description avago technologies ammc-6241 is a high gain, low-noise amplifer that operates from 26 ghz to 43 ghz. this lna provides a wide-band solution for system design since it covers several bands, thus, reduces part inventory. the device has input / output match to 50 ohm, is un - conditionally stable and can be used as either primary or sub-sequential low noise gain stage. by eliminating the complex tuning and assembly processes typically required by hybrid (discrete-fet) amplifers, the ammc- 6241 is a cost-efective alternative in the 26 - 43 ghz com - munications receivers. the backside of the chip is both rf and dc ground. this helps simplify the assembly process and reduces assembly related performance variations and costs. it is fabricated in a phemt process to provide exceptional noise and gain performance. for improved reliability and moisture protection, the die is passivated at the active areas. ammc-6241 absolute maximum ratings [1] symbol parameters/conditions units min. max. v d positive drain voltage v 7 v g gate supply voltage v na i d drain current ma 100 p in cw input power dbm 15 t ch operating channel temp. c +150 t stg storage case temp. c -65 +150 t max maximum assembly temp (60 sec max) c +300 note: operation in excess of any one of these conditions may result in permanent damage to this device. ammc-6241 26C43 ghz low noise amplifer data sheet features ? wide frequency range: 26 - 43 ghz ? high gain: 20 db ? low 50 ? noise figure: 2.7 db ? 50 ? input and output match ? flat gain response ? single 3v supply bias applications ? microwave radio systems ? satellite vsat, dbs up/down link ? lmds & pt-pt mmw long haul ? broadband wireless access (including 802.16 and 802.20 wimax) ? wll and mmds loops chip size: 1900 x 800 mm (74.8 x 31.5 mils) chip size tolerance: 10 mm ( 0.4 mils) chip thickness: 100 10 mm (4 0.4 mils) rf pad dimensions: 110 x 90 mm (4.3 x 3.5 mils) dc pad dimensions: 100 x 100 mm (3.9 x 3.9 mils) for more details, refer to avago technologies application note a004r: electrostatic discharge damage and control. esd machine model (class a) esd human body model (class 0) note: these devices are esd sensitive. the fol - lowing precautions are strongly recommended. ensure that an esd approved carrier is used when dice are transported from one destination to another. personal grounding is to be worn at all times when handling these devices.
2 ammc-6241 dc specifcations/physical properties [1] symbol parameters and test conditions units min. typ. max. i d drain supply current (under any rf power drive and temperature) (v d =3.0 v) ma 60 80 q ch-b thermal resistance [2] (backside temperature, tb = 25c) c/w 25 ammc-6241 rf specifcations [3, 4, 5] t a = 25c, v d =3.0 v, i d(q)= 60 ma, z in =z o =50 ? symbol parameters andtest conditions units minimum typical maximum sigma gain small-signal gain [6] db 26-35 ghz = 20 35-40 ghz = 18.5 26-37 ghz = 21 37-40 ghz = 19.5 1.0 nf noise figure into 50w db 26-37 ghz = 2.7 37-40 ghz = 3.0 26-37 ghz = 3.0 37-40 ghz = 3.3 0.05 p -1db output power at 1dbgain com - pression dbm +10 oip3 third order intercept point; df=100mhz; pin=-35dbm dbm +20 rlin input return loss [6] db -13 -11 0.40 rlout output return loss [6] db -16 -12 0.50 isol reverse isolation [6] db -40 0.50 notes: 1. ambient operational temperature t a =25c unless otherwise noted. 