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  lsy t676 hyper multi topled ? hyper-bright led 2003-03-04 1 besondere merkmale ? geh ? usetyp: wei ? es p-lcc-4 geh ? use  besonderheit des bauteils: bei geeigneter ansteuerung ist ein farbwechsel von gelb ber orange bis rot m ? glich  wellenl ? nge: 633 nm (super-rot), 587 nm (gelb)  abstrahlwinkel: lambertscher strahler (120 )  technologie: ingaalp  optischer wirkungsgrad: 11 lm/w (gelb), 7 lm/w (super-rot)  gruppierungsparameter: lichtst ? rke  verarbeitungsmethode: f r alle smt-best cktechniken geeignet  l ? tmethode: ir reflow l ? ten und wellenl ? ten (ttw)  vorbehandlung: nach jedec level 2  gurtung: 8 mm gurt mit 2000/rolle, ? 180 mm oder 8000/rolle, ? 330 mm anwendungen  optischer indikator  einkopplung in lichtleiter  hinterleuchtung (lcd, schalter, tasten, displays, werbebeleuchtung, allgemeinbeleuchtung) features  package: white p-lcc-4 package  feature of the device: with appropriate controlling it is possible to change colors from yellow via orange to red  wavelength: 633 nm (super-red), 587 nm (yellow)  viewing angle: lambertian emitter (120 )  technology: ingaalp  optical efficiency: 11 lm/w (yellow), 7 lm/w (super-red)  grouping parameter: luminous intensity  assembly methods: suitable for all smt assembly methods  soldering methods: ir reflow soldering and ttw soldering  preconditioning: acc. to jedec level 2  taping: 8 mm tape with 2000/reel, ? 180 mm or 8000/reel, ? 330 mm applications  optical indicators  coupling into light guides  backlighting (lcd, switches, keys, displays, illuminated advertising, general lighting)
2003-03-04 2 lsy t676 helligkeitswerte werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 11 % ermittelt. luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of 11 %. anm.: die standardlieferform von serientypen beinhaltet eine familiengruppe. einzelne gruppen sind nicht erh?ltlich. in einer verpackungseinheit / gurt ist immer nur eine gruppe pro farbe enthalten. note: the standard shipping format for serial types includes a family group. individual groups are not available. no packing unit / tape ever contains more than one luminous intensity group per color. typ type emissions- farbe color of emission farbe der lichtaustritts- fl ? che color of the light emitting area lichtst ? rke luminous intensity i f = 20 ma i v (mcd) bestellnummer ordering code super-red yellow lsy t676 lsy t676-p+p lsy t676-p+q lsy t676-p+r lsy t676-q+q lsy t676-q+r super-red / yellow colorless clear 45 ... 180 45 ... 71 45 ... 71 45 ... 71 71 ... 112 71 ... 112 45 ... 180 45 ... 71 71 ... 112 112 ...180 71 ... 112 112 ...180 q62703q3428
lsy t676 2003-03-04 3 grenzwerte maximum ratings bezeichnung parameter symbol symbol werte values einheit unit ls ly betriebstemperatur operating temperature range t op ? 40 ? + 100 c lagertemperatur storage temperature range t stg ? 40 ? + 100 c sperrschichttemperatur junction temperature t j + 125 c durchlassstrom forward current i f 30 ma sto ? strom surge current t 10 s, d = 0.005 i fm 10.2a sperrspannung 1) reverse voltage v r 12 v leistungsaufnahme power consumption p tot 80 mw w ? rmewiderstand thermal resistance sperrschicht/umgebung 1 chip on junction/air 2 chips on sperrschicht/l ? tpad 1 chip on junction/solder point 2 chips on montage auf pc-board fr 4 (padgr ?? e 16 mm 2 ) mounted on pc board fr 4 (pad size 16 mm 2 ) r th ja r th ja r th js r th js 580 790 340 470 k/w k/w k/w k/w 1) f r kurzzeitigen betrieb geeignet / suitable for short term application
