12.50 13.50 14.50 v vcc rise vcc uvlo voltage 2 v uvlo2 7.50 8.20 8.90 v vcc drop vcc uvlo hysteresis v uvlo3 - 5.30 - v v uvlo3 = v uvlo1 -v uvlo2 vcc ovp voltage 1 v ovp1 26.00 27.50 29.00 v vcc rise vcc ovp voltage 2 v ovp2 - 23.50 - v vcc drop vcc ovp hysteresis v ovp3 - 4.00 - v [output driver block] out pin h voltage v outh 10.5 12.5 14.5 v io = -20 ma out pin l voltage v outl - - 1.00 v io = +20 ma out pin pull-down resistance r pdout 75 100 125 k ? [start circuit block] start current 1 i start1 0.400 0.700 1.000 ma vcc = 0 v start current 2 i start2 1.000 3.000 5.000 ma vcc = 10 v off current i start3 - 10 20 ua inflow current from vh pin after release of uvlo start current switching voltage v sc 0.400 0.800 1.400 v downloaded from: http:///
3/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics of control ic block (unless otherwise noted, ta = 25c, vcc = 15 v) parameter symbol rating unit conditions min. typ. max. [pwm type dc/dc driver block] oscillation frequency 1a f sw1a 90 100 110 khz fb = 2.00 v average frequency oscillation frequency 2 f sw2 - 25 - khz fb = 0.40 v average frequency frequency hopping range f del1 - 6.0 - khz fb = 2.00 v average frequency hopping fluctuation frequency f ch 75 125 175 hz minimum pulse width t min - 400 - ns soft start time 1 t ss1 0.30 0.50 0.70 ms soft start time 2 t ss2 0.60 1.00 1.40 ms soft start time 3 t ss3 1.20 2.00 2.80 ms soft start time 4 t ss4 2.40 4.00 5.60 ms maximum duty d ma x 68.0 75.0 82.0 % fb pin pull-up resistance r fb 22 30 38 k ? fb / cs gain g ain - 4.00 - v/v fb burst voltage 1 v bst1 0.300 0.400 0.500 v fb drop fb burst voltage 2 v bst2 0.350 0.450 0.550 v fb rise fbolp voltage 1a v folp1a 2.60 2.80 3.00 v when overload is detected (fb rise) fbolp voltage 1b v folp1b - v folp2a -0.2 - v when overload is detected (fb drop) fbolp detection timer t folp 44 64 84 ms [overcurrent detection block] overcurrent detection voltage v cs 0.380 0.400 0.420 v ton = 0 us overcurrent detection voltage ss1 v cs_ss1 - 0.100 - v 0 [ms] ~ tss1 [ms] overcurrent detection voltage ss2 v cs_ss2 - 0.150 - v tss1 [ms] ~ tss2 [ms] overcurrent detection voltage ss3 v cs_ss3 - 0.200 - v tss2 [ms] ~ tss3[ms] overcurrent detection voltage ss4 v cs_ss4 - 0.300 - v tss3 [ms] ~ tss4 [ms] leading edge blanking time t leb - 250 - ns overcurrent detection ac compensation factor k cs 12 20 28 mv/us downloaded from: http:///
4/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 pin descriptions table1. i/o pin functions no. pin name i/o function esd diode vcc gnd 1 n.c - non connection - - 2 fb i feedback signal input pin 3 cs i primary current sense pin 4 gnd i/o gnd pin - 5 out o external mos drive pin 6 vcc i/o power supply input pin - 7 n.c. - non connection - - 8 vh i start circuit pin - i/o equivalent circuit diagram figure 2. i/o equivale nt circuit diagram downloaded from: http:///
5/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 block diagram = figure 3. block diagram downloaded from: http:///
6/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 description of application operations in blocks (1) start circuit (vh pin: 8 pin) this ic has a built-in start circuit (withstands 650 v). this enables both low standby mode power and high-speed startup. this start circuit operates only at startup. the cu rrent flow when operating is shown in figure 5. after startup, the power consumed is only for the idling current i start3 (typ = 10 ua). ex) when vac = 100 v, power consumption is from start circuit only pvh = 100 v* 2*10 ua = 1.41 mw ex) when vac = 240 v, power consumption is from start circuit only pvh = 240 v* 2*10 ua = 3.38 mw startup time is determined based on the inflow current fo r the vh pin and the capacitance for the vcc pin. startup time reference values are shown in figure 6. for example, when c vcc = 10 uf, startup takes about 0.07 seconds. when the vcc pin has been shorted by gnd, the istart1 current in figure 5 flows. when the vh pin has been shorted by gnd, a large current flows to gnd from the vh li ne. to prevent this, insert resistor r vh (5 k ? ~ 60 k ? ) to limit the current between the vh line and the vh pin of the ic. when the vh pin is shorted, the power of vh 2 /r vh is applied to the resistor. therefore, select a resistor size that is able to tolerate this amount of power. if one resistor is not enough for the allowable power, connect two or more resistors in series. figure 4. block diagram of start circuit 0.0 ? 0.1 ? 0.2 ? 0.3 ? 0.4 ? 0.5 ? 0.6 ? 0.7 ? 0.8 ? 0.9 ? 1.0 ? 0 5 10 15 20 25 30 35 40 45 50 r g [sec] cvcc ? [uf] [] figure 5. start current vs vcc voltage figure 6. startup time (reference value) (* start current flows from the vh pin.) (c vcc is capacitance for the vcc pin.) the operating waveform at startup is as follows. downloaded from: http:///