2. channel-to-backside thermal resistance ( q ch-b ) = 26c/w at t channel (t c ) = 34c as measured using infrared microscopy. thermal resistance at backside temperature (t b ) = 25c calculated from measured data. 3. small/large -signal data measured in wafer form t a = 25c. 4. 100% on-wafer rf test is done at frequency =30, 32, and 38 ghz. 5. specifcations are derived from measurements in a 50 ? test environment. aspects of the amplifer performance may be improved over a more narrow bandwidth by application of additional conjugate, linearity, or low noise (gopt) matching. 6. as derived from measured s-parameters noise figure at 32 ghz typical distribution of small signal gain, noise figure, and return loss. based on 1500 part sampled over several production lots. gain at 38 ghz noise figure at 38ghz lsl 19 20 usl 2.6 2.7 2.8 2.9 usl 2.8 2.9 3 3.1 3.2 3.3
3 figure 1. typical gain figure 2. typical isolation figure 3 typical input return loss figure 4. typical output return loss figure 5. typical noise figure into a 50 ? load. figure 6. typical output p -1db and 3 rd order intercept point. figure 7. gain over temperature figure 8. isolation over temperature figure 9. input return loss over temperature ammc-6241 typical performances (t a = 25c, v d1 = v d2 =3.0 v, i total = 60 ma, z in = z out = 50 ? unless otherwise stated) note: these measurements are in a 50 ? test environment. aspects of the amplifer performance may be improved over a narrower bandwidth by application of additional conjugate, linearity, or low noise (gopt) matching. 0 5 10 15 20 25 25 29 33 37 41 45 frequency (ghz) s21 (db) -70 -60 -50 -40 -30 -20 -10 0 25 29 33 37 41 45 frequency (ghz) s12 (db) -20 -15 -10 -5 0 25 29 33 37 41 45 frequency (ghz) s11 (db) -25 -20 -15 -10 -5 0 25 29 33 37 41 45 frequency (ghz) s22 (db) 1.0 1.5 2.0 2.5 3.0 3.5 26 28 30 32 34 36 38 40 frequency (ghz) nf (db) 0 5 10 15 20 25 27 31 35 39 43 frequency (ghz) oip3 & op1db (dbm) oip3 op-1db 0 5 10 15 20 25 30 25 29 33 37 41 45 frequency (ghz) s21 (db) 25c -40c +85c -80 -60 -40 -20 0 25 29 33 37 41 45 frequency (ghz) s12 (db) 25c -40c +85c -20 -15 -10 -5 0 25 29 33 37 41 45 frequency (ghz) s11 (db) 25c -40c +85c
4 figure 10. output return loss over temperature ammc-6241 typical performances (t a = 25c, v d1 = v d2 =3.0 v, i total =60 ma, z in = z out = 50 ? unless otherwise stated) note: these measurements are in a 50 w test environment. aspects of the amplifer performance may be improved over a narrower bandwidth by application of additional conjugate, linearity, or low noise (gopt) matching. figure 11. noise figure over temperature figure 12. typical total idd over temperature figure 13. gain over vdd figure 14. isolation over vdd figure 15. input rl over vdd figure 16. output rl over vdd figure 17. output ip3 over vdd -30 -25 -20 -15 -10 -5 0 25 29 33 37 41 45 frequency (ghz) s22 (db) 25c -40c +85c 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 26 28 30 32 34 36 38 40 frequency (ghz ) nf (db) +25c -40c +85c 56 58 60 62 64 66 3 3.5 4 4.5 5 vdd (v) idd (ma) -40c +25c +85c 0 5 10 15 20 25 25 30 35 40 45 frequency (ghz) s21 (db) 3v 4v 5v -80 -60 -40 -20 0 25 30 35 40 45 frequency (ghz) s12 (db) 3v 4v 5v -20 -15 -10 -5 0 25 30 35 40 45 frequency (ghz) s11 (db) 3v 4v 5v -25 -20 -15 -10 -5 0 25 30 35 40 45 frequency (ghz) s22 (db) 3v 4v 5v 4 9 14 19 24 29 27 31 35 39 43 frequency (ghz) oip3 (dbm) 3v 4v 5v
