Part Number Hot Search : 
GI3310 EB100 1N6286CA C3346 2228M00 BCM56 ST7806R PI74A
Product Description
Full Text Search
 

To Download PS8551AL4-E3 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  r08ds0123ej0100 rev.1.00 page 1 of 18 jun 27, 2014 1. v dd 1 2. v in+ 3. v in ? 4. gnd1 5. gnd2 6. v out ? 7. v out+ 8. v dd 2 pin connection (top view) 12 4 3 65 87 shield + ? + ? preliminary data sheet ps8551al4 analog output type optical coupled isolation amplifier description the ps8551al4 is an optically coupled isol ation amplifier that uses an ic wi th a high-accuracy sigma-delta a/d converter and a gaaias light-emitting diode with high-speed response and high luminance efficiency on the input side, and an ic with a high-accuracy d/a converter on the output side. the ps8551al4 is designed specifically for high common m ode transient immunity (cmti) and high linearity (non- linearity). the ps8551al4 is designed for current and voltage sensing. features ? non-linearity (nl200 = 0.35% max.) ? high common mode transient immunity (cmti = 10 kv/ s min.) ? high isolation voltage (bv = 5 000 vr.m.s.) ? gain tolerance (g = 7.92 to 8.08 ( 1%)) gain: 8 v/v typ. ? package: 8-pin dip lead bending type (gull-wing) for long creepage distance for surface mount (l4) ? embossed tape product: PS8551AL4-E3: 1 000 pcs/reel ? pb-free product ? safety standards ? ul approved: no. e72422 ? csa approved: no. ca 101391 (ca5a, can/csa-c22.2 60065, 60950) ? semko approved (en60065, en60950) ? din en60747-5-5 (vde0884-5) approved (option) applications ? ac servo, inverter ? solar power conditioner ? measurement equipment r08ds0123ej0100 rev.1.00 jun 27, 2014
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 2 of 18 jun 27, 2014 package dimensions (unit: mm) lead bending type (gull-wing) for long creepage distance for surface mount (l4) 9.25 +0.5 ?0.25 6.5 +0.5 ?0.1 10.05 0.4 0.620.25 0.20.15 3.70.35 3.50.2 1.01 +0.4 ?0.2 2.54 0.50.15 photocoupler construction parameter unit (min.) air distance 8 mm outer creepage distance 8 mm isolation distance 0.4 mm
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 3 of 18 jun 27, 2014 marking example r 8551a nt131 no. 1 pin mark 1 31 year assembled (last 1 digit) t n rank code in-house code (t: pb-free) week assembled assembly lot type number company initial ordering information part number order number solder plating specification packing style safety standard approval application part number * 1 ps8551al4 ps8551al4-ax pb-free magazine case 50 pcs standard products ps8551al4 PS8551AL4-E3 PS8551AL4-E3-ax (ni/pd/au) embossed tape 1 000 pcs/reel (ul, csa, semko approved) ps8551al4-v ps8551al4-v-ax magazine case 50 pcs ul, csa, semko, ps8551al4-v-e3 ps8551al4-v-e3-ax embossed tape 1 000 pcs/reel din en60747-5-2 (vde0884-5) approved *1 for the application of the safety standard, following part number should be used.
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 4 of 18 jun 27, 2014 absolute maximum ratings (t a = 25 c, unless otherwise specified) parameter symbol ratings unit operating ambient temperature t a 40 to 105 c storage temperature t stg 55 to 125 c supply voltage v dd 1, v dd 2 0 to 5.5 v input voltage v in + , v in ? 2 to v dd 1 0.5 v 2 seconds transient input voltage v in + , v in ? 6 to v dd 1 0.5 v output voltage v out + , v out? 0.5 to v dd 2 0.5 v isolation voltage *1 bv 5 000 vr.m.s. *1 ac voltage for 1 minute at t a = 25 c, rh = 60% between input and output. pins 1-4 shorted together, 5-8 shorted together. recommended operating conditions parameter symbol min. max. unit operating ambient temperature t a ?40 105 c supply voltage v dd 1, v dd 2 4.5 5.5 v input voltage (accurate and linear) *1 v in + , v in ? ? 200 200 mv *1 using v in ? = 0 v (to be connected to gnd1) is recommended. avoid using v in ? of 2.5 v or more, because the internal test mode is activated when the voltage v in ? reaches more than 2.5 v.
