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agilent dual channel, high speed optocouplers data sheet description these dual channel optocouplers contain a pair of light emitting diodes and integrated photo- detectors with electrical insulation between input and output. separate connection for the photodiode bias and output transistor collectors increase the speed up to a hundred times that of a conventional phototransistor coupler by reducing the base- collector capacitance. hcpl-2530, hcpl-2531, hcpl-4534 hcpl-0530, hcpl-0531, hcpl-0534 features 15 kv/ s minimum common mode transient immunity at v cm = 1500 v (hcpl-4534/0534) high speed: 1 mb/s ttl compatible available in 8 pin dip, so-8, and 8 pin dip ?gull wing surface mount (option 020) packages high density packaging 3 mhz bandwidth open collector outputs guaranteed performance from 0 c to 70 c safety approval ul recognized ?3750 v rms for 1 minute (5000 v rms for 1 minute for option 020) per ul1577 csa approved iec/en/din en 60747-5-2 ? iorm = 630 vpeak for hcpl-2530/2531/4534 0ption 060 ? iorm = 560 vpeak for hcpl-0530/0531/0534 0ption 060 single channel version available (4502/3, 0452/3) mil-prf-38534 hermetic version available (55xx/65xx/4n55) applications line receivers ?high common mode transient immunity (>1000 v/ s) and low input-output capacitance (0.6 pf) high speed logic ground isolation ttl/ttl, ttl/lttl, ttl/cmos, ttl/lsttl replace pulse transformers save board space and weight analog signal ground isolation integrated photon detector provides improved linearity over phototransistor type polarity sensing isolated analog amplifier dual channel packaging enhances thermal tracking caution: it is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by esd. functional diagram a 0.1 f bypass capacitor between pins 5 and 8 is recommended. 7 1 2 3 4 5 6 8 anode 1 cathode 1 cathode 2 anode 2 v cc v o1 v o2 gnd truth table (positive logic) led on off v o low high
2 these dual channel optocouplers are available in an 8 pin dip and in an industry standard so-8 package. the following is a cross reference table listing the 8 pin dip part number and the electrically equivalent so-8 part number. so-8 8 pin dip package hcpl-2530 hcpl-0530 hcpl-2531 hcpl-0531 hcpl-4534 hcpl-0534 the so-8 does not require through holes in a pcb. this package occupies approximately one-third the footprint area of the standard dual-in-line package. the lead profile is designed to be compatible with standard surface mount processes. the hcpl-2530/0530 is for use in ttl/cmos, ttl/lsttl or wide bandwidth analog applications. current transfer ratio (ctr) for the hcpl-2530/0530 is 7% minimum at i f = 16 ma. the hcpl-2531/0531 is designed for high speed ttl/ttl applications. a standard 16 ma ttl sink current through the input led will provide enough output current for 1 ttl load and a 5.6 k ? pull-up resistor. ctr of the hcpl-2531/0531 is 19% minimum at i f = 16 ma. the hcpl-4534/0534 is an hcpl- 2531/0531 with increased common mode transient immunity of 15,000 v/ s minimum at v cm = 1500 v guaranteed. ordering information specify part number followed by option number (if desired). example: hcpl-2531#xxxx 020 = ul 5000 v rms/1 minute option* 060 = iec/en/din en 60747-5-2 option 300 = gull wing surface mount option? 500 = tape and reel packaging option xxxe = lead free option option data sheets available. contact your agilent sales representative or authorized distributor for information. *for hcpl-2530/1 and hcpl-4534 only. ?gull wing surface mount option applies to through hole parts only. remarks: the notation # is used for existing products, while (new) products launched since 15th july 2001 and lead free optio n will use C selection guide widebody minimum cmr 8-pin dip (300 mil) small-outline so-8 (400 mil) hermetic current dual single dual single single single and dv/dt v cm transfer channel channel channel channel channel dual channel (v/ s) (v) ratio (%) package package* package package* package* packages* 1,000 10 7 hcpl-2530 6n135 hcpl-0530 hcpl-0500 hcnw135 19 hcpl-2531 6n136 hcpl-0531 hcpl-0501 hcnw136 hcpl-4502 hcpl-0452 hcnw4502 15,000 1500 19 hcpl-4534 hcpl-4503 hcpl-0534 hcpl-0453 hcnw4503 1,000 10 9 hcpl-55xx hcpl-65xx 4n55 *technical data for these products are on separate agilent publications.
