axk7l, 8l 1 narrow pitch (0.4mm) connectors f4 akct1b57e ?3.9 http://www.nais-e.com/ new narrow pitch (0.4mm) connectors f4 narrow-pitch connectors for pc board-to-fpc connection socket header example of connection between a board and an fpc 0.9mm pcb f4 connector fpc reinforcing plate (including the fpc) before mating after mating features 1. the lowest pro?e class among two- piece connectors in the world (mated height: 0.9mm) achieved both a 0.4-mm pitch and an ultra low pro?e of 0.9 mm high when mated, contributing to further thickness reduction of products. 2. ultra low pro?e, but high contact reliability our own bellows-type double contact structure provides a high resistance to twisting and shock, ensuring a high contact reliability. 3. improved mating strength between the socket and header the simple locking structures provided for the retention ?tings and the contact points improve the mating strength and provide tactile feedback when locked. 4. easy to design product circuits 1) an insulating wall provided for the bottom surface of the connector prevents contact between the pattern on the pc board and the metal pins, enabling pattern wiring under the connector, and thus contributing to the reduction in size of pc boards. 2) the usage shown below further enhances the ?xibility of connector positioning. [example of application of connection between a board and an fpc] 5. standard use of ni barrier plating the use of ni barrier plating, which is highly resistant against solder creeping, on the socket terminals is standard. double contact locking structure of the retention fittings socket header [socket] pattern wiring under the connector is possible. [header] pcb 1.5 fpc f4 p4 0.9 product types notes) 1. regarding ordering units: during production: please make orders in 1-reel units. samples for mounting con?mation: available in units of 50 pieces. please consult us. samples: available. please consult us. 2. the standard type comes with no positioning bosses. connectors with positioning bosses are available for on-demand production . for this type of connector, 9th digit of the part no. changes from 2 to 1. e.g. 20 contacts for sockets: axk7l2021 7* 3. please consult us regarding a different number of contacts. mated height no. of contacts part no. packing socket header inner carton (1-reel) outer carton 0.9 mm 20 axk7l20227* axk8l20125* asterisk at the last digit of the part no.: j: 3,000 pieces v: 3,000 pieces asterisk at the last digit of the part no.: j: 6,000 pieces (2 reels) v: 15,000 pieces (5 reels) 22 axk7l22227* axk8l22125* 30 axk7l30227* axk8l30125* 40 axk7l40227* axk8l40125* 50 axk7l50227* axk8l50125* 60 axk7l60227* axk8l60125* 70 axk7l70227* axk8l70125* 80 axk7l80227* axk8l80125* new
axk7l, 8l 2 specifications 1. characteristics 2. material and surface treatment item speci?ations conditions electrical characteristics rated current 0.3a/terminal (max. 5 a at total terminals) rated voltage 60v ac/dc breakdown voltage 150v ac for 1 min. rated voltage is applied for one minutes and check for short circuit or damage with a detection current of 1ma insulation resistance min. 1,000m w (initial) using 250v dc megger (applied for 1 min.) contact resistance max. 90m w measured based on the hp4338b measurement method of jis c 5402 environmental characteristics ambient temperature ?5 c to +85 c no freezing at low temperatures soldering heat resistance max. peak temperature of 245 c infrared re?w soldering 300 c within 5 sec, 350 c within 3 sec. soldering iron storage temperature ?5 c to +85 c (product only) ?0 c to +50 c (emboss packing) no freezing at low temperatures thermal shock resistance (header and socket mated) 5 cycles, insulation resistance min. 100m w , contact resistance max. 90m w sequence 1. -55 c, 30 min. 2. 25 c, max.5 min. 3. 85 c, 30 min. 4. 25 c, max.5 min. humidity resistance (header and socket mated) 120 hours, insulation resistance min. 100m w , contact resistance max. 90m w temperature 40 2 c, humidity 90 to 95% r.h. saltwater spray resistance (header and socket mated) 24 hours, insulation resistance min. 100m w , contact resistance max. 90m w temperature 35 2 c, saltwater concentration 5 1% h 2 s resistance (header and socket mated) 48 hours, contact resistance max. 90m w temperature 40 2 c, gas concentration 3 1 ppm, humidity 75 to 80% r.h. lifetime characteristics insertion and removal life 50 times repeated insertion and removal speed of max. 200 times/hours unit weight 40 contacts; socket: 0.05g header: 0.03g part name material surface treatment molded portion lcp resin (ul94v-0) contact/post copper alloy contact portion: au plating over ni terminal portion: au plating over ni (except for front edge of terminal) retention ?ting portion: sn plating over ni (socket: except for front edge of the terminal) +0 ? +10 ? +3 ? +10 ? dimensions ?socket (mated height 0.9 mm) 5.00 0.87 5.00 0.40 0.05 0.15 0.03 retention solder tab a c 0.15 