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1 www.semtech.com sc2595 integrated linear ddr termination regulator power management revision: june 12, 2007 typical application circuit the sc2595 is an integrated linear ddr termination device, which provides a complete solution for ddr termination designs; while meeting the jedec require- ments of sstl-2 specifications for ddr-sdram termi- nation. the sc2595 can source and sink 1.5a current at the output v tt while maintaining excellent load regulation. v tt is designed to track the v ref voltage with a tight tolerance over the entire current range while preventing shoot through on the output stage. a v sense pin is incorporated to provide excellent load regulation, along with a buffered reference voltage. the sc2595 incorporates a disable function built into the av cc pin to tri-state the output during suspend to ram (str) states. (multiple patents pending.) ? ddr memory termination ? high speed data line termination ? pc motherboards ? graphics boards ? disk drives ? cd-rom drives ? regulates while sourcing or sinking 1.5a ? av cc range is from 2.5v to 5v ? reference output ? minimum number of external components ? accurate internal voltage divider ? soic-8l edp package. also available in lead-free package, fully weee and rohs compliant description features applications sc2595 nc 1 gnd 2 vsense 3 vref 4 vddq 5 avcc 6 pvcc 7 vtt 8 vtt vdd vref
2 ? 2007 semtech corp. www.semtech.com sc2595 preliminary power management r e t e m a r a pr e t e m a r a p r e t e m a r a p r e t e m a r a pr e t e m a r a pl o b m y sl o b m y s l o b m y s l o b m y sl o b m y ss n o i t i d n o c t s e ts n o i t i d n o c t s e t s n o i t i d n o c t s e t s n o i t i d n o c t s e ts n o i t i d n o c t s e tn i mn i m n i m n i mn i mp y tp y t p y t p y tp y tx a mx a m x a m x a mx a ms t i n us t i n u s t i n u s t i n us t i n u e g a t l o v e c n e r e f e rv f e r i t u o _ f e r a m 0 =2 / q d d v v m 0 4 - 5 2 . 12 / q d d v v m 0 4 + v n o i t a l u g e r d a o l ) 1 ( g e r d a o l i d a o l a 5 . 1 + o t 0 : i d a o l a 5 . 1 - o t 0 : 5 . 0 - 5 . 0 + % t e s f f o e g a t l o v t u p t u o t t vs o v t t v i t u o v , a 0 = t t v - f e r 0 2 -00 2 +v m t n e r r u c t n e c s e i u qi q i d a o l a 0 =0 0 4a d l o h s e r h t e l b a n e c c v a 1 . 2v e c n a d e p m i t u p n i q d d vz q d d v 0 0 1k ? specifications with standard typeface are for t j = 25 o c and limits in boldface type apply over the full operating temperature range (t j = -40 o c to +150 o c). unless otherwise specified, av cc = pv cc = 2.5v, v ddq = 2.5v. electrical characteristics absolute maximum ratings exceeding the specifications below may result in permanent damage to the device, or device malfunction. operation outside of th e parameters specified in the electrical characteristics section is not implied. note: note: note: note: note: (1) for load regulation, use a 10ms current pulse width when measuring v tt . operating range r e t e m a r a pr e t e m a r a p r e t e m a r a p r e t e m a r a pr e t e m a r a p l o b m y sl o b m y s l o b m y s l o b m y sl o b m y sm u m i x a mm u m i x a m m u m i x a m m u m i x a mm u m i x a ms t i n us t i n u s t i n u s t i n us t i n u e g n a r e r u t a r e p m e t n o i t c n u jt j 0 5 1 + o t 0 4 -c d n g o t c c v av a c c 5 . 5 o t 3 . 2v d n g o t c c v pv p c c o t 3 . 