1 / 4 www.asb.co.kr august 2009 p lerow tm ALE2045T3 internally matched lna module the plerow tm al e - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, w cdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the applicat ion band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and conven ient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 1920 2170 gain db 24 25 gain flatness db 0.7 0.8 noise figure db 0.70 0.75 output ip3 (1) dbm 37.5 39.5 s11 / s22 (2) db - 18 / - 10 output p1db dbm 20 21 switching time (3) m sec - supply current ma 200 220 supply voltage v 5 impedance w 50 max. rf input power dbm c.w 29 ~ 31 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 c to +85 c. 1) oip3 is measured wi th two tones at an output power of 4 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 2 rf in 5 rf out 6 v s other s ground ou t line drawing (unit: mm) s 21 = 25.7 db @ 1920 mhz = 24.3 db @ 2170 mhz nf of 0.70 db over frequency unconditionally stable single 5v supply high oip3 @ low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pin s for better rf and thermal performance, as shown in the dra w ing at the left side. (recommended footprint) ale2 045t3 asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 2 - stage single type specifications (in pr o duction) typ. @ t = 25 c, v s = 5 v, freq. = 2045 mhz, z o.sys = 50 ohm feature s description
2 / 4 www.asb.co.kr august 2009 p lerow tm ALE2045T3 internally matched lna module s - param e ters noise figure oip3 p1db 1920~2045 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr august 2009 p lerow tm ALE2045T3 internally matched lna module 1. s - parameter 2. oip3, p1db & nf note: tested at room temperature. 1. s - parameter 2. oip3, p1db & nf note: tested at v s = 5 v . 1920 mhz 2045 mhz 2170 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) 4.50 v 26.37 - 19.10 - 24.41 25.69 1.29 - 19.83 - 22.65 25.08 - 20.02 - 20.70 4.75 v 26.38 - 19.68 - 25.65 25.72 1.28 - 20.38 - 23.80 25.10 - 20.69 - 21.64 5.00 v 26.40 - 20.06 - 26.77 25.73 1.28 - 20.85 - 25.15 25.12 - 21.38 - 22.65 5.25 v 2 6.41 - 20.45 - 28.21 25.73 1.29 - 21.43 - 26.95 25.12 - 22.12 - 23.96 5.50 v 26.38 - 20.99 - 29.45 25.72 1.27 - 21.94 - 29.18 25.11 - 22.97 - 25.25 1920 mhz 2045 mhz 2170 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) n f (db) oip3 (dbm) p1db (dbm) nf (db) 4.50 v 38.73 21.20 0.573 38.61 21.42 0.589 38.31 21.44 0.625 4.75 v 39.92 21.72 0.581 39.77 21.94 0.629 39.59 21.97 0.652 5.00 v 40.86 22.20 0.601 41.09 22.44 0.642 40.66 22.46 0.696 5.25 v 41.29 22.66 0.623 41.42 2 2.96 0.667 41.21 22.91 0.734 5.50 v 41.39 23.08 0.658 41.66 23.38 0.704 41.91 23.36 0.774 1920 mhz 2045 mhz 2170 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) - 45 c 27.16 - 19.54 - 24.10 26.57 1.12 - 20.05 - 34.54 26.04 - 21.61 - 37.39 - 10 c 27.01 - 19.65 - 27.46 26.42 1.16 - 20.77 - 30.47 25.85 - 21.27 - 27.05 25 c 26.53 - 19.87 - 28.40 25.96 1.16 - 20.83 - 26.45 25.37 - 21.05 - 24.08 60 c 26.48 - 20.10 - 26.71 25.89 1.19 - 20. 90 - 23.41 25.29 - 20.84 - 21.89 85 c 26.25 - 20.11 - 25.06 25.63 1.21 - 20.73 - 21.77 25.04 - 20.99 - 20.85 1920 mhz 2045 mhz 2170 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) - 45 c 39.76 22. 33 0.267 40.37 22.66 0.291 40.48 22.73 0.318 - 10 c 40.33 22.21 0.438 40.51 22.57 0.464 40.54 22.63 0.499 25 c 40.72 22.19 0.604 40.86 22.52 0.626 40.97 22.59 0.633 60 c 40.80 22.02 0.735 40.95 22.35 0.761 41.19 22.52 0.788 85 c 41.15 21.95 0.923 41 .02 22.29 0.949 41.93 22.49 0.975 rf performance with operating temperature rf performance with voltage change
4 / 4 www.asb.co.kr august 2009 p lerow tm ALE2045T3 internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determi ned by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and outpu t port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are i n clu d- ed inside the ale module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer w ants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit r ecommended soldering reflow process 20~40 sec 260 c 200 c 150 c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 c/sec) + - ale out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor in out vs size 25x25mm (for ale - t series C 10x10mm) evaluation board layout
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