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page 1 bm 90 bluetooth ? 3.0 multi-speaker stereo audio module features system specification ? compliant with bluetooth specification v. 3.0 + edr in 2.4 ghz ism band module ? it supports following profiles : - hands free 1.5 - headset 1. 0 - a2dp 1.0 - avrcp 1.0 baseband hardware ? built-in 16mhz main clock input. ? built-in internal rom for program memory ? support to connect to two hosts ( phones, tabl ets) with hfp or a2dp profiles simultaneously ? adaptive frequency hopping (afh) avoids occupied rf channels ? fast connection supported rf hardware ? fully bluetooth 3.0 + edr system in 2.4 ghz ism band. ? combined tx/rx rf terminal simplifies external matching and reduces external antenna switches. ? max. +4dbm output power with 20 db level control from register control. ? built-in t/r switch for class 2/3 application ? to avoid temperature variation, temperature sensor with temperature calibration is utilized into bias current and gain control. ? fully integrated synthesizer has been created. there requires no external vco, varactor diode, resonator and loop filter. ? crystal oscillation with built-in digital trimming for temperature/process variations. ? built-in pcb antenna. audio processor ? support a-law or ? -law pcm format, or cvsd (continuous variable slope delta modulation) for sco channel operation. ? noise suppression ? echo suppression ? sbc decoding ? packet loss concealment ? build-in one languages (english) voice prompts and 20 events for each one ? support scms-t audio codec ? 16 bit dac and 16 bit adc codec ? 94 db snr dac playback ? 85 db snr adc. peripherals ? built-in lithium-ion battery charger (up to 350ma) ? integrate 3v, 1.8v configurable switching regulator and ldo ? built-in adc for battery monitor and voltage sense. ? a line-in port for external audio input ? t wo led drivers ? built-in 32kb eeprom flexible hci interface ? high speed hci-uart (universal asynchronous receiver transmitter) interface (up to 921600bps) package ? 15 x 29 mm 2 40 pins package description BM90 multi-speaker stereo audio module is a compact, highly integrated module for bluetooth v 3.0 with enhanced data rate 2.4ghz applications. this module is fully compliant with bluetooth specification and completely backward-compatible with bluetooth 2.0 or 1.2 systems. it incorporates is1690s multi-speaker stereo audio chip , 32kb eeprom , pcb antenna , and isscs own bluetooth software stack to achieve the required bt v 3.0 with edr functions. downloaded from: http:///
page 2 bm 90 module to provide the superior audio and voice quality, it also integrates a dsp co-processor, a pll, and a codec dedicated for voice and audio applications. for voice, not only basic cvsd encoding and decoding but also enhanced noise reduction and echo cancelation are implemented by the built-in dsp to reach the better quality in the both sending and receiving sides. for enhanced audio applications, sbc decoding functions can be also carried out by dsp to satisfy bluetooth a2dp requirements. in addition, to minimize the external components required for portable devices, a battery voltage sensor , battery charger, a switching regulator and ldo are integrated to reduce system bom cost for various bluetooth applications. applications ? stereo headsets ? portable speakerphones ? multi speaker. downloaded from: http:///