3 schematic package outline drawings 8-pin dip package (hcpl-2530/2531/4534) 1.080 ?0.320 (0.043 ?0.013) 2.54 ?0.25 (0.100 ?0.010) 0.51 (0.020) min. 0.65 (0.025) max. 4.70 (0.185) max. 2.92 (0.115) min. dimensions in millimeters and (inches). *marking code letter for option numbers. "v" = option 060 option numbers 300 and 500 not marked. note: floating lead protrusion is 0.25 mm (10 mils) max. 5?typ. 0.254 + 0.076 - 0.051 (0.010 + 0.003) - 0.002) 7.62 ?0.25 (0.300 ?0.010) 6.35 ?0.25 (0.250 ?0.010) 9.65 ?0.25 (0.380 ?0.010) 1.78 (0.070) max. 1.19 (0.047) max. a xxxxz yyww date code 5 6 7 8 4 3 2 1 option code* ul recognition ur type number 3.56 ?0.13 (0.140 ?0.005) i f1 hcpl-4534/0534 shield 8 7 v cc + 2 v o1 i cc v f1 i o1 1 i f2 6 5 gnd 4 v o2 v f2 i o2 3 + use of a 0.1 f bypass capacitor connected between pins 5 and 8 is recommended.
4 small outline so-8 package (hcpl-0530/0531/0534) xxx yww 8765 4 3 2 1 5.994 0.203 (0.236 0.008) 3.937 0.127 (0.155 0.005) 0.406 0.076 (0.016 0.003) 1.270 (0.050) bsc * 5.080 0.127 (0.200 0.005) 3.175 0.127 (0.125 0.005) 1.524 (0.060) 45 x 0.432 (0.017) 0.228 0.025 (0.009 0.001) type number (last 3 digits) date code 0.305 (0.012) min. * total package length (inclusive of mold flash) 5.207 0.254 (0.205 0.010) dimensions in millimeters (inches). lead coplanarity = 0.10 mm (0.004 inches) max. 0.203 0.102 (0.008 0.004) 7 note: floating lead protrusion is 0.15 mm (6 mils) max. 7.49 (0.295) 1.9 (0.075) 0.64 (0.025) land pattern recommendation package outline drawings, continued 8-pin dip package with gull wing surface mount option 300 (hcpl-2530/2531/4534) 0.635 0.25 (0.025 0.010) 12 nom. 9.65 0.25 (0.380 0.010) 0.635 0.130 (0.025 0.005) 7.62 0.25 (0.300 0.010) 5 6 7 8 4 3 2 1 9.65 0.25 (0.380 0.010) 6.350 0.25 (0.250 0.010) 1.016 (0.040) 1.27 (0.050) 10.9 (0.430) 2.0 (0.080) land pattern recommendation 1.080 0.320 (0.043 0.013) 3.56 0.13 (0.140 0.005) 1.780 (0.070) max. 1.19 (0.047) max. 2.54 (0.100) bsc dimensions in millimeters (inches). lead coplanarity = 0.10 mm (0.004 inches). note: floating lead protrusion is 0.25 mm (10 mils) max. 0.254 + 0.076 - 0.051 (0.010 + 0.003) - 0.002)
5 regulatory information the devices contained in this data sheet have been approved by the following organizations: ul recognized under ul 1577, component recognition program, file e55361. solder reflow thermal profile recommended pb-free ir profile 0 time (seconds) temperature ( c) 200 100 50 150 100 200 250 300 0 30 sec. 50 sec. 30 sec. 160 c 140 c 150 c peak temp. 245 c peak temp. 240 c peak temp. 230 c soldering time 200 c preheating time 150 c, 90 + 30 sec. 2.5 c 0.5 c/sec. 3 c + 1 c/ 0.5 c tight typical loose room temperature preheating rate 3 c + 1 c/ 0.5 c/sec. reflow heating rate 2.5 c 0.5 c/sec. csa approved under csa component acceptance notice #5, file ca 88324. iec/en/din en 60747-5-2 approved under: iec 60747-5-2:1997 + a1:2002 en 60747-5-2:2001 + a1:2002 din en 60747-5-2 (vde 0884 teil 2):2003-01. (option 060 only) 217 c ramp-down 6 c/sec. max. ramp-up 3 c/sec. max. 150 - 200 c 260 +0/-5 c t 25 c to peak 60 to 150 sec. 20-40 sec. time within 5 c of actual peak temperature t p t s preheat 60 to 180 sec. t l t l t smax t smin 25 t p time temperature notes: the time from 25 c to peak temperature = 8 minutes max. t smax = 200 c, t smin = 150 c
6 insulation and safety related specifications 8-pin dip (300 mil) so-8 parameter symbol value value units conditions minimum external l(101) 7.1 4.9 mm measured from input terminals to output to air gap (external to output terminals, shortest distance through air. clearance) minimum external l(102) 7.4 4.8 mm measured from input terminals to output tracking (external terminals, shortest distance path along body. creepage) minimum internal 0.08 0.08 mm through insulation distance, conductor to plastic gap conductor, usually the direct distance (internal clearance) between the photoemitter and photodetector inside the optocoupler cavity. minimum internal na na mm measured from input terminals to output tracking (internal terminals, along internal cavity. creepage) tracking resistance cti 200 200 volts din iec 112/vde 0303 part 1 (comparative tracking index) isolation group iiia iiia material group (din vde 0110, 1/89, table 1) option 300 - surface mount classification is class a in accordance with cecc 00802.
