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datashee t product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. 1/16 tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 dual-output (fixed/variable) ldo regulators ba3259hfp ba30e00whfp general description the ba3259hfp and ba30e00whfp are 2-output, low-saturation regul ators. these units have bot h a 3.3 v fixed output as well as a variable output with a voltage accuracy of 2%, and incorporate an overcurrent protection circuit to prevent ic destruction due to output shorting along with a tsd (thermal shut down) circuit to protect the ic from thermal destruction caused by overloading. features ? output voltage accuracy: 2%. ? reference voltage accuracy: 2% ? ceramic capacitor can be used to prevent output oscillation (ba3259hfp) ? low dissipation with two voltage input supported (ba30e00whfp) ? built-in thermal shutdown circuit ? built-in overcurrent protection circuit key specifications input power supply voltage: ba3259hfp 14.0v(max.) ba30e00whfp 16.0v(max.) output voltage type: v o 1 fixed v o 2 variable output current: ba3259hfp 1a (max) ba30e00whfp 0.6a (max) operating temperature range: ba3259hfp 0 to 85 ba30e00whfp ? 25 to 105 applications available to all commercial de vices, such as fpd, tv, and pc sets besides dsp power supplies for dvd and cd sets. packages w (typ.) x d (typ.) x h (max.) hrp5 9.395mm x 10.54mm x 2.005mm hrp7 9.395mm x 10.54mm x 2.005mm ordering information b a 3 x x x h f p - tr part number package hfp:hrp5 hrp7 packaging and forming specification tr: embossed tape and reel lineup maximum output current (max.) output voltage 1 (typ.) output voltage 2 (typ.) package orderable part number 1.0a 3.3v 0.8 to 3.3v hrp5 reel of 2000 BA3259HFP-TR 0.6a 3.3v 0.8 to 3.3v hrp7 reel of 2000 ba30e00whfp-tr hrp5 hrp7
2/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 block diagrams / standard example application ci rcuits / pin configurations / pin descriptions fig.1 ba3259hfp block diagram fig.2 ba30e00whfp block diagram pin no. pin name function 1 v cc power supply pin 2 adj variable output voltage detection pin 3 gnd gnd pin 4 vo2 variable output pin 5 vo1 3.3 v output pin fin gnd gnd pin pin no. pin name function 1 en output on/off control pin: high active 2 vcc2 power supply pin 2 3 vcc1 power supply pin 1 4 gnd gnd pin 5 vo1 power supply pin for 3.3 v output 6 vo2 variable output voltage detection pin (0.8 v to 3.3 v) 7 adj variable output voltage detection pin fin gnd gnd pin pin external capacitor setting range vcc (1pin) approximately 3.3f vo1 (5pin) 1 f to 1000 f vo2 (4pin) 1 f to 1000 f top view pin external capacitor setting range vcc1 (3pin) approximately 1 f vcc2 (2pin) approximately 1 f vo1 (5pin) 47 f to 1000 f vo2 (6pin) 47 f to 1000 f top view hrp5 hrp7 absolute maximum ratings ba3259hfp ba30e00whfp parameter symbol ratings units parameter symbol ratings units applied voltage vcc 15 *1 v applied voltage vcc 18 *1 v power dissipation pd 2300 *2 mw power dissipation pd 2300 *2 mw operating temperature range topr 0 to 85 operating temperature range topr ? 25 to 105 ambient storage temperature range ts t g ? 55 to 150 ambient storage temperature range ts t g ? 55 to 150 maximum junction temperature tjmax 150 maximum junction temperature tjmax 150 *1 must not exceed pd. *2 derated at 18.4 mw/ at ta>25 when mounted on a glass epoxy board (70 mm 70 mm 1.6 mm). 1 2 3 4 5 6 7 1 2 3 4 5 v ref current limi t thermal shutdown current limi t v o1 v o2 gnd 3.3v 1 f 1.5v 1 f 3.3 f v in c o1 c o2 c in 1 5 4 fin 2 a dj vcc r1 r2 3 gnd en current limit sat. prevention current limit sat. prevention thermal shut down gnd(fin) vcc1 vcc1 vcc2 vcc2 vcc1 adj gnd vo2 vo1 vcc2 reference voltage r1 r2 47 f 47 f 1 f 1 f 1 2 3 4 5 6 7