7/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 the operating waveform at startup is shown in figure 7. secondary output switing vh voltage vcc(5pin) vh input current a b c v uvlo1 set voltage v sc d figure 7. operating waveform at startup a: vh voltage is applied when plugged into the outlet. at t hat time, charging starts from the vh pin via the start circuit to the vcc pin. at that time, vcc < v sc (typ = 0.8 v), so the vh input current is lim ited to istart1 by the vcc pin short protection function. b: since vcc voltage > v sc (typ = 0.8 v), vcc short protection is cancelled and cu rrent flow is from the vh input current. c: since vcc voltage > v uvlo1 (typ = 13.5 v), the start circuit is stoppe d and the vh input current flow is only i start3 (typ = 10 ua). when switching starts, secondary output begins to increase, but since secondary output is low, the vcc pin voltage is reduced. the drop rate of vcc is determined by the cons umption current between the vcc pin capacitor and the ic and by the load current connected to the vcc pin. (v/t = cvcc/icc) d: since secondary output has risen to a constant voltage, voltage is applied from the auxiliary winding to the vcc pin, and vcc voltage is stabilized. downloaded from: http:///
8/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ( 2) startup sequences (soft start operation, light load operati on, auto recovery operation during overload protection) startup sequences are shown in figure 8. see the sections below for detailed descriptions. figure 8. startup sequence time chart a: voltage is applied to the input voltage (vh) pin (pin 8). b: the vcc pin (pin 6) voltage rises, and when vcc v uvlo1 (13.5 v typ) this ic starts to operate. when protection functions (vcc, cs, fb pin, temperatur e) are judged as normal, switching operation begins. at this time, the vcc pin (pin 6) consumption curr ent necessarily causes the vcc pin voltage to drop. when vcc < v uvlo2 (8.2 v typ), switching operation stops by vcc uvlo function. for that, set vcc capacitor to finish start-up before vcc v uvlo1 (13.5 v typ), the start circuit stops charging vcc. j: same as f k: same as g startup waveforms are shown as reference examples in figure 9 and figure 10. soft ? start vlim1 start ? ~ ? 0.5 ms 0.10 v (12%) 0.5 ms ? ~ 1 ms 0.15 v (25%) 1 ms ? ~ 2 ms 0.20 v (50%) 2 ms ? ~ ? 4 ms 0.30 v (75%) 4 ms ~ 0.500 v (100%) downloaded from: http:///
9/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 figure 9. waveform of no-load startup figure 10. waveform of high-load startup (3) vcc pin protection function this ic includes a vcc pin under voltage protection function vcc uvlo (under voltage protection) and overvoltage protection function vcc ovp (over voltage protection). the vcc uvlo function and vcc ovp func tion prevent damage to the switching mosfet that can occur when the vcc voltage drops or becomes excessive. (3-1) vcc uvlo and vcc ovp functions vcc uvlo is an auto recovery type comparator with vo ltage hysteresis. for vcc ov p, the bm1p067fj has an auto recovery type comparator. after vccovp operation detects , switching operation re-start when vcc 10/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 a: voltage is applied to the vh pin (pin 8) and voltage at the vcc pin (pin 6) starts to rise. b: when vcc pin (pin 6) voltage > v uvlo1 , the vcc uvlo function is canc eled and the dc/dc operation starts. then vcc start-up circuit stops charging. c: when vcc pin (pin 6) voltage < v uvlo2 , the vcc uvlo function is operat ed and the dc/dc operation stops. then vcc start-up circuit starts charging. d: when vcc pin (pin 6) voltage > v uvlo1 , the vcc uvlo function is canc eled and the dc/dc operation starts. then vcc start-up circuit stops charging. e: after finishing start-up, vcc pin voltage is stable as secondary output voltage is stable. f: vcc pin voltage rises g: when vcc pin (pin 6) voltage > v ocp status continues for t latch (typ = 100us), switching operation is stopped by the vcc ovp function. h: when vcc pin voltage < v ovp2 , vccovp function is released, and the switching operation re-starts. i: when vcc pin voltage < v uvlo2 , vccuvlo function operates, and switching operation