b 0.1 suction 0.80 0.08 (contact and retention fitting) this surface c 0.15 terminal coplanarity 0.40 0.05 4.40 0.10 0.03 dimension table (mm) dimensions no. of contacts a b c d 20 6.4 3.6 5.0 6.4 22 6.8 4.0 5.4 6.8 30 8.4 5.6 7.0 8.4 40 10.4 7.6 9.0 10.4 50 12.4 9.6 11.0 12.4 60 14.4 11.6 13.0 14.4 70 16.4 13.6 15.0 16.4 80 18.4 15.6 17.0 18.4 mm general tolerance: 0.2 ?header (mated height: 0.9 mm) 3.36 4.10 r0.15 0.63 (post and retention fitting) terminal coplanarity 0.08 0.08 0.03 0.40 0.05 r0.15 b retention solder tab 0.15 0.03 suction 2.30 a c 0.1 1.20 0.05 dimension table (mm) dimensions no. of contacts a b c d 20 6.0 5.74 3.6 6.4 22 6.4 6.14 4.0 6.8 30 8.0 7.74 5.6 8.4 40 10.0 9.74 7.6 10.4 50 12.0 11.74 9.6 12.4 60 14.0 13.74 11.6 14.4 70 16.0 15.74 13.6 16.4 80 18.0 17.74 15.6 18.4
axk7l, 8l 3 ?socket and header are mated header 0.90 0.15 socket embossed tape and reel dimensions chart 1. socket ?tape dimensions 1) a dimensions: 24mm 2) a dimensions: 32mm 2) a dimensions: 16mm 1.5 dia. +0.1 0 (a 0.3) (c) 8.0 (4.0) (2.0) (1.75) pull-out direction 1.5 dia. +0.1 0 (4.0) 8.0 (2.0) (b) (c) (a 0.3) (1.75) narrow pitch connector 165 to 180 top cover tape emboss carrier tape narrow pitch connector 165 to 180 1.5 dia. +0.1 0 (a 0.3) (4.0) 8.0 (2.0) (c) (1.75) top cover tape pull-out direction emboss carrier tape dimension table (mm) dimensions no. of contacts a b c d max.24 16.0 7.5 16.4 26 to 70 24.0 11.5 24.4 80 32.0 28.4 14.2 32.4 2. header ?tape dimensions 1) a dimensions: 24mm 2) a dimensions: 32mm 2) a dimensions: 16mm pull-out direction (4.0) 8.0 1.5 dia. +0.1 0 (2.0) (c) (1.75) (a 0.3) 1.5 dia. +0.1 0 8.0 (4.0) (2.0) (1.75) (c) (b) 165 to 180 top cover tape emboss carrier tape narrow pitch connector (a 0.3) (c) (1.75) (4.0) (2.0) 8.0 165 to 180 pull-out direction emboss carrier tape narrow pitch connector 1.5 dia. +0.1 0 (a 0.3) top cover tape dimension table (mm) dimensions no. of contacts a b c d max.24 16.0 7.5 16.4 26 to 70 24.0 11.5 24.4 80 32.0 28.4 14.2 32.4 ?reel dimensions label taping reel (d +2 0 ) cavity 370 dia. emboss carrier tape top cover tape
axk7l, 8l 4 akct1b57e 200309-3yt please contact .......... specifications are subject to change without notice. printed in japan. automation controls company k head office: 1048, kadoma, kadoma-shi, osaka 571-8686, japan k telephone: japan (81) osaka (06) 6908-1050 k facsimile: japan (81) osaka (06) 6908-5781 http://www.nais-e.com/ copyright ?2003 all rights reserved matsushita electric works, ltd. these materials are printed on ecf pulp. these materials are printed with earth-friendly vegetable-based (soybean oil) ink. notes 1. removal by pulling up from an end causes the entire connector removal f o r ce to concentrate on the reten t ion ?tings and end terminals. therefore, please lift and remove from the side. doing so will also prevent cracking of the soldered parts. 2. pc boards and recommended metal mask patterns connectors are mounted with high density, with a pitch interval of 0.4 to 0.5 mm. it is therefore necessary to make sure that the right levels of solder are used, in order to reduce solder bridge and other issues. the ?ures to the right are recommended metal mask patterns. please use them as a reference. ?socket recommended pc board pattern (mount pad arrangement pattern) recommended metal mask pattern metal mask thickness: 150 m m (terminal portion opening area ratio: 53%) (metal portion opening area ratio: 100%) recommended metal mask pattern metal mask thickness: 120 m m (terminal portion opening area ratio: 66%) (metal portion opening area ratio: 100%) ?header recommended pc board pattern (mount pad arrangement pattern) relation between connector and mounting pad recommended metal mask pattern metal mask thickness: 150 m m (terminal portion opening area ratio: 52%) (metal portion opening area ratio: 40%) recommended metal mask pattern metal mask thickness: 120 m m (terminal portion opening area ratio: 66%) (metal portion opening area ratio: 51%) in particular, if a lot of solder is used in the header retaining reten t ion ?ting s , it might interfere with and cause incomplete socket mating. therefore, please follow the recommended conditions given on the left. pull pull ng d 0.05 3.60 0.03 b 0.05 4.00 0.03 0.23 0.03 5.60 0.03 1.00 0.03 0.40 0.03 c 0.40 0.40 0.01 0.20 0.01 5.40 0.01 4.42 0.01 (0.49) (1.00) c 0.40 1.00 0.01 3.60 0.01 1.40 0.01 5.60 0.01 5.40 0.01 0.20 0.01 0.40 0.01 4.18 0.01 (0.61) 1.00 0.01 3.60 0.01 (1.00) 1.40 0.01 5.60 0.01 c 0.40 0.23 0.03 0.40 0.03 4.70 0.03 3.20 0.03 d 0.05 c 0.05 max. 2.20 0.57 0.03 1.40 0.03 : through hole without insulation is prohibited. (4.70 0.03) (3.20 0.03) (max. 2.20) mounting pad : through hole without insulation is prohibited. 0.20 0.01 0.40 0.01 3.60 0.01 (0.45) 4.50 0.01 1.30 0.01 0.25 0.01 1.30 0.01 0.40 0.01 0.20 0.01 3.36 0.01 (0.57) 4.50 0.01 1.30 0.01 1.30 0.01 0.31 0.01
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