3/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 recommended operating ratings ba3259hfp ba30e00whfp parameter symbol ratings unit parameter symbol ratings unit min. typ. max. min. typ. max. input power supply voltage vcc 4.75 ? 14.0 v input power supply voltage 1 vcc1 4.1 ? 16.0 v 3.3 v output current io1 ? ? 1 a input power supply voltage 2 vcc2 2.8 ? vcc 1 v variable output current io2 ? ? 1 a 3.3 v output current io1 ? ? 0.6 a variable output current io2 ? ? 0.6 a electrical characteristics ba3259hfp (unless otherwise specified, ta=25 , vcc=5 v, r1=r2=5 k ?) parameter symbol limits unit conditions min. typ. max. circuit current i b ? 3 5 ma io1=0ma, io2=0ma [3.3 v output block] output voltage 1 vo1 3. 234 3.300 3.366 v io1=50ma minimum i/o voltage difference 1 ? vd1 ? 1.1 1.3 v io1=1 a, vcc=3.8v current capability 1 io1 1.0 ? ? a ripple rejection 1 r.r.1 46 52 ? db f=120hz, ein=0.5vp-p, io1=5ma input stability 1 ? v line 1 ? 5 15 mv vcc=4.75 14v, io1=5ma load stability 1 ? v load 1 ? 5 20 mv io1=5ma 1 a temperature coefficient of output voltage 1 *3 tcvo1 ? 0.01 ? %/ io1=5ma, tj=0 to 85 [variable output] reference voltage v ref 0.784 0.800 0.816 v io2=50ma minimum i/o voltage difference 2 ? vd2 ? 1.1 1.3 v io2=1 a current capability 2 io2 1.0 ? ? a ripple rejection 2 r.r.2 46 52 ? db f=120hz, ein=0.5vp-p, io2=5ma input stability 2 ? v line 2 ? 5 15 mv vcc=4.75 14v, io2=5ma load stability 2 ? v load 2 ? 5 20 mv io2=5ma 1 a temperature coefficient of output voltage 2 *3 tcvo2 ? 0.01 ? %/ io2=5ma, tj=0 to 85 variable pin current i adj ? 0.05 1.0 a v adj =0.85v *3 not 100% tested
4/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 electrical characteristics - continued ba30e00whfp (unless otherwise specified, ta=25 , vcc1=vcc2=v en =5 v, r1=50k , r2=62.5k ) parameter symbol limits unit conditions min. typ. max. bias current ib ? 0.7 1.6 ma io1=0ma, io2=0ma standby current i st ? 0 10 a v en =gnd en pin on voltage v on 2.0 ? ? v active mode en pin off voltage v off ? ? 0.8 v standby mode en pin current i en ? 50 100 a v en =3.3v [3.3 v output] output voltage 1 vo1 3. 234 3.300 3.366 v io1=50ma minimum i/o voltage difference 1 ? vd1 ? 0.30 0.60 v io1=300ma, vcc=3.135v output current capacity 1 io1 0.6 ? ? a ripple rejection 1 r.r.1 ? 68 ? db f=120hz, ein=1vp-p, io1=100ma input stability 1 reg.i1 ? 5 30 mv vcc1=4.1 16v, io1=50ma load stability 1-1 reg.l1-1 ? 30 90 mv io1=0ma 0.6a load stability 1-2 reg.l1-2 ? 30 90 mv vcc1=3.7v, io1=0 0.4a temperature coefficient of output voltage 1 *3 tcvo1 ? 0.01 ? %/ io1=5ma, tj=0 to 125 [variable output] (at 1.8 v) reference voltage v adj 0.784 0.800 0.816 v io2=50ma minimum i/o voltage difference 2 ? vd2 ? 0.30 0.60 v at io2=3.3v io2=300ma, vcc1=vcc2=3.135v output current capacity 2 io2 0.6 ? ? a ripple rejection 2 r.r.2 ? 66 ? db f=120hz, ein=1vp-p, io2=100ma input stability 2 reg.i2 ? 5 30 mv vcc1=vcc2=4.1v 16v, io2=50ma load stability 2 reg.l2 ? 30 90 mv io2=0ma 0.6a temperature coefficient of output voltage 2 *3 tcvo2 ? 0.01 ? %/ io2=5ma, tj=0 to 125 *3 not 100% tested
5/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves ba3259hfp (unless otherwise specified, ta=25 , vcc=5 v) fig.3 circuit current (with no load) fig.5 adj pin outflow current fig.4 circuit current vs load current io fig.6 input stability (3.3 v output with no load)
6/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves - continued fig.9 load stability (variable output: 1.5 v) fig.10 i/o voltage difference (3.3 v output) (3.3 v output, io1=0 a 1 a) fig.7 input stability (variable output with no load) fig.8 load stability (3.3 v output)
7/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves - continued fig.14 circuit current vs temperature fig.11 r.r. r.r.(variable output :1.5 v) r.r.(3.3 v output) fig.12 output voltage vs temperature (3.3 v output) fig.13 output voltage vs temperature (variable output: 1.5 v)
8/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves - continued ba30e00whfp (unless otherwise specified, ta=25 , vcc1=vcc2=5v) fig.17 adj pin source current fig.18 input stability (3.3 v output io1=600 ma) fig.15 circuit current (with no load) fig.16 circuit current vs load current io (io=0 600 ma)
