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3northway lane north latham,new york 12110. tollfree:1.800.984.5337 phone:1.518.956.2980 fax:1.518.785.4725 http://www.marktechopto.com specification part no. : MT5470-BL 5.24.6mm oval led lamp observe precaution for handling electro static sensitive devices attention
MT5470-BL 5.24.6mm oval led lamp ver.: 01 date: 2007/03/22 page: 1 / 5 description this blue lamp is made with ingan/sapphire chip and blue diffused epoxy resin. ak 1.5 typ. 2.540.1 4.6 5.2 7.8 24.0 min. 0.5 max. notes: 1. all dimensions are in mm. 2. tolerance is 0.25mm unless otherwise noted. description led chip part no. material emitting color lens color MT5470-BL ingan/sapphire blue blue diffused
MT5470-BL 5.24.6mm oval led lamp ver.: 01 date: 2007/03/22 page: 2 /5 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation p d 100 mw reverse voltage v r 5 v d.c. forward current if 25 ma reverse (leakage) current ir 50 ?a peak current(1/10duty cycle,0.1ms pulse width.) if(peak) 100 ma operating temperature range topr. -40 to +95
storage temperature range tstg. -40 to +100
soldering temperature(1.6mm from body) tsol. dip soldering : 260 for
5 sec. hand soldering : 350 for 3 sec.
electrostatic discharge esd. 6000 v electrical and optical characteristics: parameter symbol condition min. typ. max. unit luminous intensity i v if=20ma 550 950 mcd forward voltage vf if=20ma 3.2 4.0 v dominant wavelength d 465 470 475 nm reverse (leakage) current ir vr=5v 50 a vertical 21/2 if=20ma 35 viewingangle horizontal 21/2 if=20ma 55 deg spectrum line halfwidth ? if=20ma 26 nm notes: the datas tested by is tester. 2. customer?s special requirements are also welcome. if=20ma if=20ma if=20ma if=20ma if=20ma
MT5470-BL 5.24.6mm oval led lamp ver.: 01 date: 2007/03/22 page: 3 / 5 typical electrical / optical characteristics curves : applied voltage (v) forward current vs.applied voltage forward current if(ma) 10 20 40 30 50 2.2 2.6 3.0 3.4 3.8 4.2 forward current (ma) forward current vs. luminous intensity temperature ( )
forward current vs. ambient temperature 0204060 100 80 forward current if(ma) 10 20 40 30 50 3 kqjo
8 r j-a=490
/w radiation diagram 80 90 60 70 50 30 40 0.1 0.5 0.7 0.8 0.3 1.0 0.9 0.4 0.2 0.6 0 10 20 horizontal vertical 0.0 10.0 20.0 30.0 300 600 900 1200 1500 relative luminous intensity(mcd)
MT5470-BL 5.24.6mm oval led lamp ver.: 01 date: 2007/03/22 page: 4 / 5 specifications for bin grading: iv(mcd) bin min. max. r 550 770 s 770 1100 t 1100 1520 specifications for vf group: vf(v) group min. max. v6 2.6 2.8 v7 2.8 3.0 v8 3.0 3.2 v9 3.2 3.4 v10 3.4 3.6 v11 3.6 3.8 v12 3.8 4.0 *majority vf bins are highlighted in yellow. specifications for wavelength group: ? d(nm) @20ma group min . max. x4 465 470 x5 470 475
MT5470-BL 5.24.6mm oval led lamp ver.: 01 date: 2007/03/22 page: 5 / 5 precautions: take note of the following in use of led 1. temperature in use since the light generated inside the led needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. consequently, the heat resistant ability of the resin used for led is usually low; therefore, please be careful on the following during use. avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. the glass transition temperature of epoxy resin used for the led is approximately 120-130
. at a temperature exceeding this limit, the co efficient of liner expansi on of the resin doubles or more compared to that at nor mal temperature and the resin is softened. if external force or stress is applie d at that time, it may cause a wire rupture. 2. soldering please be careful on the following at soldering. after soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), (1) soldering measurements: distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) solder dip: preheat: 90
max. (backside of pcb), within 60 seconds solder bath: 260 ? 5
(solder temperature), within 5 seconds (3) soldering iron : 350
max. (temperature of soldering iron tip), within 3 seconds 3. insertion pitch of the led leads and pitch of mounting holes need to be same 4. others since the heat resistant ability of the led resin is low, sm d components are used on the same pcb, please mount the led after adhesive baking process for smd components. in case adhesive baking is done after led lamp in sertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the led and follow the conditions below. baking temperature: 120
max. baking time: within 60 seconds if soldering is done sequentially after the adhesi ve baking, please perform the soldering after cooling down the led to normal temperature.

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