stps8h100d/f/g/g-1 ? november 1998 - ed: 4a high voltage power schottky rectifier schottky barrier rectifier designed for high fre- quency compact switched mode power sup- plies such as adaptators and on board dc/dc converters. description to-220ac stps8h100d k a symbol parameter value unit v rrm repetitive peak reverse voltage 100 v i f(rms) rms forward current 30 a i f(av) average forward current d = 0.5 to-220ac / i 2 pak / d 2 pak tc= 165 c8 a isowatt220ac tc = 150 c i fsm surge non repetitive forward current tp = 10 ms sinusoidal 250 a i rrm repetitive peak reverse current tp = 2 m s f = 1khz square 1 a i rsm non repetitive peak reverse current tp = 100 m s square 3 a e as non repetitive avalanche energy t j =25 cl=60mh i as =2a 24 mj i ar repetitive avalanche current va = 1.5 x v r typ current decaying linearly to 0 in 1 m s frequency limited by tj max. 2a t stg storage temperature range - 65 to + 175 c tj maximum operating junction temperature 175 c dv/dt critical rate of rise of rise voltage 10000 v/ m s absolute ratings (limiting values) i 2 pak stps8h100g-1 d 2 pak stps8h100g isowatt220ac stps8h100f k a nc k a k a nc i f(av) 8a v rrm 100 v tj (max) 175 c v f (max) 0.58 v main product characteristics negligibleswitching losses high junction temperature capability low leakage current good trade off between leakage current and forward voltage drop avalanche rated features and benefits 1/7
symbol parameter value unit r th (j-c) junction to case to-220ac/ i 2 pak / d 2 pak 1.6 c/w r th (j-c) junction to case isowatt220ac 4 c/w thermal resistances symbol parameter tests conditions min. typ. max. unit i r * reverse leakage current tj = 25 cv r =v rrm 4.5 m a tj = 125 c26ma v f ** forward voltage drop tj = 25 ci f = 8 a 0.71 v tj = 25 ci f = 10 a 0.77 tj = 25 ci f = 16 a 0.81 tj = 125 ci f = 8 a 0.56 0.58 tj = 125 ci f = 10 a 0.59 0.64 tj = 125 ci f = 16 a 0.65 0.68 static electrical characteristics pulse test : * tp = 5 ms, d <2% ** tp = 380 m s, d <2% to evaluate the maximum conduction losses use the following equation : p = 0.48 x i f(av) + 0.0125 x i f 2 (rms) 012345678910 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 if(av) (a) pf(av)(w) d = 0.2 d = 0.5 d =1 d = 0.05 d = 0.1 t d =tp/t tp fig. 1: average forward power dissipation versus average forward current. (to-220ac / isowatt220ac / i 2 pak / d 2 pak) 0 20 40 60 80 100 120 140 160 180 0 2 4 6 8 10 tamb( c) if(av)(a) rth(j-a)=15 c/w rth(j-a)=rth(j-c) t d =tp/t tp fig. 2-1: average forward current versus ambient temperature ( d =0.5) (to-220ac / i 2 pak / d 2 pak). stps8h100d/f/g/g-1 2/7
0 20 40 60 80 100 120 140 160 180 0 2 4 6 8 10 rth(j-a)=50 c/w rth(j-a)=rth(j-c) tamb( c) if(av)(a) t d =tp/t tp fig. 2-2: average forward current versus ambient temperature( d =0.5) (isowatt220ac). 1e-3 1e-2 1e-1 1e+0 0 10 20 30 40 50 60 70 80 90 100 tc=75 c tc=100 c tc=125 c t(s) im(a) i m t d =0.5 fig. 3-2: non repetitive surge peak forward current versus overload duration (maximum values) (isowatt220ac). 1e-3 1e-2 1e-1 1e+0 1e+1 0.0 0.2 0.4 0.6 0.8 1.0 tp(s) zth(j-c)/rth(j-c) d = 0.1 d = 0.2 d = 0.5 single pulse t d =tp/t tp fig. 4-2: relative variation of thermal impedance junction to case versus pulse duration (isowatt220ac). 1e-3 1e-2 1e-1 1e+0 0 20 40 60 80 100 120 140 160 t(s) im(a) tc=75 c tc=100 c tc=125 c i m t d =0.5 fig. 3-1: non repetitive surge peak forward current versus overload duration (maximum values) (to-220ac / i 2 pak / d 2 pak). 1e-4 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 tp(s) zth(j-c)/rth(j-c) d = 0.1 d = 0.2 d = 0.5 single pulse t d =tp/t tp fig. 4-1: relative variation of thermal impedance junction to case versus pulse duration (to-220ac / i 2 pak / d 2 pak). 0 102030405060708090100 1e-2 1e-1 1e+0 1e+1 1e+2 1e+3 5e+3 vr(v) ir( m a) tj=125 c tj=25 c fig. 5: reverse leakage current versus reverse voltage applied (typical values). stps8h100d/f/g/g-1 3/7
