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  1. general description the BGA3031 is an upstream amplifier meeting the data over cable service interface specifications (docsis 3.0). it is designed fo r cable modem, catv set top box and voip modem applications. the device operates from 5 mhz to 85 mhz. the BGA3031 provides 58 db gain control range in 1 db increments with high incremental accuracy. its maximum gain setting delivers 34 db voltage gain and a superior linear performance. it supports high output levels up to 67 dbmv while mini mizing distortion and output noise levels. the BGA3031 operates at 5 v supply. the gain is controlled via a 3-wire serial interface. the current consumption can be reduced in 4 steps via the serial interface. this enables the user to optimize between dc power efficiency and linearity. in addition the current is automatically reduced at lower ga in settings while preserving the linearity performance. in disable mode the device draws typical 6 ma wh ile it still can be prog rammed to new gain and current settings. the BGA3031 is housed in 20 pins 5 mm ? 5 mm leadless hvqfn package. 2. features and benefits ? 58 db gain control range in 1 db steps using a 3-wire serial interface ? 5 mhz to 85 mhz frequency operating range ? ? 0.2 db incremental gain step accuracy ? maximum voltage gain 34 db ? excellent imd3 of ? 70 dbc at 64 dbmv output power ? excellent second harmonic level of ? 80 dbc at 64 dbmv output power ? excellent third harmonic level of ? 67 dbc at 64 dbmv output power ? excellent noise figure of 3.5 db at maximum gain ? 5 v single supply operation ? excellent esd protection at all pins ? unconditionally stable ? compliant to directive 2002/ 95/ec, regarding restriction of hazardous substances (rohs) 3. applications ? docsis 3.0 cable modems ? voip modems ? set-top boxes BGA3031 docsis 3.0 upstream amplifier rev. 1 ? 15 august 2013 product data sheet + 9 4 ) 1  
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 2 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier 4. quick reference data [1] voltage gain does not include loss due to input and output transformers. [2] p i = 30 dbmv. 5. ordering information table 1. quick reference data typical values at v cc = 5 v; current setting = 3; t case = 25 ? c; z i = 200 ? : z o = 75 ? , unless otherwise specified. symbol parameter conditions min typ max unit i cc supply current transmit-enable mode; tx_en = high - 325 - ma transmit-disable mode; tx_en = low - 6.0 - ma g v voltage gain gain code = 111111 [1] [2] -34- db nf noise figure transmit-enable mode; gain code = 111111 - 3.5 - db ? 2h second harmonic level p i = 30 dbmv; p l = 64 dbmv into 75 ? differential impedance - ? 80 - dbc ? 3h third harmonic level p i = 30 dbmv; p l = 64 dbmv into 75 ? differential impedance - ? 67 - dbc imd3 third-order intermodulation distortion p i = 27 dbmv per tone; p l = 61 dbmv per tone into 75 ? differential impedance - ? 70 - dbc p l(1db) output power at 1 db gain compression signal - 74 - dbmv table 2. ordering information type number package name description version BGA3031 hvqfn20 plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 ? 5 ? 0.85 mm sot662-1
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 3 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier 6. functional diagram 7. pinning information 7.1 pinning fig 1. functional diagram ddd &/. '$7$ qf qf 9 && qf qf qf 287b3 qf   287b1 qf *1' ,1b3 ,1b1 qf *1' &6 7;b(1 9 && 6(5,$/ ,17(5)$&( $77 fig 2. pin configuration %*$ whuplqdo lqgh[duhd *1'  qf ,1b3  287b3 ,1b1  qf qf  287b1 *1'  qf &/.  qf  '$7$  qf &6  qf 7;b(1  9 && 9 &&  qf ddd
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 4 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier 7.2 pin description 8. functional description 8.1 logic programming the programming word is set through a shift register via the data, clock and chip select lines. the data is entered in order with the most significant bit (msb) first and the least significant bit (lsb) last. the chip select line must be low for the duration of the data entry, then set high to latch the shift regist er. the rising edge of the clock pulse shifts each data value into the register. [1] for current bit settings see table 6 . [2] for gain bit settings see table 5 . table 3. pin description symbol pin description gnd 1 ground in_p 2 amplifier input + in_n 3 amplifier input ? n.c. 4 not connected gnd 5 ground clk 6 clock data 7 data cs 8 chip select tx_en 9 transmit enable v cc 10 supply voltage for serial interface n.c. 11 not connected out_n 12 amplifier output ? n.c. 13 not connected out_p 14 amplifier output + n.c. 15 not connected n.c. 16 not connected v cc 17 supply voltage for variable gain amplifier (vga) n.c. 18 not connected n.c. 19 not connected n.c. 20 not connected paddle ground table 4. programming register data bit 11 10 9 8 7 6 5 4 3 2 1 0 function register address current setting [1] attenuation (gain) setting [2] initialize000100000000 set gain 0 0 0 0 c[1] c[0] g[5] g[4] g[3] g[2] g[1] g[0]