2v a c c v r e t e m a r a pr e t e m a r a p r e t e m a r a p r e t e m a r a pr e t e m a r a p l o b m y sl o b m y s l o b m y s l o b m y sl o b m y sm u m i x a mm u m i x a m m u m i x a m m u m i x a mm u m i x a ms t i n us t i n u s t i n u s t i n us t i n u d n g o t q d d v , c c v a , c c v pv c c 0 . 6 + o t 3 . 0 -v e s a c o t n o i t c n u j e c n a t s i s e r l a m r e h t p d e l 8 - c i o s c j 5 . 5 w / c t n e i b m a o t n o i t c n u j e c n a t s i s e r l a m r e h t p d e l 8 - c i o s a j 5 . 6 3 w / c e g n a r e r u t a r e p m e t g n i t a r e p ot a 5 0 1 + o t 0 4 -c e g n a r e r u t a r e p m e t n o i t c n u j g n i t a r e p ot j 0 5 1 + o t 0 4 -c e g n a r e r u t a r e p m e t e g a r o t st g t s 0 5 1 + o t 5 6 -c s 0 4 - 0 1 e r u t a r e p m e t w o l f e r r i k a e pt d a e l 0 4 2c s 0 4 - 0 1 e r u t a r e p m e t w o l f e r r i k a e pt d a e l 0 6 2c ) l e d o m y d o b n a m u h ( g n i t a r d s ed s e2v k
3 ? 2007 semtech corp. www.semtech.com power management sc2595 pin configuration ordering information notes: (1) only available in tape and reel packaging. a reel contains 2500 devices for soic-8l package. (2) lead free package. device is fully weee and rohs compliant. top view (soic-8l edp) part number package temp. range (t a ) SC2595STRT (1)(2) soic-8l edp -40 to +105 o c sc2595evb evaluation board
4 ? 2007 semtech corp. www.semtech.com sc2595 preliminary power management pin descriptions p d e l 8 - c i o sp d e l 8 - c i o s p d e l 8 - c i o s p d e l 8 - c i o sp d e l 8 - c i o s # n i p# n i p # n i p # n i p# n i p e m a n n i pe m a n n i p e m a n n i p e m a n n i pe m a n n i pn o i t c n u f n i pn o i t c n u f n i p n o i t c n u f n i p n o i t c n u f n i pn o i t c n u f n i p 1c n. n o i t c e n n o c l a n r e t n i o n ) 1 ( 2d n g. d n u o r g 3e s n e s vv e s n e s v . n i p k c a b d e e f a s i t t t s o m n i e n a l p p i r t s g n o l d n a w o r r a n a s y a w l a s i e n a l p e c a r t e g r a l a e s u a c l l i w e n a l p p i r t s g n o l s i h t . s n o i t a c i l p p a d r a o b r e h t o m t s a f a ; n o i t i d n o c t n e i s n a r t d a o l e h t r e d i s n o c . e c n a t s i s e r e c a r t d n a e c n a t c u d n i v h g u o r h t g n i o g t n e r r u c d a o l t t v e h t n o s e k i p s e g a t l o v e t a e r c n a c e n a l p p i r t s t t v e h t n o p o r d e g a t l o v c d a e s u a c o s l a n a c t n e r r u c d a o l e h t . e n a l p t t s i t i . e n a l p v t a h t d e d n e m m o c e r e s n e s v f o r e t n e c e h t o t d e t c e n n o c e b d l u o h s t t o t e n a l p t ' n a c e n o t a h t e s a c n i . y t i n u m m i e s i o n e h t d n a n o i t a l u g e r d a o l e h t e v o r p m i v e h t t c e n n o c e s n e s v e h t f o r e t n e c e h t o t n i p t t e h t o t t i t c e n n o c d l u o h s e n o , e n a l p v 5 9 5 2 c s t t v f o e c a r t r e g n o l a . y l t c e r i d n i p e s n e s e h t e s u a c d n a e s i o n p u k c i p y a m . d e d i o v a e b t s u m e c a r t r e g n o l e h t e c n e h ; n o i t a l u g e r d a o l f o r o r r e v e h t o t e s o l c r o t i c a p a c c i m a r e c f n 0 0 1 o t f n 0 1 a e s n e s d i o v a o t d e r i u q e r s i n i p . n o i t i d n o c t n e i s n a r t g n i r u d n o i t a l l i c s o 4f e r vv f e r e c n e r e f e r l a n r e t n i e h t f o t u p t u o d e r e f f u b e h t s e d i v o r p h c i h w , n i p t u p t u o n a s i v e h t e s u n a c r