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 5 of 18 jun 27, 2014 electrical characteristics (dc characteristics) (typ.: t a = 25 c, v in + = v in? = 0 v, v dd 1 = v dd 2 = 5 v, min., max.: refer to recommended operat ing conditions, unless otherwise specified) parameter symbol conditions min. typ. max. unit input offset voltage v os t a = 25 c ?2 ? 0.25 2 mv ?3 ? 0.25 3 input offset voltage drift vs. temperature ? dv os /dt a ? 1.6 10 v/ c gain *1 g ?200 mv v in + 200 mv, t a = 25 c 7.92 8 8.08 v/v gain drift vs. temperature ? dg/dt a ? 0.0006 v/v c v out non-linearity (200 mv) *2 nl200 ?200 mv v in + 200 mv 0.014 0.35 % v out non-linearity (200 mv) drift vs. temperature ? dnl200/dt a ? 0.0001 %/ c v out non-linearity (100 mv) *2 nl100 ?100 mv v in + 100 mv 0.011 0.2 % maximum input voltage before v out clipping ? v in + ? max. 320 mv input supply current i dd 1 v in + = 400 mv 13.5 16 ma output supply current i dd 2 v in + = ? 400 mv 7.8 16 ma input bias current i in + v in + = 0v ?1 ? 0.65 1 a input bias current drift vs. temperature ? di in + /dt a ? 0.3 na/ c low level saturated output voltage v ol v in + = ? 400 mv 1.29 v high level saturated output voltage v oh v in + = 400 mv 3.8 v output voltage (v in + = v in ? = 0 v) v ocm v in + = v in ? = 0 v 2.2 2.55 2.8 v output short-circuit current ? i osc ? 20 ma equivalent input resistance r in 450 k v out output resistance r out 4 input dc common-mode rejection ratio *3 cmrr in 76 db *1 the differential output voltage (v out+ ? v out ? ) with respect to the differential input voltage (v in+ ? v in ? ), where v in+ = ? 200 mv to 200 mv and v in ? = 0 v) is measured under the circuit shown in fig. 2 nl200, g test circuit . upon the resulting chart, the gain is defined as the slope of the optimum line obtained by using the method of least squares. *2 the differential output voltage (v out+ ? v out ? ) with respect to the differential input voltage (v in+ ? v in ? ) is measured under the circuit shown in fig. 2 nl200, g test circuit . upon the resulting chart, the optimum line is obtained by using the method of least squares. non-linearity is defined as the ratio (%) of the optimum line obtained by dividing [half of the peak to peak value of the (residual) deviation] by [full-scale differential output voltage]. for example, if the differential output vo ltage is 3.2 v, and the peak to peak val ue of the (residual) deviation is 22.4 mv, while the input v in+ is 200 mv, the output non-linearity is obtained as follows: nl200 = 22.4/(2 3 200) = 0.35% *3 cmrr in is defined as the ratio of the differential signal gain (when the differential signal is applied between the input pins) to the common-mode signal gain (when both input pins are connected and the signal is applied). this value is indicated in db.
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 6 of 18 jun 27, 2014 electrical characteristics (ac characteristics) (typ.: t a = 25 c, v in + = v in? = 0 v, v dd 1 = v dd 2 = 5 v, min., max.: refer to recommended operatin g conditions, unless otherwise specified) parameter symbol conditions min. typ. max. unit v out bandwidth ( ? 3 db) f c v in + = 200 mv p-p , sine wave 50 100 khz v out noise n out v in + = 0 v 15.6 mvr.m.s. v in to v out signal delay (50 to 10%) t pd10 v in + = 0 to 150 mv step 2.4 3.3 s v in to v out signal delay (50 to 50%) t pd50 4.2 5.6 v in to v out signal delay (50 to 90%) t pd90 6.1 9.9 v out rise time/fall time (10 to 90%) t r /t f v in + = 0 to 150 mv step 3.1 6.6 s common mode transient immunity *1 cmti v cm = 0.5 kv, t r = 20 ns, t a = 25 c 10 28 kv/ s power supply noise rejection *2 psr f = 1 mhz 40 mvr.m.s. *1 cmti is tested by applying a pulse that rises and falls suddenly (v cm = 0.5 kv) between gnd1 on the input side and gnd2 on the output side (pins 4 and 5) by using the circuit shown in fig. 9 cmti test circuit . cmti is defined at the point where the differential output voltage (v out+ ? v out ? ) fluctuates 200 mv (>1 s) or more from the average output voltage. *2 this is the value of the transient vo ltage at the differential output when 1 v p-p , 1 mhz, and 40 ns rise/fall time square wave is applied to both v dd 1 and v dd 2.
