high performance surface mount flip chip leds technical data hp sunpower series hsma-h670/h690/h770/ h790/r661/R761 hsmc-h670/h690/h770/ h790/r661/R761 hsml-h670/h690/h770/ h790/r661/R761 features ? high brightness alingap material ? improved reliability through elimination of internal wire bond ? -40 to 85 c operating temperature range ? three small package sizes ? industry standard 2.0 x 1.25 mm and 1.6 x 0.8 mm footprints ? right angle package ? three colors available ? diffused optics ? compatible with ir and through-the-wave solder processes ? available in 8 mm tape on 178 mm (7") and 330 mm (13") diameter reels applications ? keypad backlighting ? lcd backlighting ? symbol backlighting ? front panel indicator description the hsmx-h670/h770, -h690/ h790, and -r661/R761 combine high reliability surface mount flip chip led construction with hps bright alingap material. these very small, bright leds have a high luminous efficiency capable of producing high light output over a wide range of drive currents. the 590 nm amber, 605 nm orange, and 626 nm red colors are available in three compact, low profile packages. the hsmx-h670/h770 has the industry standard 2.0 x 1.25 mm footprint that is excellent for all around use. the hsmx-h690/ h790 has the industry standard 1.6 x 0.8 mm footprint, and its low 0.6 mm profile and wide viewing angle make this led excellent for backlighting applications. the hsmx-r661/R761 has a small 2.1 x 1.3 mm footprint and a low profile 0.7 mm height that makes this part ideal for lcd backlighting and sidelighting applications where space is at a premium. all packages are compatible with ir and convective reflow soldering processes. in addition, these parts are also compatible with through- the-wave soldering processes.
2 device selection guide amber 590 nm orange 605 nm red 626 nm 13" 13" 13" footprint (mm) [1][2] 7" reel reel 7" reel reel 7" reel reel 1.6 x 0.8 x 0.6 hsma-h690 -h790 hsml-h690 -h790 hsmc-h690 -h790 2.0 x 1.25 x 1.1 hsma-h670 -h770 hsml-h670 -h770 hsmc-h670 -h770 2.1 x 1.3 x 0.7 [3] hsma-r661 -R761 hsml-r661 -R761 hsmc-r661 -R761 notes: 1. dimensions in mm. 2. tolerances 0.1 mm unless otherwise noted. 3. right angle package. package dimensions hsmx-h670 series hsmx-h690 series hsmx-r661 series polarity 2.10 0.70 0.30 1.30 1.40 0.80 r 0.50 polarity mark emitted
direction soldering
metallization anode cathode cathode
mark 1.10
(0.043) 0.50 (0.020) 1.27
(0.050) polarity cathode
mark 2.00
(0.079) 1.25
(0.049) 0.40
(0.016) 0.40
(0.016) bottomside cathode mark 0.60 0.30 1.00 polarity 0.80 1.60 bottomside cathode mark topside
cathode
mark cathode
mark 0.45
3 optical characteristics at t a = 25 c peak color, dominant viewing luminous wavelength wavelength angle 2 q 1 / 2 efficacy h v l peak (nm) l d [2] (nm) degrees [3] (lm/w) part no. color typ. typ. typ. hsma-h6x0 amber 592 590 165 480 hsma-r661 hsml-h6x0 orange 607 605 165 370 hsml-r661 hsmc-h6x0 red 638 626 165 197 hsmc-r661 optical characteristics at t a = 25 c (contd) luminous luminous luminous intensity intensity intensity iv (mcd) iv (mcd) iv (mcd) @ i f = 5 ma @ i f = 20 ma @ i f = 2 ma part no. color min. typ. typ. typ. hsma-h6x0 amber 2.5 7.5 35 2.5 hsma-r661 hsml-h6x0 orange 2.5 7.5 35 2.5 hsml-r661 hsmc-h6x0 red 2.5 6.5 30 2.5 hsmc-r661 notes: 1. the dominant wavelength l d is derived from the cie chromaticity diagram and represents the perceived color of the device. 2. q 1 / 2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 3. operation below i f = 1 ma is not recommended. absolute maximum ratings at t a = 25 c parameter max. rating units dc forward current [1] 20 ma power dissipation 50 mw reverse voltage 5 v (i r = 100 m a) operating temperature range -40 to 85 c storage temperature range [2] -40 to 85 c notes: 1. derate linearly as shown in figure 4 for temperatures above 25 c. 2. maximum temperature for tape and reel packaging is 60 c.
