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to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation (http://www.renesas.com) send any inquiries to http://www.renesas.com/inquiry.
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without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. re nesas electronics shall not be in any way liable for any damages or losses incurred by you or third partie s arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intende d where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electr onics data sheets or data books, etc. ?standard?: computers; office equipmen t; communications e quipment; test and measurement equipment; audio and visual equipment; home electronic a ppliances; machine tools; personal electronic equipmen t; and industrial robots. ?high quality?: transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specif ically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support device s or systems), surgical im plantations, or healthcare intervention (e.g. excision, etc.), and any other applicati ons or purposes that pose a di rect threat to human life. 8. you should use the renesas electronics pr oducts described in this document within the range specified by renesas electronics , especially with respect to the maximum ra ting, operating supply voltage range, movement power volta ge range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its produc ts, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate a nd malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physic al injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safe ty design for hardware and software in cluding but not limited to redundancy, fire control and malfunction prevention, appropri ate treatment for aging degradation or an y other appropriate measures. because the evaluation of microcomputer software alone is very difficult , please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesa s electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regul ate the inclusion or use of c ontrolled substances, including wi thout limitation, the eu rohs directive. renesas electronics assumes no liability for damage s or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in w hole or in part, without prio r written consent of renes as electronics. 12. please contact a renesa s electronics sales office if you have any questi ons regarding the informat ion contained in this document or renesas electroni cs products, or if you have any other inquiries. (note 1) ?renesas electronics? as used in this document means renesas electronics corporation and also includes its majority- owned subsidiaries. (note 2) ?renesas electronics product(s)? means any product developed or manufactured by or for renesas electronics.
description the pg2214tb is a gaas mmic for l, s-band spdt (single po le double throw) switch which was developed for mobile phone and another l, s-band application. this device can operate 2 cont rol switching by control voltage 1.8 to 5. 3 v. this device can operate frequency from 0.05 to 3.0 ghz, having the low insertion loss and high isolation. this device is housed in a 6-pin super minimold pack age. and this package is able to high-density surface mounting. features ? switch control voltage : v cont (h) = 1.8 to 5.3 v (3.0 v typ.) : v cont (l) = ? 0.2 to +0.2 v (0 v typ.) low insertion loss : l ins1 = 0.25 db typ. @ f = 0.05 to 0.5 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : l ins2 = 0.25 db typ. @ f = 0.5 to 1.0 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : l ins3 = 0.30 db typ. @ f = 1.0 to 2.0 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : l ins4 = 0.35 db typ. @ f = 2.0 to 2.5 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : l ins5 = 0.35 db typ. @ f = 2.5 to 3.0 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v high isolation : isl1 = 32 db typ. @ f = 0.05 to 0.5 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : isl2 = 28 db typ. @ f = 0.5 to 1.0 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : isl3 = 27 db typ. @ f = 1.0 to 2.0 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : isl4 = 26 db typ. @ f = 2.0 to 2.5 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : isl5 = 24 db typ. @ f = 2.5 to 3.0 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v handling power : p in (1 db) = +27.0 dbm typ. @ f = 0.5 to 3.0 ghz, v cont (h) = 3.0 v, v cont (l) = 0 v : p in (1 db) = +20.0 dbm typ. @ f = 0.5 to 3.0 ghz, v cont (h) = 1.8 v, v cont (l) = 0 v high-density surface mounting : 6- pin super minimold package (2.0 1.25 0.9 mm) applications l, s-band digital cellular or cordless telephone w-lan, wll and bluetooth tm etc. ordering information part number package marking supplying form pg2214tb-e4 6-pin super minimold (2012) g4j ? embossed tape 8 mm wide ? pin 4, 5, 6 face the perforation side of the tape ? qty 3 kpcs/reel remark to order evaluation samples, contact your nearby sales office. part number for sample order: pg2214tb data sheet caution observe precautions when handling because these devices are sensitive to electrostatic discharge. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec compound semiconductor devices representative for availability and additional information. l, s-band spdt switch gaas integrated circuit pg2214tb document no. pg10477ej03v0ds (3rd edition) date published october 2004 cp(k) printed in japan the mark ? shows major revised points. ? nec compound semiconductor devices, ltd. 2004
pin connections and internal block diagram pin no. pin name 1 output1 2 gnd 3 output2 4 v cont2 5 input g4j (top view) 1 2 3 6 5 4 (bottom view) 6 5 4 1 2 3 (top view) 1 2 3 6 5 4 6 v cont1 truth table v cont1 v cont2 input ? output1 input ? output2 low high on off high low off on absolute maximum ratings (t a = +25 c, unless otherwise specified) parameter symbol ratings unit switch control voltage v cont +6.0 note v input power p in +30 dbm operating ambient temperature t a ? 45 to +85 c storage temperature t stg ? 55 to +150 c note ? ?
