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lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 1 /1 5 ta - i technology co., ltd 1. scope this specification applies for the lead - free fuse series of thin film chip fuse made by ta - i. 2. construction 3. type designation over coat ceramic substrate conductor cu / ni plating fuse element c fs chip fuse 12 size 12:1206(3216) v6 rated voltage t pac k aging t: paper tape (5k) v6:63v v5:50v v3:32v va:125v r 5 0 2 rated current r50:0.5a 1r0:1a sn plating
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 2 /1 5 ta - i technology co., ltd 4. dimensions u nit : mm 5. applications and ratings part designation marking rated current fusing time resistance (m ) typ.* rated voltage breaking capacity body temper ature rising cfs12v6tr50 f 0.50a open within 5sec.at250% rated current 385 dc 63 v dc63v 50a < 75 at 100% rated current cfs12v6tr80 k 0.80a 165 cf s 12v6t1r0 l 1.00a 108 cf s 12v6t1r25 m 1.25a 76 cf s 12v6t1r50 p 1. 50 a 51 cf s 12v6t2r0 s 2.00a 32 cf s 12v3t2r50 t 2.50a 26 dc 32 v dc32v 50a cf s 12v3t3r00 3 3.00a 20 cf s 12v3t4r0 w 4.00a 14 cf s 12v3t5r0 y 5.00a 10 cfs12v 3 t7r0 z 7.00a 6.5 *resistance valve was measured wi th less than 10% of rated current type (inch size code) dimensions (mm) l w c d t cf s 12v ( 1206 ) 3.1 0. 1 1.55 0.1 0. 5 0. 3 0. 5 0. 2 0. 6 0.1
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 3 /1 5 ta - i technology co., ltd 6. temperatuer derating curve 6.1 normal ambient temperature: 25 6.2 operating temperature: - 20 ~105 ,whit proper derating factor as below: 7.reliability tests parameter requirement test method carrying capacity no fusing rated current ,4hr fusing time within 5sec 250% of its rated current interrupting abi lity no mechanical d amages after the fuse is interrupt ed ,rated voltage applied for 30sec again bending test no mechanical d amages distance between holding points: 90mm, bending:3mm,1time ,30sec resistance to solder heat 2 0% 260 5 ,10seconds 1 second solder a b ility 95% coverage minimum 2 35 5 , 2 0.5 second 245 5 , 2 0.5 second (lead free) temperature rise < 7 5 1 00% of its rated current, measure of surface temperature resistance to dry heat 2 0% 105 5 ,1 000 hrs resistance to solvent no evi d en t dama ges on protective coating and marking 23 5 of isopropyl alcohol 90second residual resistance 10k and more measure dc resistance after fusing thermal shock r< 10 % - 20 / +25 +125 +25 105
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 4 /1 5 ta - i technology co., ltd 8.marking symbol for rating current symbol f i k l m p n s t 3 u w y z rating current(a) 0.5 0.63 0.8 1 1.25 1.5 1.6 2 2.5 3 3.15 4 5 7 9.taping & reel 9.1 taping dimensions 4mm pitch paper packing type a b w f e p 1 p 2 p 0 d 0 t paper tape cf s 12v 2.0 0.1 5 3.6 0. 2 8.0 0.2 3.5 0.05 1.75 0. 1 4.0 0.1 2.0 0.05 4.0 0.1 +0.1 1.5 - 0 0. 8 4 0.1 u nit : mm type series paper tape 4 mm pitch 180mm/r cf s 12v 5000
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 5 /1 5 ta - i technology co., ltd 9 . 2 reel specifications u nit : mm series a b c w t cf s 12v 180 +0 - 3 60 min 13.0 1.0 9.0 1.0 11.4 2.0 9.3 peel C off force : pull top cover tape 300 mm/min 1 0 15 standard : 0.1 ~ 0.7 n carrier tape 10. storage conditions : temperature: 5 ~35 ,humidity: 4 0 %~75% 11. shelf life: 2 year s from manufacturing date
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 6 /1 5 ta - i technology co., ltd 12. label date code rating current lead - free products t ype lot no: customer label 13. recommended land patterns land pattern type size dimension a b c cf s 12 ( 120 6 ) 2.0 ~ 2.4 4.4 ~ 5.0 1.2 ~1. 8 qty: 5000 pcs lead - free r50 v6 433f001z - 0433 cfs12v6 t chip fuse
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 7 /1 5 ta - i technology co., ltd 14. recommend ir C reflow profile : (solder : sn96.5 / ag3 / cu0.5) peak : 250 , 5 sec pre C heat zone : 150 to 180 , 90 30 sec soldering zone : 230 or higher , 30 10 sec 15. approval by ul248 - 14 the fuses have been approved by ul. file no. of ul recognition is e241710 16. ecn engineering change notice: the customer will be informed with ecn if there is significant modification on the characteristics and materials described in approval sheet. 17. manufacturing country & city : ta - i technology co., ltd. ( taiwan C tao yuan ) tel: (+ 886 ) - 3 - 3246169 fax : (+ 886 ) - 3 - 3247410 associated companies : (1) fortune task resistor factory ( china C dong guan ) tel : (+ 86 ) - 769 - 8 3394790 fax : (+ 86 ) - 769 - 8 3394794 (2) ta - i technology ( su zhou ) co., ltd. ( china C su zhou ) tel : (+ 86 ) - 512 - 6 3457879 fax : ( + 86 ) - 512 - 6 3457869 (3) tai ohm electronics ( m ) sdn. bhd. ( malaysia C penang ) tel : (+ 604 ) - 3900480 fax : (+ 604 ) - 3901481 (4) p.t.tai electronics indonesia ( indonesia C jakarta ) tel : ( +62 ) - 21 - 44820254 fax : ( +62 ) - 21 - 44820256 0 5 ? ?