5 ammc-6241 typical scattering parameters [1] (tc=25c, v d1 =v d2 = 3 v, i total = 60 ma ,z in = z out = 50 ? ) note: data obtained from on-wafer measurements freq ghz s11 s21 s12 s22 db mag phase db mag phase db mag phase db mag phase 15.0 -1.013 0.890 173.506 -7.637 0.415 -94.306 -59.891 0.001 132.755 -10.443 0.301 129.202 17.0 -1.306 0.860 152.019 5.022 1.783 163.635 -74.194 0.000 57.784 -14.828 0.181 102.094 19.0 -1.528 0.839 127.230 9.344 2.932 75.144 -58.181 0.001 46.460 -20.040 0.100 80.180 22.0 -2.642 0.738 74.942 15.740 6.123 -29.058 -71.353 0.000 -129.404 -27.825 0.041 4.390 24.0 -5.557 0.527 13.805 19.561 9.507 -103.326 -69.197 0.000 139.800 -28.011 0.040 -90.859 25.0 -8.397 0.380 -29.421 20.760 10.915 -143.267 -73.597 0.000 -65.707 -24.449 0.060 -110.024 26.0 -11.117 0.278 -81.009 21.155 11.422 178.829 -69.288 0.000 169.237 -23.448 0.067 -127.918 26.5 -11.627 0.262 -106.817 21.214 11.501 160.796 -58.793 0.001 -110.455 -22.500 0.075 -137.132 27.0 -11.731 0.259 -129.432 21.239 11.533 143.152 -59.928 0.001 -142.525 -22.260 0.077 -143.296 27.5 -11.805 0.257 -149.942 21.203 11.485 126.214 -58.475 0.001 -171.775 -21.694 0.082 -148.929 28.0 -11.787 0.257 -165.515 21.113 11.367 110.350 -58.768 0.001 -162.445 -21.715 0.082 -157.855 28.5 -12.038 0.250 -176.581 21.023 11.250 95.138 -57.465 0.001 158.458 -21.674 0.082 -156.390 29.0 -12.076 0.249 173.456 21.060 11.297 80.037 -57.267 0.001 169.607 -21.093 0.088 -165.820 29.5 -12.070 0.249 165.646 21.058 11.296 65.449 -55.391 0.002 168.814 -21.180 0.087 -168.128 30.0 -12.259 0.244 159.454 21.007 11.229 51.326 -52.903 0.002 134.843 -21.033 0.089 -165.016 30.5 -12.339 0.242 154.710 21.043 11.276 37.629 -55.427 0.002 92.750 -19.948 0.101 -169.860 31.0 -12.699 0.232 150.567 21.040 11.272 23.753 -55.992 0.002 109.517 -19.390 0.107 -174.803 31.5 -12.988 0.224 148.382 21.078 11.322 10.265 -53.178 0.002 109.357 -18.631 0.117 -177.679 32.0 -13.131 0.221 146.592 21.104 11.355 -3.075 -61.593 0.001 76.010 -18.449 0.120 173.486 32.5 -13.159 0.220 145.349 21.192 11.471 -16.397 -56.515 0.001 131.534 -18.461 0.119 168.589 33.0 -13.040 0.223 145.137 21.308 11.625 -30.578 -58.069 0.001 100.560 -17.807 0.129 164.643 33.5 -12.824 0.228 143.097 21.302 11.617 -44.533 -54.981 0.002 85.525 -18.223 0.123 157.797 34.0 -12.498 0.237 140.155 21.296 11.609 -58.173 -56.012 0.002 113.052 -18.033 0.125 155.542 34.5 -12.573 0.235 138.158 21.182 11.458 -72.363 -54.348 0.002 84.952 -17.550 0.133 150.830 35.0 -12.710 0.231 134.590 21.024 11.251 -85.797 -55.336 0.002 50.316 -17.667 0.131 145.841 35.5 -12.792 0.229 131.388 20.813 10.981 -98.385 -57.651 0.001 106.642 -17.466 0.134 143.100 36.0 -13.029 0.223 130.988 20.678 10.811 -111.390 -54.494 0.002 104.628 -17.225 0.138 137.833 36.5 -13.389 0.214 129.322 20.494 10.585 -123.674 -54.425 0.002 83.500 -16.978 0.142 131.310 37.0 -13.752 0.205 130.820 20.310 10.364 -136.026 -52.515 0.002 90.790 -17.004 0.141 127.335 37.5 -13.599 0.209 