7 iec/en/din en 60747-5-2 insulation characteristics (option 060) characteristic hcpl- hcpl- description symbol 2530/2531/4534 0530/0531/0534 unit installation classification per din vde 0110/1.89, table 1 for rated mains voltage 150 v rms i-iv for rated mains voltage 300 v rms i-iv i-iii for rated mains voltage 600 v rms i-iii i-ii climatic classification 55/100/21 55/100/21 pollution degree (din vde 0110/1.89) 2 2 maximum working insulation voltage v iorm 630 567 v peak input to output test voltage, method b* v iorm x 1.875 = v pr , 100% production test v pr 1181 1050 v peak with t m = 1 sec, partial discharge < 5 pc input to output test voltage, method a* v iorm x 1.5 = v pr , type and sample test, v pr 945 840 v peak t m = 60 sec, partial discharge < 5 pc highest allowable overvoltage v iotm 6000 4000 v peak (transient overvoltage, t ini = 10 sec) safety limiting values (maximum values allowed in the event of a failure.) case temperature t s 175 150 ?c input current** i s,input 230 230 ma output power** p s,output 600 600 mw insulation resistance at t s , v io = 500 v r s > 10 9 > 10 9 ? * refer to the optocoupler section of the isolation and control components designer's catalog, under product safety regulations section, iec/en/din en 60747-5-2, for a detailed description of method a and method b partial discharge test profiles. ** refer to the following figure for dependence of p s and i s on ambient temperature. note: isolation characteristics are guaranteed only within the safety maximum ratings, which must be ensured by protective circuits in application. output power p s , input current i s 0 0 t s case temperature c 200 700 400 25 800 50 75 100 200 150 175 p s (mw) i s (ma) 125 100 300 600 500
8 absolute maximum ratings parameter symbol device min. max. units note storage temperature t s -55 125 c operating temperature t a -55 100 c average forward input current i f(avg) 25 ma (each channel) peak forward input current (each channel) i f(peak) 50 ma (50% duty cycle, 1 ms pulse width) peak transient input current (each channel) i f(trans) 1a ( 1 s pulse width, 300 pps) reverse led input voltage (each channel) v r 5v input power dissipation (each channel) p in 45 mw average output current (each channel) i o(avg) 8ma peak output current i o(peak) 16 ma supply voltage (pin 8-5) v cc -0.5 30 v output voltage (pins 7-5, 6-5) v o -0.5 20 v output power dissipation (each channel) p o 35 mw 13 lead solder temperature t ls 8 pin dip 260 c (through-hole parts only) 1.6 mm below seating plane, 10 seconds reflow temperature profile t rp so-8 and see package outline drawings option 300 section
9 electrical specifications (dc) over recommended temperature (t a = 0 c to 70 c) unless otherwise specified. see note 9. parameter sym. device min. typ.* max. units test conditions fig. note current ctr hcpl-2530/ 7 18 50 % t a = 25 ci f = 16 ma, 1, 2 1, 2 transfer 0530 v cc = 4.5 v 4 ratio 5 v o = 0.5 v hcpl-2531/ 19 24 50 % t a = 25 c 0531 hcpl-4534/ 15 0534 logic low v ol hcpl-2530/ 0.1 0.5 v t a = 25 ci o = 1.1 ma i f = 16 ma, 1 1 output 0530 v cc = 4.5 v voltage 0.5 i o = 0.8 ma hcpl-2531/ 0.1 0.5 v t a = 25 ci o = 3.0 ma 0531 hcpl-4534/ 0.5 i o = 2.4 ma 0534 logic high i oh 0.003 0.5 at a = 25 cv o = open i f = 0 ma 6 1 output v cc = 5.5 v current 50 t a = 25 cv o = open v cc = 15.0 v logic low i ccl 100 400 ai f = 16 ma, v o = open, supply v cc = 15 v current logic high i cch 0.05 4 ai f = 0 ma, v o = open, supply v cc = 15 v current input v f 1.5 1.7 v t a = 25 c31 forward i f = 16 ma voltage 1.8 input bv r 5vi r =10 a1 reverse breakdown voltage temperature ? v f -1.6 mv/ i f = 16 ma coefficient ? t a c of forward voltage input c in 60 pf f = 1 mhz, v f = 0 v 1 capacitance *all typicals at t a = 25 c.