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 5 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier 8.2 register settings 8.2.1 register address only addresses 0000 an d 0001 are used. using any othe r addresses will not affect the vga. 8.2.2 gain/attenuator setting the gain shall be controlled via the 3-wire bus. data bits d0 through d5 set the gain/attenuator level, with 111111 being the min attenuation setting, and 000101 being the max attenuation setting. a new gain/attenuator setting can be loaded while the vga is on (transmit-enable), but shall not take effect until transmit-enable transitions from low to high. [1] with every increment of the gain setting between 000110 (6) and 111111 (63) the ty pical gain will increase accordingly. 8.2.3 output stage current setting the current (of the output stage) shall be controlled via the 3-wire bus. data bits d6 and d7 set the current. setting 11 will set the maximum current for maximum linearity. the current can be lowered for improved efficiency at lower output power levels, or lower linearity requirements. setting 00 will set the minimum cu rrent. a new current setting can be loaded while the vga is on (transmit-enable), but shall not take effect until transmit-enable transiti ons from low to high. fig 3. serial data input timing ddd w g !?v ' $7$ &/. 5)rxw 7;b(1 &6 '  '  06% table 5. gain settings gain setting g[5:0] typical gain binary notation decimal notation (db) 000000 to 000101 0 to 5 ? 24 000110 [1] 6 [1] ? 23 111110 [1] 62 [1] 33 111111 [1] 63 [1] 34
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 6 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier the current is automatically reduced at lowe r gain settings while preserving the linearity performance. 8.3 tx enable / tx disable the amplifier can be disabled or enabled by making tx_en (pin 9) low or high. a low to high tx enable transition will activate new programed settings. if no new settings are programmed the last programmed setting will be re-activated. 9. limiting values table 6. supply current settings at gain setting 63. current setting c[1:0] typical supply current binary notation decimal notation (ma) 00 0 215 01 1 260 10 2 290 11 3 325 table 7. supply current versus gain setting gain setting g[5:0] typical current (ma) binary notation decimal notation current setting c[1:0] current setting c[1:0] current setting c[1:0] current setting c[1:0] 00 (decimal = 0) 01 (decimal = 1) 10 (decimal = 2) 11 (decimal =3) 111111 63 215 260 290 325 110111 55 215 260 290 325 110110 54 165 190 200 215 110001 49 165 190 200 215 110000 48 135 150 160 160 101000 40 135 150 160 160 100111 39 120 125 125 125 000101 5 120 125 125 125 table 8. limiting values in accordance with the absolute ma ximum rating system (iec 60134). absolute maximum ratings are given as limiting values of st ress conditions during operation, that must not be exceeded under the worst probable conditions. symbol parameter conditions min max unit v cc supply voltage -6.0v v i input voltage on pin in_p ? 0.5 +6.0 v on pin in_n ? 0.5 +6.0 v on pin clk [1] ? 0.5 +6.0 v on pin data [1] ? 0.5 +6.0 v on pin cs [1] ? 0.5 +6.0 v on pin tx_en [1] ? 0.5 +6.0 v on pin out_n ? 0.5 +6.0 v on pin out_p ? 0.5 +6.0 v
