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  the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. mos field effect transistor pa2722t1a switching n-channel power mosfet data sheet document no. g18625ej1v0ds00 (1st edition) date published may 2007 ns cp(k) printed in japan 2007 package drawing (unit: mm) 1 2 3 4 7 8 6 5 1.27 5 0.2 5.15 0.2 6 0.2 3.65 0.2 0.7 0.15 0.6 0.15 0.42 ? 0.05 +0.1 0.10 m 0.10 s 0 ? 0 +0.05 0.27 0.05 1.0 max. 4.1 0.2 1, 2, 3 : source 4 : gate 5, 6, 7, 8: drain 5.4 0.2 1 0.2 description the pa2722t1a is n-channel mosfet designed for dc/dc converter applications. features ? low on-state resistance r ds(on)1 = 3.3 m max. (v gs = 10 v, i d = 15 a) r ds(on)2 = 4.6 m max. (v gs = 4.5 v, i d = 15 a) ? built-in gate protection diode ? thin type surface mount package with heat spreader (8-pin hvson) ? rohs compliant absolute maximum ratings (t a = 25 c, all terminals are connected.) drain to source voltage (v gs = 0 v) v dss 30 v gate to source voltage (v ds = 0 v) v gss 20 v drain current (dc) i d(dc) 29 a drain current (pulse) note1 i d(pulse) 170 a total power dissipation note2 p t1 1.5 w total power dissipation (pw = 10 sec) note2 p t2 4.6 w channel temperature t ch 150 c storage temperature t stg ? 55 to + 150 c single avalanche current note3 i as 29 a single avalanche energy note3 e as 84 mj thermal resistance channel to ambient thermal resistance note2 r th(ch-a) 83.3 c/w channel to case (drain) thermal resistance r th(ch-c) 1.5 c/w notes 1. pw 10 s, duty cycle 1% 2. mounted on a glass epoxy board of 25.4 mm x 25.4 mm x 0.8 mm 3. starting t ch = 25 c, v dd = 15 v, r g = 25 , v gs = 20 0 v, l = 100 h remark the diode connected between the gate and source of th e transistor serves as a protector against esd. when this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device. equivalent circuit source body diode gate protection diode gate drain
data sheet g18625ej1v0ds 2 c, all terminals are connected.) characteristics symbol test conditions min. typ. max. unit zero gate voltage drain current i dss v ds = 30 v, v gs = 0 v 10 a gate leakage current i gss v gs = 20 v, v ds = 0 v 10 a gate to source cut-off voltage v gs(off) v ds = 10 v, i d = 1 ma 1.0 2.5 v forward transfer admittance note | y fs | v ds = 10 v, i d = 15 a 13 s drain to source on-state resistance note r ds(on)1 v gs = 10 v, i d = 15 a 2.4 3.3 m r ds(on)2 v gs = 4.5 v, i d = 15 a 3.4 4.6 m input capacitance c iss v ds = 15 v, 6200 pf output capacitance c oss v gs = 0 v, 800 pf reverse transfer capacitance c rss f = 1 mhz 410 pf turn-on delay time t d(on) v dd = 15 v, i d = 15 a, 31 ns rise time t r v gs = 10 v, 20 ns turn-off delay time t d(off) r g = 10 129 ns fall time t f 40 ns total gate charge q g v dd = 15 v, 46 nc gate to source charge q gs v gs = 5 v, 17 nc gate to drain charge q gd i d = 29 a 18 nc body diode forward voltage note v f(s-d) i f = 29 a, v gs = 0 v 0.8 v reverse recovery time t rr i f = 29 a, v gs = 0 v, 44 ns reverse recovery charge q rr di/dt = 100 a/ s 44 nc gate resistance r g f = 1 mhz 1.4 note pulsed test circuit 3 gate charge v gs = 20 0 v pg. r g = 25 50 d.u.t. l v dd test circuit 1 avalanche capability pg. d.u.t. r l v dd test circuit 2 switching time r g pg. i g = 2 ma 50 d.u.t. r l v dd i d v dd i as v ds bv dss starting t ch v gs 0 = 1 s duty cycle 1% v gs wave form v ds wave form v gs v ds 10% 0 0 90% 90% 90% v gs v ds t on t off t d(on) t r t d(off) t f 10% 10%
data sheet g18625ej1v0ds 3 c) derating factor of forward bias safe operating area forward bias safe operating area dt - percentage of rated power - % 0 040 20 60 100 140 80 120 160 120 100 80 60 40 20 t a - ambient temperature - c i d - drain current - a 0.1 1 10 100 1000 0.01 0.1 1 10 100 i d(pulse) i d(dc) mounted on a glass epoxy board o f 25.4 mm x 25.4 mm x 0.8 mm single pulse p w = 3 0 0 s 1 i m i s 1 i 0 m i s 1 i 0 0 m i s 1 i 0 s p o w e r d i s s i p a t i o n l i m i t e d r d s ( o n ) l i m i t e d ( v g s = 1 i 0 v ) v ds - drain to source voltage - v transient thermal resistance vs. pulse width r th(t) - transient thermal resistance - c/w 0.01 0.1 1 10 100 1000 r th(ch-a) = 83.3 c/w i r th(ch-c) = 1.5 c/w i single pulse r th(ch-a) : mounted on a glass epoxy board of 25.4 mm x 25.4 mm x 0.8 mm pw - pulse width - s drain current vs. drain to source voltage forward transfer characteristics i d - drain current - a 0 30 60 90 0 0.2 0.4 0.6 0.8 1 v gs = 3.0 v 3.2 v 3.4 v 3.6 v pulsed 3.8 v 4.0 v 10 v 4.5 v v ds - drain to source voltage - v i d - drain current - a 0 30 60 90 012345 v ds = 10 v pulsed t a = ? 55 c 25 c 75 c 125 c v gs - gate to source voltage - v 100 1 m 10 m 100 m 1 10 100 1000