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 7 of 18 jun 27, 2014 test circuit fig. 1 v os test circuit fig. 2 nl200, g test circuit fig. 3 i dd 1 test circuit fig. 4 i dd 2 test circuit v dd1 v dd2 10 k 10 k 0.1 f shield + ? + ? 0.1 f 0.47 f 0.47 f v out +15 v ?15 v 0.1 f 0.1 f ad624cd (x100) v dd1 v in v dd2 10 k 10 k 0.1 f shield + ? + ? 0.1 f 0.47 f 0.01 f 0.47 f 0.47 f 10 k 13.2 404 +15 v ?15 v 0.1 f 0.1 f ad624cd (x4) v out +15 v ?15 v 0.1 f 0.1 f ad624cd (x10) 1 2 3 4 8 7 6 5 1 2 3 4 8 7 6 5 0.01 f shield + ? + ? 1 5 v i dd 1 400 mv 2 3 4 8 7 6 5 0.1 f 0.01 f shield + ? + ? 1 5 v ? 400 mv 2 3 4 8 7 6 5 0.1 f 0.1 f 5 v i dd 2 ? + ? + ? +
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 8 of 18 jun 27, 2014 fig. 5 i in+ test circuit fig. 6 v out test circuit v ol v ocm v oh 0.01 f shield + ? + ? 1 ? 400 mv 2 3 4 8 7 6 5 0.1 f 0.1 f 5 v 5 v 0.01 f shield + ? + ? 1 5 v i in+ 2 3 4 8 7 6 5 0.1 f v ol 0.01 f shield + ? + ? 1 2 3 4 8 7 6 5 0.1 f 0.1 f 5 v 5 v v ocm 0.01 f shield + ? + ? 1 400 mv 2 3 4 8 7 6 5 0.1 f 0.1 f 5 v 5 v v oh
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 9 of 18 jun 27, 2014 fig. 7 |i osc | test circuit fig. 8 t pd test circuit fig. 9 cmti test circuit v dd1 v in v dd2 2 k 10 k 2 k 0.1 f shield + ? + ? 0.1 f 0.01 f +15 v ?15 v 0.1 f 0.1 f ne5534 v out 1 2 3 4 8 7 6 5 i osc 0.01 f shield + ? + ? 1 2 3 4 8 7 6 5 0.1 f 0.1 f 5 v 9 v 78l05 5 v i osc 0.01 f shield + ? + ? 1 2 3 4 8 7 6 5 0.1 f 0.1 f 5 v 5 v 10 k v dd2 2 k 2 k 0.1 f 0.1 f shield + ? + ? 0.1 f pc813 v out 1 2 3 4 8 7 6 5 10 k 150 pf 10 k 150 pf in out v cm +15 v ?15 v ?+ 0.1 f 0.1 f + ? + ?
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 10 of 18 jun 27, 2014 typical characteristics (t a = 25 c, unless otherwise specified) 3.0  2.0  1.0  0.0 ?  1.0 ?  2.0 ? 3.0 4.5 4.75 5 5.25 5.5 ? 50 ? 25 0 25 50 75 100 125 ? 50 ? 25 0 25 50 75 125100 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 non-linearity nl200 (%) 2.0 1.5 1.0 0.5 0.0 ? 0.5 ? 1.0 ? 1.5 ? 2.0 8.2 8.1 8.0 7.9 7.8 8.2 8.1 8.0 7.9 7.8 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 v dd 1 = v dd 2 = 5 v v in+ = ? 200 mv to + 200 mv, v in- = 0 v v dd 1 = v dd 2 = 5 v v in+ = ? 200 mv to + 200 mv, v in- = 0 v v dd 1 = v dd 2 = 5 v v in+ = v in- = 0 v v in+ = v in- = 0 v v in+ = ? 200 mv to + 200 mv, v in- = 0 v v in+ = ? 200 mv to + 200 mv, v in- = 0 v ? 50 ? 25 0 25 50 75 125100 4.5 4.75 5 5.25 5.5 4.5 4.75 5 5.25 5.5 input offs e t volt a ge vs. ambient temperature ambient temperature t a ( c) input offset voltage v os (mv) input offset v o lt a ge vs. supply voltage supply voltage v dd 1, v dd 2 (v) input offset voltage v os (mv) gain vs. ambient temperature ambient temperature t a ( c) gain g (v/v) non-linearity vs. ambient temperature ambient temperature t a ( c) non-linearity nl200 (%) gain vs. supply voltage supply voltage v dd 1, v dd 2 (v) gain g (v/v) non-linearity vs. supply voltage supply voltage v dd 1, v dd 2 (v) remark the graphs indicate nominal characteristics.