stops. j: when vcc pin (pin 6) voltage > v uvlo1 , the vcc uvlo function is canc eled and the dc/dc operation starts. k: the same as i. l: the same as j. m: the same as k. n: high voltage line vh is reduced. then vcc pin voltage drops because ic cannot charge the power to vcc pin. o: when vcc < v uvlo2 , the vcc uvlo function operates. p: when vcc v uvlo , start-up circuit stops, and the switching operation re-starts. ? capacitance value of vcc pin to ensure stable operation of the ic, set the vcc pin capacitance value to 10 uf or above. if the capacitor for the vcc pin is too large, it will delay th e response of the vcc pin to secondary output. in cases where the transformer has a low degree of coupling, a large surge can be generated at the vcc pin, which may damage the ic. in such cases, insert a resistance of 10 ? to 100 ? on a bus between the diode and capacitor after the auxiliary winding. as for constants, perform a waveform evaluati on of the vcc pin and enter se ttings that will prevent any surge at the vcc pin from exceeding the absolute maximum rating for the vcc pin. ? vcc ovp voltage protection settings for increased secondary output the vcc pin voltage is determined by the secondar y output and the transformer ratio (np:ns). accordingly, when secondary output has become large, it can be protected by vcc ovp. the vcc ovp protection settings are as follows. figure 12 vcc ovp settings this is determined by vcc voltage = vout x nb/ns. (vout: secondary output, nb: auxiliary winding turns, ns: secondary winding turns). when secondary output voltage rises 30% high, and protection is desired, set the number of winding turns so that 1.3 x vout x (nb/ns) v ovp1 . for vcc ovp protection, since there is the t latch (typ = 100 us) blanking time, vcc ovp protection cannot be detected for instantaneous surges at the vcc pin. however, vcc ovp is detected when the v cc pin voltage has become higher than v ovp1 for at least the t latch period, such as due to the impact of a low degree of transformer c ouplings, so an application evaluation should be done to check this before setting vcc ovp. downloaded from: http:///
11/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (4) dc/dc driver (pwm comparator, frequency hopping, slope compensation, osc, burst) (4-1) pwm basic operations figure 13 shows a pwm basic block diagram and figure 14 illustrates pwm basic operations. figure 13. block diagram of ic internal pwm operations figure 14. pwm basic operations a: a set signal is output from the oscillat or in the ic, and the mosfet is turned on. at that time, the capacitance between the mosfet drain and source becomes discharged, and noise is generated at the cs pin. this noise is called the leading edge. this ic has a built-in filter for this noise. (see (5).) as a result of this filter and delay time, the minimum pulse width of the ic is 400 ns (typ). afterward, current flow to the mosfet and t he vcs = rs * ip voltage is applied to the cs pin. b: when cs pin voltage rises to become greater than the fb pin voltage/gain (typ = 4) or the overcurrent detection voltage vcs, the reset signal is output and out is turned off. c: there is a delay time tondelay between time point b and actual turn-off. this time is the result of differences in maximum power that occur based on the ac vo ltage. this ic includes a function that suppresses these differences. (see (4-4).) d: the energy that accumulates in the transformer du ring ton status is discharged to the secondary side, and the drain voltage starts to oscillate freely based on the transformer lp value and the mosfet cds (drain-source capacitance). e: since the switching frequency with in the ic is predetermined, set signal out put from the internal oscillator occurs for a set period starting from point a, and the mosfet is turned on. ip downloaded from: http:///
12/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (4-2) frequency operations figure 15. pwm operations in ic the pwm frequency is generated by the osc block (internal oscillator) in figure 15. this oscillator has a switching frequency hopping function and the switching frequency changes such as is shown in figure 16. the fluctuation cycle is 125 hz. due to this frequency ho pping function, the frequency spectrum is dispersed and the frequency spectrum peak is lowered. this increases the margin for emi testing. [] figure 16. frequency hopping function in figure 16, the duty is calculated as ton * switching frequency * 100. the maximum duty value is dmax (typ = 75%). since the pwm current mode method is being used, if the duty exceeds 50% sub harmonic oscillation may occur. 22 mv/us slope compensation is built in as a countermeasure to this. to reduce power consumption when there is a light load, a burst mode circuit and fr equency reduction circuit are built in. these operations are illustrated in figure17. as shown in this figure, frequency fluctuates according to the fb voltage. if the fb voltage is in the range shown for mode2, switching lo ss is reduced by reducing internal oscillations based on the fb voltage. downloaded from: http:///