electrical characteristics (t a = +25 c, v cont (h) = 3.0 v, v cont (l) = 0 v, dc cut capacitors = 100 pf, unless otherwise specified) parameter symbol test conditions min. typ. max. unit insertion loss 1 l ins1 f = 0.05 to 0.5 ghz note 1 ? 0.25 0.45 db insertion loss 2 l ins2 f = 0.5 to 1.0 ghz ? 0.25 0.45 db insertion loss 3 l ins3 f = 1.0 to 2.0 ghz ? 0.30 0.50 db insertion loss 4 l ins4 f = 2.0 to 2.5 ghz ? 0.35 0.55 db insertion loss 5 l ins5 f = 2.5 to 3.0 ghz ? 0.35 0.60 db isolation 1 isl1 f = 0.05 to 0.5 ghz note 1 29 32 ? db isolation 2 isl2 f = 0.5 to 1.0 ghz 25 28 ? db isolation 3 isl3 f = 1.0 to 2.0 ghz 24 27 ? db isolation 4 isl4 f = 2.0 to 2.5 ghz 23 26 ? db isolation 5 isl5 f = 2.5 to 3.0 ghz 21 24 ? db input return loss 1 rl in1 f = 0.05 to 0.5 ghz note 1 15 20 ? db input return loss 2 rl in2 f = 0.5 to 3.0 ghz 15 20 ? db output return loss 1 rl out1 f = 0.05 to 0.5 ghz note 1 15 20 ? db output return loss 2 rl out2 f = 0.5 to 3.0 ghz 15 20 ? db 0.1 db loss compression p in (0.1 db) f = 2.0/2.5 ghz +21.0 +23.0 ? dbm input power note 2 f = 0.5 to 3.0 ghz ? +23.0 ? dbm 1 db loss compression input power note 3 p in (1 db) f = 0.5 to 3.0 ghz ? +27.0 ? dbm 2nd harmonics 2f 0 f = 2.0 ghz, p in = +15 dbm ? ? 55 ? 47 dbc f = 2.5 ghz, p in = +15 dbm ? ? 55 ? 47 dbc 3rd harmonics 3f 0 f = 2.0 ghz, p in = +15 dbm ? ? 55 ? 47 dbc f = 2.5 ghz, p in = +15 dbm ? ? 55 ? 47 dbc intermodulation intercept point iip 3 f = 0.5 to 3.0 ghz, 2 tone, p in = +16 dbm, 5 mhz spicing ? +58 ? dbm switch control current i cont ? 4 20 a switch control speed t sw 50% ctl to 90/10% rf ? 20 200 ns notes 1. dc cut capacitors = 1 000 pf at f = 0.05 to 0.5 ghz 2. p in (0.1 db) is measured the input power level when the inse rtion loss increases more 0.1 db than that of linear range. 3. p in (1 db) is measured the input power level when the insert ion loss increases more 1 db than that of linear range. data sheet pg10477ej03v0ds 3 pg2214tb
electrical characteristics (t a = +25 c, v cont (h) = 1.8 v, v cont (l) = 0 v, dc cut capacitors = 100 pf, unless otherwise specified) parameter symbol test conditions min. typ. max. unit insertion loss 6 l ins6 f = 0.05 to 0.5 ghz note 1 ? 0.25 0.50 db insertion loss 7 l ins7 f = 0.5 to 1.0 ghz ? 0.25 0.50 db insertion loss 8 l ins8 f = 1.0 to 2.0 ghz ? 0.30 0.55 db insertion loss 9 l ins9 f = 2.0 to 2.5 ghz ? 0.35 0.60 db insertion loss 10 l ins10 f = 2.5 to 3.0 ghz ? 0.35 0.65 db isolation 6 isl6 f = 0.05 to 0.5 ghz note 1 27 30 ? db isolation 7 isl7 f = 0.5 to 2.0 ghz 23 27 ? db isolation 8 isl8 f = 2.0 to 2.5 ghz 21 25 ? db isolation 9 isl9 f = 2.5 to 3.0 ghz 20 24 ? db input return loss 3 rl in3 f = 0.05 to 3.0 ghz note 1 15 20 ? db output return loss 3 rl out3 f = 0.05 to 3.0 ghz note 1 15 20 ? db 0.1 db loss compression p in (0.1 db) f = 2.0/2.5 ghz +14.0 +17.0 ? dbm input power note 2 f = 0.5 to 3.0 ghz ? +17.0 ? dbm 1 db loss compression input power note 3 p in (1 db) f = 0.5 to 3.0 ghz ? +20.0 ? dbm switch control current i cont ? 4 20 a switch control speed t sw 50% ctl to 90/10% rf ? 20 200 ns notes 1. dc cut capacitors = 1 000 pf at f = 0.05 to 0.5 ghz 2. p in (0.1 db) is measured the input power level when the inse rtion loss increases more 0.1 db than that of linear range. 3. p in (1 db) is measured the input power level when the insert ion loss increases more 1 db than that of linear range. caution this device is used it is necessary to use dc cut capacitors. the value of dc cut capacitors should be cho sen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. the range of recommended dc cut capacitor val ue is less than 100 pf. data sheet pg10477ej03v0ds 4 pg2214tb