4 electrical characteristics at t a = 25 c forward forward reverse capacitance voltage voltage breakdown v r c (pf) v f (volts) v f (volts) (volts) v f = 0, @ i f = 5 ma @ i f = 20 ma @ i r = 100 m a f = 1 mhz part no. color typ. max. typ. max. min. typ. hsma-h670 amber 1.9 2.2 2.0 2.4 5.0 20 hsma-h690 1.9 2.2 2.0 2.4 5.0 20 hsma-r661 1.9 2.2 2.0 2.4 5.0 20 hsml-h670 orange 1.9 2.2 2.0 2.4 5.0 20 hsml-h690 1.9 2.2 2.0 2.4 5.0 20 hsml-r661 1.9 2.2 2.0 2.4 5.0 20 hsmc-h670 red 1.8 2.2 1.9 2.4 5.0 20 hsmc-h690 1.8 2.2 1.9 2.4 5.0 20 hsmc-r661 1.8 2.2 1.9 2.4 5.0 20 electrical characteristics at t a = 25 c (contd) thermal thermal resistance r resistance r part no. color q j-pin ( c/w) q j-a ( c/w) hsma-h670 amber 275 300 hsma-h690 350 400 hsma-r661 350 400 hsml-h670 orange 275 300 hsml-h690 350 400 hsml-r661 350 400 hsmc-h670 red 275 300 hsmc-h690 350 400 hsmc-r661 350 400 figure 1. relative intensity vs. wavelength. wavelength ?nm relative intensity 550 600 650 700 1.0 0.5 0 amber red orange 594 607 630
5 figure 2. forward current vs. forward voltage. figure 4. maximum dc current vs. ambient temperature. figure 5. intensity vs. angle for hsmx-h670/h770 and hsmx-h690/h790. figure 3. relative iv vs. dc forward current (operation below 1 ma not recommended). 0 20 0.5 0.5 2.0 3.0 3.5 50 5 1 i f ?forward current ?ma v f ?forward voltage ?v 1.5 1.0 2.5 2 10 100 0 3 0 5152025 5 4 2 1 relative luminous intensity
(normalized at 5 ma) i f ?forward current ?ma 10 0 20 0 20 60 80 100 15 5 i f ?forward current ?ma t a ?ambient temperature ?? 40 25 10 r q j-a = 300?/w r q j-a = 400?/w 10 100 40 70 20 60 80 30 50 90 normalized intensity angle 0 10 20 30 40 50 60 70 80 90 1.0 .6 .8 .2 .4 figure 6. intensity vs. angle (horizontal) for hsmx-r661/R761. 10 100 40 70 20 60 80 30 50 90 normalized intensity angle 0 10 20 30 40 50 60 70 80 90 1.0 .6 .8 .2 .4
6 figure 7. intensity vs. angle (vertical) for hsmx-r661/R761. figure 8. recommended solder pad patterns. figure 9. recommended ir reflow soldering profile. figure 10. recommended wave solder profile. 10 100 40 70 20 60 80 30 50 90 normalized intensity angle 0 10 20 30 40 50 60 70 80 90 1.0 .6 .8 .2 .4 235? max. 10 sec. max. time temperature pre-heat 125-145? 3?/sec. max. 90 sec. max.
above 183? 3?/sec. max. 250? max. 10 sec. max. time temperature pre-heat 140-160? 3?/sec. max. 90 sec. max.
above 183? 3?/sec. max. 1.1
(0.043) 1.1 (0.043) hsmx-h670/h770 series 1.25
(0.049) 1.25
(0.049) 0.85 0.8 (0.031) 0.80 0.80 hsmx-h690/h790 series 1.4 0.8 1.0 1.0 hsmx-r661/R761 series
7 figure 11. reeling orientation. figure 12. reel dimensions. cathode side printed label user feed direction 2.0
(0.08) 21.0
(0.83) 13.0
(0.51) 1.5
(0.06) typ. 13.0
(0.51) 10.0
(0.39) dim. a 60.0
(2.36) label part no. dim. a hsmx-x6x0
hsmx-x7x0 178 mm (7.0 in.)