13/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 figure 17. operation with fb pin voltage ? mode1: burst operation ? mode2: frequency reduction operation (reduces maximum frequency.) ? mode3: fixed frequency operation (operates at maximum frequency.) ? mode4: overload operation (overload status is detected and pulse operation is stopped.) (4-3) overcurrent detection operation r fb (30 k ? .typ) is used as pull-up resistance for the fb pin wi th regard to the internal power supply (4.0 v). when the load of the secondary output voltage (secondary load power) changes , the photo-coupler current changes, and so the fb pin voltage also changes. fb voltage vfb is determined by the equation fb voltage = 4 v - i fb . (i fb : photo coupler current) for example, when the load becomes heavier, the fb current is reduced, so the fb voltage rises. when the load becomes lighter, the fb current is increased, so the fb voltage drops. in this way, secondary voltage is monitored by the fb pin. as the fb pin voltage is monitored, if the load becomes li ghter (if fb voltage drops), a burst mode operation or frequency reduction operation is executed. figure 18 shows the cs detection voltage with regard to fb voltage. figure 18 fb voltage and cs voltage characteristics when fb voltage is less than 2.0 v or when the cs voltage exceeds the fb voltage / gain (typ = 4), the mosfet is turned off. (see time point c in figure 14.) when the fb voltage exceeds 2.0 v, the cs voltage = vcs + kcs * ton. kcs * ton depends on ac voltage compensation. (see 4-4.) therefore, peak current ip is determined as ip = vcs1 / rs. the current value for the mosfet should be set with a margin with regard to the ip value obtained from this formula. maximum power is determined as pmax = 1/2 x lp x ip 2 x fsw. (lp: primary inductance value, ip: primary peak current, fsw: switching frequency) vcs1 is determined as vcs1 = vcs (typ = 0.4 v) + kcs (typ = 20) * ton + vdelay. vdelay is the amount of cs voltage increase during t he delay time rondelay between b and c in figure 14. this is calculated as vdelay = vin / lp * tondelay * rs. S cs/ S fb gain : 1/4 downloaded from: http:///
14/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (4-4) ac voltage dependent compensation of overcurrent limiter this ic has an ac voltage compensation function on chip . this function performs compensation for ac voltage by increasing the level of the overcurrent lim iter over time. in the equation below, (a) and (b) are assigned values similar to those for ac 100 v and ac 200 v to perform compensation. vcs1 = vcs (typ = 0.4 v) + kcs (typ = 20) *ton + vdelay (a) (b) these operations are shown in figures 19, 20, and 21. when there is no ac voltage compensation, the peak current becomes offset during the response time. figure 19. without ac voltage compensation function figure 20. with ac voltage compensation function primary peak current that flows during ov erload mode is defined as follows. primary peak current i peak = v cs /r s + kcs * ton/rs + v in /l p * tondelay v cs : overcurrent limiter voltage in ic r s : current detection resistor v in : input dc voltage l p : primary peak current to n delay : delay time after overcurrent limiter detection figure 21. overcurrent limiter voltage downloaded from: http:///
