flat panel sensor c9732dk-11 for soft x-ray imaging, cassette type with usb 2.0 interface large photodiode area: 120 120 mm www.hamamatsu.com 1 the c9732dk-11 is two-dimensional cmos image sensor module designed for x-ray imaging which requires high resolution, large area and wide dynamic range. a target material of x-ray source and x-ray energy adequate for the sensor is mo and 17 kev. the device shape is thin cassette which incorporate on-chip high-resolution scintillator and a control board. an on-board usb 2.0 interface can realize fast data transfer with the c9732dk-11. 2400 2400 pixels (50 m pitch) high resolution 14-bit digital output (usb 2.0 interface) high-speed imaging: 1 frame/s no dead area (insensitive area) due to seamless structure compatible with hamamatsu api (dcam-api) structure the c9732dk-11 is comprised of a sensor board and a control board. mounted on the sensor board is a cmos image sensor chip made up of a two-dimensional photodiode array, row-scanning vertical shift register, and 8 charge amplifier arrays. each charge amplifier ar ray has a horizontal shift register and consists of 300 ch charge amplifiers with cds circuit. csi scintillator is directly deposited on the two-dimensional photodiode array. x-rays incident on the scintillator are convert ed to fluorescence, which then enters the two-dimensional photodiode array where electric charge is accumulated in each pixel according to the ligh t intensity. the accumulated charge on each row is sequentially selected by the row-scanning vertical shift register, transferred to the amplifiers through the data line, and converted to a voltage signal. then an analog signal is sent out from each amplifier array by scanning the horizontal shift register. the control board converts the analog signal into a 14-bit digital signal, which is then output to a pc through the usb 2.0 int erface. kaccc031 vertical shift register timing pulse generator oscillator pixel number trgout a/d external power supply a.vdd, d.vdd (not attached) photodiode array with directly deposited csi scintillator buffer amp buffer amp processing amp processing amp 12 5760000 5759999 2400 2399 4800 4799 2401 bias generator usb ic trgin fifo a/d fifo video data flat panel control (usb 2.0 interface) note: signals are read out in order of pixel number. charge amp array no. 1 (with horizontal shift register, 300 ch) charge amp array no. 8 (with horizontal shift register, 300 ch) sensor board control board kaccc0310ec x-ray imaging (optimized to 17 kev) features applications
flat panel sensor c9732dk-11 2 structure absolute maximum ratings (ta=25 c) specifications (ta=25 c, a.vdd=5.0 v, d.vdd=5.0 v) parameter specification unit pixel size 50 50 m photodiode area 120 120 mm number of pixels 2400 2400 pixels number of active pixels 2368 2340 pixels readout charge amplifier array - video output usb 2.0, 14-bit - trgin, trgout ttl - scintillator direct deposition csi - parameter symbol value unit supply voltage for digital circuitry (+5 v) d.vdd +6.0 v supply v oltage f or analog circuitry (+5 v) a.vdd +6.0 v operating temperature * 1 topr 0 to +40 c storage temperature * 1 tstg -10 to +60 c incident x-ray energy - 35 kvp *1: no condensation parameter symbol min. typ. max. unit frame rate max. sf(max) 0.95 1 - frames/s fr ame r ate sf - 0.5 to sf(max) - frames/s noise (rms)* 2 n(rms) - 1250 - electrons sensitivity * 3 s 52 (5.9) 65 (7.4) - lsb/mr (lsb/ gy) resolution * 4 reso 9 10 - line pairs/mm saturation charge csat - 6.4 - m electrons dynamic range - - 5100 - - defect line * 5 - - - 16 lines adjacent defect line - - - 1 line pair blemish * 6 - - - 600 m non-uniformity of sensitivity * 6 -- - 4 % defect cluster * 6 - not allowed - bright line output adjacent to a defect line (vertical) * 6 - - - 105 % bright line output adjacent to a defect line (horizontal) * 6 - - - 120 % output offset * 7 - - 260 800 lsb * 2: internal trigger mode at sf(max) * 3: mo target 30 kv, without filter * 4: spatial frequency at ctf=5 % * 5: a defect line is a horizontal or vertical line containing 4 or more cosecutive pixels located at the opposite side of an amp lifier array or a shift register, that produce 1/8 of the average sensitivity of the surrounding pixels. * 6: see p.8, ?description of terms? * 7: average of all active pixels at sf(max) note: x-ray energy range is less than 35 kvp (17 kev mo source).
