aos semiconductor product reliability report AO4455 , rev a plastic encapsulated device alpha & omega semiconductor, inc www.aosmd.com
this aos product reliability report summarizes the qualification result for AO4455 . accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. review of final electrical test result confirms that AO4455 passes aos quality and reliability requirements. the released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. table of contents: i. product description ii. packa ge and die information iii. environmental stress test summary and result iv. reliability evaluation i. product description: the AO4455 uses advanced trench technology to provide excellent r ds(on) , and ultra - low low gate charge with a 25v gate rating. this device is suitable for use as a load switch or in pwm applications. - rohs compliant - halogen free detailed information refers to datasheet. ii. die / package information: AO4455 process standard sub - micron 30 v p - channel mosfet package type so8 lead frame c u die attach ag epoxy bonding cu wire mold material epoxy resin with silica filler msl (moisture sensitive level) level 1 based on j - std - 020 note * based on info rmation provided by assembler and mold compound supplier
iii. result of reliability stress for AO4455 test item test condition time point lot attribution total sample size number of failures standard msl precondition 168hr 85 c /85 %rh +3 cycle reflow@260c - 33 lots 5489 pcs 0 j esd22 - a113 htgb temp = 150 ? c , vgs=100% of vgsmax 168 hrs 500 hrs 1000 hrs 6 lot 3 lot (note a*) 693 pcs 77pcs / lot 0 jesd22 - a 108 htrb temp = 150 ? c , vds=80% of vdsmax 168 hrs 500 hrs 1000 hrs 6 lot 3 lot (note a*) 693 pcs 77pcs / lot 0 jesd22 - a108 hast 130 ? c , 85% rh , 33.3 psi, vgs = 10 0% of vgs max 96 hrs 2 0 lots (note a*) 1100 pcs 5 5 pcs / lot 0 jesd22 - a110 pressure pot 121 ? c , 29.7psi , rh=100% 96 hrs 24 lots (note a*) 1848 pcs 77 pcs / lot 0 jesd22 - a102 temperature cycle - 65 ? c to 150 ? c , air to air 250 / 500 cycles 33 lots (note a*) 2541 pcs 77 pcs / lot 0 jesd22 - a104 note a: the reliability data presents total of available generic data up to the published date. iv. reliability evaluation fit rate (per billion): 3.82 mt t f = 29919 years the presentation of fit rate for the individual product reliability is restricted by the actual burn - in sample size of the selected product ( AO4455 ). failure rate determination is based on jedec standard jesd 85. fit means one failure per billion hours. failure rate = chi 2 x 10 9 / [ 2 (n) (h) (af) ] = 1.83 x 10 9 / [ 2 x ( 12 x77x500 +6 x77x1000 ) x 25 9 ] = 3.82 mt t f = 10 9 / fit = 2.62 x 10 8 hrs = 29919 years chi2 = chi squared distribution, determined by the number of failures and confidence interval n = total number of units from htrb and htgb tests h = duration of htrb/htgb testing af = acceleration factor from test to use conditions (ea = 0.7ev and tuse = 55 c ) acceleration factor [af ] = exp [ea / k ( 1/tj u C 1/tj s )] acceleration factor ratio list: 55 deg c 70 deg c 85 deg c 100 deg c 115 deg c 130 deg c 150 deg c af 25 9 87 32 13 5.64 2.59 1 tj s = stressed junction temperature in degree (kelvin), k = c+273.16 tj u = the use junction temperature in degree (kelvin), k = c+273.16 k = boltz m an n s constant, 8.617164 x 10 - 5 e v / k
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