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  mpc9819 rev 3, 09/2005 freescale semiconductor technical data ? freescale semiconductor, in c., 2005. all rights reserved. clock generator for powerquicc and powerpc microprocessors and microcontrollers the mpc9819 is a pll-based clock gen erator specifically designed for freescale microprocessor and microc ontroller applications including the powerpc and powerquicc. this device generates the microprocessor input clock and other microprocesso r system and bus clocks at any one of four output frequencies. these frequencies include t he popular 66- and 133-mhz pci/x bus frequencies. the device offers five low-skew clock outputs plus three reference outputs. the clock input reference is 25 mhz and may be derived from an external source or by the addition of a 25-mhz crystal to the on-chip crystal oscillator. the extended temperatur e range of the mpc9819 supports telecommunication and networking requirements. features ? 5 lvcmos outputs for proce ssor and other system circuitry ? 3 buffered 25-mhz reference clock outputs ? crystal oscillator or external reference input ? 25-mhz input reference frequency ? selectable output frequencies in clude: 66, 100, 125, or 133 mhz ? low cycle-to-cycle and period jitter ? package: 20-lead ssop ? 3.3-v supply ? supports computing, networking, and telecommunications applications ? ambient temperature range: ?40c to +85c functional description the mpc9819 uses a pll with a 25-mhz input reference frequen cy to generate a single bank of five configurable lvcmos output clocks. the ou tput frequency of this bank is config urable to eith er 66, 100, 125, or 133 mh z by two fsel pins. the 25- mhz reference may be either an external fr equency source or a 25-mhz crystal. the 25-m hz crystal is directly connected to the xtal_in and xtal_out pins with no additional components requir ed. an external reference may be applied to the xtal_in pin with the xtal_out pin left floating. the input reference, whether provided by a crystal or an external input, is also direc tly buffered to a second bank of three lvcmos outputs. these outputs may be used as the clock source for processor i/o applications such as an ethernet phy. the mpc9819 is packaged in a 20-lead ssop package. mpc9819 microprocessor clock generator en suffix 20 ssop package pb-free package case 1461-02 sd suffix 20 ssop package case 1461-02
advanced clock drivers devices 2 freescale semiconductor mpc9819 figure 1. mpc9819 logic diagram table 1. pin configurations pin i/o type function qa0, qa1, qa2, qa3, qa4 output lvcmos clock outputs qref0, qref1, qref2 output lvcmos reference output (25 mhz) xtal_in input lvcmos crystal oscillator input pin xtal_out output lvcmos crystal oscillator output pin fsel0, fsel1 input lvcmos configures bank a clock output frequency (pull-up) mr/oe input lvcmos enables all outputs (pull-down) v dd ? ? 3.3-v supply gnd ? ? ground table 2. function table control default 00 01 10 11 fsel0, fsel1 11 66 mhz 125 mhz 100 mhz 133 mhz ref pll 400 or 500 mhz qa0 qa1 qa2 qa4 xtal_in osc xtal_out fsel0 qref0 fsel1 qa3 qref1 qref2 data generator mr/oe 66,100,125,133 25 mhz mhz
advanced clock drivers devices freescale semiconductor 3 mpc9819 figure 2. mpc9819 20-lead ssop package pinout (top view) mpc9819 operation crystal oscillator the mpc9819 features a fully integrated pierce oscillator to minimize system implementa tion costs. other than the addition of a 25-mhz crystal, no external components are required.the crystal selection should be: 25 mhz, parallel resonant type with a load specification of c l = 10 pf. crystals with a load specification of c l = 20 pf may be used, however, the reference frequency may be higher than the specified 25 mhz. externally supplied capacitors on both the xtal_in and xtal_out pins may be used to trim the frequency as desired. the crystal should be located as close to the mpc9819 xtal_in and xtal_out pins as possible to avoid any board level parasitic. power supply bypassing the mpc9819 should have all v dd pins bypassed with 0.01 capacitors and a minimum of one 1.0 capacitor for the overall package. all capacitors should be located as close to the ssop pins as possible. external clock source an external reference source of 25 mhz may be applied to the xtal_in pin. in this mode of operation, the xtal_out pin should be left floating. xtal_in xtal_out fsel0 v dd fsel1 qref2 gnd qref1 qref0 v dd v dd qa4 qa3 gnd qa2 qa1 v dd qa0 mr/oe gnd 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 table 3. crystal specifications parameter value crystal cut fundamental at cut resonance parallel resonance shunt capacitance (c o ) 5?7 pf load capacitance (c l ) 10 pf equivalent series resistance (esr) 20?60 ?