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 7 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier [1] all digital pins may not exceed v cc as the internal esd circuit can be damaged. to pr event this it is recommended that control pins are limited to a maximum of 5 ma. 10. thermal characteristics [1] simulated using final element method model resemb ling the device mounted on the application board. see section 13 . [2] device mounted on application board. 11. static characteristics [1] voltage on the control pins. p i(max) maximum input power - 40 dbmv t stg storage temperature ? 65 +150 ?c t j junction temperature - 150 ?c v esd electrostatic discharge voltage human body model (hbm); according jedec standard 22-a114e -4000v charged device model (cdm); according jedec standard 22-c101b -2000v table 8. limiting values ?continued in accordance with the absolute ma ximum rating system (iec 60134). absolute maximum ratings are given as limiting values of st ress conditions during operation, that must not be exceeded under the worst probable conditions. symbol parameter conditions min max unit table 9. thermal characteristics symbol parameter conditions typ unit r th(j-bop) thermal resistance from junction to bottom of package in free air [1] 14 k/w r th(j-a) thermal resistance from junction to ambient in free air [2] 35 k/w table 10. characteristics typical values at v cc = 5 v; current setting = 3; t case = 25 ? c; z i = 200 ? : z o = 75 ? , unless otherwise specified. symbol parameter conditions min typ max unit i cc supply current transmit-enable mode; tx_en = high - 325 - ma transmit-disable mode; tx_en = low - 6.0 - ma v ih high-level input voltage [1] 2.0 - v cc +0.6 v v il low-level input voltage [1] 0- 0.8 v p power dissipation - 1.625 w
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 8 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier 12. dynamic characteristics [1] voltage gain does not include loss due to input and output transformers. [2] p i = 30 dbmv. table 11. characteristics typical values at v cc = 5 v; current setting = 3; z i = 200 ? : z o = 75 ? , t case = 25 ? c, unless otherwise specified. symbol parameter conditions min typ max unit g v voltage gain gain code = 111111 [1] [2] -34- db gain code = 000000 [1] [2] - ? 24 - db g flat gain flatness f = 5 mhz to 42 mhz [2] - ? 0.4 - db f = 5 mhz to 85 mhz [2] - ? 0.6 - db g step gain step [2] -1.0- db e g(dif) differential gain error [2] - ? 0.2 - db r i(dif) differential input resistance - 200 - ? r o(dif) differential output resistance - 75 - ? f range frequency range 5 - 85 mhz p n noise power transmit-disable mode; tx_en = low; any bandwidth = 160 khz from f=5mhzto85mhz - ? 69 - dbmv ? isol isolation transmit-disable mode; tx_en = low; f=85mhz - ? 90 - db nf noise figure transmit mode; gain code = 111111 - 3.5 - db transmit mode; gain code = 101110 - 6.5 - db t sw(g) gain switch time transmit-disable/transmit-enable transient duration -1.8- ? s v os overshoot voltage transmit-disable/transmit-enable transient step size 55 dbmv output power - 80 - mv(p-p) 49 dbmv output power - 50 - mv(p-p) 43 dbmv output power - 25 - mv(p-p) 37 dbmv output power - 5 - mv(p-p) ? 31 dbmv output power - 5 - mv(p-p) ? 2h second harmonic level p i = 30 dbmv; p l = 64 dbmv into 75 ? differential impedance - ? 80 - dbc ? 3h third harmonic level p i = 30 dbmv; p l = 64 dbmv into 75 ? differential impedance - ? 67 - dbc imd3 third-order intermodulation distortion p i = 27 dbmv per tone; p l = 61 dbmv per tone into 75 ? differential impedance - ? 70 - dbc p l(1db) output power at 1 db gain compression cw signal - 74 - dbmv
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 9 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier 13. application information 13.1 external components matching the balanced output of the chip to a single-ended 75 ? load is accomplished using a 1 : 1 ratio transformer. in addition to the balanced to single-ended conversion. for measurements in a 50 ? system r7 and r8 are added for impedance transformation from 75 ? to 50 ? . r7 and r8 are not required in the final application. the transformer also cancels even mode distortion products and common mode signals, such as the voltage transients that occur while enabling and disabling the amplifiers. external capacitors are needed for the function ality of the circuit, the pins are internal nodes in the output amplifier. fig 4. external components ddd 9 && 9 && 9 && 9 && 9 && ; 7 5)b,1  5)b287   5 ; 5 & & ; 5 & & 5 & 5 5 5 5                 qf 287b1 qf 287b3 qf *1' qf ,1b1 ,1b3 *1' &/. '$7$ &6 7;b(1 9 && qf qf qf 9 && qf ; & 9 *1' 9 && 7
