? semiconductor components industries, llc, 2013 may, 2013 ? rev. 5 1 publication order number: murd330/d murd330t4g, surd8330t4g switchmode power rectifier dpak surface mount package these state ? of ? the ? art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. features ? low forward voltage drop ? low leakage ? ultra ? fast recovery time ? aec ? q101 qualified and ppap capable ? surd8 prefix for automotive and other applications requiring unique site and control change requirements ? pb ? free package* mechanical characteristics ? case: epoxy, molded ? weight: 0.4 gram (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds maximum ratings rating symbol value unit rated reverse voltage v r 300 v average rectified forward current (rated v r , t c = 170 c) i f 3.0 a non ? repetitive peak surge current i fsm 75 a operating junction and storage temperature range t j , t stg ? 55 to +175 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. dpak case 369c 4 1 ultrafast rectifier 3 a, 300 v marking diagram u330 = specific device code a = assembly location y = year ww = work week g = pb ? free package ayww u330g 3 1 device package shipping ? ordering information murd330t4g dpak (pb ? free) 2,500/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. http://onsemi.com surd8330t4g dpak (pb ? free) 2,500/tape & reel
murd330t4g, surd8330t4g http://onsemi.com 2 thermal characteristics characteristics symbol value unit thermal resistance ? junction ? to ? case r jc 2 c/w thermal resistance ? junction ? to ? ambient (note 1) r ja 49 c/w 1. rating applies when surface mounted on a 700 mm 2 , 1 oz cu heat spreader. electrical characteristics characteristics symbol value unit maximum instantaneous forward voltage drop (i f = 3 a, t j = 25 c) (i f = 3 a, t j = 150 c) v f 1.15 0.92 v maximum instantaneous reverse current (t j = 25 c, 300 v) (t j = 150 c, 300 v) i r 5 500 a maximum reverse recovery time (i f = 1 a, di/dt = 50 a/ s, v r = 30 v, t j = 25 c) t rr 50 ns esd ratings: machine model = c human body model = 3b > 400 > 8000 v typical peak reverse recovery current (i f = 1.0 a, di/dt = 50 a/ s) i rm 1.5 a typical characteristics 0.1 1.0 10.0 100.0 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 v f , instantaneous voltage (v) i f , instantaneous forward current (a) 25 c 175 c 150 c figure 1. typical forward voltage 0.1 1.0 10.0 100.0 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 v f , instantaneous voltage (v) i f , instantaneous forward current (a) 25 c 175 c 150 c figure 2. maximum forward voltage
murd330t4g, surd8330t4g http://onsemi.com 3 typical characteristics figure 3. typical reverse voltage figure 4. maximum reverse voltage 1.0e ? 10 1.0e ? 09 1.0e ? 08 1.0e ? 07 1.0e ? 06 1.0e ? 05 1.0e ? 04 1.0e ? 03 1.0e ? 02 0.0 50 100 150 200 250 300 v r , reverse voltage (v) i r , reverse current (a) 25 c 175 c 150 c 1.0e ? 10 1.0e ? 09 1.0e ? 08 1.0e ? 07 1.0e ? 06 1.0e ? 05 1.0e ? 04 1.0e ? 03 1.0e ? 02 0.0 50 100 150 200 250 300 v r , reverse voltage (v) 25 c 175 c 150 c i r , reverse current (a) v r , reverse voltage (volts) 040 20 100 figure 5. typical capacitance 60 c, capacitance (pf) 100 80 10 1.0 120 160 140 180 200 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 i o , average forward current p o , average power dissipation (w) square wave dc figure 6. power dissipation t a , ambient temperature ( c) 0 1.0 2.0 3.0 4.0 5.0 6.0 t c , case temperature ( c) 100 1.0 2.0 3.0 4.0 5.0 0 6.0 110 120 130 140 150 160 170 180 figure 7. current derating, case 0 20406080100 figure 8. current derating, ambient square wave dc 120 140 160 180 200 i f , average forward current (a) i f , average forward current (a) square wave r jc = 2 c/w t j = 175 c/w dc r jc = 2 c/w t j = 175 c/w
murd330t4g, surd8330t4g http://onsemi.com 4 package dimensions dpak (single gauge) case 369c ? 01 issue d b d e b3 l3 l4 b2 e m 0.005 (0.13) c c2 a c c z dim min max min max millimeters inches d 0.235 0.245 5.97 6.22 e 0.250 0.265 6.35 6.73 a 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.030 0.045 0.76 1.14 c 0.018 0.024 0.46 0.61 e 0.090 bsc 2.29 bsc b3 0.180 0.215 4.57 5.46 l4 ??? 0.040 ??? 1.01 l 0.055 0.070 1.40 1.78 l3 0.035 0.050 0.89 1.27 z 0.155 ??? 3.93 ??? notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inches. 3. thermal pad contour optional within di- mensions b3, l3 and z. 4. dimensions d and e do not include mold flash, protrusions, or burrs. mold flash, protrusions, or gate burrs shall not exceed 0.006 inches per side. 5. dimensions d and e are determined at the outermost extremes of the plastic body. 6. datums a and b are determined at datum plane h. 12 3 4 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 mm inches scale 3:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h 0.370 0.410 9.40 10.41 a1 0.000 0.005 0.00 0.13 l1 0.108 ref 2.74 ref l2 0.020 bsc 0.51 bsc a1 h detail a seating plane a b c l1 l h l2 gauge plane detail a rotated 90 cw on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 murd330/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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