9/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves - continued fig.22 i/o voltage difference (vcc=3.135 v, 3.3 v output) fig.19 input stability (variable output: 1.8 v) fig.20 load stability (3.3 v output) fig.21 load stability (variable output: 1.8 v)
10/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves - continued fig.23 r.r. (ein=1 vp-p, io=100 ma) vo2(variable output:1.8v) vo1(3.3v output) fig.25 output voltage vs temperature (variable output: 1.8 v) fig.26 circuit current vs temperature (io=0 ma) fig.24 output voltage vs temperature (3.3 v output)
11/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 application information setting the output voltage vo2 the following output voltage setting method applies to the variable output pin. vo2=v adj ( 1 + r2 ) - r2 i adj r1 v adj : output feedback reference voltage (0.8 v typ.) i adj : adj pin source current (0.05a typ.: ba3259hfp) (0.2a typ.: ba30e00whfp) note:connect r1 and r2 to make output voltage settings as shown in fig.1and fig.2. k eep in mind that the offset voltage caused by the current (i adj ) flowing out of the adj pin will become high if higher resistance is used. function explanation 1) two-input power supply (ba30e00whfp) the input voltages (vcc1 and vcc2) supply power to two outpu ts (vo1 and vo2, respectively). the power dissipation between the input and output pins can be suppres sed for each output according to usage. 2) standby function (ba30e00whfp) the standby function is operated through the en pin. output is turned on at 2.0 v or hi gher and turned off at 0.8 v or lower. power dissipation if the ic is used under the conditions of ex cess of the power dissipation, the chip temperature will rise, which will have an adverse effect on the electrical characteri stics of the ic, such as a reduction in current capability. furthermore, if the temperature exceeds t jmax , element deterioration or damage may occur. im plement proper thermal designs to ensure that the power dissipation is within the permissible range in orde r to prevent instantaneous ic damage resulting from heat and maintain the reliability of the ic for long-term operation. refer to the power derating characteristics curves in fig.27. ? power consumption pc (w) calculation method: ba3259hfp ba30e00whfp 5v vcc vo1 vo2 reg1 reg2 3.3 v/0.3 a 1.8 v/0.3 a power loss between input and output (vcc ? vo1) io1 + (vcc ? vo2) io2 = (5 ? 3.3) 0.3 + (5 ? 1.8) 0.3 = 0.51w + 0.96w = 1.47w single 5v input results in decreased efficiency power loss between input and output (vcc1 ? vo1) io1 + (vcc2 ? vo2) io2 = (5 ? 3.3) 0.3 + (5 ? 1.8) 0.3 = 0.51w + 0.36w = 0.87w reduced power loss by 0.6w. additional 3v input improves efficiency 5v vcc vo1 vo2 reg1 reg2 3v 3.3 v/0.3 a 1.8 v/0.3 a conventional efficiency comparison: 5v single input vs. 5v/3v two inputs ? regulator with single input and two outputs ? regulator with two inputs and two outputs (vo2=1.8v, io1=io2=0.3a) current vcc gnd vo1 vo2 controller icc i p vcc vcc io1 io2 3.3 v output 0.8 v to 3.3 v output power tr power tr vcc1 gnd io1 io2 controller icc1+icc2 vcc1 vcc2 io1 io2 3.3 v output 0.8 v to 3.3 v output vcc2 i b 1 i b 2 power tr power tr ? power consumption of power transistor on vo1 (3.3 v output) pc1=(vcc1 ? vo1) io1 ? power consumption of power transistor on vo2 (variable output ) pc2=(vcc2 ? vo2) io2 ? power consumption by circuit current pc3=vcc1 icc1 + vcc2 icc2 ? pc=pc1 + pc2 + pc3 * vcc1, vcc2: applied voltage io1: load current on 3.3 v output side io2: load current on variable output side icc1, icc2: circuit currents ? power consumption of 3.3 v powe r transistor pc1=(vcc ? 3.3) io1 ? power consumption of vo2 powe r transistor pc2=(vcc ? vo2) io2 ? power consumption by circuit current pc3=vcc icc ? pc=pc1 + pc2 + pc3 * vcc: applied voltage io1: load current on vo1 side io2: load current on vo2 side icc: circuit current r1 ba3259hfp: 1 k to 10 k ba30e00hfp: 1 k to 5 k the above is recommended. vo2 adj i adj v adj r2 r1
