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www.seoulsemicon.com product data sheet STW9B12G C mid - power led 1 product data sheet product brief description key applications features and benefits www.seoulsemicon.com 1 achieving the best system cost in mid/high power STW9B12G (warm) mid - power led C 3020 series ? this white colored surface - mount led comes in standard package dimension. package size : 3.0x2.0x0.6mm ? it has a substrate made up of a molded plastic reflector sitting on top of a lead frame. ? the die is attached within the reflector cavity and the cavity is encapsulated by silicone. ? the package design coupled with careful selection of component materials allow these products to perform with high reliability. ? thermally enhanced package design ? mid power (up to 0.13w) ? max. driving current 40ma ? compact package size ? high color quality with cri min. 90(r9>50 ) ? rohs compliant ? interior lighting ? general lighting ? indoor and outdoor displays ? architectural and decorative lighting part number cct color min. typ. max. STW9B12G warm white 2600k 3000k 3700k table 1. product selection table rohs
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 2 table of contents index ? product brief ? table of contents ? performance characteristics ? color bin structure ? packaging information ? product nomenclature ( labeling information ) ? recommended solder pad ? reflow soldering characteristics ? handling of silicone resin for leds ? precaution for use ? company information
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 3 performance characteristics table 2. product selection guide, i f =30ma , t a =25oc, rh30% notes : part number cct (k) [1] rank luminous intensity [2] i v ( cd ) luminous flux [3] v (lm) cri r a typ. min max min max min. STW9B12G 3500 k0 2.0 2.5 6.0 7.5 90 k5 2.5 3.0 7.5 9.0 90 l0 3.0 3.5 9.0 10.5 90 3000 k0 2.0 2.5 6.0 7.5 90 k5 2.5 3.0 7.5 9.0 90 l0 3.0 3.5 9.0 10.5 90 2700 k0 2.0 2.5 6.0 7.5 90 k5 2.5 3.0 7.5 9.0 90 l0 3.0 3.5 9.0 10.5 90 (1) correlated color temperature is derived from the cie 1931 chromaticity diagram. color coordinate : ? 0.007 (2) seoul semiconductor maintains a tolerance of ? 7% on intensity and power measurements. the luminous intensity iv was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the led package. (3) calculated performance values are for reference only.
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 4 performance characteristics parameter symbol value unit min. typ. max. forward current i f - 30 40 ma forward voltage v f (30ma) 2.9 3.3 v luminous intensity (2,600~4,200 k) i v (30ma) - 2.6 (7.8lm) - cd (lm) color rendering index [1] ra 90 - - viewing angle [2] 2 1/2 120 power dissipation p d - 132 mw junction temperature t j - - 125 oc operating temperature t opr - 40 - + 85 oc storage temperature t stg - 40 - + 100 oc thermal resistance (j to s) [3] r j - s - 28 - /w esd sensitivity(hbm) [4] - - - 5000 v table 3. characteristics, i f =30ma , t a =25oc, rh30% notes : (1) tolerance is ? 2.0 on cri measurements. (2) 2 1/2 is the off - axis where the luminous intensity is 1/2 of the peak intensity (3) thermal resistance: rth js (junction to solder ) (4) a zener diode is included to protect the product from esd. ? leds properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. ? all measurements were made under the standardized environment of seoul semiconductor.
