all specification & dimensions are subject to change, please cal l your nearest foxconn sales re presentative for update informat ion. specifications burn-in & test socket burn-in socket series bga type, open top, type 2 0.80 mm [.031?] pitch 90 pos. mechanical durability: 10?000 cycles min. actuation force: 2.5kgf max. electrical current rating: 1amp/pin min. dielectric withstanding voltage: 650v a.c for 60 sec. insulation resistance: 1000m ? min. contact resistance: 150m ? max. hast: pass 85 j at 85% rh, 50 hours duration temperature cycling: pass -55 to 125 j , 1000 cycles bake : pass 150 j for 168 hours physical cover & base & lid: thermoplastic, ul 94v-0 contact: copper alloy contact plating: see ?ordering information? operating temperature: 150 j max. drawing ordering in fo r matio n product no.: 2 q 0 0 * * 3 7 - 3 3 2 * - 1 0 f 2q009037-3325-10f 90 12.0x8.0 2q009037-3324-10f 90 11.5x11.0 2q009037-3321-10f 90 12.5x10.0 2q007237-332a-10f 72 19.5x11.5 2Q007237-3321-10F 72 12.5x10.0 p/n pos. chip spec. pitch 3=0.80 mm contact plating 7=15 ? gold plating design type 2=type #2 tail plating 3=au chip/burn-in board 3=bga/pga lf code f=lead free package 1=soft tray pick-up design 0=none chip spec. 1=12.5x10.0 4=11.5x11.0 5=12.0x8.0 a =10.5x11.5 pin counts 0072=72 pos. 0090=90 pos.
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