2003-03-04 4 lsy t676 kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol werte values einheit unit ls ly wellenl ? nge des emittierten lichtes (typ.) wavelength at peak emission i f = 20 ma peak 645 591 nm dominantwellenl ? nge 1) (typ.) dominant wavelength 1) i f = 20 ma dom 633 ?6 587 ? 7/+8 nm spektrale bandbreite bei 50 % i rel max (typ.) spectral bandwidth at 50 % i rel max i f = 20 ma ? 16 15 nm abstrahlwinkel bei 50 % i v (vollwinkel) (typ.) viewing angle at 50 % i v 2 ? 120 120 grad deg. durchlassspannung 2) (typ.) forward voltage 2) (max.) i f = 20 ma v f v f 2.0 2.4 2.0 2.4 v v sperrstrom (typ.) reverse current (max.) v r = 12 v i r i r 0.01 10 0.01 10 a a temperaturkoeffizient von peak (typ.) temperature coefficient of peak i f = 20 ma; ? 10 c t 100 c tc peak 0.14 0.13 nm/k temperaturkoeffizient von dom (typ.) temperature coefficient of dom i f = 20 ma; ? 10 c t 100 c tc dom 0.05 0.10 nm/k temperaturkoeffizient von v f (typ.) temperature coefficient of v f i f = 20 ma; ? 10 c t 100 c tc v ? 2.0 ? 2.5 mv/k optischer wirkungsgrad (typ.) optical efficiency i f = 20 ma opt 711lm/w 1) wellenl ? ngen werden mit einer stromeinpr ? gedauer von 25 ms und einer genauigkeit von 1 nm ermittelt. wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm. 2) durchlassspannungen werden mit einer stromeinpr ? gedauer von 1 ms und einer genauigkeit von 0,1 v ermittelt. forward voltages are tested at a current pulse duration of 1 ms and a tolerance of ?.1 v.
lsy t676 2003-03-04 5 relative spektrale emission i rel = f ( ), t a = 25 c, i f = 20 ma relative spectral emission v( ) = spektrale augenempfindlichkeit standard eye response curve abstrahlcharakteristik i rel = f ( ? ) radiation characteristic ohl01061 400 0 20 40 60 80 100 450 500 550 600 650 700 nm % i rel v yellow super-red 0 0.2 0.4 1.0 0.8 0.6 ? 1.0 0.8 0.6 0.4 0? 10? 20? 40? 30? ohl01660 50? 60? 70? 80? 90? 100? 0? 20? 40? 60? 80? 100? 120?
lsy t676 2003-03-04 6 durchlassstrom i f = f ( v f ) forward current t a = 25 c maximal zul ? ssiger durchlassstrom i f = f ( t ) max. permissible forward current relative lichtst ? rke i v / i v(20 ma) = f ( i f ) relative luminous intensity t a = 25 c maximal zul ? ssiger durchlassstrom i f = f ( t ) max. permissible forward current ohl00232 10 -1 1.4 1.8 2.2 2.6 3 v 3.4 0 10 1 10 10 2 5 5 ma 5 1 f v f i ohl01072 0 020406080 ? c 100 t i f 5 10 15 20 25 30 35 2 chips on 1 chip on t s temp. solder point i ohl01062 f -1 10 v i 10 -3 -2 -1 0 1 10 10 10 10 10 0 10 1 10 2 5 5 5 55ma (20 ma) i v super-red yellow ohl01075 0 020406080 ? c 100 t i f 5 10 15 20 25 30 35 2 chips on 1 chip on temp. ambient t a
lsy t676 2003-03-04 7 relative lichtst ? rke i v / i v(25 c) = f ( t a ) relative luminous intensity i f = 20 ma zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c ls zul ? ssige impulsbelastbarkeit i f = f ( t p ) permissible pulse handling capability duty cycle d = parameter, t a = 25 c ly t ohl01068 0 v i -20 0 20 40 60 ? c 100 a 0.4 0.8 1.2 1.6 2.0 i v (25 ? c) yellow super-red super-red yellow ohl00318 f i 10 10 -5 -4 -3 10 10 -2 10 -1 10 0 s 10 1 10 2 p t 0.05 0.5 0.2 0.1 d 0.02 0.01 0.005 = -2 10 -1 10 0 10 5 5 a d t t = p t t p i f ohl00316 f i 10 10 -5 -4 -3 10 10 -2 10 -1 10 0 s 10 1 10 2 p t 0.05 0.5 0.2 0.1 d 0.02 0.01 0.005 = -2 10 -1 10 0 10 5 5 a d t t = p t t p i f
2003-03-04 8 lsy t676 ma ? zeichnung package outlines ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). gewicht / approx. weight: 35 mg marking package gply6837 23 4 1 0.8 (0.031) 0.6 (0.024) 2.6 (0.102) 2.1 (0.083) 2.3 (0.091) 3.0 (0.118) 3.4 (0.134) 3.0 (0.118) (2.4 (0.094)) 2.1 (0.083) 1.7 (0.067) 0.9 (0.035) 0.7 (0.028) 4 ? 1 0.1 (0.004) typ 1.1 (0.043) 3.3 (0.130) 3.7 (0.146) 0.5 (0.020) 0.12 (0.005) 0.18 (0.007) 0.4 (0.016) 0.6 (0.024) c a circuit diagram c a lsyt676 led emission color 1 emission color 2 package cathode: pin 1 cathode: pin 3