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 11 of 18 jun 27, 2014 4 3.5 3 2.5 2 1.5 1 4.5 4.75 5 5.25 5.5 10 100 1 000 10 000 100 000 1 000 000 input voltage v in+ (v) input voltage v in (v) frequency f (hz) output voltage v o (v) supply current i dd (ma) input voltage v in+ (v) input current i in+ (a) gain g v (db) frequency f c ? 3 db (hz) supply voltage v dd 1, v dd 2 (v) ambient temperature t a ( c) frequency f c ? 3 db (hz) 16 14 12 10 8 6 4 2 0 3 2 1 0 ? 1 ? 2 ? 3 1 0 ? 1 ? 2 ? 3 ? 4 ? 5 ? 6 ? 7 ? 8 120 100 80 60 40 20 0 120 100 80 60 40 20 0 v dd 1 = v dd 2 = 5 v v in- = 0 v v dd 1 = v dd 2 = 5 v, v in- = 0 v v in+ = 200 mv p-p sine wave v dd 1 = v dd 2 = 5 v, v in- = 0 v v in+ = 200 mv p-p sine wave v dd 1 = v dd 2 = 5 v, v in- = 0 v v in+ = 200 mv p-p sine wave v dd 1 = v dd 2 = 5 v v dd 1 = v dd 2 = 5 v v out+ i dd 2 i dd 1 v out ? ? 0.4 ? 0.2 0 0.2 0.4 ? 0.4 ? 0.2 0 0.2 0.4 ? 0.4 ? 0.2 0 0.2 0.4 125 100 ? 50 ? 25 0 25 75 50 output voltage vs. input voltage supply curre n tvs.inp u t volt a ge input current vs. input voltage frequency vs. ambient temperature gain vs. frequency frequency vs. supply voltage remark the graphs indicate nominal characteristics.
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 12 of 18 jun 27, 2014 7 6 5 4 3 2 1 0 ? 50 ? 25 0 25 50 75 100 125 signal del a ytime vs. ambient temperature ambient temperature t a ( c) signal delay time pd ( s) t pd10 t f t r t pd50 t pd90 v dd 1 = v dd 2 = 5 v, v in- = 0 v v in+ = 0 to 150 mv step remark the graphs indicate nominal characteristics.
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 13 of 18 jun 27, 2014 taping specifications (unit: mm) outline and dimensions (tape) 1.550.1 2.00.1 4.00.1 1.750.1 4.65 max. 9.950.1 12.00.1 1.5 +0.1 ?0 7.50.1 10.550.1 16.00.3 4.20.1 0.30.05 outline and dimensions (reel) packing: 1 000 pcs/reel 3302.0 1001.0 2.00.5 13.00.2 r 1.0 21.00.8 2.00.5 21.51.0 17.51.0 tape direction PS8551AL4-E3
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 14 of 18 jun 27, 2014 recommended mount pad dimensions (unit: mm) d c b a part number ps8551al4 lead bending a lead bending type (gull-wing) for surface mount 9.0 b 2.54 c 1.7 d 2.0
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 15 of 18 jun 27, 2014 notes on handling 1. recommended soldering conditions (1) infrared reflow soldering ? peak reflow temperature 260 c or below (package surface temperature) ? time of peak reflow temperature 10 seconds or less ? time of temperature higher than 220 c 60 seconds or less ? time to preheat temperature from 120 to 180 c 120 30 s ? number of reflows three ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) 12030 s (preheating) 220c 180c package surface temperature t (c) time (s) recommended temperature profile of infrared reflow (heating) to 10 s to 60 s 260c max. 120c (2) wave soldering ? temperature 260 c or below (molten solder temperature) ? time 10 seconds or less ? preheating conditions 120 c or below (package surface temperature) ? number of times one (allowed to be dipped in solder including plastic mold portion.) ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (3) soldering by soldering iron ? peak temperature (lead part temperature) 350 c or below ? time (each pins) 3 seconds or less ? flux rosin flux containing small amount of chlorine (the flux with a maximum chlorine content of 0.2 wt% is recommended.) (a) soldering of leads should be made at the poi nt 1.5 to 2.0 mm from the root of the lead
