v2 masw-006102-13610 hmic? silicon pin diode switch with integrated bias network ? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macom.com for additi onal data sheets and pr oduct information. ma-com technical soluti ons and its affiliates reserve th e right to make changes to the product(s) or information cont ained herein wi thout notice. 1 advanced: data sheets contain information regarding a product ma-com technical solutions is considering for development. performance is based on target specifications, simulated results, and/ or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product ma-com technical solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. parameter absolute maximum operating temperature -65 o c to +125 o c storage temperature -65 o c to +150 o c junction temperature +175 o c applied reverse voltage 50v rf incident power +33dbm c.w. 1 bias current +25c 20ma note: 1. maximum operating conditions for a combination of rf power, d.c. bias and operating temperature: +33dbm cw @ 15ma (per diode) @+85c features ? broad bandwidth 2 to 18 ghz ? usable up to 26 ghz ? integrated bias network ? low insertion loss / high isolation ? rugged, glass encapsulated construction ? fully monolithic ? rohs compliant description the masw-006102-13610 is a sp6t broadband switch with integrated bias network utilizing m/a-com technology solutions hmic tm (heterolithic microwave integrated circuit) process, us patent 5,268,310. this wafer fabrication process allows the incorporation of silicon pedestals that form series and shunt diodes and vias by imbedding them in low loss, low dispersion glass. by using small spacing between elements, plus the combination of silicon and glass gives this hmic device low loss and high isolation performance with exceptional repeatability through low millimeter frequencies. large bond pads facilitate the use of low inductance ribbons or 1 mil wire while full backside gold metallization a llows for die attachment using 80/20 - au/sn, 62/36/ 2 - sn/pb/ag solders or electrically conductive silver epoxy. yellow areas denote wire bond pads applications the masw-006102-13160 is a high performance switch which is suitable for use in multi-band ecm, radar, and instrumentation c ontrol circuits where high isolation to insertion loss ratios are required. with a standard +5v/-5v, ttl controlled pin diode driver, 80ns switching speeds can be achieved.
v2 masw-006102-13610 hmic? silicon pin diode switch with integrated bias network ? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macom.com for additi onal data sheets and pr oduct information. ma-com technical soluti ons and its affiliates reserve th e right to make changes to the product(s) or information cont ained herein wi thout notice. 2 advanced: data sheets contain information regarding a product ma-com technical solutions is considering for development. performance is based on target specifications, simulated results, and/ or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product ma-com technical solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. masw-006102-13610 ( sp6t ) electrical specifications @ t amb = +25 o c, 10ma bias current 1.typical switching speed measured from 10% to 90% of detect ed rf signal driven by ttl compatible drivers using rc output spiking network, r = 50 ? 200 ? , c = 390 ? 560pf. note: operation of the masw-006102-13610 operation of the masw series of pin switches is achi eved by the simultaneous application of negative dc current to the low loss port and positive dc current to the remaining isolated switching ports per the driver connections table below. the control currents should be su pplied by constant current sources. for insertion loss, -10ma bias results in approximately ?2v, and for isol ation ,+10ma yields approximately +0.9v at the respective bias nodes. the backside area of the die is the rf and dc return ground plane. driver connections parameter frequency band min typ max units insertion loss 6 ghz 1.0 1.4 db 12 ghz 1.3 2.0 db 18 ghz 1.9 2.9 db isolation 6 ghz 43 49 db 12 ghz 35 43 db 18 ghz 30 39 db input return loss 6 ghz 18 db 12 ghz 20 db 18 ghz 16 db output return loss 6 ghz 19 db 12 ghz 22 db 18 ghz 20 db switching speed 10 ghz 80 ns control level ( dc current ) condition of rf output b2 b3 b4 b5 b6 b7 j2-j1 j3-j1 j4-j1 j5-j1 j6-j1 j7-j1 -10ma +10ma +10ma +10ma +10ma +10ma low loss isolation isolation isolation isolation isolation +10ma -10ma +10ma +10ma +10ma +10ma isolation low loss isolation isolation isolation isolation +10ma +10ma -10ma +10ma +10ma +10ma isolation isolation low loss isolation isolation isolation +10ma +10ma +10ma -10ma +10ma +10ma isolation isolation isolation low loss isolation isolation +10ma +10ma +10ma +10ma -10ma +10ma isolation isolation isolation isolation low loss isolation +10ma +10ma +10ma +10ma +10ma -10ma isolation isolation isolation isolation isolation low loss
v2 masw-006102-13610 hmic? silicon pin diode switch with integrated bias network ? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macom.com for additi onal data sheets and pr oduct information. ma-com technical soluti ons and its affiliates reserve th e right to make changes to the product(s) or information cont ained herein wi thout notice. 3 advanced: data sheets contain information regarding a product ma-com technical solutions is considering for development. performance is based on target specifications, simulated results, and/ or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product ma-com technical solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. masw-006102-13610 typical insertion loss -5.00 -4.00 -3.00 -2.00 -1.00 0.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 frequency ( ghz ) il ( db ) j2 j3 j4 j5 j6 j7 masw-006102-13610 typical isolation -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 frequency ( ghz ) iso ( db ) j2 j3 j4 j5 j6 j7