evaluation circuit output2 output1 c0 note c0 6 5 4 1 2 3 v cont2 v cont1 input c0 1 000 pf 1 000 pf note c0 : 0.05 to 0.5 ghz 1 000 pf : 0.5 to 3.0 ghz 100 pf the application circuits and their parameters are for reference only and are not intended for use in actual design-ins. data sheet pg10477ej03v0ds 5 pg2214tb
illustration of the test circuit assembled on evaluation board c3 c5 c1 c2 c4 g4j 6pin smm spdt sw vc2 vc1 in out 2 out 1 c1 c1 c1 c2 c2 v cont2 output2 input output1 v cont1 using the nec evaluation board symbol values c1, c2, c3 100 pf c4, c5 1 000 pf data sheet pg10477ej03v0ds 6 pg2214tb
typical characteristics (t a = +25 c, v cont (h) = 3.0 v, v cont (l) = 0 v, dc cut capacitors = 100 pf, unless otherwise specified) 4 5 2 1 0 ?2 ?4 ?5 2.0 3.5 insertion loss l ins (db) frequency f (ghz) input-output1 insertion loss vs. frequency 1.0 1.5 2.5 3.0 0.5 3 ?1 ?3 4 5 2 1 0 ?2 ?4 ?5 2.0 3.5 insertion loss l ins (db) frequency f (ghz) input-output2 insertion loss vs. frequency 1.0 1.5 2.5 3.0 0.5 3 ?1 ?3 2 1 3 4 5 2 1 3 4 5 2: ?0.674 db 1.5 ghz 1: ?0.533 db 1.0 ghz 3: ?0.830 db 2.0 ghz 4: ?0.939 db 2.5 ghz 5: ?1.142 db 3.0 ghz 2: ?0.688 db 1.5 ghz 1: ?0.533 db 1.0 ghz 3: ?0.860 db 2.0 ghz 4: ?0.949 db 2.5 ghz 5: ?1.152 db 3.0 ghz remark the graphs indicate nominal characteristics. caution these characteristics values include the losses of the nec evaluation board. data sheet pg10477ej03v0ds 7 pg2214tb
40 50 20 10 0 ?20 ? 40 ?50 2.0 3.5 isolation isl (db) frequency f (ghz) input-output1 isolation vs. frequency 1.0 1.5 2.5 3.0 0.5 30 ?10 ?30 40 50 20 10 0 ?20 ? 40 ?50 2.0 3.5 isolation isl (db) frequency f (ghz) input-output2 isolation vs. frequency 1.0 1.5 2.5 3.0 0.5 30 ?10 ?30 40 50 20 10 0 ?20 ? 40 ?50 2.0 3.5 input return loss rl in (db) frequency f (ghz) input-output1 input return loss vs. frequency 1.0 1.5 2.5 3.0 0.5 30 ?10 ?30 40 50 20 10 0 ?20 ? 40 ?50 2.0 3.5 input return loss rl in (db) frequency f (ghz) input-output2 input return loss vs. frequency 1.0 1.5 2.5 3.0 0.5 30 ?10 ?30 40 50 20 10 0 ?20 ? 40 ?50 2.0 3.5 output return loss rl out (db) frequency f (ghz) input-output1 output return loss vs. frequency 1.0 1.5 2.5 3.0 0.5 30 ?10 ?30 40 50 20 10 0 ?20 ? 40 ?50 2.0 3.5 output return loss rl out (db) frequency f (ghz) input-output2 output return loss vs. frequency 1.0 1.5 2.5 3.0 0.5 30 ?10 ?30 3.0 2 1 3 4 5 2 1 3 4 5 2 1 3 4 5 2 1 3 4 5 2 1 3 4 5 2 1 3 4 5 2: ?29.405 db 1.5 ghz 1: ?29.439 db 1.0 ghz 3: ?31.854 db 2.0 ghz 4: ?36.656 db 2.5 ghz 5: ?35.398 db 3.0 ghz 2: ?29.243 db 1.5 ghz 1: ?29.393 db 1.0 ghz 3: ?31.255 db 2.0 ghz 4: ?34.569 db 2.5 ghz 5: ?34.949 db 3.0 ghz 2: ?22.334 db 1.5 ghz 1: ?28.279 db 1.0 ghz 3: ?19.341 db 2.0 ghz 4: ?19.843 db 2.5 ghz 5: ?24.355 db 3.0 ghz 2: ?22.261 db 1.5 ghz 1: ?29.277 db 1.0 ghz 3: ?19.021 db 2.0 ghz 4: ?19.468 db 2.5 ghz 5: ?24.914 db 3.0 ghz 2: ?22.826 db 1.5 ghz 1: ?30.808 db 1.0 ghz 3: ?19.596 db 2.0 ghz 4: ?19.41 db 2.5 ghz 5: ?22.554 db 3.0 ghz 2: ?22.191 db 1.5 ghz 1: ?29.853 db 1.0 ghz 3: ?18.863 db 2.0 ghz 4: ?18.563 db 2.5 ghz 5: ?23.874 db 3.0 ghz remark the graphs indicate nominal characteristics. data sheet pg10477ej03v0ds 8 pg2214tb