e n g i s e d m e t s y s . e g a t l o v f e r t e s p i h c e g d i r b h t r o n r o f e g a t l o v t u p t u o e r e h t , e c n a d e p m i h g i h y l l a c i p y t e r a s n i p t u p n i e s e h t e s u a c e b . y r o m e m d n a v e h t m o r f n w a r d t n e r r u c f o t n u o m a l l a m s a e b d l u o h s f e r o t . ] 0 1 , 9 e r u g i f [ n i p d e d d a e b d l u o h s ) f n 0 0 1 - f n 0 1 ( r o t i c a p a c c i m a r e c a , y t i n u m m i e s i o n e h t e v o r p m i v e h t m o r f f e r . e c n a t s i d t r o h s h t i w d n u o r g o t n i p 5q d d v ) 2 ( v e h t q d d v e t a l u g e r o t e g a t l o v e c n e r e f e r l a n r e t n i g n i t a e r c r o f t u p n i n a s i n i p . t t e h t v q d d p a t l a r t n e c e h t . r e d i v i d r o t s i s e r m h o k 0 0 1 l a n r e t n i o t d e t c e n n o c s i e g a t l o v v ( r e d i v i d r o t s i s e r f o q d d h c i h w , r e f f u b e g a t l o v l a n r e t n i e h t o t d e t c e n n o c s i ) 2 / v o t d e t c e n n o c s i t u p t u o f e r r e i f i l p m a r o r r e e h t f o t u p n i g n i t r e v n i - n o n e h t d n a n i p v e h t , d e s o l c p o o l k c a b d e e f e h t h t i w . e g a t l o v e c n e r e f e r e h t s a t t e g a t l o v t u p t u o v e h t k c a r t s y a w l a l l i w q d d a + m h o 1 . 5 e s u o t d e d n e m m o c e r s i t i . y l e s i c e r p 2 / v r o f r o t i c a p a c c i m a r e c f u 1 q d d . y t i n u m m i e s i o n e h t e s a e r c n i o t r e t l i f s ' n i p 6c c v a ) 2 ( v a e h t c c v a . y r t i u c r i c l o r t n o c l a n r e t n i e h t f o l l a y l p p u s o t d e s u s i n i p c c e g a t l o v e h t w o l l a o t ) l a c i p y t v 1 . 2 ( e g a t l o v d l o h s e r h t o l v u s t i n a h t r e t a e r g e b o t s a h v a f i . n o i t a r e p o l a m r o n n i e b 5 9 5 2 c s c c d l o h s e r h t o l v u e h t n a h t r e w o l s i e g a t l o v v e h t , e g a t l o v t t . v 0 t a n i a m e r l l i w e g a t l o v t u p t u o 7c c v p ) 2 ( v p e h t c c v e h t e r e h w m o r f e g a t l o v l i a r e h t s e d i v o r p n i p t t . t n e r r u c d a o l s w a r d n i p v a n e e w t e b n o i t a t i m i l a s i e r e h t c c v p d n a c c v p e h t . c c r o s s e l e b t s u m e g a t l o v v a o t l a u q e c c v e h t . n o i t a l u g e r e g a t l o v t u p t u o t c e r r o c e h t e r u s n e o t e g a t l o v t t v p n o t n e d n e p e d s i y t i l i b a p a c t n e r r u c e c r u o s c c n o e g a t l o v e h t r e h g i h . e g a t l o v v p c c r e h g i h d n a s s o l r e w o p e r o m e s u a c l l i w t i , r e v e w o h ; t n e r r u c e c r u o s e h t r e h g i h , . ] 2 1 , 1 1 , 5 e r u g i f [ e s i r e r u t a r e p m e t 8t t vv e h t t t s u o u n i t n o c a 5 . 1 e c r u o s d n a k n i s n a c t i . 5 9 5 2 c s f o t u p t u o e h t s i n i p s i t i . n o i t a l u g e r d a o l t n e l l e c x e g n i p e e k e l i h w t n e r r u c k a e p a 3 d n a t n e r r u c r s e ( s r o t i c a p a c r s e w o l f u 0 2 2 t s a e l t a e s u d l u o h s e n o t a h t d e d n e m m o c e r e r a h c i h w , s r o t i c a p a c c i m a r e c f u 0 1 d n a ) m h o m 0 5 2 n a h t r e w o l e b d l u o h s v e h t n o d a e r p s y l m r o f i n u t t d a o l r e d n u e k i p s e g a t l o v e h t e c u d e r o t e n a l p p i r t s . n o i t i d n o c t n e i s n a r t l a m r e h t d a p . d n g o t d e t c e n n o c e b d l u o h s d a p l a m r e h t
