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BK3211 datasheet v 1. 2 ? 20 1 2 beken corporation proprietary and confidential page 1 of 14 bk 3211 specifications beken internal data signed nda required for distribution single chip for bluetooth beken corporation suite 3a, no. 1278 keyuan road, zhangjiang high tech park, pudong new district, shanghai 201203 , china phone: (86) 21 5108 6811 fax: (86)21 6087 1277 this document contains information that may be proprietary to, and/or secrets of, beken corporation. the contents of this document should not be disclosed outside the companies without specific written permission. disc laimer: descriptions of specific implementations are for illustrative purpose only, actual hardware implementation may differ .
BK3211 datasheet bluetooth ? 20 1 2 beken corporation proprietary and confidential page 2 of 14 content s 1. general description ................................ ................................ ................................ ........ 3 1.1. features ................................ ................................ ................................ ................. 3 1.1.1. radio features ................................ ................................ ............................. 3 1.1.2. baseband features ................................ ................................ ....................... 3 1.1.3. device features ................................ ................................ ........................... 3 1.2. applications ................................ ................................ ................................ ........... 3 2. pin definition ................................ ................................ ................................ ................. 4 3. functional description ................................ ................................ ................................ .... 6 3.1. block diagram ................................ ................................ ................................ ....... 6 4. electrical characteristics ................................ ................................ ................................ . 7 4.1. absolute maximum ratings ................................ ................................ .................... 7 4.2. recommended operating conditions ................................ ................................ ....... 7 4.3. t ypical power consumption ................................ ................................ ................... 7 4.4. rx ac characteristics ................................ ................................ ............................ 7 4.4.1. basic data rate mode rx ac characteristics ................................ ........... 7 4.4.2. enhanced data rate mode rx ac characteristics ................................ .... 8 4.5. tx ac characteristics ................................ ................................ ............................ 9 4.5.1. basic data rate mode tx ac characteristics ................................ ........... 9 4.5.2. enhanced data rate mode tx ac characteristics ................................ .... 9 5. application schema tic ................................ ................................ ................................ .. 11 6. package information ................................ ................................ ................................ ..... 12 7. solder reflow profile ................................ ................................ ................................ ... 13 7.1 . rohs compliant ................................ ................................ ................................ .. 13 7.2. esd sensitivity ................................ ................................ ................................ .... 13