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 5 relative spectral distribution product data sheet fig 1. color spectrum, t a = 25 , rh30% fig 2. viewing angle distribution i f =30ma i f =30ma 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.6 0.8 1.0 0 30 60 90 0.0 0.2 0.4 0.6 0.8 1.0 -90 -60 -30 0 400 500 600 700 800 0.0 0.5 1.0 relative emission intensity wavelength [nm]
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 6 forward current characteristics product data sheet fig 3. forward voltage vs. forward current , t a =25 fig 4. forward current vs. relative luminous flux, t a =25 0 10 20 30 40 0.0 0.5 1.0 1.5 relative luminous intensity forward current i f [ma] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 10 20 30 40 forward current(ma) forward voltage [v]
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 7 forward current characteristics product data sheet fig 5. forward current vs. cie x, y shift , t a =25 (2600k~3700k ) 0.464 0.465 0.466 0.467 0.418 0.420 0.422 25 70 100 125 40ma 30ma 20ma y x 10ma
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 8 product data sheet junction temperature characteristics fig 6. relative light output vs. junction temperature fig 7. junction temperature vs. relative forward voltage i f =30ma i f =30ma 30 45 60 75 90 105 120 0.0 0.2 0.4 0.6 0.8 1.0 relative forward voltage junction temperature tj ( o c ) 30 45 60 75 90 105 120 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous intensity junction temperature tj ( o c )
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 9 product data sheet junction temperature characteristics fig 8. chromaticity coordinate vs. junction temperature (2600k~3700k ) i f =30ma 0.451 0.452 0.453 0.454 0.400 0.402 0.404 0.406 0.408 0.410 0.412 25 70 100 125 50 25 100 75 125 y x
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 10 ambient temperature characteristics product data sheet fig 9. maximum forward current vs. ambient temperature -40 -20 0 20 40 60 80 100 0 10 20 30 40 forward current i f [ma] ambient temperature ta [ o c] rth j-a = 4 00 o c/w
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 11 color bin structure part number luminous intensity ( cd ) @ i f = 30ma color chromaticity coordinate @ i f = 30ma typical forward voltage (v f ) @ i f = 30ma bin code min. max. bin code min. max. STW9B12G k0 2.0 2.5 refer to page.14 y3 2.9 3.0 k5 2.5 3.0 z1 3.0 3.1 l0 3.0 3.5 z2 3.1 3.2 z3 3.2 3.3 table 4. bin code description cct cie iv rank 3200~3700 k f k0 k5 l0 2900~3200 k g k0 k5 l0 2600~2900 k h k0 k5 l0 table 5. intensity rank distribution available ranks notes : (1) all measurements were made under the standardized environment of seoul semiconductor. (2) seoul semiconductor sorts the led package according to the luminous intensity iv. (3) the lumen table is only for reference.
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 12 color bin structure fig 10. cie chromaticity diagram t a =25 , i f =30ma f g h (1) energy star binning applied to all 2600~3700k . (2) measurement uncertainty of the color coordinates : 0.007 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.36 0.38 0.40 0.42 0.44 cie coord.(x) cie coord.(y)
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 13 color bin structure f11 f21 f31 f41 cie x cie y cie x cie y cie x cie y cie x cie y 0.3996 0.4015 0.4071 0.4052 0.4146 0.4089 0.4223 0.4127 0.3969 0.3934 0.4042 0.3969 0.4114 0.4005 0.4187 0.4041 0.4042 0.3969 0.4114 0.4005 0.4187 0.4041 0.4261 0.4077 0.4071 0.4052 0.4146 0.4089 0.4223 0.4127 0.4299 0.4165 f12 f22 f32 f42 cie x cie y cie x cie y cie x cie y cie x cie y 0.3969 0.3934 0.4042 0.3969 0.4114 0.4005 0.4187 0.4041 0.3943 0.3853 0.4012 0.3886 0.4082 0.3920 0.4152 0.3955 0.4012 0.3886 0.4082 0.3920 0.4152 0.3955 0.4223 0.3990 0.4042 0.3969 0.4114 0.4005 0.4187 0.4041 0.4261 0.4077 f13 f23 f33 f43 cie x cie y cie x cie y cie x cie y cie x cie y 0.3943 0.3853 0.4012 0.3886 0.4082 0.3920 0.4152 0.3955 0.3916 0.3771 0.3983 0.3803 0.4049 0.3836 0.4117 0.3869 0.3983 0.3803 0.4049 0.3836 0.4117 0.3869 0.4185 0.3902 0.4012 0.3886 0.4082 0.3920 0.4152 0.3955 0.4223 0.3990 f14 f24 f34 f44 cie x cie y cie x cie y cie x cie y cie x cie y 0.3916 0.3771 0.3983 0.3803 0.4049 0.3836 0.4117 0.3869 0.3889 0.3690 0.3953 0.3721 0.4017 0.3751 0.4082 0.3783 0.3953 0.3721 0.4017 0.3751 0.4082 0.3783 0.4147 0.3814 0.3983 0.3803 0.4049 0.3836 0.4117 0.3869 0.4185 0.3902 < i f =30ma, t a =25 > 0.39 0.40 0.41 0.42 0.43 0.37 0.38 0.39 0.40 0.41 0.42 f44 f43 3200k 3500k 3700k f41 f31 f21 f11 cie y cie x f32 f42 f22 f12 f33 f23 f13 f34 f24 f14
