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1. product profile 1.1 general description intermediate level n-channel and p-channel complementary pair enhancement mode field-effect transistor (fet) in a plastic package using vertical d-mos technology. this product is designed and qualified for use in computing, communications, consumer and industrial applications only. 1.2 features and benefits ? low conduction losses due to low on-state resistance ? suitable for high frequency applications due to fast switching characteristics 1.3 applications ? motor and actuator drivers ? power management ? synchronized rectification 1.4 quick reference data PHC21025 complementary intermediate level fet rev. 04 ? 17 march 2011 product data sheet so8 table 1. quick reference data symbol parameter conditions min typ max unit v ds drain-source voltage t j 25 c; t j 150 c; n-channel --30v t j 25 c; t j 150 c; p-channel ---30v i d drain current t sp 80 c; p-channel - - -2.3 a t sp 80 c; n-channel - - 3.5 a p tot total power dissipation t amb =25c [1] --1w static characteristics r dson drain-source on-state resistance v gs =-10v; i d =-1a; t j = 25 c; p-channel; see figure 16 ; see figure 19 - 0.22 0.25 ? v gs =10v; i d =2.2a; t j = 25 c; n-channel; see figure 15 ; see figure 18 - 0.08 0.1 ?
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 2 of 16 nxp semiconductors PHC21025 complementary intermediate level fet [1] maximum permissible dissipati on per mos transistor. device moun ted on printed-circuit board with a thermal resistance from ambient to solder point of 90 k/w. 2. pinning information 3. ordering information dynamic characteristics q gd gate-drain charge v gs =-10v; i d =-2.3a; v ds =-15v; t j =25c; p-channel; see figure 12 -3-nc v gs =10v; i d =2.3a; v ds =15v; t j =25c; n-channel; see figure 11 -2.5-nc table 1. quick reference data ?continued symbol parameter conditions min typ max unit table 2. pinning information pin symbol description simplified outline graphic symbol 1s1source1 sot96-1 (so8) 2 g1 gate1 3s2source2 4 g2 gate2 5d2drain2 6d2drain2 7d1drain1 8d1drain1 4 5 1 8 sym114 d1 d1 d2 d2 s1 g1 s2 g2 table 3. ordering information type number package name description version PHC21025 so8 plastic small outline package; 8 leads; body width 3.9 mm sot96-1
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 3 of 16 nxp semiconductors PHC21025 complementary intermediate level fet 4. limiting values [1] pulse width and duty cycle limite d by maximum junction temperature. [2] maximum permissible dissi pation per mos transistor. device mounted on printe d-circuit board with a thermal resistance from a mbient to solder point of 90 k/w. [3] maximum permissible dissipation per mos transistor. both devices may be loaded up to 2 w at the same time. [4] maximum permissible dissipation if onl y one mos transistor dissipates. device m ounted on printed-circuit board with thermal resistance from ambient to solder point of 90 k/w. [5] maximum permissible dissipation per mo s transistor. device mounted on printed-circuit board with a thermal resistance from a mbient to solder point of 27.5 k/w. [6] pulse width and duty cycle limite d by maximum junction temperature. table 4. limiting values in accordance with the absolute maxi mum rating system (iec 60134). symbol parameter conditions min max unit v ds drain-source voltage t j 25 c; t j 150 c; n-channel - 30 v t j 25 c; t j 150 c; p-channel - -30 v v gs gate-source voltage - - v v gso gate-source voltage open drain -20 20 v i d drain current t sp 80 c; p-channel - -2.3 a t sp 80 c; n-channel - 3.5 a i dm peak drain current t sp = 25 c; pulsed; n-channel; see figure 2 [1] -14a t sp = 25 c; pulsed; p-channel; see figure 3 [1] --10a p tot total power dissipation t amb =25c [2] -1w t sp =80c; see figure 1 [3] -2w t amb =25c [4] -1.3w [5] -2w t stg storage temperature -65 150 c t j junction temperature - 150 c source-drain diode i s source current t sp 80 c; p-channel - -1.25 a t sp 80 c; n-channel - 1.5 a i sm peak source current t sp = 25 c; pulsed; p-channel [6] --5a t sp = 25 c; pulsed; n-channel [6] -6a