12/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 the icc (circuit current) varies with the load. refer to the above and implement proper thermal designs so that the ic will not be used under conditions of excess power dissipation pd under all operating temperatures. i/o equivalence circuit ba3259hfp ba30e00whfp fig.30 ba3259hfp i/o equivalence circuit fig.31 ba30e00whfp i/o equivalence circuit explanation of external components ba3259hfp 1) vcc (pin 1) it is recommended that a ceramic capacitor with a capacita nce of approximately 3.3f is placed between vcc and gnd at a position closest to the pins as possible. 2) vo (pins 4 and 5) insert a capacitor between vo and gnd in order to prevent output oscillation. the capacitor may oscillate if the capacitance changes as a result of temperature fluctuations. theref ore, it is recommended that a ceramic capacitor with a temperature coefficient of x5r or above and a maximum capacitance change (resulting from temperature fluctuations) of 10% be used. the capacitance should be between 1f and 1,000f. (refer to fig.28.) ba33e00hfp 1) vcc1 (pin 3) and vcc2 (pin 2) insert capacitors with a capacitance of 1f between vcc1 and gnd and vcc2 and gnd. the capacitance value will vary depending on the application. be sure to im plement designs with sufficient margins. 2) vo1 (pin 5) and vo2 (pin 6) insert a capacitor between vo and gnd in order to prevent oscillation. the capacitance of the capacitor may greatly vary with temperature changes, making it impossible to completely prevent oscillation. therefor e, use a tantalum aluminum electrolytic capacitor with a low esr (equivalent serial re sistance) that ensures good perfo rmance characteristics at low temperatures. the output oscillate s if the esr is too high or too low. refe r to the esr characteristics in fig.29 and operate the ic within the stable operating region. if there is a sudden load change, use a capacitor with a higher capacitance. a capacitance between 47f and 1,000f is recommended. 8 10 (3) 7.3w 9 7 6 5 4 3 2 1 0 power dissipation: pd [w] ambient temperature: ta [c] 25 50 75 100 125 150 board size: 70 mm 70 mm 1.6 mm (with a thermal via incorporated by the board) board surface area: 10.5 mm 10.5 mm (1) 2-layer board (backside copper foil area: 15 mm 15 mm) (2) 2-layer board (backside copper foil area: 70 mm 70 mm) (3) 4-layer board (backside copper foil area: 70 mm 70 mm) 0 (2) 5.5w (1) 2.3w fig.27 ambient temperature vs. power dissipation fig.28 ba3259hfp esr characteristics fig.29 ba30e00whfp esr characteristics io [ma] 200 400 600 800 1000 0 0.01 0.1 0.5 1.0 2.0 esr [? ] 0.02 0.05 0.2 5.0 unstable region 10.0 stable region 0.7 unstable region 200 400 600 800 1000 0 0.01 0.1 0.5 1.0 2.0 io [ma] esr [? ] stable region 0.02 0.05 0.2 5.0 unstable region 10.0 vcc vo1 vo2 adj vcc vcc1 vo1 vcc1 vcc2 vo2 adj
13/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 operational notes 1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify br eaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute ma ximum ratings, consider adding circuit protection devices, such as fuses. 2) gnd voltage the potential of gnd pin must be minimu m potential in all operating conditions. 3) thermal design use a thermal design that allows for a sufficient margin in light of the power dissipation (pd) in actual operating conditions. 4) inter-pin shorts and mounting errors use caution when positioning the ic fo r mounting on printed circuit boards. t he ic may be damaged if there is any connection error or if pi ns are shorted together. 5) actions in strong electromagnetic field use caution when using the ic in the presence of a strong electr omagnetic field as doing so may cause the ic to malfunction. 