this is information on a product in full production. october 2014 docid026812 rev 1 1/9 DLPF-GP-01D3 dual differential filter with integrated matching for greenpeak transceiver datasheet - production data features ? nominal input / conjugate match to greenpeak ? low loss dual-channel differential filter ? low loss dual-channel common-mode filter ? small footprint < 1.2 x 3.4 mm2 ? very low profile (< 560 m after reflow) ? high rf performance ? rf bom and area reduction applications ? 2.45 ghz impedance matched dual-differential filter ? optimized for greenpeak gp540 and gp561 circuits description the DLPF-GP-01D3 is an ultra miniature dual differential filter tailored for greenpeak zigbee/rf4ce rf transceivers. the DLPF-GP-01D3 integrates also matching network and replaces 16 smd components. matching impedance has been customized for greenpeak zigbee/rf4ce rf transceivers. it is using stmicroelectronics ipd technology on non- conductive glass substrate which optimize rf performances. figure 1. reference schematic (a) rf1p gnd1 rf1n rf2p gnd2 rf2n vcm ant1p ant1n ant2p ant2n bump view a. courtesy of greenpeak. * 3 www.st.com
absolute maximum ratings DLPF-GP-01D3 2/9 docid026812 rev 1 1 absolute maximum ratings table 1. absolute maximum ratings (limiting value) symbol parameter value unit min. typ. max. p in input power rfin 20 dbm v esd esd ratings mil std883c (hbm:c=100 pf, r=1.5 k , air discharge) 800 v esd ratings machine model (mm: c=200 pf, r=25 , l=500 nh) 550 v t op operating temperature -40 +80 oc
docid026812 rev 1 3/9 DLPF-GP-01D3 electrical characteristics 9 2 electrical characteristics table 2. impedances symbol parameter value unit min. typ. max. z out nominal differential output impedance - conjugate match to greenpeak ic - ? z in nominal differential input impedance - 100 - ? table 3. rf performance symbol parameter test condition value unit min. typ. max. t op operating temperature - -40 +80 c f frequency range (bandwidth) - 2400 2500 mhz i l insertion loss in bandwidth t j = 25 c -1.45 -1.7 db r l_ant return loss in bandwidth -16 -11 db r l_ic return loss in bandwidth -15 -10.5 db 2f0 2f0 attenuation -41 -37 db 3f0 3f0 attenuation -34 -28 db
electrical characteristics DLPF-GP-01D3 4/9 docid026812 rev 1 2.1 rf measurements (on board) figure 2. differential transmission figure 3. diff mode insertion loss (db) figure 4. diff mode - 2f0 second harmonic (db) figure 5. diff mode - 3f0 third harmonic (db) figure 6. return loss on ant side (db) figure 7. return loss on ic side (db)
docid026812 rev 1 5/9 DLPF-GP-01D3 package mechanical data 9 3 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 8. mechanical specifications (bump view) $ 1 7 3 $ 1 7 1 $ 1 7 3 $ 1 7 1 5 ) 3 * 1 ' 5 ) 1 9 & 0 5 ) 3 * 1 ' 5 ) 1 5 ) 3 * 1 ' 5 ) 1 5 ) 3 * 1 ' 5 ) 1 9 & 0 $ 1 7 3 $ 1 7 1 $ 1 7 3 $ 1 7 1 p p p p ? p
package mechanical data DLPF-GP-01D3 6/9 docid026812 rev 1 figure 9. layout recommendations no extra components required thanks to DLPF-GP-01D3. dimensions (distances) from center pad to center pad (filter gp chip) shall be respected as much as possible in order to avoid any deviation in performances. figure 10. footprint - non solder mask defined figure 11. footprint - solder mask defined copper pad diameter: 220 m recommended 180 m minimum 260 m maximum solder mask opening: 320 m recommended 300 m minimum 340 m maximum solder stencil opening: 220 m recommended line to connect copper pad on solder mask opening shopuld be smaller than copper pad diameter solder mask opening : 220 m recommended 180 m minimum 260 m maximum copper pad diameter : 320 m recommended 300 m minimum solder stencil opening : 220 m recommended
docid026812 rev 1 7/9 DLPF-GP-01D3 package mechanical data 9 figure 14. tape and reel specification note: the dimensions shown on this proposed drawing are for illustrative purpose. dimensions from actual carrier may vary slightly more information is available in the application notes an2348: ?flip chip: package description and recommendations for use?. figure 12. marking specification figure 13. footprint coordinates x z z y w w $ 1 7 3 $ 1 7 1 $ 1 7 3 $ 1 7 1 5 ) 3 * 1 ' 5 ) 1 9 & 0 5 ) 3 * 1 ' 5 ) 1 5 ) 1 * 1 ' 5 ) 3 5 ) 1 * 1 ' 5 ) 3 9 & 0 $ 1 7 1 $ 1 7 3 $ 1 7 1 $ 1 7 3
ordering information DLPF-GP-01D3 8/9 docid026812 rev 1 4 ordering information 5 revision history table 4. ordering information part number marking weight base qty delivery mode DLPF-GP-01D3 sw 4.43 mg 5000 tape and reel table 5. document revision history date revision changes 10-oct-2014 1 initial release.
docid026812 rev 1 9/9 DLPF-GP-01D3 9 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved
|