15/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (6) l.e.b period when the driver mosfet is turned on, a surge cu rrent is generated at time point a in figure 14. at that time, the cs voltage (pin 4) rises, which may c ause detection errors in the overcurrent limiter circuit. to prevent these detection errors, the out pin in this ic is switched from low to high and the cs voltage (pin 4) is masked for 250 ns by the built-in l.e.b. function (leading edge blanking function). this blanking function can reduce the cs pin noise filter fo r the noise that is generated when switching the out pin from low to high. however, if the cs pin noise does not stay within this 250 ns period, an rc filter should be applied to this pin, such as is shown in figure 22. at this time , a delay time occurs due to the rc filter when the cs pin is detected. even if there is no filt er, attachment of r cs as a surge countermeasure is recommended. the recommended resistance for rcs is 1 k ? . when a filter ring is desired, use ccs to adjust for this resistance. figure22. circuits peripheral to the cs pin (6) cs pin open protection when the cs pin (pin 4) has become an open pin, transient heat (due to noise, etc.) occurs in the ic, which may become damaged. an open protection circuit has been built in to prevent such damage. (auto recovery protection) _ figure 23. cs pin peripheral circuit downloaded from: http:///
16/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (7) output overload protection function (fb olp comparator) as is shown in mode4 of figure 17, when the fb pin voltage rises to above a certain value, it is called an overload condition. the output overload protection func tion stops switching operations wh en mode4 has an overload condition. during an overload condition, the output voltage drops and so current no longer flows to the photo coupler while the fb voltage (pin 2) rises. when the fb voltage (pin 2) exceeds v folp1a (2.8v typ) continuously for t folp2 (64ms typ), it is judged as an overload condition and switching is stopped. while the fb pin (pin 2) exceeds v folp1a (2.8v typ), if the fb pin (pin 2) voltage drops below v folp1b (2.6v typ) during the t folp (64 ms typ) period, the overload protection timer is reset. switching operation are performed during the t folp (64ms typ) period. at startup, the fb pi n (pin 2) voltage is pulled up by a resistance to the ic internal voltage, and operations start when the voltage reaches v folp1a (2.8v typ) or above. therefore, at startup the start time of secondary output voltage must be set so that the fb voltage (pin 2) drops to v folp1b (2.6v typ) or below within the t folp (64 ms typ) period. once fbolp is detected, the switching operation stops, and vcc voltage falls do wn because secondary output voltage falls down. when vcc voltage is lower than v uvlo2 (8.2v.typ), ic is reset, and ic starts by starter circuit shown in (1). the switching stop time is calculated by vcc pin voltage and vcc capacitor and icc current stop time : tstop tstop=cvcc*(vcc C vuvlo2) / icc figure 24. overload protection (auto recovery) a: since fb > v folp1a , the fbolp comparator detects an overload. b: when fb v folp1a , the fbolp comparator detects an overload. d: when the condition at c continues for t folp (typ = 64 ms), switching is stopped by the overload protection function. as switching operation stops, vcc pin voltage falls down because output voltage falls down. e: when vcc pin voltage < vuvlo2, ic is reset by vcc uvlo function, and start-up circuit operates. f: when vcc pin voltage > vuvlo1, vcc uvlo is released, and switching operation starts. g: because secondary output voltage is stable, vcc pin voltage is also stable. downloaded from: http:///
17/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (8-1) out pin clamp function to protect the external mosfet, the high voltage le vel of the out pin (pin 5) is clamped to v outh (typ = 12.5 v). the vcc pin (pin 6) voltage is raised to prev ent mosfet gate damage. (shown in figure25.) figure 25. out pin (pin 5) schematic (8-2) out pin driver circuit figure 26. out pin (pin 5) driver circuit switching noise that occurs when out is tur ned on or off may cause emi-related problems. in such cases, the mosfet turn-on ti me and turn-off time must be delayed. however, when the turn off time is delayed, switching loss increases. figure 26 shows a delay circuit for the out pin. in figure 26, is valid during both turn-on and turn-off operations. shows a delay in the turn-on only, while turn-off is accelerated. downloaded from: http:///