10 package characteristics parameter sym. device min. typ.* max. units test conditions fig. note input-output v iso 3750 v rms rh < 50%, 3, 10 momentary with- t = 1 min., stand voltage** resistance r i-o 10 12 ? rh 45% 3 (input-output) v i-o = 500 vdc, t = 5 s capacitance c i-o 0.6 pf f = 1 mhz, 12 (input-output) t a = 25 c input-input i i-i 0.005 a rh 45%, 4 insulation t = 5 s, leakage current v i-i = 500 vdc resistance r i-i 10 11 ? 4 (input-input) capacitance c i-i hcpl-2530/ 0.03 pf f = 1 mhz 4 (input-input) 2531/4534 hcpl-0530/ 0.25 0531/0534 *all typicals at t a = 25 c. **the input-output momentary withstand voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. for the continuous voltage rating refer to the iec/en/din en 60747-5-2 insulation characteristics table (if applicable) , your equipment level safety specification or agilent application note 1074 entitled ?ptocoupler input-output endurance voltage,?publication number 5963-2203e. hcpl-2530/ 2531/4534 option 020 3, 11 5000 device parameter sym. hcpl- min. typ.* max. units test conditions fig. note propagation t phl 2530/0530 0.2 1.5 st a = 25 cr l = 4.1 k ? 5, 9, 6, 7 delay time 2.0 11 to logic low 2531/0531/ 0.2 0.8 t a = 25 cr l = 1.9 k ? at output 4534/0534 1.0 propagation t plh 2530/0530 1.3 1.5 st a = 25 cr l = 4.1 k ? 5, 9, 6, 7 delay time 2.0 11 high to logic 2531/0531/ 0.6 0.8 t a = 25 cr l = 1.9 k ? at output 4534/0534 1.0 common |cm h | 2530/0530 1 10 kv/ sr l = 4.1 k ? i f = 0 ma, 10 5, 6, mode transient 2531/0531 1 10 r l = 1.9 k ? t a = 25 c, 7 immunity at 4534/0534 15 30 r l = 1.9 k ? v cm = 10 v p-p logic high level output common |cm l | 2530/0530 1 10 kv/ sr l = 4.1 k ? i f = 0 ma, 10 5, 6, mode transient 2531/0531 1 10 r l = 1.9 k ? t a = 25 c, 7 immunity at 4534/0534 15 30 r l = 1.9 k ? v cm = 10 v p-p logic low level output bandwidth bw 3 mhz r l = 100 k ? 7, 8 *all typicals at t a = 25 c. switching specifications (ac) over recommended temperature (t a = 0 c to 70 c), v cc = 5 v, i f = 16 ma unless otherwise specified.