page 3 bm 90 module table of contents 1.0 device overview .................................................................................................................................................................. 4 2.0 k ey features table ............................................................................................................................................................ 6 3.0 p in description .................................................................................................................................................................... 7 4.0 specifications ...................................................................................................................................................................... 9 5.0 applications ...................................................................................................................................................................... 17 6.0 reference circuit ........................................................................................................................................................... 27 7.0 packing information ....................................................................................................................................................... 28 downloaded from: http:///
page 4 bm 90 module abbreviations list: hfp: hands- free profile avrcp: audio video remote control profile a2dp: advanced audio distribution profile pbap: phone book access profile hsp: headset profile spp: serial port profile nfc: near field communication scms-t :serial copy management system 1.0 device overview BM90 multi-speaker stereo audio module integrate is1690s multi-speaker stereo audio chip . figure 1-1 shows th e application block diagram. figu re 1-1: application block di agram * pmu: power management unit and all voltages generated internally. * aux in: analog line in signal. crystal eeprom pmu adap_in vdd_io bat_in i/o codec rf spkr spkl mic aux_in amp amp_en:p0_0 aux_in detection sk1 codec_vo button s bk_out mic1_p mic1_n air/ail mfb mfb fwd rev vol+ vol- play phone reset downloaded from: http:///
page 5 bm 90 module audio interface the module audio interface circuit consists of ? stereo audio codec. ? one mic. input and aux -in port ? stereo outputs. figu re 1-2: analog audio interface block diagram figu re 1-3: twin speaker link block diagram audio pa or 16/32 ohm spk mic and bias circuit aux- in spkr spkl aohpm mic1_p mic1_n air ail BM90 system main board mic_bias twin master speaker twin slave speaker proprietary protocol mic input stereo aux- in music source mobile phone downloaded from: http:///
page 6 bm 90 module 2.0 key features table spec chip BM90 application multi- spk stereo/mono stereo pin count 40 dimension (mm 2 ) 15x29 audio dac output 2-ch dac (cap-less) snr@2.8v (db) - 94 adc snr @2.8v (db) - 85 i 2 s digital interface x analog aux- in ? ? mono mic 1 support external audio amplifier ? ? buil t-in class- d audio amplifier x uart x led driver 2 internal dc - dc step-down regulator ? ? dc 5v adapter ? ? battery charger (350ma max) ? ? io for application 10 switches support 6 support nf c application ? ? voice prompt ? ? multi-tone ? ? dsp sound effect s ? ? buil t-in eeprom ? profile a2 dp 1. 0 avrcp 1. 0 h fp 1. 5 hs p 1. 0 pb ap x spp x ??? support the feature downloaded from: http:///