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 4 of 16 nxp semiconductors PHC21025 complementary intermediate level fet = 0.01. t s = 80 c. (1) r dson limitation. fig 1. power derating curve fig 2. soar; n-channel = 0.01 t s = 80 c. (1) r dson limitation. fig 3. soar; p-channel 0 200 2.5 0 0.5 1.0 1.5 2.0 mlb836 t s ( c) 50 100 150 p tot (w) mlb833 10 2 10 110 v ds (v) i d (a) 1 10 ? 1 10 ? 1 10 2 10 ? 2 0.1 s 1 ms dc (1) t p = 10 s t p t p t p t t = mbe155 ? 10 2 ? 10 ? 1 ? 10 ? 1 ? 10 2 ? 1 ? 10 ? 10 ? 2 ? 10 ? 1 v ds (v) i d (a) 0.1 s 1 ms dc (1) t p = 10 s t p t p t p t t =
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 5 of 16 nxp semiconductors PHC21025 complementary intermediate level fet 5. thermal characteristics table 5. thermal characteristics symbol parameter conditions min typ max unit r th(j-sp) thermal resistance from junction to solder point --35k/w fig 4. transient thermal impedance from junction to solder point as a function of pulse duration mbe152 t p (s) 10 ? 6 10 ? 1 1 10 ? 2 10 ? 3 10 ? 5 10 ? 4 10 1 10 2 r th j-s (k/w) 10 ? 1 0.5 0.1 0 0.05 0.33 0.01 0.02 0.2 = 0.75 t p t p t p t t =
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 6 of 16 nxp semiconductors PHC21025 complementary intermediate level fet 6. characteristics table 6. characteristics symbol parameter conditions min typ max unit static characteristics v (br)dss drain-source breakdown voltage i d =-10a; v gs =0v; t j =25c; p-channel -30--v i d =10a; v gs =0v; t j =25c; n-channel 30--v v gs(th) gate-source threshold voltage i d =-1ma; v ds =v gs ; t j =25c; p-channel; see figure 17 -1 - -2.8 v i d =1ma; v ds =v gs ; t j =25c; n-channel; see figure 17 1- 2.8v i dss drain leakage current v ds =-24v; v gs =0v; t j =25c; p-channel - - -100 na v ds =24v; v gs =0v; t j =25c; n-channel - - 100 na i gss gate leakage current v gs =20v; v ds =0v; t j =25c; n-channel - - 100 na v gs =20v; v ds =0v; t j =25c; p-channel - - 100 na v gs =-20v; v ds =0v; t j =25c; p-channel - - 100 na v gs =-20v; v ds =0v; t j =25c; n-channel - - 100 na r dson drain-source on-state resistance v gs =-10v; i d =-1a; t j =25c; p-channel; see figure 16 ; see figure 19 - 0.22 0.25 ? v gs =10v; i d = 2.2 a; t j =25c; n-channel; see figure 15 ; see figure 18 - 0.08 0.1 ? v gs =-4.5v; i d =-0.5a; t j =25c; p-channel; see figure 16 ; see figure 19 - 0.33 0.4 ? v gs =4.5v; i d = 1 a; n-channel; see figure 15 ; see figure 18 - 0.11 0.2 ? i dson on-state drain current v ds =5v; v gs = 4.5 v; n-channel 2 - - a v ds =-5v; v gs = -4.5 v; p-channel -1 - - a v ds =-1v; v gs = -10 v; p-channel -2.3 - - a v ds =1v; v gs = 10 v; n-channel 3.5 - - a dynamic characteristics q g(tot) total gate charge i d = 2.3 a; v ds =15v; v gs =10v; t j = 25 c; n-channel; see figure 11 - 1030nc i d =-2.3a; v ds =-15v; v gs =-10v; t j = 25 c; p-channel; see figure 12 - 1025nc
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 7 of 16 nxp semiconductors PHC21025 complementary intermediate level fet q gs gate-source charge i d = 2.3 a; v ds =15v; v gs =10v; t j = 25 c; n-channel; see figure 11 -1-nc i d =-2.3a; v ds =-15v; v gs =-10v; t j = 25 c; p-channel; see figure 12 -1-nc q gd gate-drain charge i d =-2.3a; v ds =-15v; v gs =-10v; t j = 25 c; p-channel; see figure 12 -3-nc i d = 2.3 a; v ds =15v; v gs =10v; t j = 25 c; n-channel; see figure 11 -2.5-nc c iss input capacitance v ds =20v; v gs =0v; f=1mhz; t j = 25 c; n-channel; see figure 5 - 250 - pf v ds =-20v; v gs = 0 v; f = 1 mhz; t j = 25 c; p-channel; see figure 6 - 250 - pf c oss output capacitance v ds =20v; v gs =0v; f=1mhz; t j = 25 c; n-channel; see figure 5 - 140 - pf v ds =-20v; v gs = 0 v; f = 1 mhz; t j = 25 c; p-channel; see figure 6 - 140 - pf c rss reverse transfer capacitance v ds =20v; v gs =0v; f=1mhz; t j = 25 c; n-channel; see figure 5 -50-pf v ds =-20v; v gs = 0 v; f = 1 mhz; t j = 25 c; p-channel; see figure 6 -50-pf g fs transfer conductance v ds =-20v; i d =-1a; t j =25c; p-channel 12- s v ds =20v; i d =2.2a; t j =25c; n-channel 24.5- s t off turn-off time v ds =20v; v gs =10v; r g(ext) =4.7 ? ; i d =1a; r l =20 ? ; t j = 25 c; n-channel - 25 140 ns v ds =-20v; v gs =-10v; r g(ext) =4.7 ? ; i d =-1a; r l =20 ? ; t j = 25 c; p-channel - 50 140 ns t on turn-on time - 20 80 ns v ds =20v; v gs =10v; r g(ext) =4.7 ? ; i d =1a; r l =20 ? ; t j = 25 c; n-channel - 1540ns source-drain diode v sd source-drain voltage i s =1.25a; v gs =0v; t j =25c; n-channel; see figure 13 --1.2v i s = -1.25 a; v gs =0v; t j =25c; p-channel; see figure 14 ---1.6v t rr reverse recovery time i s = -1.25 a; di s /dt = 100 a/s; v gs =0v; v ds =-25v; t j =25c; p-channel - 150 200 ns i s =1.25a; di s /dt = -100 a/s; v gs =0v; v ds =25v; t j =25c; n-channel - 35 100 ns table 6. characteristics ?continued symbol parameter conditions min typ max unit
