1 / 5 www.asb.co.kr february 2009 p lerow tm apm0882 - p29 high oip3 medium power ampl i fier module parameter unit specifications min typ max frequency range mhz 869 894 gain db 31 32 gain flatness db ? 0.3 ? 0.5 noise figure db 6.6 7.0 output ip3 (1) dbm 44 47 s11 / s22 (2) db - 15 / - 9 output p1db dbm 28 29 switching time (3) ? sec - supply current ma 370 400 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured wi th two tones at an output power of 12 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 2 rf in 5 rf out 6 v s other s ground feature s c o u pl er note: 1. the number and si ze of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left s ide. description c o u pl er c o u pl er c o u pl er c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 1 - stage single type s 21 = 32.3 db @ 869 mhz = 31.7 db @ 894 mhz nf of 6.6 db over fr e quency unconditionally stab le single 5v supply high oip3 @ low current typ. @ t = 25 ? c, v s = 5 v, freq. = 882 mhz, z o.sys = 50 ohm specifications (in pr o duction) ou t line drawing (unit: mm) apm0882 - p29 asb inc. (top view) solder stencil area ? 0.3 plated thru holes to ground plane (side view) 2 x ? 2.0 plated thru holes to screw on heat sinker (recommended footprint) (bottom view) plerow the plerow tm apm - series is an internally matched amplifier mini - module for such application band in smd pac k age with the output p1db of 29 dbm. it is compactly designed for low current consum p tion and high oip3. integrating all the components for biasing and matching within the module e n hances production yield and throughput as well. it passes through the stringent dc, rf, and reliability tests. not sa m ple test but 100% quality control test is made before pac k ing.
2 / 5 www.asb.co.kr february 2009 p lerow tm apm0882 - p29 high oip3 medium power ampl i fier module s - param e ters oip3 p1db tx 869~894 mhz +5 v stability fa c tor (k) typical performance (measured) noise figure
3 / 5 www.asb.co.kr february 2009 p lerow tm apm0882 - p29 high oip3 medium power ampl i fier module output channel power (@ aclr= - 45dbc, +/ - 5mhz of f set) ** test source : agilent e4433b (3gpp w - cdma test model - 1 64dpch) oip3 vs output power (@ 1mhz offset, 1 - tone p ower) aclr vs channe l power
4 / 5 www.asb.co.kr february 2009 p lerow tm apm0882 - p29 high oip3 medium power ampl i fier module 1) the tantal or mlc (multi laye r ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly t o the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are in clu d- ed inside the apm module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflow process 2 0~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) + - apm out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor in out vs evaluation board layout size 40x40mm (for apm series C 10x10mm)
5 / 5 www.asb.co.kr february 2009 p lerow tm apm0882 - p29 high oip3 medium power ampl i fier module channel power vs. aclr test configuration apm0882 C p29 evaluation board attached with heat sink evaluation board * in order to prevent damage of d.u.t (apm - series) fro m heating, you must to use a properly sized heat sink for testing a module.
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