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 14 color bin structure g11 g21 g31 g41 cie x cie y cie x cie y cie x cie y cie x cie y 0.4299 0.4165 0.4364 0.4188 0.4430 0.4212 0.4496 0.4236 0.4261 0.4077 0.4324 0.4099 0.4387 0.4122 0.4451 0.4145 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4514 0.4168 0.4365 0.4189 0.4430 0.4212 0.4496 0.4236 0.4562 0.4260 g12 g22 g32 g42 cie x cie y cie x cie y cie x cie y cie x cie y 0.4261 0.4077 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4223 0.3990 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4468 0.4077 0.4324 0.4100 0.4387 0.4122 0.4451 0.4145 0.4515 0.4168 g13 g23 g33 g43 cie x cie y cie x cie y cie x cie y cie x cie y 0.4223 0.3990 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4185 0.3902 0.4243 0.3922 0.4302 0.3943 0.4361 0.3964 0.4243 0.3922 0.4302 0.3943 0.4361 0.3964 0.4420 0.3985 0.4284 0.4011 0.4345 0.4033 0.4406 0.4055 0.4468 0.4077 g14 g24 g34 g44 cie x cie y cie x cie y cie x cie y cie x cie y 0.4243 0.3922 0.4302 0.3943 0.4302 0.3943 0.4361 0.3964 0.4203 0.3834 0.4259 0.3853 0.4259 0.3853 0.4316 0.3873 0.4147 0.3814 0.4203 0.3834 0.4316 0.3873 0.4373 0.3893 0.4185 0.3902 0.4243 0.3922 0.4361 0.3964 0.4420 0.3985 < i f =30ma, t a =25 > 0.41 0.42 0.43 0.44 0.45 0.46 0.38 0.39 0.40 0.41 0.42 0.43 g44 g43 2900k 3000k 3200k g41 g31 g21 g11 cie y cie x g32 g42 g22 g12 g33 g23 g13 g34 g24 g14
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 15 color bin structure h11 h21 h31 h41 cie x cie y cie x cie y cie x cie y cie x cie y 0.4562 0.4260 0.4625 0.4275 0.4687 0.4289 0.4750 0.4304 0.4515 0.4168 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4758 0.4225 0.4625 0.4275 0.4687 0.4289 0.4750 0.4304 0.4810 0.4319 h12 h22 h32 h42 cie x cie y cie x cie y cie x cie y cie x cie y 0.4515 0.4168 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4468 0.4077 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4703 0.4132 0.4575 0.4182 0.4636 0.4197 0.4697 0.4211 0.4758 0.4225 h13 h23 h33 h43 cie x cie y cie x cie y cie x cie y cie x cie y 0.4468 0.4077 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4420 0.3985 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4648 0.4038 0.4526 0.4090 0.4585 0.4104 0.4644 0.4118 0.4703 0.4132 h14 h24 h34 h44 cie x cie y cie x cie y cie x cie y cie x cie y 0.4420 0.3985 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4373 0.3893 0.4428 0.3906 0.4483 0.3919 0.4538 0.3932 0.4428 0.3906 0.4483 0.3919 0.4538 0.3932 0.4593 0.3944 0.4477 0.3998 0.4534 0.4012 0.4591 0.4025 0.4648 0.4038 < i f =30ma, t a =25 > 0.43 0.44 0.45 0.46 0.47 0.48 0.38 0.39 0.40 0.41 0.42 0.43 0.44 h44 h43 2600k 2700k 2900k h41 h31 h21 h11 cie y cie x h32 h42 h22 h12 h33 h23 h13 h34 h24 h14
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 16 mechanical dimensions notes : circuit top view package marking side view (1) all dimensions are in millimeters. (2) scale : none (3) undefined tolerance is 0.2mm bottom view
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 17 reel packaging ( tolerance : 0 . 2 , unit : mm ) (1) quantity : max 4,000pcs/reel (2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm (3) adhesion strength of cover tape adhesion strength to be 0.1 - 0.7n when the cover tape is turned off from the carrier tape at the angle of 10 ? to the carrier tape. (4) package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package.