11 notes: 1. each channel. 2. current transfer ratio is defined as the ratio of output collector current, i o , to the forward led input current, i f , times 100%. 3. device considered a two-terminal device: pins 1, 2, 3, and 4 shorted together and pins 5, 6, 7, and 8 shorted together. 4. measured between pins 1 and 2 shorted together, and pins 3 and 4 shorted together. 5. common mode transient immunity in a logic high level is the maximum tolerable (positive) dv cm /dt on the rising edge of the common mode pulse, v cm , to assure that the output will remain in a logic high state (i.e., v o > 2.0 v). common mode transient immunity in a logic low level is the maximum tolerable (negative) dv cm /dt on the falling edge of the common mode pulse signal, v cm , to assure that the output will remain in a logic low state (i.e., v o < 0.8 v). 6. the 1.9 k ? load represents 1 ttl unit load of 1.6 ma and the 5.6 k ? pull-up resistor. 7. the 4.1 k ? load represents 1 lsttl unit load of 0.36 ma and the 6.1 k ? pull-up resistor. 8. the frequency at which the ac output voltage is 3 db below the low frequency asymptote. 9. use of a 0.1 f bypass capacitor connected between pins 5 and 8 is recommended. 10. in accordance with ul 1577, each optocoupler is proof tested by applying an insulation test voltage 4500 v rms for 1 second (leakage detection current limit, i i-o 5 a). 11. in accordance with ul 1577, each optocoupler is proof tested by applying an insulation test voltage 6000 v rms for 1 second (leakage detection current limit, i i-o 5 a). 12. measured between the led anode and cathode shorted together and pins 5 through 8 shorted together. 13. derate linearly above 90 c free-air temperature at a rate of 3.0 mw/ c for the soic-8 package. figure 1. dc and pulsed transfer characteristics. figure 2. current transfer ratio vs. input current. figure 3. input current vs. forward voltage. 0 10 20 v o output voltage v i o output current ma 10 5 0 t = 25 c v = 5.0 v a cc 40 ma 35 ma 30 ma 25 ma 20 ma 15 ma 10 ma i = 5 ma f normalized i = 16 ma v = 0.5 v v = 5 v t = 25 c f o cc a hcpl-2530/0530 hcpl-2531/0531/4534/0534 1.5 1.0 0.5 0.1 0 1 10 100 normalized current transfer ratio i f input current ma v f forward voltage volts 100 10 0.1 0.01 1.1 1.2 1.3 1.4 i f forward current ma 1.6 1.5 1.0 0.001 1000 i f v f + t = 25 c a figure 4. current transfer ratio vs. temperature. figure 5. propagation delay vs. temperature. figure 6. logic high output current vs. temperature. -50 +50 t a temperature c i oh logic high output current na 10 -2 -25 0 +25 +75 +100 10 -1 10 0 10 +1 10 +2 10 +3 10 +4 v o = v cc = 5.0 v i f = 0 1.1 1.0 0.9 0.8 0.7 0.6 -60 -20 0 80 normalized current transfer ratio t a temperature c f cc a -40 20 40 60 100 o normalized i = 16 ma v = 0.5 v v = 5 v t = 25 c hcpl-2530/0530 hcpl-2531/0531/4534/0534 2000 1500 1000 500 0 -60 -20 20 60 100 t a temperature c t p propagation delay ns t phl t plh i f = 16 ma, v cc = 5.0 v hcpl-2530/0530 (r l = 4.1 k ? ) hcpl-2531/0531/4534/0534 (r l = 1.9 k ? )
3.0 2.0 1.0 0.1 4 0.6 0.4 3 2 1 0.2 8 7 6 5910 0.8 r l load resistance k ? t plh t phl v = 5.0 v t = 25 c cc i = 10 ma i = 16 ma f t p propagation delay s f a figure 11. propagation delay time vs. load resistance. figure 8. frequency response. figure 7. small-signal current transfer ratio vs. quiescent input current. ? i f ? i o small signal current transfer ratio 0 0.10 0.20 0.30 0 i f quiescent input current ma 24 16 4 8 12 20 t a = 25 c, r l = 100 ? , v cc = 5 v figure 9. switching test circuit. figure 10. test circuit for transient immunity and typical waveforms. v o pulse gen. z = 50 ? t = 5 ns o r i monitor f i f 0.1f l r c l = 1.5 pf r m 0 t phl t plh o v i f ol v 1.5 v +5 v 1.5 v 5 v 10% duty cycle 1/f < 100 s 7 1 2 3 4 5 6 8 f frequency mhz 0 -20 0.01 0.1 normalized response db 1.0 -25 10 -30 t a = 25 c i f = 16 ma -15 -10 -5 r l = 100 ? r l = 220 ? r l = 470 ? r l = 1 k ? 1 2 3 4 8 7 6 5 20 k ? set i f +5 v ac input 0.1 f 560 ? 100 ? 2n3053 1.6 v dc 0.25 vp-p ac 0.1 f +5 v v o r l 12 o v 5 v ol v o v 0 v 10% 90% 90% 10% switch at a: i = 0 ma f switch at b: i = 16 ma f cm v t r t f v o i f 0.1 f l r +5 v a b pulse gen. v cm + v ff 7 1 2 3 4 5 6 8
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152 (domestic/interna- tional), or 0120-61-1280 (domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ?2004-2005 agilent technologies, inc. obsoletes 5989-2115en june 17, 2005 5989-3350en

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