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 8 of 16 nxp semiconductors PHC21025 complementary intermediate level fet fig 5. capacitance as a function of drain-source voltage; n-channel; typical values fig 6. capacitance as a function of drain-source voltage; p-channel; typical values fig 7. output characteristics: drain current as a function of drain-source voltage; n-channel; typical values fig 8. output characteristics: drain current as a function of drain-source voltage; p-channel; typical values 0 600 400 200 0 10 20 30 mbe137 c (pf) v ds (v) c iss c oss c rss 0 600 400 200 0 ? 10 ? 20 ? 30 mbe144 c (pf) v ds (v) c iss c oss c rss 0 2 10 12 16 12 4 0 8 mbe142 468 v ds (v) i d (a) 5 v 4 v 3 v v gs = 10 v 4.5 v 3.5 v 6 v 0 ? 2 ? 10 ? 12 ? 10 ? 8 ? 6 ? 2 0 ? 4 mbe154 ? 4 ? 6 ? 8 v ds (v) i d (a) ? 7.5 v ? 6 v ? 5 v ? 4.5 v ? 4 v ? 3.5 v ? 3 v ? 2.5 v v gs = ? 10 v
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 9 of 16 nxp semiconductors PHC21025 complementary intermediate level fet fig 9. transfer characteristics: drain current as a function of gate-source voltage; n-channel; typical values fig 10. transfer characteristics: drain current as a function of gate-source voltage; p-channel; typical values fig 11. gate-source voltage as a function of gate charge; n-channel; typical values fig 12. gate-source voltage as a function of gate charge; p-channel; typical values 024 8 16 12 4 0 8 mbe141 6 i d (a) v gs (v) 0 ? 2 ? 4 ? 8 ? 10 ? 8 ? 6 ? 2 0 ? 4 mbe157 ? 6 i d (a) v gs (v) 024 8 10 0 8 mbe136 6 6 4 2 q g (nc) v gs (v) 0 ? 2 ? 4 ? 10 ? 8 ? 10 0 ? 8 mbe145 ? 6 ? 6 ? 4 ? 2 q g (nc) v gs (v)
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 10 of 16 nxp semiconductors PHC21025 complementary intermediate level fet v gd = 0. (1) t j = 150 c. (2) t j = 25 c. (3) t j = -55 c. v gd = 0. (1) t j = 150 c. (2) t j = 25 c. (3) t j = -55 c. fig 13. source current as a function of source-drain voltage; n-channel; typical values fig 14. source current as a function of source-drain voltage; p-channel; typical values v ds i d x r dson ; t j = 25 c. (1) i d = 0.1 a. (2) i d = 0.5 a. (3) i d = 1 a. (4) i d = 2.2 a. (5) i d = 3.5 a. (6) i d = 7 a. -v ds -i d x r dson ; t j = 25 c. (1) i d = -0.1 a. (2) i d = -0.5 a. (3) i d = -1 a. (4) i d = -2.3 a. (5) i d = -4.5 a. fig 15. drain-source on-state resistance as a function of drain current; n-channel; typical values fig 16. drain-source on-state resistance as a function of drain current; typical values 0 0.5 1 1.5 6 2 0 4 mbe159 i s (a) v sd (v) (1) (2) (3) 0 ? 0.5 ? 1 ? 2 ? 1.5 ? 6 ? 2 0 ? 4 mbe158 i s (a) v sd (v) (1) (2) (3) 10 0 (1)(2) (6) v gs (v) r dson (m ) 2468 10 4 10 3 10 2 10 mda217 (3)(4)(5) ? 10 0 v gs (v) r dson (m ) ? 2 ? 4 ? 6 ? 8 10 4 10 3 10 2 mda165 (1) (4) (5) (2)(3)
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 11 of 16 nxp semiconductors PHC21025 complementary intermediate level fet typical v gsth at i d = 1 ma; v ds = v gs = v gsth . typical r dson at: (1) i d = 2.2 a; v gs = 10 v. (2) i d = 1 a; v gs = 4.5 v. fig 17. temperature coe fficient of gate-source threshold voltage fig 18. temperature coefficient of drain-source on-state resistance; n-channel typical r dson at: (1) i d = -1 a; v gs = -10 v. (2) i d = -0.5 a; v gs = -4.5 v. fig 19. temperature coefficient of drain-source on-state resistance; p-channel 0.6 0.7 0.8 0.9 1.0 1.2 1.1 0 50 100 150 ? 50 k t j ( c) mbe138 0.6 0.8 1.0 1.2 1.4 1.8 1.6 0 50 100 150 ? 50 k mbe139 (1) (2) t j ( c) 0.6 0.8 1.0 1.2 1.4 1.8 1.6 0 50 100 150 ? 50 k t j ( c) mbe146 (1) (2)
