cystech electronics corp. spec. no. : c468j3 issued date : 2009.07.03 revised date :2010.07.29 page no. : 1/7 CSK640J3 cystek product specification 6amp. schottky barrier rectifiers CSK640J3 features ? excellent power dissipation offers better re verse leakage current and thermal resistance ? low profile surface mount applicati on in order to optimize board space ? metal silicon junction, major carrier conduction ? 6a total (3a per diode leg) ? guardring for over voltage protection ? low power loss, high efficiency ? high surge capability ? high current capability, low forward voltage drop ? ultra-high speed switching ? lead-free parts meet environm ental standard mil-std-19500 /228 mechanical data ? case: molded plastic, to-252 ? mounting position: any ? weight: 0.34 grams approximately ? terminals: pure tin plated, lead-fre e, solderable per mil-std-750 method 2026 ? epoxy: ul 94v-0 rate flame retardant ? polarity : indicated by diode symbol equivalent circuit outline to-252ab to-252aa CSK640J3 a k a a k a
cystech electronics corp. spec. no. : c468j3 issued date : 2009.07.03 revised date :2010.07.29 page no. : 2/7 CSK640J3 cystek product specification maximum ratings and electrical ch aracteristics (per diode leg) ( rating at 25 c ambient temperature unless otherwise sp ecified. single phase, half wave, 60hz, resistive or inductive loa d. for capacitive load, derate current by 20%.) parameter symbol limits units maximum recurrent peak reverse voltage v rrm 40 v maximum rms voltage v rms 28 v maximum dc blocking voltage v dc 40 v maximum instantaneous forward voltage at i f =3a v f 0.55 v per diode 3 maximum average forward rectified current per device i f(av) a 6 non-repetitive peak forward surge current @8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 75 a 0.5 maximum instantaneous reverse current at v r =40v, t a = 25 v r =40v, t a = 125 ma i r 20 maximum thermal resistance, junction-to-case r jc 5 c/w maximum thermal resistance, junction-to-ambient r ja 125 c/w storage temperature range t stg -65 ~ +175 operating junction temperature range t j -55 ~ +125 ordering information device package shipping marking to-252 (pb-free) 3000 pcs / tape & reel CSK640J3 sk640 recommended soldering footprint
cystech electronics corp. spec. no. : c468j3 issued date : 2009.07.03 revised date :2010.07.29 page no. : 3/7 CSK640J3 cystek product specification characteristic curves forward current derating curve 0 1 2 3 4 5 6 7 0 50 100 150 casetemperature---t c () average forward current---i f(av) (a) maximum non-repetitive forward surge current 0 25 50 75 100 11 0 number of cycles at 60hz peak forward surge current---i fsm (a) 1 0 0 tj=25, 8.3ms single half sine wave jedec method forward current vs forward voltage 0.01 0.1 1 10 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 forward voltage---v f (v) instantaneous forward current---i f (a) tj=25, pulse width=300s, 1% duty cycle reverse leakage current vs reverse voltage 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 percent of rated peak reverse voltage---(%) reverse leakage current---i r (ma) tj=75 tj=25c
cystech electronics corp. spec. no. : c468j3 issued date : 2009.07.03 revised date :2010.07.29 page no. : 4/7 CSK640J3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c468j3 issued date : 2009.07.03 revised date :2010.07.29 page no. : 5/7 CSK640J3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. 100 c 150 c 150 c 200 c preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 60-120 seconds 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max.
cystech electronics corp. spec. no. : c468j3 issued date : 2009.07.03 revised date :2010.07.29 page no. : 6/7 CSK640J3 cystek product specification to-252ab dimension 3-lead to-252ab plastic surface mount package cystek package code: j3 marking: sk640 st y le: pin 1. a node 2.common cathode 3. a node *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.087 0.094 2.200 2.400 e1 0.177 0.185 4.500 4.700 a1 0.000 0.005 0.000 0.127 h 0.118 ref 3.000 ref b 0.053 0.065 1.350 1.650 k 0.199 ref 5.000 ref b 0.020 0.028 0.500 0.700 l 0.374 0.390 9.500 9.900 b1 0.028 0.035 0.700 0.900 l1 0.100 0.114 2.550 2.900 c 0.017 0.023 0.430 0.580 l2 0.055 0.070 1.400 1.780 c1 0.017 0.023 0.430 0.580 l3 0.014 0.026 0.350 0.650 d 0.250 0.262 6.350 6.650 p 0.028 ref 0.700 ref d1 0.205 0.213 5.200 5.400 s 0.209 ref 5.300 ref e 0.213 0.224 5.400 5.700 v 0.150 ref 3.800 ref e *0.091 *2.300 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: kfc; pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0
cystech electronics corp. spec. no. : c468j3 issued date : 2009.07.03 revised date :2010.07.29 page no. : 7/7 CSK640J3 cystek product specification to-252aa dimension st y le: pin 1. a node 2.common cathode 3. a node 3-lead to-252aa plastic surface mount package cystek package code: j3 marking: sk640 *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.087 0.094 2.200 2.400 e1 0.177 0.185 4.500 4.700 a1 0.000 0.005 0.000 0.127 h 0.163 ref 4.140 ref b 0.039 0.048 0.990 1.210 k 0.185 ref 4.700 ref b 0.028 0.032 0.710 0.810 l 0.382 0.400 9.700 10.100 b1 0.028 0.035 0.700 0.900 l1 0.100 0.114 2.550 2.900 c 0.017 0.023 0.430 0.580 l2 0.055 0.070 1.400 1.780 c1 0.017 0.023 0.430 0.580 l3 0.014 0.026 0.350 0.650 d 0.255 0.265 6.470 6.730 p 0.026 ref 0.650 ref d1 0.207 0.213 5.250 5.410 s 0.207 ref 5.250 ref e 0.235 0.245 5.970 6.230 v 0.150 ref 3.800 ref e *0.090 *2.286 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: kfc; pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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