5 ? 2007 semtech corp. www.semtech.com power management sc2595 block diagram out + - gnd v ddq v ref v sense uvl o + - pv cc a vcc v tt nc driver circuit out notes: notes: notes: notes: notes: (1) can be used for vias. (2) power up of av cc , pv cc and v ddq supplies. (a) the preferred mode of operation is when the av cc , pv cc and v ddq pins are tied together to a single supply. (b) if and when av cc , pv cc pins are tied to a supply separate to that of the v ddq supply pin; then the v ddq supply should lead av cc , pv cc supply or the v ddq supply and the av cc , pv cc supply should rise simultaneously. (c) if the av cc , pv cc and v ddq supply pins are connected in a way such that, av cc , pv cc supplies precedes v ddq supply; then v tt output precedes v ddq . this can cause the sdram device to latch-up, which may cause permanent damage to the sdram.
6 ? 2007 semtech corp. www.semtech.com sc2595 preliminary power management overview overview overview overview overview double data rate (ddr) sdram was defined by jedec 1997. its clock speed is the same as previous sdram but data transfers speed is twice than previous sdram. by now, the requirement voltage range is changed from 3.3v to 2.5v; the power dissipation is smaller than sdram. for above reasons, it is very popular and widely used in m/b, n/b, video-cards, cd rom drives, disk drives. regarding the ddr power management solution, there are two topologies can be selected for system design- ers. one is switching mode regulator that has bigger sink/ source current capability, but the cost is higher and the board space needed is bigger. another solution is linear mode regulator, which costs less, and needs the less board space. for two dimm motherboards, system de- signers usually choose the linear mode for ddr power management solution. applications t t t t t ypical application cir ypical application cir ypical application cir ypical application cir ypical application cir cuits & w cuits & w cuits & w cuits & w cuits & w a a a a a v v v v v ef ef ef ef ef orms orms orms orms orms two different application circuits are shown below in fig- ure 1 to figure 2. each circuit is designed for specific condition. more details are described below. see note 1. below for recommended power up sequencing. application_1: standar application_1: standar application_1: standar application_1: standar application_1: standar d ss d ss d ss d ss d ss tl tl tl tl tl -2 application -2 application -2 application -2 application -2 application the av cc pins, the pv cc pin, and the v ddq pin can be tied together for sstl-2 application. it only needs a 2.5v power rail for normal operation. system designer can save the pcb space and reduce the cost. please refer to figures 3 to 4 for test waveforms. figure 1: standard sstl-2 application application information application_2: lower power loss configuration application_2: lower power loss configuration application_2: lower power loss configuration application_2: lower power loss configuration application_2: lower power loss configuration f f f f f or ss or ss or ss or ss or ss tl tl tl tl tl -2 -2 -2 -2 -2 if power loss is a major concern, separated the pv cc form the av cc and the v ddq will be a good choice. the pv cc can operate at lower voltage (1.8v to 2.5v). if 2.5v voltage is applied on av cc and the v ddq , but the source current is lower due to the lower operating voltage applied on the