330 mm (13.0 in.)
8 figure 14. tape leader and trailer dimensions for hsmx-h670/h770 series. end start there shall be a
minimum of 40 mm
(1.57 inch) of empty
component pockets
sealed with cover
tape. mounted with
components there shall be a
minimum of 40 mm
(1.57 inch) of empty
component pockets
sealed with cover
tape. 150 mm-360 mm
(5.9 - 14.2 inch)
may consist
of carrier
and/or
cover tape. figure 13. tape dimensions, hsmx-h670/h770 series. 8.00 ?0.30
(0.315 ?0.012) user feed
direction 2.44 ?0.10
(0.096 ?0.004) 3.50 ?0.05
(0.138 ?0.002) 1.75 ?0.10
(0.069 ?0.004) 1.30 ?0.10
(0.051 ?0.004) 0.20 ?0.05
(0.008 ?0.002) carrier tape cover tape 1.68 ?0.10
(0.066 ?0.004) 4.00 ?0.10
(0.157 ?0.004) 2.00 ?0.05
(0.079 ?0.002) 4.00 ?0.10
(0.157 ?0.004) 1.50 + 0.10
0
(0.059 + 0.004)
0 cathode
9 figure 15. tape dimensions, hsmx-h690/h790 series. 8.00 ?0.30
(0.315 ?0.012) user feed
direction 1.87 ?0.10
(0.074 ?0.004) 3.50 ?0.05
(0.138 ?0.002) 1.75 ?0.10
(0.069 ?0.004) 0.74 ?0.10
(0.029 ?0.004) 0.20 ?0.05
(0.008 ?0.002) carrier tape cover tape 1.07 ?0.10
(0.040 ?0.004) 2.00 ?0.05
(0.079 ?0.002) 4.00 ?0.10
(0.157 ?0.004) 1.50 + 0.10
0
(0.059 + 0.004)
0 cathode figure 16. tape leader and trailer dimensions for hsmx-h690/h790 series. end start there shall be a
minimum of 40 mm
(1.57 inch) of empty
component pockets
sealed with cover
tape. mounted with
components 150 mm-360 mm
(5.9 - 14.2 inch)
may consist
of carrier
and/or
cover tape.
www.hp.com/go/led for technical assistance or the location of your nearest hewlett-packard sales office, distributor or representative call: americas/canada: 1-800-235-0312 or 408-654-8675 far east/australasia: call your local hp sales office. japan: (81 3) 3335-8152 europe: call your local hp sales office. data subject to change. copyright ? 1999 hewlett-packard co. obsoletes 5968-1097e (8/98) 5968-3197e (2/99) convective ir reflow soldering for more information on ir reflow soldering, refer to application note 1060, surface mounting smt led indicator components. figure 17. tape dimensions for hsmx-rx61. figure 18. tape leader and trailer dimensions. 8.00 ?0.30
(0.315 ?0.012) user feed
direction 2.26 3.50 ?0.05
(0.138 ?0.002) 1.75 ?0.10
(0.069 ?0.004) 1.20 0.20 1.47 4.00 ?0.10
(0.157 ?0.004) 2.00 ?0.05
(0.079 ?0.002) 4.00 ?0.10
(0.157 ?0.004) 1.50 + 0.10
0
(0.059 + 0.004)
0 cathode 1.1 end start there shall be a
minimum of 40 mm
(1.57 inch) of empty
component pockets
sealed with cover
tape. mounted with
components there shall be a
minimum of 40 mm
(1.57 inch) of empty
component pockets
sealed with cover
tape. 150 mm-360 mm
(5.9 - 14.2 inch)
may consist
of carrier
and/or
cover tape.
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