v2 masw-006102-13610 hmic? silicon pin diode switch with integrated bias network ? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macom.com for additi onal data sheets and pr oduct information. ma-com technical soluti ons and its affiliates reserve th e right to make changes to the product(s) or information cont ained herein wi thout notice. 4 advanced: data sheets contain information regarding a product ma-com technical solutions is considering for development. performance is based on target specifications, simulated results, and/ or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product ma-com technical solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. masw-0006102-13610 typical input return loss -30.00 -25.00 -20.00 -15.00 -10.00 -5.00 0.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 frequency ( ghz ) irl ( db ) j2 j3 j4 j5 j6 j7 masw006102-13610 typical output return loss -30.00 -25.00 -20.00 -15.00 -10.00 -5.00 0.00 2.00 4.00 6.00 8.00 10.00 12.00 14.00 16.00 18.00 frequency ( ghz ) orl ( db ) j2 j3 j4 j5 j6 j7
v2 masw-006102-13610 hmic? silicon pin diode switch with integrated bias network ? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macom.com for additi onal data sheets and pr oduct information. ma-com technical soluti ons and its affiliates reserve th e right to make changes to the product(s) or information cont ained herein wi thout notice. 5 advanced: data sheets contain information regarding a product ma-com technical solutions is considering for development. performance is based on target specifications, simulated results, and/ or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product ma-com technical solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. masw-006102-13610 schematic dc bias j1 ( input common port ) j2 j3 j5 j7 j4 j6
v2 masw-006102-13610 hmic? silicon pin diode switch with integrated bias network ? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macom.com for additi onal data sheets and pr oduct information. ma-com technical soluti ons and its affiliates reserve th e right to make changes to the product(s) or information cont ained herein wi thout notice. 6 advanced: data sheets contain information regarding a product ma-com technical solutions is considering for development. performance is based on target specifications, simulated results, and/ or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product ma-com technical solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. masw-006102-13610 chip outline drawing 1,2 notes: 1. topside and backside metallization is gold , 2.5mm thick typical. 2. yellow areas indicate wire bonding pads dim inches millimeters min max min max a .1325 .1335 3.3655 3.3909 b .1225 .1235 3.1115 3.1369 c .0595 .0605 1.5113 1.5367 d .0345 .0355 0.8763 0.9017 e .0245 .0255 0.6223 0.6477 f .0115 .0125 0.2921 0.3175 g .0305 .0315 0.7747 0.8001 h .0275 .0285 0.6985 0.7239 i .0395 .0405 1.0033 1.0287 j .0295 .0305 0.7493 0.7747 rf bond pads (j1-j7) .016 x . 005 ref. 0.4064 x 0.127 ref. dc bond pads (b2-b5) .005 x .005 ref. .127 x .127 ref. thickness 0.005 ref. 0.127 ref.
v2 masw-006102-13610 hmic? silicon pin diode switch with integrated bias network ? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macom.com for additi onal data sheets and pr oduct information. ma-com technical soluti ons and its affiliates reserve th e right to make changes to the product(s) or information cont ained herein wi thout notice. 7 advanced: data sheets contain information regarding a product ma-com technical solutions is considering for development. performance is based on target specifications, simulated results, and/ or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product ma-com technical solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. cleanliness these chips should be handled in a clean environment. wire bonding thermosonic wedge wire bonding using 0.00025? x 0.003? ribbon or 0. 001? diameter gold wire is recommended. a heat stage temperature of 150 o c and a force of 18 to 22 grams should be used. ultrasonic energy should be adjusted to the minimum required to achieve a good bond. rf bond wires should be kept as short and straight as possible. mounting the hmic switches have ti-pt-au back metal. they c an be die mounted with a gold-tin eutectic solder preform or conductive epoxy. mounting surface must be clean and flat. eutectic die attachment an 80/20, gold-tin, eutectic solder preform is recommended with a work surface temperature of 255 o c and a tool tip temperature of 265 o c. when hot gas is applied, the tool tip temperature should be 290 o c. the chip should not be exposed to temperatures greater than 320 o c for more than 20 seconds. no more than three seconds should be required for attachment. solders containing tin should not be used. epoxy die attachment a minimum amount of epoxy should be used. a thin epoxy fillet should be visible around the perimeter of the chip after placement. cure epoxy per manufacturer?s schedule. (typically 125-150 o c). wire/ribbon and die at tachment recommendations part number package masw-006102-13610w waffle pack ordering information
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