pv cc . please find the relative test result in figures 5, 11 and 12. figure 2: lower power loss for sstl-2 application notes: notes: notes: notes: notes: (1) power up of av cc , pv cc and v ddq supplies. (a) the preferred mode of operation is when the av cc , pv cc and v ddq pins are tied together to a single supply. (b) if and when av cc , pv cc pins are tied to a supply separate to that of the v ddq supply pin; then the v ddq supply should lead av cc , pv cc supply or the v ddq supply and the av cc , pv cc supply should rise simultaneously. (c) if the av cc , pv cc and v ddq supply pins are con nected in a way such that, av cc , pv cc supplies precedes v ddq supply; then v tt output precedes v ddq . this can cause the sdram device to latch- up, which may cause permanent damage to the sdram. cin2 1uf cout1 220uf vdd cin1 68uf cout2 10uf sc2595 nc 1 gnd 2 vsense 3 vref 4 vddq 5 avcc 6 pvcc 7 vtt 8 vtt cref 10nf csence 2.2uf 2.5v 1.25v r1 5.1 r1 5.1 10uf cin2 1.25v csense 2.2uf 1uf cin2 vin 2.5v cr ef 10nf vtt cout1 220uf sc2595 nc 1 gnd 2 vsense 3 vref 4 vddq 5 avcc 6 pvcc 7 vtt 8 cddq 1uf vdd 1.8v to 2.5v cin1 68uf
7 ? 2007 semtech corp. www.semtech.com power management sc2595 layout guidelines layout guidelines layout guidelines layout guidelines layout guidelines 1)the sc2595 has a power so-8 package. it can im- prove the thermal impedance ( jc ) significantly. a suitable thermal pad should be added when pcb layout. some thermal vias are required to connect the thermal pad to the pcb ground layer. this will improve the thermal per- formance . 2)to increase the noise immunity, a ceramic capacitor of 10nf to 100nf is required to decouple the v ref pin with the shortest connection trace, also a 10nf to 100nf ceramic capacitor close to the v sense pin is required to avoid oscillation during transient condition. 3)to reduce the noise on the input power rail for stan- dard sstl-2 application, a 68f low esr capacitor and a 1f ceramic capacitor have to be used on the input power rail with shortest possible connection. 4)for lower power loss sstl-2 application, a 220f al. capacitor (esr should be lower than 250m ohm) and a 10f ceramic has to be added on the pv cc pin and a 1f ceramic capacitor +5.1 ohm filter has to be added on the v ddq pin with shortest possible connection. 5)v tt output copper plane should be as large as possible. 6)v sense trace should be as short as possible. application information (cont.)
8 ? 2007 semtech corp. www.semtech.com sc2595 preliminary power management test waveforms typical characteristics avcc vs i q 0 50 100 150 200 250 300 350 400 450 500 550 600 2.53.03.54.04.55.05.56.0 avcc(v) quiescent current(ua) vddq =2.5v vddq =1.8v avcc=vddq=2.5v 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 1.81.9 2 2.12.22.32.42.5 pv cc( v ) output current(a ) max source curren t figure 3 figure 4 figure 5 figure 6 vtt vref test condition: avcc=pvcc=vddq=2.5v,vtt=1.25v cout1=220uf, cout2=10uf, sink 2a. vddq avcc pvcc test condition: avcc=pvcc=vddq=2.5v,vtt=1.25v cout1=220uf, cout2=10uf, source 2a. vddq avcc pvcc vtt vref
9 ? 2007 semtech corp. www.semtech.com power management sc2595 typical characteristics (cont.) quiescent current(avcc= 2.5v) 200 300 400 500 600 700 800 0 20406080100120140 temperature ( ) current(ua) 2.5v 1.8v temp vs uvlo 1.90 1.91 1.92 1.93 1.94 1.95 1.96 1.97 1.98 1.99 2.00 20 30 40 50 60 70 80 90 100 110 temperature( ) voltage(v) uvlo (ty pical) vddq=pvcc=avcc=2.5v 1.210 1.215 1.220 1.225 1.230 1.235 1.240 1.245 1.250 0 100 200 300 400 500 600 700 800 900 iref( ua ) vref(v) vref_m ax vs iref(vddq=2.5v) 1.210 1.215 1.220 1.225 1.230 1.235 1.240 1.245 1.250 0 100 200 300 400 500 600 700 800 900 iref(ua) vref(v) -40 0 25 75 150 figure 7 figure 8 figure 9 figure 10