data sheet g18625ej1v0ds 4 gate to source cut-off voltage vs. channel temperature forward transfer admittance vs. drain current v gs(off) - gate to source cut-off voltage - v 0 0.5 1 1.5 2 2.5 3 -75 -25 25 75 125 175 v ds = 10 v i d = 1 ma t ch - channel temperature - c | y fs | - forward transfer admittance - s 0.1 1 10 100 0.01 0.1 1 10 100 v ds = 10 v pulsed t a = ? 55 c 25 c 75 c 125 c i d - drain current - a drain to source on-state resistance vs. drain current drain to source on-state resistance vs. gate to source voltage r ds(on) - drain to source on-state resistance - m 0 2 4 6 8 10 0.1 1 10 100 1000 pulsed 10 v v gs = 4.5 v i d - drain current - a r ds(on) - drain to source on-state resistance - m 0 5 10 15 0 5 10 15 20 i d = 15 a pulsed v gs - gate to source voltage - v drain to source on-state resistance vs. channel temperature capacitance vs. drain to source voltage r ds(on) - drain to source on-state resistance - m 0 2 4 6 8 10 -75 -25 25 75 125 175 i d = 15 a pulsed v gs = 4.5 v 10 v t ch - channel temperature - c c iss , c oss , c rss - capacitance - pf 100 1000 10000 1 00000 0.1 1 10 100 v gs = 0 v f = 1 mhz c rss c iss c oss v ds - drain to source voltage - v
data sheet g18625ej1v0ds 5 dynamic input/output characteristics source to drain diode forward voltage v gs - gate to source voltage - v 0 2 4 6 0204060 i d = 29 a v dd = 24 v 15 v 6 v q g - gate charge - nc i f - diode forward current - a 0.1 1 10 100 1000 0 0.2 0.4 0.6 0.8 1 1.2 pulsed v gs = 10 v 0 v v f(s-d) - source to drain voltage - v ordering information part number lead plating packing package pa2722t1a-e1-az note pa2722t1a-e2-az note sn-bi pa2722t1a-e1-ay note pa2722t1a-e2-ay note pure sn tape 3000 p/reel 8-pin hvson 0.10 g typ. note pb-free (this product does not co ntain pb in the external electrode.)
pa2722t1a the information in this document is current as of may, 2007. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec electronics data sheets or data books, etc., for the most up-to-date specifications of nec electronics products. not all products and/or types are available in every country. please check with an nec electronics sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec electronics. nec electronics assumes no responsibility for any errors that may appear in this document. nec electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec electronics products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec electronics or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. nec electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec electronics endeavors to enhance the quality, reliability and safety of nec electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. nec electronics products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to nec electronics products developed based on a customer- designated "quality assurance program" for a specific application. the recommended applications of an nec electronics product depend on its quality grade, as indicated below. customers must check the quality grade of each nec electronics product before using it in a particular application. the quality grade of nec electronics products is "standard" unless otherwise expressly specified in nec electronics data sheets or data books, etc. if customers wish to use nec electronics products in applications not intended by nec electronics, they must contact an nec electronics sales representative in advance to determine nec electronics' willingness to support a given application. (note) ? ? ? ? ? ? m8e 02. 11-1 (1) (2) "nec electronics" as used in this statement means nec electronics corporation and also includes its majority-owned subsidiaries. "nec electronics products" means any product developed or manufactured by or for nec electronics (as defined above). computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. "standard": "special": "specific":


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