BK3211 datasheet v 1. 2 ? 20 1 2 beken corporation proprietary and confidential page 3 of 14 1. general description the BK3211 chip is a highly integrated single - chip bluetooth device. it integrates the high - performance transceiver a nd rich features baseband processor, which is compliant with bluetooth 2.1 + edr specification. the BK3211 is available in 32 - pin 4x4 mm qfn packages. 1.1. feature s 1.1.1. radio features ? on - chip tx/rx switch ? polar modulation transmitter architecture with very low po wer consumption and high tx performance ? near - zero if receiver architecture with - 9 1 dbm sensitivity ? support for class 1, class 2 and class 3 transmitting power requirement ? fully integrated synthesizer without external loop filter component 1.1.2. baseband featur es ? fully compliant with bluetooth 2.1 + edr specification ? support bluetooth piconet and scatternet ? support up to 3mbps high speed uart interface ? support sniff mode, hold mode and park mode ? support a - law, - law and cvsd digitize audio codec in pcm interface ? provide i2c interface 1.1.3. device features ? enhanced support for wlan/bt co - existence ? standby and sleep modes to minimize power consumption ? support share handset system reference clock 1.2. applic ations ? mobile handset ? mp3, mp4 player and pmp ? other portable devices
BK3211 datasheet bluetooth ? 20 1 2 beken corporation proprietary and confidential page 4 of 14 2. pin de finition figure 1 BK3211 pin definition diagram table 1 pin definition p ackage pin # name d escription 1 uart _ r x d uart r x data input 2 pcm _ sdo pcm data output 3 pcm _ sdi pcm data input 4 pcm _ clk pcm data clock 5 pcm _ s ync pcm data sync 6 vio io power supply 7 vdd 18 1.8v voltage output, connected with 1 uf decoupling cap. 8 sw internal buck regulator output 9 vbat vbat ldo input, connected with 1 uf decoupling cap. 10 clk _ 32k 32.768 khz clock input c l k _ 3 2 k g p i o 5 l d o _ e n g p i o 2 i 2 c _ s c l i 2 c _ s d a v d d 1 8 n c c l k _ e n v b a t x o v i o s w x i n c n c p c m _ s d o p c m _ s d i p c m _ c l k p c m _ s y n c r f p n c n c u a r t _ t x d u a r t _ r x d 1 2 3 4 5 9 1 0 1 1 1 2 1 3 2 4 2 3 2 2 2 1 2 0 2 8 2 9 3 0 3 1 3 2 g n d p a d b k 3 2 1 1 6 7 8 1 4 1 5 1 6 1 9 1 8 1 7 2 5 2 6 2 7 n c n c b t _ w a k e n c h o s t _ w a k e g p i o 4 v d d 1 2
BK3211 datasheet v 1. 2 ? 20 1 2 beken corporation proprietary and confidential page 5 of 14 11 i2c_scl i2c clock signal 12 i2c_sda i2c data signal 13 clk _ en request source clock active 14 xi crystal input or oscillator input. 15 x o crystal output. 16 ldo_en system power on/off control 17 nc not connect 18 nc not connect 19 rf p rf input and output 20 gpio 5 general purpose input/output 21 gpio 2 general purpose input/output or bluetooth priority signal 22 nc not connect 23 nc not connect 24 nc not connect 25 nc not connect 26 bt_wake to wakeup bt. input from host. 27 nc not connect 28 nc not connect 29 vddd12 power supply for digital 30 gpio4 general purpose input/output or wlan active signal 31 host_wake to wakeup host . output to host. 32 uart_tx d uart tx data output
BK3211 datasheet bluetooth ? 20 1 2 beken corporation proprietary and confidential page 6 of 14 3. functional description 3.1. block diagram figure 2 BK3211 block diagram as shown in the figure 2 , the bk 3211 integrates the bluetooth t ransceiver, bluetooth baseband controller and mcu etc. the bluetooth transceiver integrates the low - if single conversion rx and polar loop modulation tx. the bluetooth baseband controller carries out the baseband protocols an d other low - level link routines such as modulation/demodulation, packets processing, bit strea m processing, frequency hopping and so on. m c u b l u e t o o t h b a s e b a n d c o n t r o l l e r ( b t m a c ) a p b p c m b l u e t o o t h t r a n s c e i v e r r f p g p i o u a r t c l o c k x o x i g p i o 2 g p i o 4 g p i o 5 h o s t _ w a k e b t _ w a k e c l k _ e n l d o p o r l d o _ e n v b a t v d d 1 2 s w v i o p c m _ c l k p c m _ s y n c p c m _ s d i p c m _ s d o u a r t _ t x d u a r t _ r x d c l k _ 3 2 k i 2 c i 2 c _ s c l i 2 c _ s d a v d d 1 8 b k 3 2 1 1
