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description precision optical performance alingap ii (aluminum indium gallium phosphide) leds offer superior light output for excellent readability in sunlight and dependable performance. the alingap ii technology provides extremely stable light output over long periods of time. these led lamps are untinted, nondiffused, t-1 3 / 4 packages incorporating second generation optics which produce well defined radiation patterns at specific viewing cone angles. these lamps are made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance performance in outdoor signal and sign applications. the maximum led junction temperature limit of +130 c enables high temperature operation in bright sunlight conditions. the epoxy contains both uv-a and uv-b inhibitors to reduce the effects of long term exposure to direct sunlight. features well defined spatial radiation patterns viewing angles: 15 , 23 , 30 high luminous output colors: 592 nm amber 617 nm reddish-orange 630 nm red high operating temperature: t jled =+ 130 c superior resistance to moisture benefits viewing angles match traffic management requirements colors meet automotive and traffic signal specifications superior light output performance in outdoor environments suitable for autoinsertion into pc boards applications traffic management: traffic signals work zone warning lights variable message signs commercial outdoor advertising: signs marquees automotive: exterior and interior lights hlmp-elxx hlmp-ehxx hlmp-edxx pr ecision optical performance alingap ii led lamps data sheet
2 t-1 3 / 4 (5 mm) precision optical performance alingap ii led lamps selection guide typical viewing color and luminous angle dominant intensity iv (mcd) [3,4,5] 2 q 1 / 2 wavelength lamps without standoffs lamps with standoffs @ i(f) = 20 ma (deg.) [2] (nm), typ. [1] (outline drawing a) (outline drawing b) min. max. hlmp-el16-tw000 hlmp-el18-tw000 2500 7200 hlmp-el16-twr00 hlmp-el18-twr00 2500 7200 hlmp-el16-twk00* 2500 7200 hlmp-el16-tws00 2500 7200 hlmp-el16-tus00 2500 4200 amber 592 hlmp-el16-tv400** 2500 5500 hlmp-el16-tvu00 2500 5500 hlmp-el16-ux000 hlmp-el18-ux000 3200 9300 hlmp-el16-uxr00 hlmp-el18-uxr00 3200 9300 hlmp-el16-vw000 4200 7200 15 hlmp-el16-vwr000 4200 7200 hlmp-el16-vwk00* 4200 7200 hlmp-el16-vws00 4200 7200 hlmp-el16-vx000 4200 9300 hlmp-el16-vxr00 4200 9300 hlmp-el16-vx400** 4200 9300 hlmp-el16-vxk00* 4200 9300 hlmp-el16-vxs00 4200 9300 hlmp-el16-vy000 hlmp-el18-vy000 4200 12000 hlmp-el16-vyr00 hlmp-el18-vyr00 4200 12000 hlmp-el16-vyk00* 4200 12000 hlmp-el16-vys00 4200 12000 red-orange 615 hlmp-eh18-tw000 2500 7200 hlmp-eh16-ux000 hlmp-eh18-ux000 3200 9300 red 630 hlmp-ed16-tw000 hlmp-ed18-tw000 2500 7200 hlmp-ed16-twt00 hlmp-ed18-twt00 2500 7200 hlmp-ed16-ux000 hlmp-ed18-ux000 3200 9300 hlmp-ed16-uxt00 hlmp-ed18-uxt00 3200 9300 3 t-1 3 / 4 (5 mm) precision optical performance alingap ii led lamps (continued) selection guide typical viewing color and luminous angle dominant intensity iv (mcd) [3,4] 2 q 1 / 2 wavelength lamps without standoffs lamps with standoffs @ i(f) = 20 ma (deg.) [2] (nm), typ. [1] (outline drawing a) (outline drawing b) min. max. hlmp-el25-qs400** 1150 2500 hlmp-el25-qsu00 1150 2500 hlmp-el25-qsk00* 1150 2500 hlmp-el25-qss00 1150 2500 hlmp-el25-qt000 1150 3200 hlmp-el25-qtr00 hlmp-el27-qtr00 1150 3200 hlmp-el25-ru000 hlmp-el27-ru000 1500 4200 hlmp-el25-rur00 hlmp-el27-rur00 1500 4200 hlmp-el25-ruk00* 1500 4200 23 amber 592 hlmp-el25-rus00 1500 4200 hlmp-el25-st000 