1. general description the 74ahc541-q100; 74ahct541-q100 is a high-speed si-gate cmos device. the 74ahc541-q100; 74ahct541-q100 are octal non-inverting buffer/line drivers with 3-state bus compatible outputs. the output enable inputs oe 0 and oe 1, control the 3-state outputs. a high on oe n causes the outputs to assume a high-impedance off-state. this product has been qualified to the automotive electronics council (aec) standard q100 (grade 1) and is suitable for use in automotive applications. 2. features and benefits ? automotive product qualif ication in accordance with aec-q100 (grade 1) ? specified from ? 40 ? c to +85 ? c and from ? 40 ? c to +125 ? c ? balanced propagation delays ? all inputs have a schmitt-trigger action ? inputs accept voltages higher than v cc ? for 74ahc541-q100 only: operates with cmos input levels ? for 74ahct541-q100 only: operates with ttl input levels ? esd protection: ? mil-std-883, method 3015 exceeds 2000 v ? hbm jesd22-a114f exceeds 2000 v ? mm jesd22-a115-a exceeds 200 v (c = 200 pf, r = 0 ? ) ? multiple package options 74ahc541-q100; 74ahct541-q100 octal buffer/line driver; 3-state rev. 1 ? 6 june 2013 product data sheet
74ahc_ahct541_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserve d. product data sheet rev. 1 ? 6 june 2013 2 of 17 nxp semiconductors 74ahc541-q100; 74ahct541-q100 octal buffer/line driver; 3-state 3. ordering information 4. functional diagram table 1. ordering information type number package temperature range name description version 74AHC541D-Q100 ? 40 ? c to +125 ? c so20 plastic small outline package; 20 leads; body width 7.5 mm sot163-1 74ahct541d-q100 74ahc541pw-q100 ? 40 ? c to +125 ? c tssop20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 74ahct541pw-q100 74ahc541bq-q100 ? 40 ? c to +125 ? c dhvqfn20 plastic dual-in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 ? 4.5 ? 0.85 mm sot764-1 74ahct541bq-q100 fig 1. logic symbol fig 2. iec logic symbol 2 3 4 5 6 7 8 9 18 17 16 15 14 13 12 11 1 19 a 0 a 1 a 2 a 3 a 4 a 5 a 6 a 7 y 0 y 1 y 2 y 3 y 4 y 5 y 6 y 7 oe 0 oe 1 mna179 mna180 9 11 12 13 14 15 16 2 3 4 5 6 7 8 18 17 19 1 & en
74ahc_ahct541_q100 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserve d. product data sheet rev. 1 ? 6 june 2013 3 of 17 nxp semiconductors 74ahc541-q100; 74ahct541-q100 octal buffer/line driver; 3-state 5. pinning information 5.1 pinning 5.2 pin description (1) this is not a supply pin. the substrate is attached to this pad using conductive die atta ch material. there is no electrical or mechanical requi rement to solder this pad. however, if it is soldered, the solder land should remain floating or be connected to gnd. fig 3. pin configuration so20, tssop20 fig 4. pin configuration dhvqfn20 $ + & |