18/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (9) caution points for board layout pattern figure 27. board layout pattern ? caution points the red lines shown in figure 27 are large current pathways. in the layout, these should be as short as possible since they can cause ringing, dissipation, etc. also, any loops that occur in the red line should be made as small as possible in this layout. the orange lines in the secondary side of figure 27 should also be made short and thick like the red lines and should be made with small loops in this layout. be sure to implement grounding for the red lines, brown lines, blue lines, and green lines. the green lines are pathways for surges on the secondar y side to escape to the primary side, and since a large current may flow instantaneously, they should be laid out independently of the red lines and blue lines. the blue lines are gnd lines for ic control. they do not have any large current flow, but they are susceptible to noise effects, so they should be laid out independent ly of the red lines, green lines, and brown lines. the brown lines are current pathways for the vcc pin. a curre nt flows on these lines during switching, so they should also be laid out independently. do not route any ic control lines directly under the tr ansformer, since they may be affected by magnetic flux. downloaded from: http:///
19/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (application circuit example) _ _ figure 28. application circuit example downloaded from: http:///
20/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operation modes of protection circuit table 3 lists the operation mode of each protection function. table 3. operation modes of protection circuit function operation mode vcc undervoltage locked out auto recovery vcc overvoltage protection auto recovery (with 100-us timer) fb over limited protection auto recovery (with 64-us timer) cs open protection auto recovery (with 100-us timer) sequence the sequence for this ic is shown in figure 29. a transition to off mode occurs under a ll conditions when vcc exceeds 8.2 v. & figure 29. sequence diagram downloaded from: http:///
21/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 thermal loss in the thermal design, set operations for the following conditions. (the temperature shown below is the guar anteed temperature, so be sure that a margin is taken into account.) 1. ambient temperature ta must be 85c or less. 2. ic loss must be within the allowable dissipation pd. the thermal abatement characteristics are follows. (pcb : 70 mm x 70 mm x 1.6 mm, when mounted on glass epoxy substrate) -19 sop8 Xp figure 30. thermal abatement characteristics 0 100 200 300 400 500 600 700 800 900 1000 0 25 50 75 100 125 150 ta[ ] pd[mw] downloaded from: http:///
22/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bloc k from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trac es of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assemb ly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
23/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are of ten connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unc onnected, the electric field from th e outside can easily charge it. the small charge acquired in this way is enough to produce a signifi cant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused in put pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolat ion and p substrate layers between adjac ent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (a nd thus to the p substrate) should be avoided. figure 31. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that th e output voltage, output current, and power di ssipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that pr events heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however th e rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are autom atically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other t han protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in pr eventing damage due to sudden and unexpecte d incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. downloaded from: http:///
24/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 part number selection b m 1 p 1 0 7 f j - e 2 part name package fj : sop-j8 packaging and forming specifications e2: reel type embossed tape marking diagram line-up model name (bm1pxxxfj) bm1p061fj bm1p062fj bm1p063fj bm1p064fj bm1p065fj bm1p066fj bm1p067fj bm1p068fj bm1p101fj bm1p102fj bm1p103fj bm1p104fj bm1p105fj bm1p106fj BM1P107FJ bm1p108fj lot no. 1pin mark 1p107 downloaded from: http:///
25/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
26/26 datasheet datasheet BM1P107FJ tsz02201-0f2f0a200170-1-2 2.oct.2013.rev.001 ? 2013 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 20.jan.2014 001 new release downloaded from: http:///
datasheet datasheet notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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