page 7 bm 90 module 3.0 p in description table 3- 1: BM90 pin description pin no. pin type name description 1 i/o p3_5 io, default pull-high input phone button 2 i ean embedded rom/external flash enable h: embedded; l: external flash 3 p p3_0 io , default pull-high input low: n_spk role master/slave 4 i/o p2_0 io, default pull-high input system configuration, h: application l: baseband(ibdk mode) 5 i/o p0_0 io , default pull-high input . audio amplifier enable 6 i/o p0_4 io, default pull-high input nfc 7 ao spkr r-channel analog headphone output, for cap-less and single- ended application both 8 ao aohpm headphone common mode output/sense input. cap-less application only. 9 ao spkl l-channel analog headphone output, for cap-less and single-e nded application both 10 ap vdda positive power supply/reference voltage for codec. reserve for external cap to fine tune audio frequency response. do not add external power to this pin. 11 ai mic1_p mic 1 mono differential analog positive input 12 ai mic1_n mic 1 mono differential analog negative input 13 ap mic_bias microphone biasing voltage downloaded from: http:///
page 8 bm 90 module 14 ai air stereo analog aux in, r-channel 15 ai ail stereo analog aux in, l-channel 16 i/o rst_n system reset pin 17 i/o p3_4 io , default pull-high input. slide switch 18 i/o p3_7 io , default pull-high input. fwd button 19 p vdd_io vdd_io pin, for calibration only do not add external power to this pin 20 p adap_in power adaptor dc 5v input 21 p bat_in li -ion battery input, should be always connected even if the power is given on power adaptor input. 22 i/o sk1 line-in detection 23 p gnd ground 24 p sys_pwr system power output 25 p bk_out buck feedback sense pin 26 p mfb multi-function push button key 27 p led1 led driver 1 28 p led2 led driver 2 29 i/o p2_4 io , default pull-high input. system configuration, h: boot mode low: n_spk role master/slave 30 i/o p0_2 io , default pull-high input. play/pause button 31 i/o p0_5 io , default pull-high input when system power on. after system power on, the io function is by fw programming. re v button 32 o hci_txd hci tx data 33 i hxi_rxd hci rx data 34 i/o p1_6 io , default pull-high input. volume down button 35 i/o p0_1 io , default pull-high input. volume up button 36 i/o p0_3 io for 3 rd led optional. 37 p gnd ground. 38 nc nc . 39 nc nc . 40 nc nc . * i: signal input pin *ai: analog signal input pin * o: signal output pin *ao: analog signal output pin * i/o: signal input/output pin * p: power pin *ap: analog power pin downloaded from: http:///
page 9 bm 90 module 4.0 specifications 4.1 specifications table 4-1: absolute maximum specifications symbol parameter min max unit 1v8 digital core supply voltage 0 2.1 v vcc_rf rf supply voltage 0 2.1 v sar _vdd sar adc supply voltage 0 2.1 v vdd a/vddao codec supply voltage 0 3. 3 v vdd_io i/o supply voltage 0 3. 6 v bk_vdd buck supply voltage 0 4. 3 v 3v1_ in ldo supply voltage 0 4. 3 v bat_in input voltage for battery 0 4. 3 v adp_in input voltage for adaptor 0 7.0 v t store storage temperature - 65 +1 50 oc t operation operation temperature - 20 + 70 oc table 4-2: recommended operating condition symbol parameter min typical max unit 1v8 digital core supply voltage 1. 8 1.85 1.95 v vdd_io i/o supply voltage 2. 8 3.0 3.3 v bat_in input voltage for battery 3 3.7 4.25 v adp_in input voltage for adaptor 4.5 5 5.5 v *absolute and recommended operating condition tables reflect typical usage for device. *all these supply voltage are programmable by eeprom parameters. table 4-3: battery charger parameter min typical max unit input voltage 4.5 5.0 5.5 v battery trickle charge current (bat_in < trickle charge voltage threshold) 0.1c ma maximum battery fast charge current note: enx2=0 headroom > 0.7v (adap_in=5v) 170 200 240 ma headroom = 0.3v (adap_in=4.5v) 160 180 240 ma maximum battery fast charge current note: enx2=1 headroom > 0.7v (adap_in=5v) 330 350 420 ma headroom = 0.3v (adap_in=4.5v) 180 2 20 270 ma trickle charge voltage threshold 3 v float voltage 4.158 4.2 4.242 v battery charge termination current, (% of fast charge current) 10 % note: (1) c is set in eeprom (2) headroom = v adap_in C v bat (3) enx2 is not allowed to be enabled when v adap_in C v bat > 2v (4) the li-ion battery has operation temperature limiting condition which is depended on vender.. (5) these parameters are characterized but not tested in manufacturing. downloaded from: http:///