130.535 20.239 10.279 -147.683 -52.954 0.002 67.823 -16.551 0.149 120.618 38.0 -13.511 0.211 131.737 20.142 10.165 -160.235 -52.864 0.002 57.307 -16.813 0.144 113.724 38.5 -13.392 0.214 130.598 19.955 9.948 -172.253 -53.785 0.002 81.931 -17.019 0.141 107.173 39.0 -13.449 0.213 130.777 19.742 9.708 175.463 -51.373 0.003 54.256 -17.453 0.134 100.864 39.5 -13.713 0.206 130.341 19.463 9.400 164.088 -54.373 0.002 53.324 -17.967 0.126 97.791 40.0 -13.892 0.202 130.693 19.274 9.198 152.397 -56.900 0.001 27.630 -18.409 0.120 94.365 40.5 -13.822 0.204 131.722 19.016 8.929 141.026 -60.282 0.001 22.819 -18.887 0.114 92.964 41.0 -13.857 0.203 133.603 18.830 8.740 129.648 -54.278 0.002 32.324 -19.364 0.108 92.290 41.5 -13.578 0.209 134.336 18.631 8.542 118.871 -51.010 0.003 -8.926 -19.483 0.106 92.508 42.0 -13.775 0.205 136.724 18.429 8.346 107.881 -54.346 0.002 41.468 -19.835 0.102 94.045 42.5 -13.188 0.219 139.343 18.218 8.145 97.768 -52.144 0.002 19.887 -19.299 0.108 94.187 43.0 -13.131 0.221 142.382 18.030 7.970 87.333 -58.236 0.001 -38.809 -19.365 0.108 93.694 44.0 -11.798 0.257 146.033 17.887 7.841 67.235 -59.155 0.001 -43.306 -17.525 0.133 90.759 45.0 -10.167 0.310 147.240 17.877 7.831 45.991 -52.882 0.002 162.395 -17.185 0.138 81.030 46.0 -8.784 0.364 144.663 17.791 7.755 24.481 -52.831 0.002 -14.230 -17.248 0.137 74.975 47.0 -7.425 0.425 139.414 17.680 7.656 2.691 -50.765 0.003 -17.966 -16.593 0.148 69.936 48.0 -6.079 0.497 135.513 17.700 7.673 -19.090 -53.926 0.002 -12.616 -15.788 0.162 60.992 49.0 -4.403 0.602 128.030 17.793 7.756 -43.456 -52.746 0.002 110.943 -15.204 0.174 57.597 50.0 -2.878 0.718 120.056 17.615 7.599 -66.790 -49.370 0.003 18.237 -14.953 0.179 47.450
6 ammc-6241 typical scattering parameters [1] (tc=25c, v d1 =v d2 = 5 v, i total = 65 ma, z in = z out = 50 ? ) note: data obtained from on-wafer measurements freq ghz s11 s21 s12 s22 db mag phase db mag phase db mag phase db mag phase 15.0 -0.954 0.896 175.370 -8.236 0.387 -97.484 -58.789 0.001 74.582 -9.268 0.344 119.399 17.0 -1.228 0.868 153.538 4.910 1.760 149.468 -58.503 0.001 111.433 -12.649 0.233 86.348 19.0 -1.693 0.823 127.796 9.038 2.831 54.112 -64.600 0.001 82.329 -15.405 0.170 56.944 22.0 -4.463 0.598 72.488 14.671 5.415 -60.910 -64.010 0.001 104.610 -17.425 0.135 4.474 24.0 -10.804 0.288 7.846 17.336 7.359 -139.132 -64.039 0.001 -127.800 -17.988 0.126 -25.688 25.0 -15.616 0.166 -49.454 17.926 7.876 -177.892 -63.440 0.001 -139.623 -18.079 0.125 -40.543 26.0 -15.749 0.163 -118.695 18.185 8.114 145.637 -66.326 0.000 135.455 -18.089 0.125 -51.511 26.5 -14.388 0.191 -142.095 18.195 8.123 127.785 -60.997 0.001 147.814 -18.056 0.125 -56.680 27.0 -13.469 0.212 -157.405 18.134 8.067 111.019 -63.857 0.001 107.728 -17.926 0.127 -61.943 27.5 -12.672 0.232 -168.987 18.081 8.018 94.474 -62.998 0.001 160.703 -18.032 0.125 -67.733 28.0 -12.138 0.247 -179.012 18.015 7.957 78.323 -58.768 0.001 154.081 -18.015 0.126 -70.838 28.5 -11.933 0.253 175.281 17.898 7.850 63.047 -60.915 0.001 142.052 -17.578 0.132 -75.742 29.0 -11.570 0.264 168.288 17.844 7.802 47.754 -63.581 0.001 137.503 -17.990 0.126 -81.550 29.5 -11.350 0.271 163.120 17.735 7.704 32.835 -62.100 0.001 146.597 -18.079 0.125 -83.191 30.0 -11.555 0.264 160.007 17.591 7.578 