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 10 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier 13.2 graphs table 12. list of components for application diagram, see figure 4 . component description value size supplier: part no. c1, c2, c3, c4 capacitor 10 nf smd 0603 c5 capacitor 100 nf smd 0603 c6 capacitor 10 ? f smd 1206 r1, r6 resistor 0 ? smd 0603 r2, r3 resistor 0 ? smd 0805 r4, r5 resistor 4.7 ? smd 0603 r7 resistor 43.3 ? smd 0603 r8 resistor 86.6 ? smd 0603 t1 input balun - - toko: #617db-1714 t2 output balun - - m/a-com: maba-009572-cf18a0 x1 2-pin header - - x2, x3 sma connector - - x4 10-pin header - - fci: minitek v cc = 5 v; current setting = 3; t case = 25 ? c; p i =30dbmv. (1) f = 5 mhz (2) f = 42 mhz (3) f = 85 mhz v cc = 5 v; current setting = 3; t case = 25 ? c; p i =30dbmv. (1) gain setting = 5 (2) gain setting = 20 (3) gain setting = 36 (4) gain setting = 50 (5) gain setting = 63 fig 5. voltage gain as a function of gain setting; typical values fig 6. voltage gain as a function of frequency; typical values ddd              jdlqvhwwlqj * y * y g% g% g%          ddd            i 0+] * y * y g% g% g%               
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 11 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier v cc = 5 v; current setting = 3; t case = 25 ? c; p i =30dbmv. (1) f = 5 mhz (2) f = 42 mhz (3) f = 85 mhz v cc = 5 v; p i = 30 dbmv; p l = 64 dbmv; current setting = 3; gain setting = 63. (1) t case = ?10 ? c (2) t case = +25 ? c (3) t case = +85 ? c fig 7. differential gain error as a function of gain setting; typical values fig 8. second harmonic level as a function of frequency; typical values v cc = 5 v; p i = 30 dbmv; p l = 64 dbmv; current setting = 3; gain setting = 63. (1) t case = ? 10 ? c (2) t case = +25 ? c (3) t case = +85 ? c v cc = 5 v; p i = 27 dbmv per tone; p l = 61 dbmv per tone; current setting = 3; gain setting = 63. (1) t case = ?10 ? c (2) t case = +25 ? c (3) t case = +85 ? c fig 9. third harmonic level as a function of frequency; typical values fig 10. third order intermodulation distortion as a function of frequency; typical values ddd             jdlqvhwwlqj ( * gli * gli ( * gli g% g% g%          ddd              i 0+] . + + . + g%f g%f g%f          ddd            i 0+] . + + . + g%f g%f g%f          ddd             i 0+] ,0' ,0' ,0' g%f g%f g%f         
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 12 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier v cc = 5 v; p i = 30 dbmv per tone; p l = 64 dbmv per tone; current setting = 3; gain setting = 63. (1) t case = ? 10 ? c (2) t case = +25 ? c (3) t case = +85 ? c v cc = 5 v; current setting = 3; t case = 25 ? c; p i =30dbmv. (1) gain setting = 39 (2) gain setting = 48 (3) gain setting = 54 (4) gain setting = 63 fig 11. third order intermodulation distortion as a function of frequency; typical values fig 12. output power at 1 db gain compression as a function of frequency; typical values t case = 25 ? c; v cc = 5 v; f = 85 mhz; gain setting = 63. (1) current setting = 0 (2) current setting = 1 (3) current setting = 2 (4) current setting = 3 t case = 25 ? c; v cc = 5 v; current setting = 3. (1) f = 5 mhz (2) f = 42 mhz (3) f = 85 mhz fig 13. output power as a function of input power; typical values fig 14. noise figure as a function of gain setting; typical values ddd            i 0+] ,0' ,0' ,0' g%f g%f g%f          ddd            i 0+] 3 / g% / g% 3 / g% g%p9 g%p9 g%p9             ddd               3 l  g%p9 3 / 3 / g%p9 g%p9 g%p9             ddd               jdlqvhwwlqj 1) 1) 1) g% g% g%         
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 13 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier f = 45 mhz; v cc = 5 v; current setting = 3. (1) t case = ? 10 ? c (2) t case = +25 ? c (3) t case = +85 ? c t case = 25 ? c; v cc = 5 v. (1) current setting = 0 (2) current setting = 1 (3) current setting = 2 (4) current setting = 3 fig 15. noise figure as a function of gain setting; typical values fig 16. supply current as a function of gain setting; typical values t case = 25 ? c; v cc = 5 v; current setting = 3. (1) gain setting = 20 (2) gain setting = 44 (3) gain setting = 52 (4) gain setting = 60 t case = 25 ? c; v cc = 5 v; current setting = 3. (1) gain setting = 5 (2) gain setting = 36 (3) gain setting = 63 fig 17. supply current as a function of case temperature; typical values fig 18. input return loss as a function of frequency; typical values ddd               jdlqvhwwlqj 1) 1) 1) g% g% g%          ddd              jdlqvhwwlqj , && && , && $ $ $             ddd               7 fdvh  ?& , && && , && $ $ $             ddd            i 0+] 5/ 5/ lq lq 5/ lq g% g% g%         