BK3211 datasheet v 1. 2 ? 20 1 2 beken corporation proprietary and confidential page 7 of 14 4. electrical characteristics 4.1. absolute maximum rating s table 2 absolute maximum ratings paramet er description min typ max unit vbat battery r egulator supply v oltage - 0.3 4.8 v p rx rx i nput p ower - 10 - dbm t str storage t emperature r ange - 40 - 150 vcc input v oltage - 0.3 - 3.6 v 4.2. recommended operating conditions table 3 recommended operating conditions parameter description min typ max unit vbat battery r egulator supply v oltage 3 .3 4 4.2 v t op r operation t emperature r ange - 2 0 - 6 0 v il cmos low level input voltage 0 - 0.3*vio v v ih cmos high level input voltage 0.7*vio - vio v v th cmos threshold voltage 0.5*vio v notes : 1. vio=1.8~3.3v 4.3. typical power consumption table 4 typical power consumption state de scription min typ max unit shut d own 8 ua sleep 6 00 ua only hci a ctive 5 ma dh1/dm1 42 ma dh3/dm3 46 ma dh5/dm5 47 ma 4.4. rx ac characteristics 4.4.1. basic data rate mode rx ac characteristics table 5 b asic data rate mode rx ac characteristics (vbat = 3.6 v, t op r = 27c, unless otherwise specified) parameter condition min typ max unit input frequency 2402~2480 2402 - 2480 mhz rxsens ber=0.001 - - 89 - dbm
BK3211 datasheet bluetooth ? 20 1 2 beken corporation proprietary and confidential page 8 of 14 maximum r eceived s ignal ber=0. 001 0 - - dbm c/ico - 10 - db c/i1st f = f0 + 1mhz - 0 - db f = f0 - 1mhz - 0 - db c/i2nd f = f0 + 2mhz - - 15 - db f = f0 - 2mhz - - 24 - db c/i3rd f = f0 + 3mhz - - 30 - db f = f0 - 3mhz - - 40 - db c/i image channel f = fimage - - 15 - db out - of - b and b locking p erformance 30mhz - 2000mhz - 10 - - dbm 2000mhz - 2400m hz - 27 - - dbm 2500mhz - 3000m hz - 27 - - dbm 3000mhz - 12.5ghz - 10 - - dbm intermodulation - - 37 - dbm 4.4.2. enhanced data rate mode rx ac characteristics table 6 enhanced data rate mode rx ac characteristics (vbat = 3.6 v, t op r = 27c, unless otherwise specified) parameter condition min typ max unit /4 dqpsk rxsens ber=0.0001 - - 9 1 - dbm ber floor ber=0.00001 - - 8 5 - dbm maximum r eceived s ignal ber=0.001 0 - - dbm c/ico - 11 - db c/i1st f = f0 + 1mhz - - 11 - db f = f0 - 1mhz - - 11 - db c/i2nd f = f0 + 2mhz - - 15 - db f = f 0 - 2mhz - - 27 - db c/i3rd f = f0 + 3mhz - - 32 - db f = f0 - 3mhz - - 40 - db c/i image channel f = f image - 0 - db 8dpsk rxsens ber=0.0001 - - 83 - dbm ber floor ber=0.00001 - - 7 8 - dbm maximum r eceived s ignal ber=0.001 0 - - dbm c/i co - 2 0 - db c/i1st f = f0 + 1mhz - - 5 - db f = f0 - 1mhz - - 5 - db c/i2nd f = f0 + 2mhz - - 1 0 - db f = f0 - 2mhz - - 2 2 - db c/i3rd f = f0 + 3mhz - - 3 0 - db f = f0 - 3mhz - - 3 0 - db c/i image channel f = f image - 4 - db
BK3211 datasheet v 1. 2 ? 20 1 2 beken corporation proprietary and confidential page 9 of 14 4.5. tx ac characteristics 4.5.1. b asic data rate mode tx ac characteristics table 7 basic data rate mode tx ac characteristics (vbat = 3.6 v, t op r = 27c, unless otherwise specified) parameter condition min typ max unit maximum rf t ransmit p ower - 8 9 dbm rf p ower c ontrol r ange - 1 5 - db 20db b and w idth - 0.9 - mhz acp1st f = f0 + 1mhz - - - dbm f = f0 - 1mhz - - - dbm acp2nd f = f0 + 2mhz - - 30 - dbm f = f0 - 2mhz - - 30 - dbm acp 3rd f = f0 + 3mhz - - 40 - dbm f = f0 - 3mhz - - 40 - dbm out - of - b and s purious e mission 30mhz to 1ghz, o perating m ode - - 36 - dbm 1ghz to 12.75ghz, o perating m ode - - 30 - dbm 1.8ghz to 1.9ghz , 5.1 5ghz to 5.3ghz - - 47 - dbm f1avg maximum modulation - 160 - khz f2max minimum modulation - 120 - khz f2avg/ f1avg - 0. 9 - - initial carrier frequency tolerance - 5 - khz drift r ate - 7 - khz/50us drift (1 slot packet) - 8 - khz drift (3 slot packet) - 8 - khz drift (5 slot packet) - 10 - khz 4.5.2. enhanced data rate mode tx ac characteristics table 8 enhanced data rate mode tx ac characteristics (vbat = 3.6 v, t op r = 27c, unless otherwise specified) parameter co ndition min typ max unit maximum rf t ransmit p ower - 4 6 dbm relative t ransmit p ower - - 4 - db /4 dqpsk m ax c arrier f requency s tability w 0 - 2 - khz /4 dqpsk m ax c arrier f requency s tability w i - 3 - khz /4 dqpsk m ax c arrier f requency s tability |w i + w 0 | - 1.5 - khz