page 10 bm 90 module table 4-4: led driver parameter min typical max unit open -drain voltage 5.1 v open -drain current 5.5 ma intensity control 16 step current step 0.35 ma power down open-drain current 1 a shutdown current 1 a *test condition: sar_vdd=1.8v, temperature=25 oc. *these parameters are characterized but not tested in manufacturing. table 4-5: digital io parameters min typ max unit input voltage 2.7 3 3.6 v v ih (input high voltage) 2.0 vdd v v il (input low voltage) 0 0.8 v input reference resistor r pu (pull -up resistor) 50k ohm r pd (pull -down resistor) 50k ohm output voltage v oh (output high voltage) 2.4 vdd v v ol (output low voltage) 0 0.4 v *these parameters are characterized but not tested in manufacturing. downloaded from: http:///
page 11 bm 90 module table 4-6: audio codec digital to analogue converter t= 25 o c, vdda/vddao=2.8v, 1khz sine wave input, bandwidth = 20~20khz parameter (condition) min. typ. max. unit over-sampling rate 128 f s resolution 16 bits output sample rate 8 48 khz signal to noise ratio note: 1 (snr @ line-load ) for 48khz 94 db signal to noise ratio (snr @earphone load 16 load, 0dbfs input relative to digital silence ) 94 db digital gain - 54 0 db analog gain - 28 3 db analog gain resolution 1 db output voltage full-scale swing (avdd=2.8v) 792 mv rms maximum output power ( 16 load) 34 mw maximum output power ( 32 load) 17 mw allowed load resistive 8 16 o.c. capacitive 500 pf thd+n ( 16 load) 0.05 % note: (1) f in =1khz, b/w=20~20khz, a- weighted, thd+n < 0.01%, 0dbfs signal, load=100k (2) these parameters are characterized but not tested in manufacturing. * o.c. : open circuit. downloaded from: http:///
page 12 bm 90 module table 4-7: audio codec analogue to digital converter t= 25 o c, vdda/vddao=2.8v, 1khz sine wave input, bandwidth = 20~20khz parameter (condition) min. typ. max. unit resolution 16 bits output sample rate 8 48 khz signal to noise ratio note: 1 (snr @mic or line-in mode) 8khz 85 db 44.1khz /48khz 85 digital gain - 54 4.85 db mic boost gain 20 analog gain 26 db input full-scale at maximum gain (differential) 4 mv rms input full-scale at minimum gain (differential) 800 mv rms 3db bandwidth 20 khz microphone mode (input impedance) 6 10 k thd+n (microphone input) @30mvrms input 0.0 4 % note: (1) f in =1khz, b/w=20~20khz, a-weighted, thd+n < 1%, 150mvpp input (2) these parameters are characterized but not tested in manufacturing. downloaded from: http:///
page 13 bm 90 module table 4-8: transmitter section for bdr parameter min typ max bluetooth specification unit maximum rf transmit power 3 4 .0 -6 to 4 dbm rf power control range 20 16 db 20db bandwidth for modulated carrier 9 00 1000 khz * test condition: vcc_rf= 1.8v, temperature=25 oc. *the rf transmit power is calibrated during production using mp tool software and mt8852 bluetooth test equipment. table 4-9: transmitter section for edr min typ max bluetooth specification unit relative transmit power - 1. 6 -4 to 1 db * test condition: vcc_rf= 1.8v, temperature=25 oc. *the rf transmit power is calibrated during production using mp tool software and mt8852 bluetooth test equipment. table 4-10: receiver section for bdr min typ max bluetooth specification unit sensitivity at 0.1% ber -90 - 70 dbm * test condition: vcc_rf= 1.8v, temperature=25 oc. table 4-11: receiver section for edr modulati on min typ max bluetooth specification unit sensitivity at 0.01% ber /4 dqpsk -91 - 70 dbm 8dpsk -83 - 70 dbm * test condition: vcc_rf= 1.8v, temperature=25 oc. downloaded from: http:///