1900 3200 hlmp-el25-str00 1900 3200 hlmp-el25-stk00* 1900 3200 hlmp-el25-sts00 1900 3200 hlmp-el25-su000 1900 4200 hlmp-el25-sur00 1900 4200 hlmp-el25-su400** 1900 4200 hlmp-el25-suu00 1900 4200 hlmp-el25-suk00* 1900 4200 hlmp-el25-sus00 1900 4200 hlmp-el25-svk00* 1900 5500 hlmp-el25-svs00 1900 5500 hlmp-el25-sv000 hlmp-el27-sv000 1900 5500 hlmp-el25-svr00 hlmp-el27-svr00 1900 5500 hlmp-el25-tw000 hlmp-el27-tw000 2500 7200 hlmp-el25-twr00 hlmp-el27-twr00 2500 7200 hlmp-el25-twk00* 2500 7200 hlmp-el25-tws00 2500 7200 notes: 1. dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the lamp. 2. 1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity. 3. the luminous intensity is measured on the mechanical axis of the lamp package. 4. the optical axis is closely aligned with the package mechanical axis. 5. tolerance for each intensity bin limit is 15%. part numbers in bold are recommended for new designs. *hlmp-xlxx-xxk00 are selected to amber color bins 2 and 4 only. **hlmp-xlxx-xx400 are selected to amber color bin 4 only. 4 t-1 3 / 4 (5 mm) precision optical performance alingap ii led lamps (continued) selection guide typical viewing color and luminous angle dominant intensity iv (mcd) [3,4] 2 q 1 / 2 wavelength lamps without standoffs lamps with standoffs @ i(f) = 20 ma (deg.) [2] (nm), typ. [1] (outline drawing a) (outline drawing b) min. max. hlmp-eh25-qt000 1150 3200 red-orange 615 hlmp-eh25-ru000 1500 4200 hlmp-eh27-sv000 1900 5500 hlmp-eh25-tw000 hlmp-eh27-tw000 2500 7200 23 hlmp-ed25-qt000 1150 3200 hlmp-ed25-qtt00 1150 3200 red 630 hlmp-ed25-ru000 hlmp-ed27-ru000 1500 4200 hlmp-ed25-rut00 hlmp-ed27-rut00 1500 4200 hlmp-ed25-sv000 hlmp-ed27-sv000 1900 5500 hlmp-ed25-svt00 hlmp-ed27-svt00 1900 5500 hlmp-ed25-tw000 hlmp-ed27-tw000 2500 7200 hlmp-ed25-twt00 hlmp-ed27-twt00 2500 7200 hlmp-el31-qrs00 1150 1900 hlmp-el31-qs000 1150 2500 hlmp-el31-qsr00 1150 2500 hlmp-el31-qs400** 1150 2500 hlmp-el31-qsu00 1150 2500 hlmp-el31-qt000 hlmp-el33-qt000 1150 3200 30 amber 592 hlmp-el31-qtr00 hlmp-el33-qtr00 1150 3200 hlmp-el31-qtk00* 1150 3200 hlmp-el31-qts00 1150 3200 hlmp-el31-sv000 hlmp-el33-sv000 1900 5500 hlmp-el31-svr00 hlmp-el33-svr00 1900 5500 hlmp-el31-st000 1900 3200 hlmp-el31-str00 1900 3200 hlmp-el31-stk00* 1900 3200 hlmp-el31-sts00 1900 3200 hlmp-el31-suk00* 1900 4200 notes: 1. dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the lamp. 2. 1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity. 3. the luminous intensity is measured on the mechanical axis of the lamp package. 4. the optical axis is closely aligned with the package mechanical axis. 5. tolerance for each intensity bin limit is 15%. part numbers in bold are recommended for new designs. *hlmp-xlxx-xxk00 are selected to amber color bins 2 and 4 only. **hlmp-xlxx-xx400 are selected to amber color bin 4 only. 5 notes: 1. dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the lamp. 2. 1/2 is the off-axis angle where the luminous intensity is one half the on- axis intensity. 3. the luminous intensity is measured on the mechanical axis of the lamp package. 