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 18 emitter tape & reel packaging reel aluminum bag outer box
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 19 emitter tape & reel packaging part number code description part number value x 1 company s x 2 top view led series t x 3 color specification w9 cri 90 x 4 package series b b series x 5 x 6 characteristic code 12 x 7 revision g lot number code description lot number value y 1 y 2 year y 3 month y 4 y 5 day y 6 top view led series y 7 y 8 y 9 y 10 mass order y 11 y 12 y 13 y 14 y 15 y 16 y 17 internal number table 6. part numbering system : x 1 x 2 x 3 x 4 x 5 x 6 x 7 table 7. lot numbering system :y 1 y 2 y 3 y 4 y 5 y 6 y 7 y 8 y 9 y 10 C y 11 y 12 y 13 y 14 y 15 y 16 y 17
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 20 recommended solder pad notes : [recommended solder pattern] (1) all dimensions are in millimeters. (2) scale : none (3) this drawing without tolerances are for reference only (4) undefined tolerance is 0.1mm cathode anode
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 21 reflow soldering characteristics table 8. caution ipc/jedec j - std - 020 profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate ( t smax to t p ) 3 c/second max. 3 c/second max. preheat - temperature min ( t smin ) - temperature max ( t smax ) - time ( t smin to t smax ) ( t s ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 180 seconds time maintained above: - temperature (t l ) - time ( t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak temperature ( t p ) 215 260 time within 5 c of actual peak temperature ( t p )2 10 - 30 seconds 20 - 40 seconds ramp - down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. (1) reflow soldering is recommended not to be done more than two times. in the case of more than 24 hours passed soldering after first, leds will be damaged. (2) repairs should not be done after the leds have been soldered. when repair is unavoidable, suitable tools must be used. (3) die slug is to be soldered. (4) when soldering, do not put stress on the leds during heating. (5) after soldering, do not warp the circuit board.
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 22 handling of silicone resin for leds (1) during processing, mechanical stress on the surface should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. (2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surface can also become scratched. (3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. (4) silicone differs from materials conventionally used for the manufacturing of leds. these conditions must be considered during the handling of such devices. compared to standard encapsulants , silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) ssc suggests using isopropyl alcohol for cleaning. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. (6) please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space.
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 23 precaution for use (1) storage to avoid the moisture penetration, we recommend store in a dry box with a desiccant . the recommended storage temperature range is 5 to 30 and a maximum humidity of rh50%. (2) use precaution after opening the packaging use proper smt techniques when the led is to be soldered dipped as separation of the lens may affect the light output efficiency. pay attention to the following: a. recommend conditions after opening the package - sealing - temperature : 5 ~ 40 humidity : less than rh30% b. if the package has been opened more than 4 week(msl_2a) or the color of the desiccant changes, components should be dried for 10 - 12hr at 60 5 (3) do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) do not rapidly cool device after soldering. (5) components should not be mounted on warped (non coplanar) portion of pcb. (6) radioactive exposure is not considered for the products listed here in. (7) gallium arsenide is used in some of the products listed in this publication. these products are dangerous if they are burned or shredded in the process of disposal. it is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) this device should not be used in any type of fluid such as water, oil, organic solvent and etc. when washing is required, ipa (isopropyl alcohol) should be used. (9) when the leds are in operation the maximum current should be decided after measuring the package temperature. (10) leds must be stored properly to maintain the device. if the leds are stored for 3 months or more after being shipped from ssc, a sealed container with a nitrogen atmosphere should be used for storage. (11) the appearance and specifications of the product may be modified for improvement without notice. (12) long time exposure of sunlight or occasional uv exposure will cause lens discoloration. (13) vocs (volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of leds and discolor when exposed to heat and photonic energy. the result can be a significant loss of light output from the fixture. knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) attaching leds, do not use adhesives that outgas organic vapor. (15) the driving circuit must be designed to allow forward voltage only when it is on or off. if the reverse voltage is applied to led, migration can be generated resulting in led damage.
www.seoulsemicon.com product data sheet STW9B12G C mid - power led 24 company information published by seoul semiconductor ? 2013 all rights reserved. company information seoul semiconductor (www.seoulsemicon.com) manufacturers and packages a wide selection of light emitting diodes (leds) for the automotive, general illumination/lighting, home appliance, signage and back lighting markets. the company is the worlds fifth largest led supplier, holding more than 10,000 patents globally, while offering a wide range of led technology and production capacity in areas such as npola , "acrich", the worlds first commercially produced ac led, and "acrich mjt - multi - junction technology" a proprietary family of high - voltage leds. the companys broad product portfolio includes a wide array of package and device choices such as acrich and acirch2, high - brightness leds, mid - power leds, side - view leds, and through - hole type leds as well as custom modules, displays, and sensors. legal disclaimer information in this document is provided in connection with seoul semiconductor products. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, seoul semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non - infringement of intellectual property rights of any third party. the appearance and specifications of the product can be changed to improve the quality and/or performance without notice.

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