18.567 -60.126 0.001 95.390 -17.595 0.132 -87.204 30.5 -11.254 0.274 157.772 17.515 7.512 4.174 -60.519 0.001 109.746 -17.674 0.131 -91.933 31.0 -11.283 0.273 155.500 17.405 7.417 -9.721 -56.518 0.001 129.344 -17.733 0.130 -94.827 31.5 -11.322 0.272 152.983 17.327 7.351 -23.446 -56.438 0.002 93.162 -17.607 0.132 -97.411 32.0 -11.104 0.278 151.391 17.244 7.281 -37.449 -60.113 0.001 102.403 -17.794 0.129 -99.657 32.5 -10.807 0.288 149.758 17.048 7.118 -51.248 -62.866 0.001 109.088 -17.546 0.133 -101.921 33.0 -10.496 0.299 147.850 16.850 6.959 -64.998 -60.915 0.001 105.331 -17.643 0.131 -104.875 33.5 -10.547 0.297 145.153 16.638 6.790 -78.200 -64.266 0.001 126.300 -17.286 0.137 -105.042 34.0 -10.404 0.302 143.126 16.371 6.585 -91.518 -55.886 0.002 113.278 -16.680 0.147 -110.187 34.5 -10.415 0.301 140.889 16.064 6.356 -103.678 -58.954 0.001 93.294 -16.775 0.145 -113.869 35.0 -10.362 0.303 138.559 15.807 6.171 -115.864 -56.036 0.002 103.385 -16.586 0.148 -114.914 35.5 -10.429 0.301 136.295 15.574 6.008 -127.653 -59.955 0.001 155.593 -16.405 0.151 -117.350 36.0 -10.496 0.299 134.946 15.279 5.807 -138.958 -54.224 0.002 99.686 -16.368 0.152 -119.576 36.5 -10.552 0.297 133.658 15.017 5.635 -150.079 -65.294 0.001 97.414 -16.046 0.158 -122.641 37.0 -10.420 0.301 132.618 14.810 5.502 -161.113 -57.283 0.001 119.408 -15.743 0.163 -125.742 37.5 -10.278 0.306 132.713 14.595 5.367 -171.710 -54.466 0.002 88.985 -15.643 0.165 -129.586 38.0 -10.279 0.306 130.938 14.400 5.248 177.346 -55.347 0.002 118.334 -15.366 0.170 -131.580 38.5 -10.249 0.307 128.628 14.210 5.134 167.047 -53.201 0.002 103.431 -15.139 0.175 -134.722 39.0 -10.210 0.309 128.373 14.060 5.047 156.768 -54.049 0.002 75.833 -14.871 0.180 -136.323 39.5 -10.178 0.310 126.565 13.885 4.946 147.006 -52.533 0.002 92.297 -14.738 0.183 -139.034 40.0 -10.306 0.305 125.591 13.784 4.889 137.311 -54.574 0.002 69.756 -14.487 0.189 -141.707 40.5 -10.258 0.307 125.375 13.652 4.815 127.521 -58.441 0.001 108.679 -14.153 0.196 -145.685 41.0 -10.127 0.312 124.344 13.606 4.790 117.909 -57.963 0.001 67.753 -13.736 0.206 -149.614 41.5 -10.264 0.307 124.574 13.621 4.798 107.923 -63.136 0.001 22.773 -13.394 0.214 -152.750 42.0 -10.032 0.315 123.150 13.524 4.745 98.584 -57.167 0.001 59.413 -13.059 0.222 -157.118 42.5 -10.283 0.306 124.307 13.509 4.736 89.573 -54.474 0.002 112.809 -12.764 0.230 -161.086 43.0 -10.126 0.312 121.899 13.579 4.775 80.311 -60.628 0.001 127.139 -12.652 0.233 -164.450 44.0 -10.167 0.310 124.109 13.792 4.893 61.548 -51.744 0.003 153.671 -12.185 0.246 -174.591 45.0 -9.783 0.324 125.766 14.185 5.120 42.684 -46.879 0.005 122.651 -11.784 0.258 177.006 46.0 -9.264 0.344 127.464 14.828 5.513 23.764 -49.932 0.003 96.883 -11.499 0.266 170.747 47.0 -8.307 0.384 129.119 15.605 6.029 3.192 -46.375 0.005 107.536 -10.948 0.284 163.908 48.0 -7.300 0.432 129.338 16.576 6.742 -18.746 -47.935 0.004 100.387 -10.276 0.306 155.748 49.0 -5.323 0.542 131.169 17.761 7.727 -44.350 -44.298 0.006 78.726 -9.333 0.341 147.162 50.0 -2.732 0.730 130.750 18.988 8.900 -72.015 -41.210 0.009 80.639 -8.077 0.395 136.626