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 16 of 18 jun 27, 2014 (4) cautions ? fluxes avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. 2. cautions regarding noise be aware that when voltage is applied suddenly between the photocoupler?s input and output at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. usage cautions 1. this product is weak for static electricity by designed wi th high-speed integrated circuit so protect against static electricity when handling. 2. board designing (1) by-pass capacitor of more than 0.1 f is used between v cc and gnd near device. also, ensure that the distance between the leads of the photocouple r and capacitor is no more than 10 mm. (2) keep the pattern connected the input (v in+ , v in- ) and the output (v out+ , v out- ), respectively, as short as possible. (3) do not connect any routing to the portion of t he frame exposed between the pins on the package of the photocoupler. if connected, it will affect the photocoupler's internal voltage and the photocoupler will not operate normally. (4) because the maximum frequency of the signal input to the photocoupler must be lower than the allowable frequency band, be sure to connect an anti-a liasing filter (an rc filter with r = 68 and c = 0.01 f, for example). (5) the signals output from the ps8551a include noise el ements such as chopping noise and quantization noise generated internally. therefore, be sure to restrict t he output frequency to the required bandwidth by adding a low-pass filter function (an rc filter with r =10 k and c = 150 pf, for example) to the operational amplifier (post amplifier) in the next stage to the ps8551a. (6) when the primary power supply (v dd 1) is off and only the secondary power supply (v dd 2) is being applied (v dd 1 = 0 v and v dd 2 = 5 v), v out+ outputs a low level, and v out ? outputs a high level (v out+ = 1.3 v typ., v out? = 3.8 v typ.), regardless of the input voltages (v in+ and v in ? ). (7) the output level of v out+ and v out ? might be unstable for several seconds immediately after the secondary power supply (v dd 2) is applied while the primary power supply (v dd 1) is being applied. 3. avoid storage at a high temperature and high humidity.
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 17 of 18 jun 27, 2014 specification of vde marks license document parameter symbol spec. unit climatic test class (iec 60068-1/din en 60068-1) 40/105/21 dielectric strength maximum operating isolation voltage test voltage (partial discharge test, procedure a for type test and random test) u pr = 1.5 u iorm , p d < 5 pc u iorm u pr 1 130 1 695 v peak v peak test voltage (partial discharge te st, procedure b for all devices) u pr = 1.875 u iorm , p d < 5 pc u pr 2 119 v peak highest permissible overvoltage u tr 8 000 v peak degree of pollution (din en 60664-1 vde0110 part 1) 2 comparative tracking index (iec 60112/din en 60112 (vde 0303 part 11)) cti 175 material group (din en 60664-1 vde0110 part 1) iii a storage temperature range t stg ?55 to +125 c operating temperature range t a ?40 to +105 c isolation resistance, minimum value v io = 500 v dc at t a = 25c v io = 500 v dc at t a max. at least 100c ris min. ris min. 10 12 10 11 safety maximum ratings (maximum permi ssible in case of fault, see thermal derating curve) package temperature current (input current i f , psi = 0) power (output or total power dissipation) isolation resistance v io = 500 v dc at t a = tsi tsi isi psi ris min. 175 400 700 10 9 c ma mw
ps8551al4 chapter title r08ds0123ej0100 rev.1.00 page 18 of 18 jun 27, 2014 caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. ? follow related laws and ordinances when disposi ng of the product. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subjec t to special control) up until final disposal. ? do not burn, destroy, cut, crush, or chemically dissolve the product. ? do not lick the product or in any way allow it to enter the mouth.
