1 copyright ? 2010, everlight all ri ghts reserved. release date : 29 - may .2013 . issue no: dse - 0008890 rev.3 www.everlight.com smd ? b 16 - 213/bhc - an1p2/3t features ? package in 8mm tape on 7 diameter reel. ? compatible with automatic placement equipment. ? compatible with infrared and vapor ph ase reflow solder process. ? mono- color type. ? pb - free. ? the product itself will remain within rohs compliant version. description ? the 16- 213 smd led is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. ? besides, lightweight makes them ideal for miniature applications. etc. applications ? backlighting in dashboard and switch. ? telecommunication: indicator and backlighting in telephone a nd fax. ? flat backlight for lcd, switch and symbol. ? general use.
datasheet smd ? b 16- 213/bhc - an1p2/3t 2 copyright ? 2010, everlight all rights reserved. release date : 29 - may - 2013 . issue no: dse - 0008890 rev. 3 www.everlight.com device selection guide chip materials emitted color resin color ingan blue water clear absolute maximum ratings (ta=25 ) parameter symbol rating unit reverse voltage v r 5 v forw ard current i f 25 ma eak forward current (duty 1/10 @1khz) i fp 100 ma power dissipation pd 95 mw electrostatic discharge esd hbm 150 v operating temperature t opr - 40 ~ +85 storage temperature ts t g - 40 ~ + 90 soldering temperature ts o l reflow solder ing : 260 for 1 0 sec. hand soldering : 350 for 3 sec.
datasheet smd ? b 16- 213/bhc - an1p2/3t 3 copyright ? 2010, everlight all rights reserved. release date : 29 - may - 2013 . issue no: dse - 0008890 rev. 3 www.everlight.com electro - optical characteristics (ta=25 ) parameter symbol min. typ. max. unit condition luminous intensity iv 28.5 ----- 72.0 mcd i f = 5 ma viewing angle 2 1/2 ----- 1 2 0 ----- deg peak waveleng th p ----- 468 ----- nm dominant wavelength d 464.5 ----- 476.5 nm spectrum radiation bandwidth ----- 35 ----- nm forward voltage v f 2.7 3.3 3.7 v reverse current i r ----- ----- 50 a v r =5v note: 1. tolerance of luminous intensity: 11% 2.tolerance of dominant wavelength 1nm 3 . tolerance of forward voltage: 0.05v
datasheet smd ? b 16- 213/bhc - an1p2/3t 4 copyright ? 2010, everlight all rights reserved. release date : 29 - may - 2013 . issue no: dse - 0008890 rev. 3 www.everlight.com bin range of luminous intensity bin code min. max. unit condition n1 28.5 36.0 mcd i f = 5 ma n2 36.0 45.0 p1 45.0 57.0 p 2 57.0 72.0 bin range of dom. wav elength bin code min. max. unit condition a9 464.5 467.5 nm i f = 5 ma a10 467.5 470.5 a11 470.5 473.5 a12 473.5 476.5 note: 1.tolerance of luminous intensity: 11% 2.tolerance of dominant wavelength 1nm
datasheet smd ? b 16- 213/bhc - an1p2/3t 5 copyright ? 2010, everlight all rights reserved. release date : 29 - may - 2013 . issue no: dse - 0008890 rev. 3 www.everlight.com typical electro - optical characte ristics curves 25 0 50 75 100 ta=25c forward voltage v (v) relative luminous intensity (%) -60 forward current derating curve ambient temperature ta (c) forward current f i (ma) 1 10 -20 -40 0 20 60 40 100 80 relative luminous intensity (%) 100 1000 forward current wavelength (nm) luminous intensity vs. ambient temperature i (ma) f spectrum distribution forward voltage f ta=25c forward current vs. 10 relative luminous intensity (%) 1 10 100 forward current i (ma) 10 10 f ta=25c luminous intensity vs. forward current 30 20 ta=25c 10 0 radiation diagram 40 60 50 90 80 0.6 70 0.2 0.1 0.5 0.3 0.4 1.0 0.8 0.9 0.7 ambient temperature ta (c) 400 550 450 500 600 2.6 0 10 25 20 40 30 50 4.2 3.4 3.0 3.8 4.5 1000 1 2 0 10 0 20 30 25 40 50 40 20 60 100 85