4. the optical axis is closely aligned with the package mechanical axis. 5. tolerance for each intensity bin limit is 15%. part numbers in bold are recommended for new designs. *hlmp-xlxx-xxk00 are selected to amber color bins 2 and 4 only. **hlmp-xlxx-xx400 are selected to amber color bin 4 only. t-1 3 / 4 (5 mm) precision optical performance alingap ii led lamps (continued) selection guide typical viewing color and luminous angle dominant intensity iv (mcd) [3,4] 2 q 1 / 2 wavelength lamps without standoffs lamps with standoffs @ i(f) = 20 ma (deg.) [2] (nm), typ. [1] (outline drawing a) (outline drawing b) min. max. hlmp-el31-sus00 1900 4200 hlmp-el31-su400** 1900 4200 amber 592 hlmp-el31-suu00 1900 4200 hlmp-el31-su000 1900 4200 hlmp-el31-sur00 1900 4200 hlmp-el31-svk00* 1900 5500 hlmp-el31-svs00 1900 5500 hlmp-eh31-ps000 880 2500 30 red-orange 615 hlmp-eh31-qt000 hlmp-eh33-qt000 1150 3200 hlmp-eh31-ru000 hlmp-eh33-ru000 1500 4200 hlmp-eh31-sv000 hlmp-eh33-sv000 1900 5500 hlmp-eh31-su000 1900 4200 HLMP-ED33-QT000 1150 3200 hlmp-ed31-qtt00 hlmp-ed33-qtt00 1150 3200 red 630 hlmp-ed31-st000 1900 3200 hlmp-ed31-stt00 1900 3200 hlmp-ed31-su000 1900 4200 hlmp-ed31-sut00 1900 4200 hlmp-ed31-ru000 hlmp-ed33-ru000 1500 4200 hlmp-ed31-rut00 hlmp-ed33-rut00 1500 4200 hlmp-ed31-sv000 hlmp-ed33-sv000 1900 5500 hlmp-ed31-svt00 hlmp-ed33-svt00 1900 5500 6 hlmp- x x x x- xxxxx mechanical options 00: bulk packaging dd: ammo pack yy: flexi-bin, bulk packaging zz: flexi-bin; ammo pack color bin & v f selections 0: no color bin limitation 4: amber color bin 4 only k: amber color bins 2 and 4 only l: color bins 4 and 6 r: amber color bins 1, 2, 4, and 6 with v f max of 2.6 v s: amber color bins 2 and 4 with v f max of 2.6 v t: red color with v f max of 2.6 v u: amber color bin 4 with v f max of 2.6 v w: color bins 2, 4 and 6 with v f max of 2.6 v y: color bins 4 and 6 with v f max of 2.6 v maximum intensity bin 0: no iv bin limitation minimum intensity bin viewing angle and lead standoffs 16: 15 degree without lead standoffs 18: 15 degree with lead standoffs 25: 23 degree without lead standoffs 27: 23 degree with lead standoffs 31: 30 degree without lead standoffs 33: 30 degree with lead standoffs color d: 630 nm red h: 615 nm red-orange l: 592 nm amber package e: 5 mm round part numbering system 7 absolute maximum ratings at t a = 25 c dc forward current [1,2,3] ........................................................................................ 50 ma peak pulsed forward current [2,3] ........................................................................ 100 ma average forward current ....................................................................................... 30 ma reverse voltage (i r = 100 a) ..................................................................................... 5 v led junction temperature ..................................................................................... 130 c operating temperature ........................................................................ -40 c to +100 c storage temperature ............................................................................ -40 c to +120 c wave solder temperature ............................................................ 250 c for 3 seconds solder dipping temperature ........................................................ 260 c for 5 seconds [1.59 mm (0.060 in.) below body] notes: 1. derate linearly as shown in figure 4. 2. for long term performance with minimal light output degradation, drive currents between 10 ma and 30 ma are recommended. for more information on recommended drive conditions, please refer to application brief i-024 (5966-3087e). 