page 14 bm 90 module 4.2 printed antenna performance table 4-12: antenna parameters parameters min typ max unit antenna gain 2 dbi efficiency 70 80 % note: the antenna gain and efficiency is measured on issc evaluation board, and will vary over pcb form factor and host pcb design. therefore, it is recommended to verify the antenna performance on final host pcb.. figu re 4-1: antenna 3d radiation pattern @2441 mhz downloaded from: http:///
page 15 bm 90 module 4. 3 bqtf information figu re 4-2: bqtf information downloaded from: http:///
page 16 bm 90 module 4. 4 current consumption table 4-13: single mode current consumption test condition: t= 25 o c, bat_in=3.8v, codec without loading normal operation min typ max unit off mode 10 ua standby mode 0.83 ma link mode 0.49 ma sco link 17.4 ma a2dp link @ 1khz tone 23 ma * for reference. table 4-14: twin mode: master current consumption test condition: t= 25 o c, bat_in=3.8v , codec without loading min typ max unit off mode 10 ua standby mode 2 ma link mode 0.63 ma sco link 18.06 ma a2dp link @ 1khz tone 27.8 ma * for reference. table 4-15: twin mode: slave current consumption test condition: t= 25 o c, bat_in=3.8v, codec without loading min typ max unit off mode 10 ua standby mode 0.75 ma link mode 0.7 ma sco link 9.4 ma a2dp link @ 1khz tone 23.2 ma * for reference. downloaded from: http:///
page 17 bm 90 module ean p2_0 rxdtxd gnd bat 5v p2_0 5v ean bat rxd txd gnd p2_4 p2_4 5. 0 applications 5.1 external configuration figure 5 - 1 shows the configuration interface on BM90. it is recommended to include a pin header on the main pcb for development . configuration modes are entered accordingly to the system configuration i/o pins as shown in table5-1 pin 2_0 , p2_4 and ean pin have internal pull- up. figure 5 - 1: external configuration header connections (here is the interface connect example of the bm 90 ) table 5-1: system configuration settings p2_0 p2_4 ean operational mode high high high normal ope ration low high high test (write eeprom) low low high write flash (firmware pr ogramming) downloaded from: http:///
page 18 bm 90 module 5.2 led driver there are two dedicate led drivers to control the leds. they provide enough sink current ( 16 step control and 0.35ma for each step ) that led can be connected directly with BM90. if the third led is necessary, use p0_3 to light up led, an external resistor to fine tune the driving current is necessary. under this configuration, the power source must be vdd_io, and the led brightness could be adjusted by r(resister). when use p0_3 to light up led, ui tool need to be modified, too. 3v1_o r led1 led2 p0_3 sys_pwr BM90 downloaded from: http:///
page 19 bm 90 module 5. 3 function of pin BM90 audio chip provides six general purpose ios for key functions. the corresponding key function s are saved in eeprom. the first button must be power key. the power on/off functions only can be set on mfb pin. there are four different operations for every button. they are short click, long click, double click and combinations. table 5-2: io s for buttons button name default functions io name button 0 power / mfb pwr button 1 volume up p0_1 button 2 volume dn p1_6 button 3 play/pause p0_2 button 4 rev p0_ 5 button 5 fwd p3_7 some signals were generated to indicate or control outside devices. the most popular applications are nfc for easy pairing, external audio amplifier for louder speaker. table 5-3: io s for added functions functions io configurable features slide switch p3_4 phone p3_5 nfc detect p0_4 external amplifier enable p0_0 3rd led p0_3 downloaded from: http:///