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 14 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier t case = 25 ? c; v cc = 5 v; current setting = 3. (1) gain setting = 5 (2) gain setting = 63 (3) amplifier disabled (tx_en low) fig 19. output return loss as a function of frequency; typical values ddd               i 0+] 5/ 5/ rxw rxw 5/ rxw g% g% g%         
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 15 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier 14. package outline fig 20. package outline sot662-1 (hvqfn20) 0.65 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 5.1 4.9 d h 3.25 2.95 y 1 5.1 4.9 3.25 2.95 e 1 2.6 e 2 2.6 0.38 0.23 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot662-1 mo-220 - - - - - - 0.75 0.50 l 0.1 v 0.05 w 0 2.5 5 mm scale sot662-1 hvqfn20: plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 x 5 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 61 0 20 16 15 11 5 1 x d e c b a e 2 terminal 1 index area terminal 1 index area 01-08-08 02-10-22 ac c b v m w m e (1) d (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included.
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 16 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier 15. handling information 15.1 moisture sensitivity 16. abbreviations 17. revision history table 13. moisture sensitivity level test methodology class jesd-22-a113 1 table 14. abbreviations acronym description catv community antenna television cw continuous wave esd electrostatic discharge hvqfn heatsink very thin quad flat pack no leads sma subminiature version a smd surface-mounted device tx transmission voip voice over internet protocol table 15. revision history document id release date data sheet status change notice supersedes BGA3031 v.1 20130815 product data sheet - -
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 17 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier 18. legal information 18.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 18.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 18.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
BGA3031 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2013. all rights reserved. product data sheet rev. 1 ? 15 august 2013 18 of 19 nxp semiconductors BGA3031 docsis 3.0 upstream amplifier export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 18.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 19. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors BGA3031 docsis 3.0 upstream amplifier ? nxp b.v. 2013. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 15 august 2013 document identifier: BGA3031 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 20. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 7 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 7.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 functional description . . . . . . . . . . . . . . . . . . . 4 8.1 logic programming . . . . . . . . . . . . . . . . . . . . . . 4 8.2 register settings . . . . . . . . . . . . . . . . . . . . . . . . 5 8.2.1 register address . . . . . . . . . . . . . . . . . . . . . . . 5 8.2.2 gain/attenuator setting . . . . . . . . . . . . . . . . . . . 5 8.2.3 output stage current setting . . . . . . . . . . . . . . . 5 8.3 tx enable / tx disable . . . . . . . . . . . . . . . . . . . 6 9 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 thermal characteristics . . . . . . . . . . . . . . . . . . 7 11 static characteristics. . . . . . . . . . . . . . . . . . . . . 7 12 dynamic characteristics . . . . . . . . . . . . . . . . . . 8 13 application information. . . . . . . . . . . . . . . . . . . 9 13.1 external components . . . . . . . . . . . . . . . . . . . . 9 13.2 graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 14 package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 15 handling information. . . . . . . . . . . . . . . . . . . . 16 15.1 moisture sensitivity . . . . . . . . . . . . . . . . . . . . . 16 16 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 17 revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 18 legal information. . . . . . . . . . . . . . . . . . . . . . . 17 18.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 18.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 18.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 18.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 19 contact information. . . . . . . . . . . . . . . . . . . . . 18 20 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19


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