3. please contact your sales representative about operating currents below 10 ma. b package dimensions a b 2.35 (0.093) max. 5.80 0.20 (0.228 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 2.54 0.38 (0.100 0.015) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead cathode flat 8.71 0.20 (0.343 0.008 1.14 0.20 (0.045 0.008) 1.14 0.20 (0.045 0.008) 5.00 0.20 (0.197 0.008) 31.60 (1.244) min. 0.70 (0.028) max. 1.00 (0.039) min. 8.71 0.20 (0.343 0.008) 0.50 0.10 (0.020 0.004) sq. typ. cathode lead d 1.50 0.15 (0.059 0.006) 5.80 0.20 (0.228 0.008) 2.54 0.38 (0.100 0.015) cathode flat part no. d hlmp-ex18-xxxxx 12.60 0.18 (0.496 0.007) hlmp-ex27-xxxxx 11.59 0.25 (0.446 0.010) hlmp-ex33-xxxxx 11.99 0.25 (0.472 0.010) 8 electrical/optical characteristics at t a = 25 c parameter symbol min. typ. max. units test conditions forward voltage i f = 20 ma amber ( l d = 592 nm) 2.15 red-orange ( l d = 617 nm) v f 2.08 2.4 [1] v red ( l d = 630 nm) 2.00 reverse voltage v r 520 vi r = 100 a peak wavelength peak of wavelength of amber 594 spectral distribution red-orange l peak 623 nm at i f = 20 ma red 639 spectral halfwidth ? l 1/2 17 nm wavelength width at spectral distribution 1 / 2 power point at i f = 20 ma speed of response t s 20 ns exponential time constant, e -t/t s capacitance c 40 pf v f = 0, f = 1 mhz thermal resistance r q j-pin 240 c/w led junction-to-cathode lead luminous efficacy [2] emitted luminous amber 500 power/emitted radiant power red-orange h v 235 lm/w at i f = 20 ma red 155 notes: 1. for options -xxrxx, -xxsxx, -xxtxx, -xxuxx, -xxwxx, -xxyxx, max forward voltage (vf) is 2.6 v. refer to vf bin table. 2. the radiant intensity, i e , in watts per steradian, may be found from the equation i e = i v / h v , where i v is the luminous intensity in candelas and h v is the luminous efficacy in lumens/watt. figure 1. relative intensity vs. peak wavelength. figure 2a. forward current vs. forward v oltage for option -xxrxx, -xxsxx, -xxtxx, -xxuxx, -xxwxx and -xxyxx. wavelength ?nm relative intensity 550 600 650 700 1.0 0.5 0 amber red-orange red dc forward current ?ma 0 0 forward voltage ?v 2.5 40 30 0.5 1.5 60 3.0 10 20 50 red 1.0 2.0 amber 9 figure 6. representative spatial radiation pattern for 23 viewing angle lamps. figure 3. relative luminous intensity vs. forward current. figure 4. maximum forward current vs. ambient temperature. derating based on t jmax = 130 c. figure 5. representative spatial radiation pattern for 15 viewing angle lamps. figure 2b. forward current vs. forward v oltage. current ?ma 1.0 0 v f ?forward voltage ?v 2.5 100 40 30 1.5 2.0 60 3.0 10 20 50 red 70 80 90 amber relative intensity (normalized at 20 ma) 0 0 forward current ?ma 40 2.0 1.5 1.0 0.5 20 50 2.5 10 30 amber red & red-orange i f ?forward current ?ma 0 0 t a ?ambient temperature ? c 40 80 50 40 30 20 10 20 60 100 r ja = 585 c/w r ja = 780 c/w normalized intensity ?% 1.00 0 angular displacement ?degrees 0.80 0.60 0.50 0.70 0.20 -20 -15 0.10 0.30 0.40 -10 0 5 10 15 20 25 0.90 -25 -5 normalized intensity ?% 1.00 0 angular displacement ?degrees 0.80 0.60 0.50 0.70 0.20 -20 -15 0.10 0.30 0.40 -10 0 5 10 15 20 25 0.90 -25 -5 10 bin name min. max. 15 84.5 587.0 25 87.0 589.5 45 89.5 592.0 65 92.0 594.5 bin name min. max. p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 x 7200 9300 y 9300 12000 z 12000 16000 intensity bin limits (mcd at 20 ma) tolerance for each bin limit is 15%. amber color bin limits (nm at 20 ma) tolerance for each bin limit is 0.5 nm. notes: 1. bin categories are established for classification of products. products may not be available in all bin categories. figure 7. representative spatial radiation pattern for 30 viewing angle lamps. normalized intensity 1.00 0 angular displacement ?degrees 0.80 0.60 0.50 0.70 0.20 0.10 0.30 0.40 0.90 -20 -15 -10 0 5 10 15 20 25 -25 -5 bin name min. max. va 2.0 2.2 vb 2.2 2.4 vc 2.4 2.6 vf bin table [2] tolerance for each bin limit is 0.05 v. 2. vf bin table only available for those part number with options -xxrxx, -xxsxx, -xxtxx, -xxuxx, -xxwxx, -xxyxx. 