? 2005 california micro devices corp. all rights reserved. 09/16/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 1 cm1425 4 channel emi filter a rray with esd protection features ? four channels of emi filtering with esd protection ? pin compatible with cmd?s csprc032a ? greater than 30db attenuation over the 800mhz to 3ghz frequency range ? 15kv esd protection (iec 61000-4-2, contact discharge) ? 30kv esd protection (hbm) ? 9-bump, 2.470mm x 0.970mm footprint chip scale package (csp) ? available with optiguard ? coating for improved reliability ? lead-free versions available applications ? filtering for antenna and keypad data lines ? i/o port protection for mobile handsets, notebook computers, pdas etc. ? emi filtering for data port s in cell phones, pdas or notebook computers. ? emi filtering for lcd and ch ip-to-chip data lines in mobile electronic devices that use flexible pcb interconnections product description camd's cm1425 is an emi filter array with esd pro- tection, which integrates 4 pi filters (c-r-c). the cm1425 has component values of 20pf-100 -20pf. the parts include esd protection diodes on every pin, which provide a very high level of protection for sensi- tive electronic components that may be subjected to electrostatic discharge (esd ). the esd diodes con- nected to the filter ports sa fely dissipate esd strikes of 15kv, well beyond the maximum requirement of the iec 61000-4-2 internationa l standard. using the mil- std-883 (method 3015) specification for human body model (hbm) esd, the pins are protected for contact discharges at greater than 30kv. this device is particularly we ll-suited for portable elec- tronics (e.g. mobile hand sets, pdas, notebook com- puters) because of its small package and easy-to-use pin assignments. in particular, the cm1425 is ideal for emi filtering and protecting data lines from esd in wireless handsets. all cm1425 devices are optionally available with opti- guard ? coating which results in improved reliability at assembly. these devices are also available with stan- dard and lead-free finishing. the cm1425 is housed in a space-saving, low-profile, chip-scale package and is fabricated with california micro devices' centurion ? processes. electrical schematic 100 20pf 20pf filter+esd1 filter+esd1 100 20pf 20pf filter+esd2 filter+esd2 100 20pf 20pf filter+esd3 filter+esd3 100 20pf 20pf filter+esd4 filter+esd4
? 2005 california micro devices corp. all rights reserved. 2 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 09/16/05 cm1425 ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices ar e specified by using a " + " character for the top side orientation mark. pin descriptions pin(s) name description pin(s) name description a1 filter+esd1 filter channel 1 b1 filter+esd1 filter channel 1 a2 filter+esd2 filter channel 2 b2 filter+esd2 filter channel 2 a4 filter+esd3 filter channel 3 b4 filter+esd3 filter channel 3 a5 filter+esd4 filter channel 4 b5 filter+esd4 filter channel 4 b3 gnd device ground b3 b4 b5 a4 a5 b1 a1 b2 a2 a1 orientation marking b3 b4 b5 a4 a5 b1 a1 b2 a2 a1 orientation marking n253 3 25 4 1 b a orientation marking (see note 2) n251 3 25 4 1 b a orientation marking (see note 2) package / pinout diagrams notes: cm1425-01 csp package (no coating) bottom view (bumps up view) top view (bumps down view) 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side orientation mark. cm1425-03 csp package ( optiguard ? coating) part numbering information bumps pkg standard finish lead-free finish 2 no coating optiguard ? coated no coating optiguard ? coated ordering part number 1 part marking ordering part number 1 part marking ordering part number 1 part marking ordering part number 1 part marking 9 csp cm1425-01cs n251 cm1425-03cs n253 CM1425-01CP n251 cm1425-03cp n253