lsy t676 2003-03-04 9 l ? tbedingungen vorbehandlung nach jedec level 2 soldering conditions preconditioning acc. to jedec level 2 ir-reflow l ? tprofil (nach ipc 9501) ir reflow soldering profile (acc. to ipc 9501) ohly0597 0 0 50 100 150 200 250 50 100 150 200 250 300 t t ? c s 240-245 ? c 10-40 s 183 ? c 120 to 180 s defined for preconditioning: up to 6 k/s ramp-down rate up to 6 k/s ramp-up rate up to 6 k/s defined for preconditioning: 2-3 k/s
2003-03-04 10 lsy t676 wellenl ? ten (ttw) (nach cecc 00802) ttw soldering (acc. to cecc 00802) ohly0598 0 0 50 100 150 200 250 50 100 150 200 250 300 t t c s 235 c 10 s c ... 260 1. welle 1. wave 2. welle 2. wave 5 k/s 2 k/s ca 200 k/s cc ... 130 100 2 k/s zwangsk ? hlung forced cooling normalkurve standard curve grenzkurven limit curves
lsy t676 2003-03-04 11 empfohlenes l ? tpaddesign ir reflow l ? ten recommended solder pad ir reflow soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). ohlpy439 padgeometrie f ? r verbesserte w ? rmeableitung improved heat dissipation paddesign for l ? tstoplack solder resist 1.1 (0.043) 4.5 (0.177) 1.5 (0.059) 2.6 (0.102) 3.3 (0.130) 0.5 (0.020) 7.5 (0.295) 0.4 (0.016) cathode marking kathoden markierung / cu fl ? che / 12 mm per pad 2 cu-area _ < 3.3 (0.130)
2003-03-04 12 lsy t676 empfohlenes l ? tpaddesign wellenl ? ten (ttw) recommended solder pad ttw soldering ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). gurtung / polarit ? t und lage verpackungseinheit 2000/rolle, 180 mm oder 8000/rolle, 330 mm method of taping / polarity and orientation packing unit 2000/reel, 180 mm or 8000/reel, 330 mm ma e werden wie folgt angegeben: mm (inch) / dimensions are specified as follows: mm (inch). ohay0583 6.1 (0.240) 2.8 (0.110) 2 (0.079) 3 (0.118) 6 (0.236) 3.5 (0.138) 1.5 (0.059) 2 (0.079) 3.5 (0.138) 1 (0.039) 8 (0.315) 2.8 (0.110) 0.5 (0.020) 7.5 (0.295) solder resist l ? tstoplack pcb-direction bewegungsrichtung der platine 2 (0.079) padgeometrie f ? r improved heat dissipation verbesserte w ? rmeableitung paddesign for 2 cu fl ? che / > 12 mm per pad cu-area ohay0093 4 (0.157) 2.9 (0.114) 1.5 (0.059) 4 (0.157) 3.6 (0.142) 3.5 (0.138) 2 (0.079) 1.75 (0.069) 8 (0.315) ca ac
lsy t676 2003-03-04 13 published by osram opto semiconductors gmbh wernerwerkstrasse 2, d-93049 regensburg ? all rights reserved. attention please! the information describes the type of component and shall not be considered as assured characteristics. all typical data and graphs are basing on representative samples, but don t represent the production range. if requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. terms of delivery and rights to change design reserved. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. if printed or downloaded, please find the latest version in the internet. packing please use the recycling operators known to you. we can also help you get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of transport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or systems must be expressly authorized for such purpose! critical components 1 may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. 2 life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. revision history: 2003-03-04 date of change previous version: 2002-09-18 page subjects (major changes since last revision) 13 annotations 2002-07-25 4 value ( tc dom from 0.01to 0.05 nm/k) 2002-07-25 3, 4 value (reverse voltage from 3 v to 12 v) 2002-09-18


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