11 precautions lead forming the leads of an led lamp may be preformed or trimmed to applicable length prior to insertion and soldering on pc board. if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress that is induced into the led package. otherwise, trim the leads to applicable length at r oom temperature after soldering process. the solder joint formed will absorb the mechanical stress, due to the lead cutting, from flowing to the wire bonding area and led chip die attach. ? or better control, it is recommended to use proper t ool to precisely form and cut the leads to applicable length rather than doing it manually. soldering condition extra care must be taken during pcb assembly and soldering process to prevent damage to the led component. the closest distance of manual soldering from the soldering heat source (soldering iron? tip) to the body is 1.59 mm. damage might occur if the led soldering distance is less than 1.59 mm. please refer to the illustration below. recommended soldering condition w ave manual soldering solder dipping pre-heat temperature 105 c max. pre-heat time 30 sec max. peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max. ? av e soldering parameter must be set and maintained according to the recommended soldering condition. customer is advised to daily check on the soldering profile to ensure that the soldering profile is always corresponding to avago recommended soldering condition. not es: 1. pcb with different size and design (component density) will have different heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to recalibrate the soldering profile again before loading a new type of pcb. 2. a vago technologies?high brightness leds use a high efficiency led die with single wire bond, as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250 c. over-stressing the led during soldering process might cause premature failure to the led due to delamination. note: electrical connection between bottom surface of led die and the lead frame material through conductive paste of solder. special attention must be given to board fabrication, solder masking, surface platting and lead holes size and component orientation to assure the solderability. recommended pc board plated through holes size for led component leads led component diagonal plated through lead size hole diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch) 0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch) note: refer to application note an1027 for more information on soldering led components. 1.59 mm cathode for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries . data subject to change. copyright ? 2006 avago technologies limited. all rights reserved. obsoletes 5989-3791en avo1-0701en december 23, 2006 laminar wave bottom side of pc board hot air knife turbulent wave fluxing preheat 01020 30 50 100 150 200 250 30 40 50 time ?seconds temperature ? c 60 70 80 90 100 top side of pc board conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 245 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.25 in.) air knife angle = 40 lead solder: sn63; flux: rma lead free solder: 96.5 wt% sn, 3.0 wt% ag, 0.5 wt% cu note: allow for boards to be sufficiently cooled before exerting mechanical force. |
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