page 20 bm 90 module 5.4 adaptive frequency hopping (afh) fw will scan and use background noise power to determine 20 channels to stand for good channels. adaptive frequency hopping (afh) avoids occupied rf channels 5.5 multi-speaker is1690s is designed for stereo bluetooth multi speaker & speaker phone application with stereo aux in input function. 5.5.1 t win speaker link technology introduction twin speaker can be configured as double mode: both speakers output the mixed l and r channe l. stereo mode: both speakers output the separated l and r channel 5.5.1.1 twin speaker link figure 11 -1 illustrates the concept of twin speaker link technology. in order to speed up the twin speaker link establishment and optimize the audio synchronization, twin speaker link is a bluetooth proprietary a2dp link between both twin master and twin slave speakers. twin_master: ? it can be setup the standard hf, a2dp and avrcp link with host bluetooth devices like mobile phone and notebook. ? it will also take the responsibility to setup proprietary a2dp link with the other twin_slave speaker. ? once the twin speaker link is established, twin_master will redirect the a2dp media packets and control signaling to twin_slave speaker. ? notice: the voice channel (sco link) and hf operation can be executed by twin_master operating only. twin_slave: ? it can only be operated with twin_master by proprietary a2dp protocol. it cannot be connected by standard a2dp protocol. ? once the twin speaker link is established, it can feedback the specific status and event to twin_master. these status and events include button operation, low battery voltage, power off event etc. figure 5-2 a2dp twin speaker link diagram bt audio bt audio spk1 bt audio spk2 twin master twin slave proprietary protocol downloaded from: http:///
page 21 bm 90 module 5. 6 mounting details BM90 phy sical dimensions are shown in figure 5-4. figure 5-5 shows the rec om mended pcb footprint and the recommended module placement is shown in figure 5-6 . th ere should be no top copp er layer ne ar th e test pi n area sh o wn in figu re 5-6. on the main pcb, th e areas un der th e a nt enna sho ul d not contain any top, inner laye r, or bottom copper. a pcb cut-out is recommended as shown in figure 5-6. a low - im pedan ce ground pl ane will ensure the best radio perfor ma nc e (be st range, lowest noise). figu re 5-6 shows the minimum ground plane area to th e left and right of t he module for the best antenna pe rformance. the ground pl an e can be extended be yond t he mini mu m recommended as need for the main pcb em c noise red uction. for the best range perfor ma nc e, ke ep all external me t al structures away fr om the antenna by at least 15 mm. 5. 7 module dimension figure 5-3: BM90 module crystal buck inductor eeprom main chip antenna label top view bottom view rf test pad downloaded from: http:///
page 22 bm 90 module figu re 5-4: outline dimension pcb dimension: x : 15.1 mm y : 29.2 mm tolerances: 0.25 mm downloaded from: http:///
page 23 bm 90 module figu re 5-5: module foot print downloaded from: http:///