10 ? 2007 semtech corp. www.semtech.com sc2595 preliminary power management typical characteristics (cont.) vddq=2.5v 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 a v cc=pv cc( v ) current(a) ma x source current vddq=1.8v 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 avcc=pvcc(v) current(a) ma x source current avcc=pvcc=vddq=2.5v 0 20 40 60 80 100 120 140 0.0 0.5 1.0 1.5 2.0 2.5 dc current ( a ) temperature( ) source sink figure 11 figure 12 figure 13
11 ? 2007 semtech corp. www.semtech.com power management sc2595 outline drawing - power soic-8l land pattern - power soic-8l y this land pattern is for reference purposes only. consult your manufacturing group to ensure your company's manufacturing guidelines are met. notes: 1. reference ipc-sm-782a, rlp no. 300a. 2. inches dimensions z p y x dim c g millimeters e .201 5.10 x failure to do so may compromise the thermal and/or functional performance of the device. shall be connected to a system ground plane. thermal vias in the land pattern of the exposed pad 3. f e d solder mask thermal via ?0.36mm d .098 2.49 f .096 2.44 z (c) g (.205) (5.20) p 3.00 .118 1.27 .050 0.60 .024 2.20 .087 7.40 .291 e see detail detail a a .050 bsc .236 bsc 8 .010 .150 .189 .154 .193 .012 - 8 0.25 1.27 bsc 6.00 bsc 3.90 4.90 - .157 .197 3.80 4.80 .020 0.31 4.00 5.00 0.51 bxn 2x n/2 tips seating aaa c e/2 2x 12 n a d a1 e1 bbb c a-b d ccc c e/2 a2 (.041) .004 .008 - .028 - - - - 0 .016 .007 .049 .000 .053 8 0 0.20 0.10 - 8 0.40 0.17 1.25 0.00 .041 .010 .069 .065 .005 1.35 (1.05) 0.72 - 1.04 0.25 - - - 1.75 1.65 0.13 0.25 - .010 .020 0.50 - c l (l1) 01 0.25 gage plane h 3. dimensions "e1" and "d" do not include mold flash, protrusions or gate burrs. -b- controlling dimensions are in millimeters (angles in degrees). datums and to be determined at datum plane notes: 1. 2. -a- -h- side view a b c d e h plane f f exposed pad l1 n 01 bbb aaa ccc a b a2 a1 d e e1 l h e c dim min millimeters nom dimensions inches min max max nom f .086 .090 .094 2.19 2.29 2.39 h 4. reference jedec std ms-012, variation ba. h c n a r b n a w i a t 0 8 3 3 - 8 4 7 2 - 2 - 6 8 8 : l e t fx a0 9 3 3 - 8 4 7 2 - 2 - 6 8 8 : h b m g d n a l r e z t i w s h c e t m e s h c n a r b n a p a j 0 5 9 0 - 8 0 4 6 - 3 - 1 8 : l e t 1 5 9 0 - 8 0 4 6 - 3 - 1 8 : x a f h c n a r b a e r o k tl e7 7 3 4 - 7 2 5 - 2 - 2 8 : f6 7 3 4 - 7 2 5 - 2 - 2 8 : x a ) . k . u ( d e t i m i l h c e t m e s 0 0 6 - 7 2 5 - 4 9 7 1 - 4 4 : l e t 1 0 6 - 7 2 5 - 4 9 7 1 - 4 4 : x a f e c i f f o i a h g n a h s t0 3 8 0 - 1 9 3 6 - 1 2 - 6 8 : l e 1 3 8 0 - 1 9 3 6 - 1 2 - 6 8 : x a f l r a s e c n a r f h c e t m e s 0 0 - 2 2 - 8 2 - 9 6 1 ) 0 ( - 3 3 : l e t 8 9 - 2 1 - 8 2 - 9 6 1 ) 0 ( - 3 3 : x a f f o y r a i d i s b u s d e n w o - y l l o h w a s i g a l a n o i t a n r e t n i h c e t m e s . a . s . u e h t n i s r e t r a u q d a e h s t i s a h h c i h w , n o i t a r o p r o c h c e t m e s h b m g y n a m r e g h c e t m e s 3 2 1 - 0 4 1 - 1 6 1 8 ) 0 ( - 9 4 : l e t 4 2 1 - 0 4 1 - 1 6 1 8 ) 0 ( - 9 4 : x a f contact information for semtech international ag

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