6) testing on application boards when testing the ic on an application board, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic's power supply off before connecting it to or removing it from a jig or fixture during the inspection pr ocess. ground the ic during assembly steps as an antistatic measure. use similar precaution wh en transporting or storing the ic. 7) regarding input pin of the ic this monolithic ic contains p+ isolati on and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersecti on of these p layers with the n layers of other elements, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the gnd (p substrate) voltage to an input pin, should not be used. 8)ground wiring patterns when using both small signal and large current gnd pattern s, it is recommended to isolate the two ground patterns, placing a single ground point at the gr ound potential of applicatio n so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. 9) thermal shutdown circuit (tsd) this ic incorporates a built-in thermal shutdown circuit fo r protection against thermal destruction. should the junction temperature (tj) reach t he thermal shutdown on temperature threshold, t he tsd will be activated, turning off all output power elements. the circuit will automatically reset once the chip's temperature tj drops below the threshold temperature. operation of the thermal sh utdown circuit presumes that the ic's absolute maximum ratings have been exceeded. application designs should never make use of the thermal shutdown circuit. 10) overcurrent protection circuit an overcurrent protection circuit is incorporated in order to prevention destruction due to s hort-time overload currents. continued use of the pr otection circuits should be avoided. please note that current increases negatively impact the temperature. 11) damage to the internal circuit or element may occur when t he polarity of the vcc pin is opposit e to that of the other pins in applications. (i.e. vcc is shorted with the gnd pin while an external capacitor is charged.) use a maximum capacitance of 1000 mf for the output pins. inse rting a diode to prev ent back-current flow in series with vcc or bypass diodes between vcc and each pin is recommended.
14/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 ( pina ) gnd parasitic element gnd (pinb) b c e other adjacent elements vcc output pin diode for preventing back current flow bypass diode gnd p n p n n p p a ? gnd n p p b ??? (npn) b n e c gnd p transistor (npn) resistor (pin a) p su b str at e parasitic element (pin b) p substrate n p n parasitic element fig.32 bypass diode fig.33 example of simple bipolar ic architecture status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
15/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 physical dimension tape and reel information marking diagrams direction of feed 1pin reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed 2000pcs tr ( ) the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand (unit : mm) hrp5 s 0.08 s (max 9.745 include burr) 5432 1 1.9050.1 0.8 350.2 1.5230.15 10.540.13 ?0.05 +0.1 0.27 4.5 (6.5) 8.82 0.1 9.3950.125 0.730.1 1.72 0.080.05 (7.49) 8.00.13 1.0170.2 1.2575 ?4.5 +5.5 direction of feed 1pin reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs tr ( ) (unit : mm) hrp7 s 0.08 0.730.1 1.27 0.8875 1.9050.1 0.8350.2 1.5230.15 10.540.13 0.080.05 (max 9.745 include burr) 9.3950.125 s 1.0170.2 8.00.13 0.27 +0.1 - 0.05 4.5 + 5.5 ? 4.5 8.820.1 (6.5) 765432 1 (7.49) hrp7 (top view) ba30e00w part number marking lot number 1pin mark hrp5 (top view) ba3259 part number marking lot number 1pin mark
16/16 ba3259hfp ba30e00whfp datasheet tsz02201-0r6r0a600100-1-2 26.jun.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 revision history date revision changes 26.jun.2012 001 new release
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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