1 10 100 100 200 500 1000 vr(v) c(nf) f=1mhz tj=25 c fig. 6: junction capacitance versus reverse volt- age applied (typical values). 0 4 8 1216202428323640 0 10 20 30 40 50 60 70 80 s(cu) (cm ) rth(j-a) ( c/w) fig. 8: thermal resistance junction to ambient ver- sus copper surface under tab (epoxy printed circuit board fr4, copper thickness: 35 m m)(d 2 pak). 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0.1 1.0 10.0 50.0 vfm(v) ifm(a) tj=25 c tj=125 c fig. 7: forward voltage drop versus forward cur- rent (maximum values). stps8h100d/f/g/g-1 4/7
package mechanical data to-220ac a c d e m l7 h2 i l5 l6 l9 l4 g f1 f l2 ref. dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 h2 10.00 10.40 0.393 0.409 l2 16.40 typ. 0.645 typ. l4 13.00 14.00 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. i 3.75 3.85 0.147 0.151 package mechanical data isowatt220ac f g f1 h de a b l7 diam l2 l6 l3 ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.40 4.60 0.173 0.181 b 2.50 2.70 0.098 0.106 d 2.40 2.75 0.094 0.108 e 0.40 0.70 0.016 0.028 f 0.75 1.00 0.030 0.039 f1 1.15 1.70 0.045 0.067 g 4.95 5.20 0.195 0.205 h 10.00 10.40 0.394 0.409 l2 16.00 0.630 l3 28.60 30.60 1.125 1.205 l6 15.90 16.40 0.626 0.646 l7 9.00 9.30 0.354 0.366 diam 3.00 3.20 0.118 0.126 stps8h100d/f/g/g-1 5/7
package mechanical data d 2 pak a c2 d r 2.0 min. flat zone a2 v2 c a1 g l l3 l2 b b2 e ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.30 4.60 0.169 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.40 0.055 c 0.45 0.60 0.017 0.024 c2 1.21 1.36 0.047 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.28 0.393 0.405 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 r 0.40 0.016 v2 0 8 0 8 8.90 3.70 1.30 5.08 16.90 10.30 footprint (in millimeters)d 2 pak stps8h100d/f/g/g-1 6/7
information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 1998 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - canada - china - france - germany - italy - japan - korea - malaysia - malta - mexico - morocco - the netherlands - singapore - spain - sweden - switzerland - taiwan - thailand - united kingdom - u.s.a. http://www.st.com package mechanical data i 2 pak ref. dimensions millimeters inches min. typ. max. min. typ. max. a 4.30 4.60 0.169 0.181 a1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.20 1.38 0.047 0.054 b2 1.25 1.40 0.049 0.055 c 0.45 0.60 0.018 0.024 c2 1.21 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 2.44 2.64 0.096 0.104 e 10.00 10.28 0.394 0.405 l 13.10 13.60 0.516 0.535 l1 3.48 3.78 0.137 0.149 l2 1.27 1.40 0.050 0.055 ordering type marking package weight base qty delivery mode stps8h100d stps8h100d to-220ac 1.86g 50 tube stps8h100f stps8h100f isowatt220ac 2.00g 50 tube stps8h100g-1 stps8h100g i 2 pak 1.49g 50 tube stps8h100g stps8h100g d 2 pak 1.48g 50 tube stps8h100g-tr stps8h100g d 2 pak 1.48g 500 tape & reel epoxy meets ul94,v0 stps8h100d/f/g/g-1 7/7
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