? 2005 california micro devices corp. all rights reserved. 09/16/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 3 cm1425 specifications note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gnd, one at a time. note 3: these parameters are guarant eed by design and characterization. absolute maximum ratings parameter rating units storage temperature range -65 to +150 c power rating per resistor 100 mw package power rating 300 mw standard operat ing conditions parameter rating units operating temperature range -40 to +85 c electrical operating characteristics 1 symbol parameter conditions min typ max units r resistance 80 100 120 c capacitance at 2.5v dc, 1mhz, 30mv ac 16 20 24 pf v diode diode standoff voltage i diode = 10 a6.0v i leak diode leakage current (reverse bias) v diode = + 3.3v 100 300 na v sig signal voltage positive clamp negative clamp i load = 10ma i load = -10ma 5.6 -1.5 6.8 -0.8 9.0 -0.4 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4- 2 level 4 notes 2 and 3 30 15 kv kv r dyn dynamic resistance positive negative 1.5 0.9 f c cut-off frequency z source =50 , z load =50 r = 100 , c = 20pf 86 mhz
? 2005 california micro devices corp. all rights reserved. 4 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 09/16/05 cm1425 performance information . figure 1. cm1425 filter typical measured frequency response figure 2. filter capacitance vs. input voltage over temperature (normalized to capacitance at 2.5vdc and 25c)
? 2005 california micro devices corp. all rights reserved. 09/16/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 5 cm1425 application information refer to application no te ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 3. recommended non-solder mask defined pad illustration figure 4. eutectic (snpb) solder ball reflow profile figure 5. lead-free (snagcu) solder ball reflow profile printed circuit boar d recommendations parameter value pad size on pcb 0.275mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.325mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (las er cut, 5% tapered walls) 0.330mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous (183c) 60 seconds maximum soldering temperature for a eutectic device using eutectic solder paste 240c maximum soldering temperature for a lead-fr ee device using lead-free solder paste 260c solder mask opening 0.325mm dia. non-solder mask defined pad 0.275mm dia. solder stencil opening 0.330mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2005 california micro devices corp. all rights reserved. 6 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 09/16/05 cm1425 mechanical details cm1425 devices are packaged in a custom chip scale packages (csp) and available with optional opti- guard ? coating. cm1425 9-bump csp mechanical specifications the cm1425 devices are packaged in a 9-bump cus- tom chip scale package (csp). dimensions are pre- sented below. note 1: applies to uncoated devices only. note 2: applies to optiguard ? (coated) devices only. package dimensions cm1425 9-bump chip scale package package dimensions package custom csp bumps 9 dim millimeters inches min nom max min nom max a1 0.925 0.970 1.015 0.0364 0.0382 0.0400 a2 2.425 2.470 2.515 0.0955 0.0972 0.0990 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.495 0.500 0.505 0.0195 0.0197 0.0199 c1 0.185 0.235 0.285 0.0073 0.0093 0.0112 c2 0.185 0.235 0.285 0.0073 0.0093 0.0112 d1 1 0.562 0.606 0.650 0.0221 0.0239 0.0256 d2 1 0.356 0.381 0.406 0.0140 0.0150 0.0160 d3 2 0.575 0.644 0.714 0.0226 0.0254 0.0281 d4 2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams 4 5 b c1 b1 a1 b2 c2 d1 d2 a2 bottom view side view a 1 2 3 dimensions in millimeters a b 0.30 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) 4 5 b c1 b1 a1 b2 c2 d3 d4 a2 bottom view side view a 1 2 3 a b 0.30 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating non-coated csp optiguard ? coated csp
? 2005 california micro devices corp. all rights reserved. 09/16/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.cmd.com 7 cm1425 mechanical details (cont?d) csp tape and reel specifications figure 6. tape and reel mechanical data part number pkg. size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel dia. qty per reel p 0 p 1 cm1425-01 2.470 x 0.970 x 0.606 2.62 x 1.12 x 0.762 8mm 178mm (7") 3500 4mm 4mm cm1425-03 2.470 x 0.970 x 0.644 2.62 x 1.12 x 0.762 8mm 178mm (7") 3500 4mm 4mm to p for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o
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