advanced clock drivers devices 4 freescale semiconductor mpc9819 table 4. absolute maximum ratings (1) 1. absolute maximum continuous ratings are those maximum val ues beyond which damage to the device may occur. exposure to these conditions or conditions beyond t hose indicated may adversely affect device reliabi lity. functional operat ion at absolute-maxim um-rated conditions is not implied. symbol characteristics min max unit condition v dd supply voltage ?0.3 3.8 v i in dc input current ? 20 ma i out dc output current ? 75 ma t s storage temperature ?65 125 c table 5. general specifications symbol characteristics min typ max unit condition v tt output termination voltage ? v dd 2 ?v mm esd protection (machine model) 200 ? ? v hbm esd protection (human body model) 2000 ? ? v lu latch-up immunity 200 ? ? ma c in input capacitance ? 4 ? pf inputs c pd power dissipation capacitance ? 8.5 ? pf ja thermal resistance (junction-to-ambient) ? 80.8 ? c/w t c ambient temperature ?40 85 c table 6. dc characteristics (v dd = 3.3 v 5%, t a = ?40 to +85c) symbol characteristics min typ max unit condition v ih input high voltage (xtal_in) 2.4 ? v dd + 0.3 v input threshold = v dd /2 v ih input high voltage 2.0 ? v dd + 0.3 v v il input low voltage ? ? 0.8 v lvcmos i in input current (1) 1. inputs have pull-down resistors affecting the input current. ? ? 150 av in = v ddl or gnd v oh output high voltage 2.4 ? ? v i oh = ?12 ma v ol output low voltage ? ? 0.4 v i ol = 12 ma z out output impedance ? 14 ? ? i dd maximum supply current f a = 66 mhz f a = 133 mhz ? ? 23 32 40 50 ma 25 mhz reference frequency i ddbase base supply current (2) (for dynamic power dissipation calculation) 2. p d = (v dd * i ddbase ) + 5 (v dd 2 ) * c pd * f a . ?14?ma
advanced clock drivers devices freescale semiconductor 5 mpc9819 figure 3. mpc9819 ac test reference (lvcmos outputs) table 7. ac characteristics (1) (2) (v dd = 3.3 v 5%, t a = ?40 to +85c) 1. ac characteristics are design targets and pending characterization. 2. ac characteristics apply for par allel output termination of 50 ? to v tt . symbol characteristics min typ max unit condition input and output timing specification f ref input reference frequency 25 mhz input xtal input 25 25 mhz mhz f vco vco frequency range fsel0, fsel1 = 00,01,11 fsel0, fsel1 = 10 400 500 mhz mhz f mcx output frequency (qax) fsel0, fsel1 = 00 fsel0, fsel1 = 10 fsel0, fsel1 = 01 fsel0, fsel1 = 11 output frequency (qrefx) 66.66 100 125 133.33 25 ? ? ? ? ? mhz mhz mhz mhz mhz pll locked f refpw reference input pulse width 10 ? ? ns @ 25 mhz dc output duty cycle 45 50 55 % f out output frequency accuracy crystal (3) external reference 3. based upon recommended crystal specificat ions as outlined in operation section. ? ? 100 0 ppm ppm with recommended crystal see table 3 pll specifications bw pll closed loop bandwidth (4) 4. ?3 db point of pll transfer characteristics. 500 khz t lock maximum pll lock time 10 ms skew and jitter specifications t sk(o) output-to-output skew (within a bank) 75 ps t jit(cc) cycle-to-cycle jitter 150 ps @ 25 mhz input reference q a output t jit(per) period jitter 100 ps @ 25 mhz input reference q a output t r , t f output rise/fall time 1 ns 20% to 80% z = 50 ? r t = 50 ? v tt z = 50 ? v tt dut mpc9819 pulse generator z = 50 ? r t = 50 ?
advanced clock drivers devices 6 freescale semiconductor mpc9819 table 8. mpc9819 pin list pin description pin description 1 xtal_in 11 gnd 2 xtal_out 12 mr/oe 3 fsel0 13 qa0 4v dd 14 v dd 5 fsel1 15 qa1 6qref2 16qa2 7gnd 17gnd 8qref1 18qa3 9qref0 19qa4 10 v dd 20 v dd
advanced clock drivers devices freescale semiconductor 7 mpc9819 package dimensions case 1461-02 issue a 20 ssop package page 1 of 3
advanced clock drivers devices 8 freescale semiconductor mpc9819 package dimensions case 1461-02 issue a 20 ssop package page 2 of 3
advanced clock drivers devices freescale semiconductor 9 mpc9819 package dimensions case 1461-02 issue a 20 ssop package page 3 of 3
how to reach us: home page: www.freescale.com e-mail: support@freescale.com usa/europe or locations not listed: freescale semiconductor technical information center, ch370 1300 n. alma school road chandler, arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) support@freescale.com japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com mpc9819 rev. 3 09/2005 information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2005. all rights reserved.


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