vicorpower.com 800-735-6200 rev. 1. 6 1/2011 page 1 of 2 ?out + out ?out + out ?in + in pc rsv tm s nrtl cu s rohs bcm ? u.s. pats. listed on packing materials & datasheets vicor corp. made in usa ? ? efficiency: 95% typical ? input: hv 270 / 350 / 380 v ? power density: >1000 w/in 3 ? current sharing: 5% ? isolation: 4,242 vdc ? footprint: 1.1 in 2 v ? i chip tm bcm tm hv bus converter family product description the hv bus converter modules provide an isolated intermediate bus voltage to power non-isolated pol converters. the hv bcms offer direct conversion from pfc bus voltage to 12 v pol at up to 300 w with isolation to 4,242 vdc. the hv family provides superior performance, the highest efficiency and power density in the smallest package available. 32,5 1.28 22,0 0.87 ?out + out ?out + out ?in + in pc rsv tm s nrtl cu s rohs bcm ? u.s. pats. listed on packing materials & datasheets vicor corp. made in usa ? ?out + out ?out + out ?in + in pc rsv tm s nrtl cu s rohs bcm ? u.s. pats. listed on packing materials & datasheets vicor corp. made in usa ? hv pol load ?out +out ?out +out ?in +in pc vc tm s nrtl cu s rohs ?in +in ?out +out pr nc il tm pc vc cd nc os sg sc vh s nrtl cu s rohs u.s. pats. listed on packing materials & datasheets prm ? vicor corp. made in usa ? vtm ? u.s. pats. listed on packing materials & datasheets vicor corp. made in usa ? hv load load 48 v 12 v 0.8 ? 55 v typical applications 6,73 0.265 mm in actual size model input output output output number* voltage voltage power current grade (v) (v) (w) (a) b384f120t30 360 ? 400 11.25 ? 12.5 300 25.0 commercial BCM352F110T300A00 330 ? 365 10.3 ? 11.4 300 28.0 commercial bcm352f125t300a00 330 ? 365 11.79 ? 13.04 300 26.0 commercial bcm352f440t330a00 330 ? 365 41.25 ? 45.63 325 7.7 commercial bcm384f480t325a00 360 ? 400 45.0 ? 50.0 325 7.0 commercial mbcm270f338m235a00 240 ? 330 30.0 ? 41.25 235 7.3 mil-cots mbcm270f450m270a00 230 ? 330 38.3 ? 55.0 270 6.25 mil-cots * products are also available in through-hole model. see individual data sheets.
vicorpower.com 800-735-6200 rev. 1. 6 1/2011 page 2 of 2 general specifications parameter typ unit note mtbf mil-hdbk-217f 3.5 mhrs 25c, gb isolation voltage 4,242 vdc input to output (basic insulation) capacitance 500?660 pf input to output resistance 10 m input to output ctvus ul /csa 60950, en60950 regulatory compliance ce mark low voltage directive rohs thermal over temperature shutdown 125 c minimum, junction temperature case-to-ambient thermal impedance 3.7 c / w with 0.25? heat sink @ 300 lfm operating junction temperature -40 to 125 c t?grade operating junction temperature -55 to 125 c mil?cots storage temperature -40 to 125 c the products described on this data sheet are protected by the following u.s. patents numbers: 5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917; 7,166,898; 7,187,263; 7,361,844; d496,906; d505,114; d506,438; d509,472 and for use under 6,975,098 and 6 ,984,965 bcm mechanical outline drawing* heat sink push-pin hole pattern 2.950.07 [0.1160.003 ] non-plated through hole see note 1. ? (2) pl (4.3 7) 0.172 (11.3 7) 0.448 (7.00) 0.276 ( 3 6.50) 1.43 7 (18 .25) 0.719 (2.510) 0.099 ( 3 1.48 ) 1.240 ( 3 9.50) 1.555 see note 2. dotted line indicates vic position see note 3 heat sink push-pin hole pattern ( top side shown ) see note 3 bottom view recommended land pattern ( component side shown ) top view ( component side ) inch mm notes: 1. dimensions are . 2. unless otherwise specified, tolerances are: .x / [.xx] = +/-0.25 / [.01]; .xx / [.xxx] = +/-0.1 3 / [.005] 3 . product marking on top surface dxf and pdf files are a v aila ble on vicorpower.com inch (mm) . notes: 1. maint ain 3.5/[0.138 ] dia. keep out zone free of copper. all pcb layers. 2. minimum recommended pitch is 39.50/[1.555]. this provides 7.00/[0.276] component edge-to-edge spacing. and 0.50/[0.020] clearance between vicor heat sinks. 3 . v?i chip land pattern shown for reference only; actual land pattern may differ. dimensions from edges of land pattern to push-pin holes will be the same for all full size v?i chips. 4. dimension are * for through?hole mechanical drawing see individual data sheets.
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