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 12 of 16 nxp semiconductors PHC21025 complementary intermediate level fet 7. package outline fig 20. package outline sot96-1 (so8) unit a max. a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 5.0 4.8 4.0 3.8 1.27 6.2 5.8 1.05 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 0.25 dimensions (inch dimensions are derived from the original mm dimensions) notes 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. 1.0 0.4 sot96-1 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 4 5 pin 1 index 1 8 y 076e03 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.20 0.19 0.16 0.15 0.05 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.01 0.041 0.004 0.039 0.016 0 2.5 5 mm scale s o8: plastic small outline package; 8 leads; body width 3.9 mm sot96 -1 99-12-27 03-02-18
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 13 of 16 nxp semiconductors PHC21025 complementary intermediate level fet 8. revision history table 7. revision history document id release date data sheet status change notice supersedes PHC21025 v.4 20110317 product data sheet - PHC21025 v.3 modifications: ? various changes to content. PHC21025 v.3 20101217 product data sheet - PHC21025 v.2
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 14 of 16 nxp semiconductors PHC21025 complementary intermediate level fet 9. legal information 9.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term 'short data sheet' is explained in section "definitions". [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple de vices. the latest product status information is available on the internet at url http://www.nxp.com . 9.2 definitions draft ? the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 9.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective document status [1] [2] product status [3] definition objective [short] data sheet development this document contai ns data from the objective spec ification for product developmen t. preliminary [short] data sheet qua lification this document contains data from the preliminary specification. product [short] data sheet production this doc ument contains the pr oduct specification.
PHC21025 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 04 ? 17 march 2011 15 of 16 nxp semiconductors PHC21025 complementary intermediate level fet agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any licens e under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulati ons. export might require a prior authorization from national authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 9.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. adelante , bitport , bitsound , coolflux , coreuse , desfire , ez-hv , fabkey , greenchip , hipersmart , hitag , i2c-bus logo, icode , i-code , itec , labelution , mifare , mifare plus , mifare ultralight , moreuse , qlpak , silicon tuner , siliconmax , smartxa , starplug , topfet , trenchmos , trimedia and ucode ? are trademarks of nxp b.v. hd radio and hd radio logo ? are trademarks of ibiquity digital corporation. 10. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors PHC21025 complementary intermediate level fet ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 17 march 2011 document identifier: PHC21025 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 11. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 general description . . . . . . . . . . . . . . . . . . . . . .1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3 5 thermal characteristics . . . . . . . . . . . . . . . . . . .5 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6 7 package outline . . . . . . . . . . . . . . . . . . . . . . . . .12 8 revision history . . . . . . . . . . . . . . . . . . . . . . . . .13 9 legal information. . . . . . . . . . . . . . . . . . . . . . . .14 9.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . .14 9.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 9.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 9.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .15 10 contact information. . . . . . . . . . . . . . . . . . . . . .15

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