all trademarks and registered trademarks are t he property of their respective owners. c - 1 revision history ps8551al4 data sheet rev. date description page summary 1.00 jun 27, 2014 ? first edition issued
http://www.renesas.com refer to "http://www.renesas.com/" for the latest and detailed information. sales offices ? 2014 renesas electronics corporation. all rights reserved. colophon 4.0 12f., 234 teheran-ro, gangnam-ku, seoul, 135-920, korea tel: +82-2-558-3737, fax: +82-2-558-5141 unit 906, block b, menara amcorp, amcorp trade centre, no. 18, jln persiaran barat, 46050 petaling jaya, selangor darul ehsan, malaysia tel: +60-3-7955-9390, fax: +60-3-7955-9510 80 bendemeer road, unit #06-02 hyflux innovation centre, singapore 339949 tel: +65-6213-0200, fax: +65-6213-0300 13f, no. 363, fu shing north road, taipei 10543, taiwan tel: +886-2-8175-9600, fax: +886 2-8175-9670 unit 1601-1613, 16/f., tower 2, grand century place, 193 prince edward road west, mongkok, kowloon, hong kong tel: +852-2265-6688, fax: +852 2886-9022/9044 unit 301, tower a, central towers, 555 langao road, putuo district, shanghai, p. r. china 200333 tel: +86-21-2226-0888, fax: +86-21-2226-0999 room 1709, quantum plaza, no.27 zhichunlu haidian district, beijing 100191, p.r.china tel: +86-10-8235-1155, fax: +86-10-8235-7679 arcadiastrasse 10, 40472 d tel: +49-211-6503-0, fax: +49-211-6503-1327 sseldorf, germany dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k tel: +44-1628-585-100, fax: +44-1628-585-900 renesas electronics europe limited renesas electronics (china) co., ltd. renesas electronics (shanghai) co., ltd. renesas electronics europe gmbh renesas electronics taiwan co., ltd. renesas electronics singapore pte. ltd. renesas electronics hong kong limited renesas electronics korea co., ltd. renesas electronics malaysia sdn.bhd. 4590 patrick henry drive, santa clara, california 95054, u.s.a. tel: +1-408-919-2500, fax: +1-408-988-0279 california eastern laboratories, inc. notice 1. descriptions of circuits, software and other related information in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. renesas electronics has used reasonable care in preparing the information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information incl uded herein. 3. renesas electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electronics products or technical information described in this document. no license, express, implied or otherwise, is granted hereby under any paten ts, copyrights or other intellectual property rights of renesas electronics or others. 4. you should not alter, modify, copy, or otherwise misappropriate any renesas electronics product, whether in whole or in part . renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from such alteration, modification, copy or otherwise misappropriation of renesas electronics product. 5. renesas electronics products are classified according to the following two quality grades: "standard" and "high quality". t he recommended applications for each renesas electronics product depends on the product's quality grade, as indicated below. "standard": computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots etc. "high quality": transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti-crime systems; and safety equipment etc. renesas electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat t o human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). you mus t check the quality grade of each renesas electronics product before using it in a particular application. you may not use any renesas electronics product for any application for which it is not intended. renesas electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any renesas electronics product for which the product is not intended by renesas electronics. 6. you should use the renesas electronics products described in this document within the range specified by renesas electronics , especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. renesas e lectronics shall have no liability for malfunctions or damages arising out of the use of renesas electronics products beyond such specified ranges. 7. although renesas electronics endeavors to improve the quality and reliability of its products, semiconductor products have s pecific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. further, renesas electronics products are not subject to radiation resistance desig n. please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a renesas electronics produc t, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measu res. because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or systems manufactured by you. 8. please contact a renesas electronics sales office for details as to environmental matters such as the environmental compatib ility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, in cluding without limitation, the eu rohs directive. renesas electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 9. renesas electronics products and technology may not be used for or incorporated into any products or systems whose manufactu re, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. you should not use renesas electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. when exporting the renesas electronics products or technology described in this do cument, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. 10. it is the responsibility of the buyer or distributor of renesas electronics products, who distributes, disposes of, or othe rwise places the product with a third party, to notify such third party in advance of the contents and conditions set forth in this document, renesas electronics assumes no responsibility for any losses incurred by yo u or third parties as a result of unauthorized use of renesas electronics products. 11. this document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of renesas electronics. 12. please contact a renesas electronics sales office if you have any questions regarding the information contained in this doc ument or renesas electronics products, or if you have any other inquiries. (note 1) "renesas electronics" as used in this document means renesas electronics corporation and also includes its majority-o wned subsidiaries. (note 2) "renesas electronics product(s)" means any product developed or manufactured by or for renesas electronics.


▲Up To Search▲   

 
Price & Availability of PS8551AL4-E3

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X