flat panel sensor c9732dk-11 3 resolution 012345678910 spatial frequency (line pairs/mm) ctf (%) 0 100 90 80 70 60 50 40 30 20 10 (ta=25 c, a.vdd=5.0 v, d.vdd=5.0 v) kaccb0154eb recommendation: 50% of frame time frame time (tvc to tvc2) txray tvc - tdelay exttrgio (ttl) x-ray kaccc0659eb (typ.) parameter value unit tdelay (delay time) 830 s tvc (cycle time min.) 1000 ms tvc2 (cycle time max.) 2000 ms note: the number of significant figures is two. (except tvc) to acquire images in external trigger mode, input an external trigger pulse as shown below. when used in synchronization with a pulsed x-ray source, x-rays should be irradiated during the txray period. external trigger mode timing chart
flat panel sensor c9732dk-11 4 to operate the c9732dk-11 at full performance, the following system and peripherals are required. o pc (recommended system requirements) pc: precision t5600 standard model (dell) os: see ?compatibility note.pdf? in ?http://www.dcamapi.com?. cpu: intel ? xenon ? processor e5-2620 (15 m cache, 2.00 ghz, 7.20 gt/s intel ? qpi) memory: 4 gb (2 gb 2) for 32-bit os 8 gb (2 gb 4) for 64-bit os ddr rdimm memory (1600 mhz, ecc) microsoft.net framework: version 2.0 and later o power source: a.vdd = +5.0 0.1 v (1100 ma), d.vdd = +5.0 0.1 v (350 ma) the voltages described above are specified at the flat panel sensor side. please use a low noise series power supply. (avoid using a switching power supply.) install a noise filter on the ac power input line to prevent surges on the ac line. always ground the ground terminal to avoid the effects of noise from peripheral devices. o dcam-api (digital camera application programming interface): produced by hamamatsu the driver software, dll are included in dcam-api. dcam-sdk which includes function manuals and sample software can be provided to oem users. the latest version of dcam-api can be downloaded from ?http://dcam-api.com? o usb cable: mini-b type o power cable (terminated with a jstj-c9-2c plug at one end and open at the other end; 2 m; see table 1.) o external trigger cable (terminated with an fgg.0b.304.clad56 plug at one end and open at the other end; 5 m; see table 2.) o earth cable (awg18; 4 m) system requirements accessories
flat panel sensor c9732dk-11 5 [table 1] pin assignment and cable color for 9-pin power receptacle pin no. color signal 1 yellow digital gnd 2 b lue digital gnd 3 gray analog gnd 4 black analog gnd 5 red analog gnd 6 green digital +5 v 7 purple digital +5 v 8 white analog +5 v 9 brown analog +5 v 9-pin receptacle: de-9pf-n made by jae (japan aviation electronics industry, limited) mating plug: jst j-c9-2c made by jst mfg. co., ltd. [table 2] pin assignment and color cable for 4-pin trigger cable pin no. color signal note 1 blue trgin twist pair 2 or ange digital gnd 3 green trgout twist pair 4 brown digital gnd 4-pin receptacle: ecg.0b.304.cll made by lemo s.a. mating plug: fgg.0b.304.clad56 made by lemo s.a. [table 3] trigger mode trigger mode trgin (see table 2) note external trigger mode rectangular signal the integration time is controlled through lemo 4-pin trigger cable. internal trigger mode high or open the integr ation time is controlled by dcam command without lemo 4-pin trigger cable. [table 4] trigger mode selection by dcam-api function: bool dcam_setpropertyvalue(hdcam h, int32 iprop, double fvalue); trigger mode iprop fvalue external trigger mode dcam_idprop_triggersource dcamprop_triggersource__external internal trigger mode dcam_idprop_triggersource dcamprop_triggersource__internal internal trigger mode (exposure time) dcam_idprop_exposuretime exposuretime(sec) note: the iprop which is not indicated in this table cannot be used.