BK3211 datasheet bluetooth ? 20 1 2 beken corporation proprietary and confidential page 10 of 14 8dpsk m ax c arrier f requency s tability w 0 - 2 - khz 8dpsk m ax c arrier f requency s tability w i - 3 - khz 8dpsk m ax c arrier f requency s tability |w i + w 0 | - 1.5 - khz /4 dqpsk modulation accuracy rms devm - 7 - % 99% devm - - 2 0 % peak devm - 15 - % 8dpsk modulation accuracy rms devm - 9 - % 99% devm - - 2 0 % peak devm - 17 - % acp1st f = f0 + 1mhz - - 14 - dbm f = f0 - 1mhz - - 13 - dbm acp2nd f = f0 + 2mhz - - 20 - dbm f = f0 - 2mhz - - 20 - dbm acp 3rd f = f0 + 3mhz - - 40 - dbm f = f0 - 3mhz - - 40 - dbm edr differential phase coding - 100 - %
BK3211 datasheet v 1. 2 ? 20 1 2 beken corporation proprietary and confidential page 11 of 14 5. application schematic figure 3 bk3 2 11 application d iagram the detail schematic design please refer s to the hardware design reference. uart_txd uart_rxd fm_outr note 1 l1 nc note 2 note 3 vbat c8 100nf r8 0 ohm /nc fm_outl note 4 ldoen r3 1 k note 6 u3 bpf_2.4ghz 1 1 3 3 2 2 4 4 l5 nc c6 10pf l3 nc i2c_sclk i2c_sda r10 nc [0 ohm] l13 2 nh l2 2.4 nh c5 1 pf c4 2.7 pf r4 10k u2 bt ant clk32k r5 10k vio vio clken c12 100nf note 5 host_wake r11 0 ohm [nc] c14 1uf c17 nc [18 pf] l4 nc [100 nh] l6 3 nh u4 fm ant pcm_sdi pcm_sdo pcm_clk pcm_sy nc u1 BK3211 [bk3511] uart_rxd 1 pcm_sdo 2 pcm_sdi 3 pcm_clk 4 pcm_sy nc 5 vio 6 vdd18 7 sw 8 vbat 9 clk_32k 10 i2c_sda 11 i2c_scl 12 clk_en 13 xi 14 xo 15 ldo_en 16 nc 17 nc 18 rfp 19 gpio5 20 gpio2 21 nc [fmin] 22 nc [fmip] 23 nc 24 gnd 33 uart_txd 32 host_wake 31 gpio4 30 vdd12 29 nc [fm_outr] 28 nc [fm_outl] 27 bt_wake [gpio_fm3] 26 nc [gpio_fm2] 25 note 7 c7 1uf r9 nc [0 ohm] c10 15pf c11 15pf x1 26mhz 1 1 2 2 3 3 4 4 r12 0 ohm [nc] r6 0 ohm c16 nc [100 nf] c18 nc [100 nf] the compatible design for BK3211 and bk3511, which inside the square brackets are bk3511 pin names or component values c3 1 uf clk_26m c13 100 pf/nc
BK3211 datasheet bluetooth ? 20 1 2 beken corporation proprietary and confidential page 12 of 14 6. package information figure 4 qfn 4x4 32 pin package diagram table 9 qfn 4x4 32 pin package dimensions
BK3211 datasheet v 1. 2 ? 20 1 2 beken corporation proprietary and confidential page 13 of 14 7. solder reflow profile figure 5 classification reflow profile table 10 solder reflow profile profile feature spec ification average ramp - up rate (tsmax to tp) 3c/second max. pre_heat temperature min (tsmin) 150c temperature max (tsmax) 200c time (ts) 60 - 180 seconds time maintained above temperature (tl) 217c time (tl) 60 - 150 seconds peak/classification temperature (tp) 260c time within 5c of actual peaktemperature (tp) 20 - 40 seconds ramp - down rate 6 6c/second max. time 25c to peak temperature 8 8 minutes max. 7.1. rohs compliant the product does not contain lead, mercury, cadmium, hexavalent chromiu m, pbb&pbde content in accordance with directive 2002/95/ec(rohs). 7.2. esd sensitivity integrated circuits are esd sensitive and can be damaged by static electricity. proper esd t echniques should be used when handling these devices.
BK3211 datasheet bluetooth ? 20 1 2 beken corporation proprietary and confidential page 14 of 14 revision history rev. date author(s) remark 1.0 5 / 7 /201 2 ymhuang initial release 1. 1 05/24/2012 lfbao updated application sch e matic ; updated e lectrical c haracteristics , specially c hange the serial resistance from 0 to 1k at 32.768k clock path 1.2 0 6 / 1 9 /2012 ymhuang updated application sch e matic t o imp rove the gsm suppression

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