7 biasing and operation the ammc-6241 is normally biased with a positive sup - ply connected to both v d1 and v d2 bond pads through the 100pf bypass capacitor as shown in figure 21. the recommended supply voltage is 3 v. it is important to place the bypass capacitor as close to the die as possible. no negative gate bias voltage is needed for the ammc- 6241. input and output matching are achieved on-die, therefore no other external component is required besides one 100pf bypass capacitor for the main sup - ply. the input and output are dc-blocked with internal coupling capacitors. no ground wires are needed because all ground connec - tions are made with plated through-holes to the backside of the device. refer the absolute maximum ratings table for allowed dc and thermal conditions. assembly techniques the backside of the mmic chip is rf ground. for mi - crostrip applications the chip should be attached directly to the ground plane (e.g. circuit carrier or heatsink) using electrically conductive epoxy [1,2] . for best performance, the topside of the mmic should be brought up to the same height as the circuit surrounding it. this can be accomplished by mounting a gold plate metal shim (same length and width as the mmic) under the chip which is of correct thickness to make the chip and adjacent circuit the same height. the amount of epoxy used for the chip and/or shim attachment should be just enough to provide a thin fllet around the bottom perimeter of the chip or shim. the ground plan should be free of any residue that may jeopardize electrical or mechanical attachment. the location of the rf bond pads is shown in figure 12. note that all the rf input and output ports are in a ground-signal-ground confguration. rf connections should be kept as short as reasonable to minimize performance degradation due to undesir - able series inductance. a single bond wire is normally sufcient for signal connections, however double bond - ing with 0.7 mil gold wire or use of gold mesh is recom - mended for best performance, especially near the high end of the frequency band. thermosonic wedge bonding is preferred method for wire attachment to the bond pads. gold mesh can be at - tached using a 2 mil round tracking tool and a tool force of approximately 22 grams and a ultrasonic power of roughly 55 db for a duration of 76 +/- 8 ms. the guided wedge at an untrasonic power level of 64 db can be used for 0.7 mil wire. the recommended wire bond stage tem - perature is 150 +/- 2c. caution should be taken to not exceed the absolute maximum notes: 1. ablebond 84-1 lm1 silver epoxy is recommended. 2. eutectic attach is not recommended and may jeopardize reliability of the device. figure 18. ammc-6241 simplifed schematic rf out rf in vd 1 vd 2
figure 19. ammc-6241 bonding pad locations figure 20. ammc-6241 assembly diagram ordering information: ammc-6241-w10 = 10 devices per tray AMMC-6241-W50 = 50 devices per tray for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries. data subject to change. copyright ? 2005-2008 avago technologies limited. all rights reserved. obsoletes av01-0231en av02-13xxen - june 23, 2008 f nut f outut v d1 v d2 gold lated shim optional 100 pf capacitor to v dd dc supply ac-6241 0 0 1 9 0 0 8 0 0 7 9 0 1 1 1 0 1 4 4 5 7 0 5 3 5 0 3 5 0 1 8 1 0 9 0 r f i n r f o u t v d 1 v d 2
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