flat panel sensor c9732dk-11 6 after installing dcam-api in a pc with a usb 2.0 port, connect the c9732dk-11 to that pc. connection video output (14-bit digital) x-ray source usb2.0 monitor pc/at (rear view) trgin trgout os + image acquisition software voltage source (a.vdd, d.vdd) c9732dk-11 power source trg i/o frame gnd usb cmos flat panel sensor c9732dk-11 kaccc0544ea
flat panel sensor c9732dk-11 7 dimensional outline (unit: mm, tolerance: 1 mm unless otherwise noted) screw hole * dimensional outline (c9732dk-11, unit: mm) active area 118.4 active area 117 1.7 14.5 12.7 25 9.5 15 10.3 20 7 9 8.1 73 266 top cover material including window is carbon fiber (1.0 mm thickness). weight: 1.2 kg * m3 screw hole for fixing usb plug to flat panel sensor. the depth of the hole: 7 mm 193 166 0.5 50 0.5 4 0.5 31 0.5 155.5 0.5 261 0.5 c1.3 (6 ) m3 depth 4 (0, 0) (2367, 2339) power source trg i/o frame gnd usb cmos flat panel sensor c9732dk-11 screw * hole 14.5 scintillator to top cover 5.0 kacca0277ea do not subject the flat panel sensors to strong vibration or shock (strong shock such as drop impacts may cause permanent dam age to these sensors). users must take responsibility for implementing x-ray shielding safety measures to avoid the risk of x-ray exposure. data listed in this datasheet is defined at the time of shipment. characteristics may vary somewhat due to exposure to x-rays so take proper countermeasures such as making periodic image correction. this product is warranted for a period of 12 months after the date of the shipment. the warranty is limited to replacement or repair of any defective product due to defects in workmanship or materials used in manufacture. the warranty does not cover loss or damag e caused by natural disaster, misuse (including modifications and any use not complying with the environment, application, usage and storage conditions described in this datasheet), or total x-ray radiation dose over 45000 r (390 gy) even within the warranty p eriod [incident x-ray energy: less than 35 kvp (17 kev mo source)]. notice
flat panel sensor c9732dk-11 8 description of terms abcdefghi j column row klmnopqrs 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 line b (column h, l) defect line (column j) line a (column i, k) kaccc0385eb kaccc0384eb this is defined as defect cluster. normal pixel defective pixel this is not defined as defect cluster. length of pixel cluster which has less than 90 % of the average sensitivity of the surrounding pixels. formed with more than 3 3 pixels which have less than 1/8 of the average sensitivity of the surrounding pixels. the relative sensitivity ratio ?a/b? should be 105 % or less for vertical lines, 120 % or less for horizontal lines, where ?a? and ?b? are defined as follows: a: average sensitivity of bright line (line a) adjacent to defect line b: average sensitivity of standard line (line b) adjacent to line a note that the average sensitivity of the bright line is calculated from the region adjacent to the defect region in the defect line. example: see the right figure defect region in defect line: from pixel (j, 1) to pixel (j, 15) a: average sensitivity from pixel (i, 1) to pixel (i, 15) or from pixel (k, 1) to pixel (k, 15) b: average sensitivity from pixel (h, 1) to pixel (h, 15) or from pixel (l, 1) to pixel (l, 15) blemish defect cluster bright line output adjacent to a defect line 20 pixels 20 pixels 20 pixels 20 pixels 146 pixels 144 pixels 144 pixels 144 pixels 140 pixels 146 pixels 146 pixels 138 pixels 1 mm active area 1 mm 1 mm 1 mm active area 16 segments 16 segments kaccc0447ea nonunifomity of sensitivity = : standard deviation of 16 16 ?xij? x : average value of 16 16 ?xij? x 16 16 segments are 16 16-divided active area excluded 1 mm from the whole edge. xij is defined as the average sensitivity of each segment. uniformity of sensitivity is calculated as following equation. nonuniformity of sensitivity
flat panel sensor c9732dk-11 cat. no. kacc1177e06 feb. 2015 dn www.hamamatsu.com hamamatsu photonics k.k., solid state division 1126-1 ichino-cho, higashi-ku, hamamatsu city, 435-8558 japan, telephone: (81) 53-434-3311, fax: (81) 53-434-5184 u.s.a.: hamamatsu corporation: 360 foothill road, bridgewater, n.j. 08807, u.s.a., telephone: (1) 908-231-0960, fax: (1) 908-23 1-1218 germany: hamamatsu photonics deutschland gmbh: arzbergerstr. 10, d-82211 herrsching am ammersee, germany, telephone: (49) 8152-375-0, fax: (49) 8152-265-8 france: hamamatsu photonics france s.a.r.l.: 19, rue du saule trapu, parc du moulin de massy, 91882 massy cedex, france, telephone: 33-(1) 69 53 71 00, fax: 33-(1) 69 53 71 10 united kingdom: hamamatsu photonics uk limited: 2 howard court, 10 tewin road, welwyn garden city, hertfordshire al7 1bw, united kingdom, telephone: (44) 1707-294888, fax: (44) 1707-325777 north europe: hamamatsu photonics norden ab: torshamnsgatan 35 16440 kista, sweden, telephone: (46) 8-509-031-00, fax: (46) 8-5 09-031-01 italy: hamamatsu photonics italia s.r.l.: strada della moia, 1 int. 6, 20020 arese (milano), italy, telephone: (39) 02-93581733 , fax: (39) 02-93581741 china: hamamatsu photonics (china) co., ltd.: b1201, jiaming center, no.27 dongsanhuan beilu, chaoyang district, beijing 100020 , china, telephone: (86) 10-6586-6006, fax: (86) 10-6586-2866 product specifications are subject to change without prior notice due to improvements or other reasons. this document has been carefully prepared and the information contained is believed to be accurate. in rare cases, however, there may be inaccuracies such as text errors. before using these products, always contact us for the delivery specification sheet to check the latest specifications. type numbers of products listed in the delivery specification sheets or supplied as samples may have a suffix "(x)" which means preliminary specifications or a suffix "(z)" which means developmental specifications. the product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that one year period. however, even if within the warranty period we accept absolutely no liability for any loss caused by natural d isasters or improper product use. copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission. information described in this material is current as of february, 2015. 9
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