page 24 bm 90 module 16 mm 5 mm 3.5 mm the coordinates please refer to footprint add silkscreen this area keep -out area no copper no component no pcb area module antenna area rf test pad 19 mm 5. 8 main board antenna area layout guide antenna keep out area is very important. figu re 5-6: mother board antenna area layout guide downloaded from: http:///
page 25 bm 90 module for more detail free space of antenna placement design, you can reference the design rule of antenna produce vendor. downloaded from: http:///
page 26 bm 90 module 5. 9 rflow profile 5. 9.1soldering recommendations standard : ipc/jedec j-std- 020 condition : preheat 150~200 60~120 seconds average ramp-up rate (217 to peak): 3 /sec max. temperature maintained above 217 : 60~150 seconds time within 5 of peak temperature: 30 ~ 40 seconds. peak temperature 260 +5/ - 0 ramp-down rate (peak to 217 ) : 6 /sec. max. time 25 to peak temperature : 8 minutes max. cycle interval 5 minutes figu re 5-7: reflow profile * for reference. BM90 modu le was assembled using standard le ad-fr ee reflow profile ipc/jedec j \ st d \ 020. th e module can be soldered to th e main pcb using standard le a de d and lead \ free solder reflow profiles. to avoid da ma ging of th e module, th e r ecommendations a re listed as follows: ? refer to micr ochi p technology application not e an233 solder reflow recommendation (ds00233) for the soldering reflow recommendations ? refe r to the so ld er paste da ta sheet for specific reflow profile recommendations ? use no \ clean flu x solder paste ? do not wash as moisture can be trapp ed un de r th e shield ? use only one flow. if th e p cb requires multi pl e flows, apply the module on the final flow . downloaded from: http:///
6 .0 reference circuit figure 6-1: BM90 reference circuit aill mic_p1 c63 1u/10v q10 spn2302 3 2 1 c13 1u/10v r72 1k 1 2 c62 np-0603 r52k 1 2 d27 cdbu0240 2 1 r81k 1 2 r61 np-0402 r73 100k 1 2 fb6 fb-0402 1 2 r72k4 1 2 g d s q2 sts2301 1 3 2 amp_pwr mic_bias codec_vo push button gpio vs. applicatio function p3_5 mic line in silence detect 3rd led fb7 gsma201209 1 2 r/l channel index bat_in aohpr air mic_n1 mic_p1 mic_bias ail power p2_4 led2 led1 mfb aohpl sy s_pwr p3_7 rst_n ean p3_0 adap_in p0_3 p0_4 p0_0 p2_0 codec_vo p1_6 p0_1 c60 10u/16v hci_txd hci_rxd p0_2 p0_5 c9 0.1u/16v for fw/eep update p3_4 r70 6k8 1 2 c4 0.1u/10v c10 0.1u/10v c3 0.1u/10v u1apa2010a sd 1 nc 2 inp 3 inn 4 vop 5 vdd 6 gnd 7 von 8 gnd 9 r3 82k 1% 1 2 p0_0 fb2 gsma201209 1 2 r4 82k 1% 1 2 c2 np-0402 *av =3.5(10.8db)*0.1uf please use x5r/x7r grade audio_o r210k 1 2 + c5 100u/16v 1 2 + c6 100u/16v 1 2 spk_p spk_n r1 0 1 2 fb5 gsma201209 1 2 *100uf may replaced 10uf;depend on bass quality on speaker c11 np-0402 c12 np-0402 led single-ended input mode amp d11 spe0572 2 1 r14 1k 1 2 r129 100k 1 2 r52 100k 1 2 c136 10u/16v q8 sts2306 3 1 2 sw10 sw-1bit 1 2 g d s q14 sts2301 1 3 2 sw8 pt-5501g 1 2 3 4 r50 10k 1 2 vddio sy s_pwr *amp gnd should be layoutout independantly mfb bat_in 5v adapter in r29 1k 1 2 g d s q5 sts2301 1 3 2 c35 1u/10v r32 20k 1 2 d21 spe1211 2 1 d23 cdbm220-g 2 1 c47 10u/16v r36 1k 1 2 adap_in amp_pwr vbus d-d+ id gnd p4 mini-b 1 2 3 4 5 6 7 8 9 c49 10u/16v li battery jp2 sjp 1x2 2 1 3 bat_in tp21 1 p16 p04 p00 volume down volume up audio amp enable p20 p05 p24 phone play/pause fwd sk1 nfc r-ch system configuration system configuration / n_spk role / l-ch com sw13 ss008-02p-13b-y 1 2 5 6 3 4 l-ch line-in detection rew p37 3rd led / drc indication p03 p3_0 p2_4 p01 p34 n_spk role / r-ch p30 p02 p35 slide switch BM90 mic_p1 mic_n1 c70 0.047u/25v c69 0.047u/25v c71 220p/50v r37 2k 1 2 mic_bias aux_det