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  ? 2005 california micro devices corp. all rights reserved. 08/26/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 1 cm1405 lcd emi filter array with esd protection features ? eight channels of emi filtering ? 30kv esd protection on each channel (iec 61000-4-2 level 4, contact discharge) ? 30kv esd protection on each channel (hbm) ? better than 35db of attenuation at 800-2700mhz ? chip scale package features extremely low lead inductance for optimum filter and esd performance ? 20-bump, 4.000mm x 1.458mm footprint chip scale package ? optiguard ? coated version available for improved reliability at assembly ? lead-free version available applications ? lcd data lines in mobile handsets ? emi filtering & esd protection for high-speed i/o ports ? emi filtering for high-speed data lines ? wireless handsets ? cell phones ? notebook computers ? pdas / handheld pcs product description california micro device's cm1 405 is an emi filter array with esd protection, which integrates eight pi- filters (c-r-c). the cm1405 has component values of 25pf- 100 -25pf. the parts include avalanche-type esd diodes on every pin, which provide a very high level of protection for sensitive elec tronic components that may be subjected to electrostatic discharge (esd). the esd diodes connected to the filter ports safely dissi- pate esd strikes of 30kv, exceeding the maximum requirement of the iec61000-4-2 international stan- dard. using the mil-std-883 (method 3015) specifica- tion for human body model (hbm) esd, the pins are protected for contact discharges at greater than 30kv. this device is particularly we ll-suited for portable elec- tronics (e.g. mobile hand sets, pdas, notebook com- puters) because of its small package and easy-to-use pin assignments. in particular, the cm1405 is ideal for emi filtering and protecting data lines from esd for the lcd display in mobile handsets. the cm1405-03 incorporates optiguard ? coating which results in improved re liability at assembly and is available in space-saving, lo w-profile chip -scale pack- ages with optional lead-free finishing. electrical schematic * see package/pinout diagram for expanded pin information. 1 of 8 emi filtering + esd channels 100 25pf 25pf filtern* gnd filtern* (pins b1-b4)
? 2005 california micro devices corp. all rights reserved. 2 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 08/26/05 cm1405 ordering information note 1: parts are shipped in tape & reel form unless otherwise specified. note 2: lead-free devices ar e specified by using a " + " character for the top side orientation mark. filter5 filter6 gnd filter5 filter6 a6 a5 orientation marking b3 c6 c5 filter7 filter8 gnd filter7 filter8 a8 a7 b4 c8 c7 filter3 filter4 gnd filter3 filter4 a4 a3 b2 c4 c3 filter1 filter2 gnd filter1 filter2 a2 a1 b1 c2 c1 a1 filter5 filter6 gnd filter5 filter6 a6 a5 orientation marking b3 c6 c5 filter7 filter8 gnd filter7 filter8 a8 a7 b4 c8 c7 filter3 filter4 gnd filter3 filter4 a4 a3 b2 c4 c3 filter1 filter2 gnd filter1 filter2 a2 a1 b1 c2 c1 a1 n053 4 3 2678 5 1 c b a orientation marking (see note 2) n051 4 3 2678 5 1 c b a orientation marking (see note 2) package / pinout diagrams notes: bottom view (bumps up view) top view (bumps down view) cm1405-03 1) these drawings are not to scale. 2) lead-free devices are specified by using a " + " character for the top side orientation mark. cm1405-01 chip scale package chip scale package pin descriptions pin(s) name description pin(s) name description a1 filter1 filter channel 1 c1 filter1 filter channel 1 a2 filter2 filter channel 2 c2 filter2 filter channel 2 a3 filter3 filter channel 3 c3 filter3 filter channel 3 a4 filter4 filter channel 4 c4 filter4 filter channel 4 a5 filter5 filter channel 5 c5 filter5 filter channel 5 a6 filter6 filter channel 6 c6 filter6 filter channel 6 a7 filter7 filter channel 7 c7 filter7 filter channel 7 a8 filter8 filter channel 8 c8 filter8 filter channel 8 b1-b4 gnd device ground part numbering information bumps pkg standard finish lead-free finish 2 no coating optiguard tm coated no coating optiguard tm coated ordering part number 1 part marking ordering part number 1 part marking ordering part number 1 part marking ordering part number 1 part marking 20 csp cm1405-01cs n051 cm1405-03cs n053 CM1405-01CP n051 cm1405-03cp n053
? 2005 california micro devices corp. all rights reserved. 08/26/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 3 cm1405 specifications note 1: t a = 25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gnd, one at a time. note 3: these parameters are guaranteed by design and characterization. absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc power per resistor 100 mw dc package power rating 500 mw standard operating conditions parameter rating units operating temperature range -40 to +85 c electrical operating characteristics (see note 1) symbol parameter conditions min typ max units r resistance 80 100 120 c capacitance at 2.5v dc, 1mhz, 30mv ac 20 25 30 pf v diode diode standoff voltage i diode = 10 a6.0v i leak diode leakage current (reverse bias) v diode = +3.3v 0.1 1 a v sig signal voltage positive clamp negative clamp i load = 10ma i load = -10ma 5.6 -1.5 6.8 -0.8 9.0 -0.4 v v v esd in-system esd wi thstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 level 4 notes 2 and 3 30 30 kv kv r dyn dynamic resistance positive negative 1.5 0.9 f c cut-off frequency z source =50 , z load =50 r = 100 , c = 25pf 70 mhz