datasheet smd ? b 16- 213/bhc - an1p2/3t 6 copyright ? 2010, everlight all rights reserved. release date : 29 - may - 2013 . issue no: dse - 0008890 rev. 3 www.everlight.com package dimension suggested pad dimension is just for reference only. please modify the pad dimension based on individual need. note: tolerances unless mentioned 0.1mm. unit = mm
datasheet smd ? b 16- 213/bhc - an1p2/3t 7 copyright ? 2010, everlight all rights reserved. release date : 29 - may - 2013 . issue no: dse - 0008890 rev. 3 www.everlight.com label explanation ? cpn: customer ? s product number ? p/n: product number ? qty: packing quantity ? cat: luminous intensity rank ? hue: chromaticity coordinates & dom. wavelength rank ? ref: forward voltage rank ? lot no: lot number reel dimensions note: the tolerances unless mentioned is 0.1mm ,unit = mm rohs pb cpn : p n : xxxxxxxxxxxxx xxxxxxxxxxxxx qty : xxx lot no : xxxxxxxxxx reference : xxxxxxxx cat : xxx hue : xxx ref : xxx everlight made in taiwan
datasheet smd ? b 16- 213/bhc - an1p2/3t 8 copyright ? 2010, everlight all rights reserved. release date : 29 - may - 2013 . issue no: dse - 0008890 rev. 3 www.everlight.com c arrier ta pe dimensions: loaded quantity 3 000 pcs per reel note: the tolerances unless mentioned is 0.1mm ,unit = mm moisture resistant packaging label desiccant label aluminum moisture-proof bag
datasheet smd ? b 16- 213/bhc - an1p2/3t 9 copyright ? 2010, everlight all rights reserved. release date : 29 - may - 2013 . issue no: dse - 0008890 rev. 3 www.everlight.com precautions for use 1. over - current - pro of customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( burn out will happen ). 2. storage 2.1 do not open moisture proof bag before the products are ready to use. 2.2 before opening the package : t he leds should be kept at 30 or l ess and 90%rh or less. 2.3 after opening the package : t he led's floor life is 1 year under 30 or less and 6 0% rh or less. if unused leds remain, it should be stored in moisture proof packages. 2. 4 if the moisture absorb ent material (silica gel) has faded away or the leds have exceeded the storage time, baking treatment should be performed using the following conditions. baking treatment : 60 5 for 24 hours. 3. soldering condition 3.1 pb - free solder temperature profile pre-heating 150~200c 60~120sec. above 217 c 60~150sec. 260c max. 10sec. max. 6 c/sec.max. above255 c 30sec.max. 3 c/sec.max. 3.2 reflow soldering should not be done more than two times. 3.3 when soldering, do not put stress on the leds during heating. 3.4 after soldering, do not warp the circuit board. 4.soldering iron each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25w. leave two seconds and more intervals, and do soldering of each terminal. be careful because the damage of the product is ofte n started at the time of the hand solder. 5.repairing repair should not be done after the leds have been soldered. when repairing is unavoidable, a double - head soldering iron should be used (as below figure). it should be confirmed beforehand whet her the characteristics of the leds will or will not be damaged by repairing.
datasheet smd ? b 16- 213/bhc - an1p2/3t 10 copyright ? 2010, everlight all rights reserved. release date : 29 - may - 2013 . issue no: dse - 0008890 rev. 3 www.everlight.com application restrictions high reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. if you have any concerns, please contact everlight before using this product in your application. this specification guarantees the quality and performance of the product as an individual component. do not use this product beyon d the specification described in this document.
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