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 8 /1 5 ta - i technology co., ltd selection guideline of fuse: checklist of selection factors normal operating current normal operating voltage ( ac or dc ) ambient temperature overload current and length of time in which the fuse must open . type of fuse ( smd or tube ) and physic al size limitation ( 0603 or 1206 ) agency approval required ( e.g., ul248 - 14 ) normal operating current e.g., rectangular wave , if i p = 1.5 a , normal operating current = 1.5 a
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 9 /1 5 ta - i technology co., ltd derating ratio for different ambient temperature referring to bottom figure and select the appropriate derating ratio : e.g., ambient temperature is 60 degree c the derating ratio 0.95 calculating the required rating of fuse needed . safety coefficient : 70 % is safety coefficient from practical experience e.g., condition : normal operating current =1.5 a ambient temperature 40 : derating ratio 0.95 rating current of fuse normal operating cu rrent 0.7 x derating ratio 1.5 0.7 x 0.95 105 2.255 < rating current of fuse ambient temperature safety coefficient
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 10 /1 5 ta - i technology co., ltd determination of the type of fuse e.g., condition : calculating value =2.255 a , 2.255a < rating current of fuse normal oper ating voltage : dc 12 v following bottom index - table : suggesting use cfs06v 3 t2r50 . part designation marking rated current rated voltage cfs12v6tr50 f 0.50a 63v cfs12v6tr80 k 0.80a 63v cfs12v6t1r0 l 1.00a 63v cfs12v6t1r25 m 1.25a 63v cfs12v61r50 p 1.50a 63v CFS12V6T2R0 s 2.00a 63v cfs12v3t2r50 t 2.50a 32v cfs12v3t3r00 3 3.00a 32v cfs12v3t4r0 w 4.00a 32v cfs12 v3 t5r0 y 5.00a 32v cfs12v3t7r0 z 7.00a 32v inrush current : considering inrush waveform & calculate i 2 t (a 2 s) value choosing fuses i 2 t (a 2 s) value > calculate i 2 t (a 2 s) value considering ratio of i 2 t repeat numbers to blowing . confrim with us e.g., choosing 0603 fuse condition : 1. rectangular wave , ip = 4 a , t = 1 ( ms ) , calculate ip 2 t = 4 2 x 1 x 10 C 3 (a) = 0.016 (a 2 s) 2. choosing cfs06v 3 t2r5 ( i 2 t = 0.200 (a 2 s) ) , 3. inrush shock : 100,000 times ( 0.35 ) calculating : 1. choosing fuses i 2 t (a 2 s) value x derati ng ratio > calculate i 2 t (a 2 s) value 2. 0.200 x 0.35 = 0.070 (a 2 s) 4. 0.070 > 0.016 page 12 index - table inrush derating ratio inrush 100,000 times
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 11 /1 5 ta - i technology co., ltd the fuse is able to meet circuit s application ta - i fuse i 2 t (a2s) part number typical i 2 t (a 2 s) cfs12v6tr50 0.030 cfs12v6tr80 0.068 cfs12v6t1r0 0. 098 cfs12v6t1r25 0.155 cfs12v6t1r50 0.236 CFS12V6T2R0 0.339 cfs12v3t2r50 0.605 cfs12v3t3r00 0.933 cfs12v3t4r0 1.537 cfs012v3t5r0 2.533 cfs12v3t7r0 5.684 note*: typical i 2 t value is measured at 10x - rated current, application with surge over 10x - r ated current. please onfirm with us. ta-i chip fuse clearing by repeater rush current 0.1 1 10 100 1000 10000 100000 ratio of i 2 t repeat numbers to blowing ratio of i 2 t
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 12 /1 5 ta - i technology co., ltd inrush waveform
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 13 /1 5 ta - i technology co., ltd ta-i 1206(250%) chip fuse i-t curve 0.001 0.01 0.1 1 10 100 0.1 1 10 100 current (a) clearing time(s) 0.8a 0.5a 3a 1a 1.25 1.5 2a 2.5 7a 4a 5a
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 14 /1 5 ta - i technology co., ltd ta-i 1206(250%) chip fuse i2-t curve 0.01 0.1 1 10 100 1000 0.001 0.01 0.1 1 clearing time in second joule integral (a2*s) 1 a 2 a 7a 1.25 a 1.5 a 2 .5 a 3 a 4a 5a 0.5 a 0.8 a
lead free thi n film chip fuse document no tcfs - 12os051e issued date 2 009/5/27 page 15 /1 5 ta - i technology co., ltd tset circuit borad type a b c d e f cf s 1206 19 6 2.4 2.6 1.9 1 unit:mm c f e d b a

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