? 2005 california micro devices corp. all rights reserved. 4 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 08/26/05 cm1405 performance information typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) figure 1. a1-c1 emi filter performance figure 2. a2-c2 emi filter performance
? 2005 california micro devices corp. all rights reserved. 08/26/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 5 cm1405 performance information (cont?d) typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) figure 3. a3-c3 emi filter performance figure 4. a4-c4 emi filter performance
? 2005 california micro devices corp. all rights reserved. 6 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 08/26/05 cm1405 performance information (cont?d) typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) figure 5. a5-c5 emi filter performance figure 6. a6-c6 emi filter performance
? 2005 california micro devices corp. all rights reserved. 08/26/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 7 cm1405 performance information (cont?d) typical filter performance (nominal conditions unless specified otherwise, 50 ohm environment) figure 7. a7-c7 emi filter performance figure 8. a8-c8 emi filter performance
? 2005 california micro devices corp. all rights reserved. 8 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 08/26/05 cm1405 performance information (cont?d) figure 9. filter capacitance vs. input voltage over temperature (normalized to capacitance at 2.5vdc and 25c)
? 2005 california micro devices corp. all rights reserved. 08/26/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 9 cm1405 application information refer to application no te ap-217, "the chip scale package", for a detailed description of chip scale packages offered by california micro devices. figure 10. recommended non-solder mask defined pad illustration figure 11. eutectic (snpb) solder ball reflow profile figure 12. lead-free (snagcu) solder ball reflow profile printed circuit boar d recommendations parameter value pad size on pcb 0.275mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.325mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (las er cut, 5% tapered walls) 0.330mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous (183c) 60 seconds maximum soldering temperature for a eutectic device using eutectic solder paste 240c maximum soldering temperature for a lead-fr ee device using lead-free solder paste 260c solder mask opening 0.325mm dia. non-solder mask defined pad 0.275mm dia. solder stencil opening 0.330mm dia. 200 250 150 100 50 0 1:00.0 2:00.0 3:00.0 4:00.0 time (minutes) temperature (c)
? 2005 california micro devices corp. all rights reserved. 10 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 08/26/05 cm1405 mechanical details cm1405-01 mechanical specifications the package dimensions for the cm1405-01 are pre- sented below. package dimensions for cm1405-01 chip scale package package dimensions package custom csp bumps 20 dim millimeters inches min nom max min nom max a1 3.955 4.000 4.045 0.1557 0.1575 0.1593 a2 1.413 1.458 1.503 0.0556 0.0574 0.0592 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.245 0.250 0.255 0.0096 0.0098 0.0100 b3 0.430 0.435 0.440 0.0169 0.0171 0.0173 b4 0.430 0.435 0.440 0.0169 0.0171 0.0173 c1 0.200 0.250 0.300 0.0079 0.0098 0.0118 c2 0.244 0.294 0.344 0.0096 0.0116 0.0135 d1 0.562 0.606 0.650 0.0221 0.0239 0.0256 d2 0.356 0.381 0.406 0.0140 0.0150 0.0160 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams a c 3456 c1 b1 a1 b3 c2 d1 d2 a2 bottom view side view 12 b2 b4 78 b a 0.30 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) dimensions in millimeters
? 2005 california micro devices corp. all rights reserved. 08/26/05 490 n. mccarthy blvd., milpitas, ca 95035-5112 tel: 408.263.3214 fax: 408.263.7846 www.calmicro.com 11 cm1405 mechanical details (cont?d) cm1405-03 mechanical specifications the package dimensions for the cm1405-03 are pre- sented below. package dimensions for cm1405-03 chip scale package csp tape and reel specifications figure 13. tape and reel mechanical data package dimensions package custom csp bumps 20 dim millimeters inches min nom max min nom max a1 3.955 4.000 4.045 0.1557 0.1575 0.1593 a2 1.413 1.458 1.503 0.0556 0.0574 0.0592 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.245 0.250 0.255 0.0096 0.0098 0.0100 b3 0.430 0.435 0.440 0.0169 0.0171 0.0173 b4 0.430 0.435 0.440 0.0169 0.0171 0.0173 c1 0.200 0.250 0.300 0.0079 0.0098 0.0118 c2 0.244 0.294 0.344 0.0096 0.0116 0.0135 d1 0.575 0.644 0.714 0.0226 0.0254 0.0281 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters mechanical package diagrams a c 3456 c1 b1 a1 b3 c2 dimensions in millimeters d1 d2 a2 bottom view side view 12 b2 b4 78 b a 0.30 dia. 63/37 sn/pb (eutectic) or solder bumps 96.8/2.6/0.6 sn/ag/cu (lead-free) optiguard tm coating part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 cm1405-01 4.00 x 1.46 x 0.606 4.11 x 1. 57 x 0.76 12mm 330mm (13") 3500 4mm 4mm cm1405-03 4.00 x 1.46 x 0.644 4.11 x 1. 57 x 0.76 12mm 330mm (13") 3500 4mm 4mm to p for tape feeder reference cover tape p 1 only including draft. concentric around b. k o embossment user direction of feed 0.2 mm p o center lines of cavity w 10 pitches cumulative tolerance on tape a o b o


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