dip sockets molded dip sockets closed frame and open frame 5 energy way , w est w arwic k, ri 02893 usa t el: 800.424.9850 | 401.823.5200 f ax: 401.823.8723 inf o@adv anced.com | www .adv anced.com ca t16-preview06 re v. 1/06 14 products shown covered by patents issued and/or pending. specifications subject to change without notice. inch/(mm) 14 table of models descr iption: closed f r ame (rds) mater ial: high t emp . liquid cr ystal p olymer (lcp)inde x: -40c to 260c (-40f to 500f) descr iption: open f r ame (rls) mater ial: high t emp . liquid cr ystal p olymer (lcp)inde x: -40c to 260c (-40f to 500f) .050 (1.27) .125 (3.18) how to order rds 3 16 - 01 m g contact plating terminal plating terminal type body type rohs compliant: rds - new hi-tempclosed frame molded rls - new hi-temp open frame molded number of pins closed frame 8 - 40open frame 8 - 64 see options on next page rohs compliant: g - goldm - matte tin t - tin/lead rohs compliant: g - goldt - tin/lead dip spacing 3 - .300/(7.62mm)4 - .400/(10.16mm) 6 - .600/(15.24mm) 9 - .900/(22.86mm)* *open frame only descr iption: p eel-a-w a y ? (ks) mater ial: p olyimide film inde x: -269c to 400c (-452f to 752f) f or more inf or mation, ref er to the p eel-a-w ay ? dip soc k ets pages . polyimide film .005(.13) rds replaces ds and hds . rls replaces ls and hls . options tape sealant - add 3m to end of part number ? remo v ab le tape seal protects plated contact in harsh en vironments ? sealed soc k et will not allo w dir t and other contaminants to enter soc k et chamber and become entr apped behind contact f ingers ? spr a y flux without contaminating contact area note: t erminals plated with matte t in are available only with gold plated cont act s. quick-t urn delivery is not available on product s with matte t in plating. specifications: terminals: brass - copper alloy(c36000) astm-b-16 contacts: ber yllium copper - copper alloy (c17200) astm-b-194 solder preform: standard: 63sn/37pblead-free: 95.5sn/4.0ag/0.5cu plating: g - gold over nickelm - matte t in over nickel t - t in/lead over nickel gold per mil-g-45204matte t in per astm545-97 t in/lead per mil-p-81728 nickel per qq-n-290 features: ? multiple finger contact on allsockets assures maximum reliability . ? t apered entr y for ease of insertion. ? closed bottom sleeve for 100%anti-wicking of solder . ? t o fit .100/(2.54mm) pitch. ? easily customized to fit yourapplication. material silicone bac k ed p olyimide film, -74c to 260c (-100f to 500f) inter mittent to 371c (700f)
molded dip sockets closed frame and open frame dip sockets 5 energy way , w est w arwic k, ri 02893 usa t el: 800.424.9850 | 401.823.5200 f ax: 401.823.8723 inf o@adv anced.com | www .adv anced.com ca t16-preview06 re v. 1/06 products shown covered by patents issued and/or pending. specifications subject to change without notice. inch/(mm) 22 .400 (10.16) .500 (12.70) 1.100 (27.54) 24 .400 (10.16) .500 (12.70) 1.200 (30.48) 24 .600 (15.24) .700 (17.78) 1.200 (30.48) 28 .600 (15.24) .700 (17.78) 1.400 (35.56) 32 .600 (15.24) .700 (17.78) 1.600 (40.64) 40 .600 (15.24) .700 (17.78) 2.000 (50.80) 48* .600 (15.24) .700 (17.78) 2.400 (60.96) 64* .900 (22.86) 1.000 (25.40) 3.200 (81.28) 8 .300 (7.62) .400 (10.16) .400 (10.16) 14 .300 (7.62) .400 (10.16) .700 (17.78) 16 .300 (7.62) .400 (10.16) .800 (20.32) 18 .300 (7.62) .400 (10.16) .900 (22.86) 20 .300 (7.62) .400 (10.16) 1.000 (25.40) 22 .300 (7.62) .400 (10.16) 1.100 (27.94) 24 .300 (7.62) .400 (10.16) 1.200 (30.48) 28 .300 (7.62) .400 (10.16) 1.400 (35.56) 15 .165 (4.19) .275 (6.99) .020 dia. (.51) standard quick-turn terminals t ype -01 t ype -29 t ype -30 t ype -51 lo w prof ile solder t ail .165 (4.19) .125 (3.18) .020 dia. (.51) .165 (4.19) .170 (4.32) .020 dia. (.51) .130 (3.30) .110 (2.79) .020 dia. (.51) lo w prof ile solder t ail lo w prof ile solder t ail lo w prof ile solder t ail t ype -04 t ype -49 .120 (3.05) .110 (2.79) .028 dia. (.71) .095 (2.41) .095 (2.41) .028 dia. (.71) solder preform terminals .072 dia. (1.83) .020 dia. (.51) .110 (2.79) .130 (3.30) solder preform .072 dia. (1.83) .165 (4.19) .125 (3.18) .020 dia. (.51) solder preform tin/lead: t ype -150 tin/lead: t ype -151 lead-free: t ype -811 lead-free: t ype -812 t ype -237 .052 dia. (1.32) .155 (3.94) dimensional information b c a .125 (3.18) c a .050* (1.27) b closed frame open frame # of pins a b c intrusive reflow application: ? combines the labor of socketloading and solder application into one operation. ? eliminates the use of solder pasteand screening operation. ? eliminates solder bridges and/orsolder shorts due to excess solder . ? ensures a reliable solder joint withcontrolled solder volume. ? ideal for sur face mount and mixed technology applications. ? for custom solder preformterminal applications consult factor y. # of pins a b c the dimensions in b lue are f or open f r ame only . *soc k et body thic kness is .100/(2.54) f or 48 and 64 positions . ultr a lo w prof ile not f or use with closed f r ame super lo w prof ile not f or use with closed f r ame surf ace mount additional standard and custom terminals available.see t erminals section online or consult factor y. available online: ? rohs qualification t est report pc board preform aftersolder flow solder preform
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