30 20 5 20 30 output power p out (dbm) input power p in (dbm) output power vs. input power 12 16 24 26 10 25 15 10 14 22 18 28 f = 2 ghz remark the graph indicate nominal characteristics. data sheet pg10477ej03v0ds 9 pg2214tb
package dimensions 6-pin super minimold (unit: mm) 0.90.1 0.7 0 to 0.1 0.15 +0.1 ?0.05 0.2 +0.1 ?0.05 2.00.2 1.3 0.65 0.65 1.250.1 2.10.1 0.1 min. data sheet pg10477ej03v0ds 10 pg2214tb
recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recomm ended below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 c or below time at peak temperature : 10 seconds or less time at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ir260 vps peak temperature (package surface temperature) : 215 c or below time at temperature of 200 c or higher : 25 to 40 seconds preheating time at 120 to 150 c : 30 to 60 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below vp215 wave soldering peak temperature (molten solder temperature) : 260 c or below time at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 c or below maximum number of flow processes : 1 time maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperature (pin temperature) : 350 c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering met hods together (except for partial heating). data sheet pg10477ej03v0ds 11 pg2214tb
bluetooth is a trademark owned by bluetooth sig, inc., u.s.a. m8e 00. 4 - 0110 the information in this document is current as of october, 2004. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ? data sheet pg10477ej03v0ds 12 pg2214tb
caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. follow related laws and ordinanc es when disposing of the produc t. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (wit h a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. exclude the product from general industria l waste and household garbage, and ensure that the product is controlled (as industria l waste subject to special c ontrol) up until final disposal. do not burn, destroy, cut, crush, or chemically di ssolve the product. do not lick the product or in any way allow it to enter the mouth. nec compound semiconductor devices hong kong limited e-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) hong kong head office taipei branch office korea branch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-558-2120 fax: +852-3107-7309 fax: +886-2-2545-3859 fax: +82-2-558-5209 nec electronics (europe) gmbh http://www.ee.nec.de/ tel: +49-211-6503-0 fax: +49-211-6503-1327 california eastern laboratories, inc. http://www.cel.com/ tel: +1-408-988-3500 fax: +1-408-988-0279 0406 nec compound semiconductor devices, ltd. http://www.ncsd.necel.com/ e-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) sales division tel: +81-44-435-1588 fax: +81-44-435-1579 for further information, please contact pg2214tb

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