mic1- r38 1k 1 2 c72 4.7u/10v r40 1k 1 2 c73 4.7u/10v line-in detection bk_out c77 1u/16v mic1+ c64 1u/16v r66 18k 1 2 r67 20k 1 2 r74 4k7 1 2 sk1 sk1 p3_4 r17 4k7 1 2 spk_p spk_n r71 6k8 1 2 c78 1u/16v d15 spe0572 2 1 aill vddio aux_det c74 0.1u/16v p8 tsh-3865d 4 3 2 10 1 r68 np-0603 aill airr r75 0 1 2 air r76 0 1 2 aux-in ail r77 np-0603 d20 spe0572 2 1 c75 1u/16v airr c76 1u/16v nfc fp1 fp-BM90spka6 p0_1 35 p1_6 34 hci_rxd 33 hci_txd 32 p0_5 31 p3_7 18 p0_2 30 p3_4 17 p2_4 29 led2 28 led1 27 mfb 26 gnd 37 bk_out 25 sy s_pwr 24 p3_5 1 p3_0 3 p2_0 4 p0_0 5 p0_4 6 spkr 7 spkl 9 vdda 10 mic1_p 11 mic1_n 12 mic_bias 13 air 14 ail 15 rst 16 sk1 22 adap_in 20 bat_in 21 ean 2 p0_3 36 vdd_io 19 aohpm 8 gnd 23 nc 38 nc 39 nc 40 led1 led-b 1 2 sw3 pt-6038n 1 2 c32 0.015u/16v phone blue d22 spe0572 2 1 sw9 pt-6038n 1 2 c7 220p/50v tp11 1 p3_5 c31 0.015u/16v sw7 pt-6038n 1 2 d19 spe0572 2 1 d3 spe0572 2 1 reset d13 spe0572 2 1 rst_n c28 0.015u/16v d18 spe0572 2 1 c25 0.015u/16v c29 0.015u/16v fb3 gsma201209 1 2 tp6 1 d17 spe0572 2 1 c26 0.015u/16v d14 spe0572 2 1 tp10 1 sw4 pt-6038n 1 2 ean ean c30 0.015u/16v slide switch c8 220p/50v d8 led-hr 1 2 sw1 pt-6038n 1 2 sw2 pt-6038n 1 2 tp15 1 d12 spe0572 2 1 tp9 1 tp4 1 r31 1k 1 2 fb4 gsma201209 1 2 tp7 1 c24 0.015u/16v tp13 1 d16 spe0572 2 1 sw6 pt-6038n 1 2 d2 spe0572 2 1 sw5 pt-6038n 1 2 bat_in adap_in sy s_pwr led4 led-b 1 2 blue p0_3 sy s_pwr all esd diodes in this schematics are reserved for testingand canbe removed if esd can be pass without adding it. bk_out vddio p0_5 aux_det p3_7 p0_2 tp22 1 led2 led1 red mfb/power fwd rew play/pause vol- vol+ d9spe0572 2 1 sy s_pwr p0_4 r25 1m 1 2 q7 sts2306 3 1 2 g d s q9 sts2301 1 3 2 d24 2 1 d26 cdsu400b 1 2 d25 cdsu400b 1 2 r30 120/1% 1 2 r26 270/1% 1 2 r27 np-0805 r39 1k 1 2 tp30 1 tp29 1 mfb for nxp 203f nfc type,which build-in rectifier circuit hci_rxd p2_4 p2_0 p2_0 gnd p2_4 hci_txd bat+ hci_txd adap hci_rxd audio_o d10 spe0572 2 1 board name size title rev date: sheet of p/n BM90 reference circuit 2.2 BM90 reference circuit c 1 1 friday , march 06, 2015 ???? 5f, no.5, industry e. rd.vii, hsinchu science park, hsinchu city 30077, taiwan tel. 886-3-5778385 on none on p0_1 mfb p1_6 speaker output path downloaded from: http:///
page 28 bm 90 module 7. 0 packing information 7.1 qr code label information label size:151.5 mm *61.5 mm device name: bmxxxxxxxxxx (12digits) mac id: xxxxxxxxxxxx (12 digits) date code: xxxx (4 digits) customer code no: xxxxxx (6 digits) customer part no example: BM90spka6nbb- c58096 device name customer code no. module weight (test condition: module with qr label) 0. 95g 10% 7.2 storage standard 1. calculated shelf life in sealed bag: 24 months at < 40 and <90% relative humidity (rh) 2. after bag is opened, devices that will be subjected to reflow solder or other high temperature process must be mounted within 168 hours of factory conditions <30 /60% rh downloaded from: http:///
page 29 bm 90 module 7.3 ordering information device module order number size shipment method BM90spka6nbb bluetooth 3.0 edr wireless speaker module 29*15 mm tray note: minimum order quantity is 630pcs tray. downloaded from: http:///
page 30 bm 90 module 7.4 tray dimensions downloaded from: http:///
7.5 packing method inner box: q ty (630 pcs) dimensions: 36*16*9.5 cm bar code label example p/n: part no. (device name) c/n: customer part no. (part no. - customer code no.) lot no: lot id q ty: box or carton module s q ty carton: qty ( 3780 pcs) dimensions: 38*35*30 cm downloaded from: http:///

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